Heat dissipation frame of cloud computing host

By using a modular drawer-style heat sink, combined with air cooling and pipe cooling technologies, the problem of efficient heat dissipation for cloud computing hosts is solved, achieving low-cost and high-efficiency heat dissipation. It is suitable for high-density server environments, and is especially suitable for cloud computing hosts that need to run continuously 24/7.

CN223872562UActive Publication Date: 2026-02-03CHONGQING SHENGJINYUAN TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520835842.2
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-04-29
Publication Date
2026-02-03
Estimated Expiration
2035-04-29

AI Technical Summary

Technical Problem

Traditional cooling methods are insufficient to meet the growing cooling demands of cloud computing servers, resulting in high energy consumption, low cooling efficiency, and impact on server performance and lifespan.

Method used

The heatsink features a modular drawer-style design, combining air cooling and pipe cooling. By using air cooling and pipe cooling units together, it can simultaneously cool the front and rear servers. It also improves heat dissipation efficiency by creating turbulence with reverse fans and using S-shaped pipe cooling units, and achieves dual rapid cooling in conjunction with liquid cooling.

Benefits of technology

It achieves efficient and low-cost heat dissipation, occupies little space, is suitable for high-density server environments, is easy to maintain, provides uniform heat dissipation from front to back, avoids local overheating, and improves heat exchange efficiency by more than 15%.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a heat dissipation frame of a cloud computing host. The heat dissipation frame is characterized by comprising a main frame (1), a plurality of air cooling groups (2) and a plurality of pipe cooling groups (3), a plurality of front drawer frames (4) which can be pulled out forwards are arranged on the front side of the main frame (1); a plurality of rear drawer frames (5) which can be pulled out backwards are arranged on the rear side of the main frame (1); the air cooling set (2) is arranged on the main frame (1) and located between the front drawer frame (4) and the rear drawer frame (5). The pipe cooling set (3) is arranged on the main frame (1) and located between the front drawer frame (4) and the rear drawer frame (5). And the pipe cooling group (3) is connected with a cooling system pipeline to form circulating cooling. The utility model can be used for centralized and combined heat dissipation of double rows of servers in front and back of the cloud computing host, and has the advantages of low cost, high heat dissipation efficiency and the like.
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Description

Technical Field

[0001] This utility model relates to the field of heat dissipation technology for cloud computing equipment, and specifically to a heat sink for a cloud computing host. Background Technology

[0002] With the rapid development of cloud computing technology, the computing power of cloud computing servers is constantly improving, and the heat generated during operation is also increasing. Traditional cooling methods are insufficient to meet the growing cooling demands of cloud computing servers, and excessively high temperatures can lead to decreased server performance, shortened lifespan, or even malfunctions. Current methods, such as relying on indoor air conditioning to lower the temperature, suffer from high energy consumption and low cooling efficiency, necessitating a more efficient and cost-effective cooling solution. Utility Model Content

[0003] This invention provides a heat dissipation rack for a cloud computing host, which solves the technical problems of high energy consumption and low heat dissipation efficiency in existing systems that rely on indoor air conditioning to lower the temperature.

[0004] To achieve the above objectives, the present invention provides a heat dissipation frame for a cloud computing host, characterized in that it includes a main frame, several air-cooling units, and several pipe-cooling units; the front side of the main frame is provided with multiple front drawer frames that can be pulled forward; the rear side of the main frame is provided with multiple rear drawer frames that can be pulled backward; the air-cooling units are disposed on the main frame and located between the front and rear drawer frames; the pipe-cooling units are disposed on the main frame and located between the front and rear drawer frames; the pipe-cooling units are connected to the cooling system piping to form a circulating cooling system.

[0005] Furthermore, the number of front drawer frames and the number of rear drawer frames are the same, and their positions correspond one-to-one.

[0006] Furthermore, each of the air-cooled units consists of multiple fans arranged side by side; the operating airflow directions of two adjacent fans are opposite.

[0007] Furthermore, each of the tube cooling groups consists of two tube cooling units, which are located on the front and rear sides of the air cooling group, respectively.

[0008] Furthermore, the tube cooling system is arranged in an S-shape.

[0009] Furthermore, the bottom plate of the front drawer frame is provided with heat dissipation holes; the left and right baffles of the front drawer frame are provided with ventilation holes; and the rear baffle of the front drawer frame is provided with wire threading holes.

[0010] Furthermore, the front drawer frame is equipped with rollers.

[0011] Furthermore, the rear drawer frame has the same structure as the front drawer frame.

[0012] Furthermore, the inlet of each of the tube cooling units is connected to the outlet pipe of the cooling system, and the outlet of each of the tube cooling units is connected to the return pipe of the cooling system.

[0013] Furthermore, the cooling system is located at the top or bottom of the main frame.

[0014] The beneficial effects of this utility model are:

[0015] First, this utility model enables the front and rear servers to work simultaneously with the air-cooling group and the pipe-cooling group to achieve a combination of air-cooling and pipe-cooling heat dissipation, and achieves common centralized heat dissipation for both the front and rear. Therefore, it has the advantages of low cost, high heat dissipation efficiency and small space occupation. It is very suitable for high-density server environments such as cloud computing, and is especially suitable for the heat dissipation needs of cloud computing hosts that need to run continuously for 7×24 hours.

[0016] Secondly, this utility model combines modular drawer-type design with air-cooling and pipe-cooling technology. When the air-cooling unit or pipe-cooling unit has a problem and needs maintenance, you only need to take out the front or rear drawer frame of the layer where the fault is located, which makes maintenance very convenient. At the same time, it solves the technical problems of low heat dissipation efficiency and inconvenient maintenance.

[0017] Third, this utility model uses a reverse fan to create turbulence in the air-cooled unit, breaking the laminar flow boundary and improving heat dissipation efficiency by more than 15%, so that the servers in the front and rear drawer frames can achieve the same cooling effect, avoiding differences and achieving uniform heat dissipation from front to back.

[0018] Fourth, this utility model can achieve bilateral synchronous cooling, and can multiply the heat exchange efficiency, avoid differences, and achieve uniform heat dissipation before and after; through the S-shaped arrangement of the tube cooling, the contact area is increased many times, and combined with liquid cooling, dual rapid cooling is achieved, resulting in rapid heat dissipation and cooling.

[0019] Fifth, the front and rear drawer frames of this utility model form a three-dimensional air duct through the multi-directional layout of heat dissipation holes and ventilation holes, which accelerates airflow, avoids local overheating, and also facilitates rapid heat exchange of the pipe cooling unit, thereby improving heat dissipation efficiency. Attached Figure Description

[0020] Figure 1 This is a perspective view of a heat sink for a cloud computing host according to this utility model.

[0021] Figure 2 This is a left view of a heat sink for a cloud computing host according to this utility model.

[0022] Figure 3 yes Figure 1 The view of AA.

[0023] Figure 4 This is a perspective view of a heat sink frame for a cloud computing host without the front and rear drawer frames installed.

[0024] Figure 5 yes Figure 4 Enlarged view of section B in the middle.

[0025] Figure 6 This is a front view showing the assembly relationship between the air-cooled group and the pipe-cooled group in each layer of this utility model.

[0026] Figure 7 This is a right-hand view showing the assembly relationship between the air-cooled group and the pipe-cooled group in each layer of this utility model.

[0027] Figure 8-9 This is a three-dimensional view of the assembly relationship between the air-cooled group and the pipe-cooled group in each layer of this utility model.

[0028] Figure 10 This is a schematic diagram of the structure in which each cooling unit is connected to the cooling system piping to form a circulating cooling system.

[0029] Figure 11 It is a 3D view of the front (back) drawer frame. Detailed Implementation

[0030] The present invention will be further described below with reference to the accompanying drawings and embodiments:

[0031] Example 1: See also Figure 1-11 A heat sink for a cloud computing host includes a main frame 1, several air-cooled units 2 and several pipe-cooled units 3.

[0032] See also Figure 1-5 The main frame 1 is a frame formed by several vertical beams, longitudinal beams, and transverse beams, and is made of aluminum alloy or steel profiles and welded together. The front, middle, and rear parts of the main frame 1 form a front drawer area, a heat dissipation area, and a rear drawer area.

[0033] See also Figure 1-3 The main frame 1 is provided with multiple front drawer frames 4 that can be pulled forward.

[0034] See also Figure 1-3 In this embodiment, 10 front drawer frames 4 can be assembled, with a total of 10 layers. Each front drawer frame 4 can be taken out independently. When in use, the front drawer frame 4 contains a single server unit of the cloud computer host.

[0035] See also Figure 4-5 Specifically, the main frame 1 is provided with a drawer slide 101 and / or a drawer partition 102 on its front side. The front drawer frame 4 is slidably engaged with the drawer slide 101 and / or the drawer partition 102.

[0036] See also Figure 1-3 The main frame 1 is provided with multiple rear drawer frames 5 that can be pulled out backward.

[0037] See also Figure 1-3 In this embodiment, 10 rear drawer frames 5 can be assembled, with a total of 10 layers; each rear drawer frame 5 can be removed independently, and when in use, the rear drawer frame 5 contains a single server unit of the cloud computer host.

[0038] See also Figure 4-5 Specifically, the rear side of the main frame 1 is also provided with drawer slides 101 and / or drawer dividers 102. The rear drawer frame 5 is slidably engaged with the drawer slides 101 and / or drawer dividers 102.

[0039] See also Figure 4-5 Furthermore, the drawer partition 102 is provided with a plurality of ventilation holes 102-1.

[0040] Furthermore, the number of the front drawer frame 4 and the number of the rear drawer frame 5 are the same (10), and their positions correspond one-to-one.

[0041] In this configuration, an air-cooled assembly 2 and a pipe-cooled assembly 3 are provided between each layer of the main frame 1, between the front drawer frame 4 and the rear drawer frame 5.

[0042] In this embodiment, there are 10 air-cooled units 2 and 10 pipe-cooled units 3. Each floor has one air-cooled unit 2 and one pipe-cooled unit 3.

[0043] See also Figure 3 Specifically, the air-cooled unit 2 is fixedly assembled on the main frame 1 and located between the front drawer frame 4 and the rear drawer frame 5 of each layer.

[0044] See also Figure 3 Specifically, the pipe cooling unit 3 is fixedly assembled on the main frame 1 and located between the front drawer frame 4 and the rear drawer frame 5 of each layer.

[0045] See also Figure 10 Each of the aforementioned tube cooling units 3 is connected to the cooling system 6 via piping to form a circulating cooling system. The inlet of each tube cooling unit 3 is connected to the outlet of the cooling system 6, and the outlet of each tube cooling unit 3 is connected to the return pipe of the cooling system. Specifically, the cooling system 6 includes a coolant tank and a pump. The pump draws coolant (such as water or antifreeze) from the coolant tank to each tube cooling unit 3, and then returns it to the coolant tank, thus achieving a circulating cooling process. Since the cooling system 6 can employ existing designs, it will not be described in detail here.

[0046] Furthermore, the cooling system 6 can be located at the top or bottom of the main frame 1. This saves space and facilitates maintenance and piping management.

[0047] When in use, the server of the cloud computing host is installed in the rear drawer frame 5 and the front drawer frame 4 of the heat sink of the cloud computing host.

[0048] During operation, the front and back servers on each floor are simultaneously cooled by the air-cooling group 2 and the pipe-cooling group 3 of the same floor to achieve a combination of air cooling and pipe cooling, and achieve centralized heat dissipation for both front and back. Therefore, it has the advantages of low cost, high heat dissipation efficiency and small space occupation.

[0049] Furthermore, when maintenance is required for either the air-cooled module 2 or the pipe-cooled module 3, only the front or rear drawer frame of the affected layer needs to be removed, making maintenance very convenient. Therefore, by combining air-cooling and pipe-cooling technologies with a modular drawer-type design, the technical problems of low heat dissipation efficiency and inconvenient maintenance are simultaneously solved.

[0050] Example 2: This example is a further improvement on Example 1:

[0051] See also Figure 3 Furthermore, each of the air-cooled groups 2 consists of multiple fans arranged side by side; the working airflow directions of two adjacent fans are opposite.

[0052] See also Figure 6-9 Because the air-cooled unit generates turbulence through reverse fans, breaking the laminar flow boundary and improving heat dissipation efficiency by more than 15%. At the same time, servers in the front and rear drawer frames can achieve the same cooling effect, avoiding differences and achieving uniform heat dissipation from front to back.

[0053] See also Figure 6-9 Specifically, each of the air-cooled units 2 consists of four fans 2-1 arranged side by side.

[0054] Example 3: This example is a further improvement on Example 1 or Example 2:

[0055] See also Figure 6-9 Furthermore, each of the tube cooling units 3 consists of two tube coolers 3-1, which are located on the front and rear sides of the air cooling unit 2, respectively. This enables simultaneous cooling on both sides, significantly improves heat exchange efficiency, avoids differences, and ensures uniform heat dissipation from front to back.

[0056] See also Figure 6-9 Furthermore, the tube cooler 3-1 is arranged in an S-shape. The tube cooler assembly adopts an S-shaped pipe design, which increases the contact area by more than ten times compared to straight pipes, and works in conjunction with liquid cooling to achieve dual rapid cooling and achieve rapid heat dissipation.

[0057] Therefore, it is suitable for use in high-density server environments such as cloud computing, and is especially suitable for the heat dissipation needs of cloud computing hosts that need to run continuously 24 / 7.

[0058] Example 4: This example is a further improvement on Example 1, 2, or 3:

[0059] See also Figure 11 Furthermore, the bottom plate 4-1 of the front drawer frame 4 is provided with heat dissipation holes 4-11; the left and right baffles 4-2 of the front drawer frame 4 are each provided with ventilation holes 4-21; and the rear baffle 4-3 of the front drawer frame 4 is provided with a wire threading hole 4-31. The multi-directional arrangement of the heat dissipation holes 4-11 and ventilation holes 4-21 forms a three-dimensional airflow channel, accelerating airflow, preventing localized overheating, and facilitating rapid heat exchange by the pipe cooling unit, thereby improving heat dissipation efficiency.

[0060] See also Figure 11 Furthermore, the front drawer frame 4 is provided with rollers 4-4.

[0061] Specifically, the rear drawer frame 5 and the front drawer frame 4 may have the same structure.

[0062] The preferred embodiments of this utility model have been described in detail above. It should be understood that those skilled in the art can make numerous modifications and variations based on the concept of this utility model without creative effort. Therefore, all technical solutions that can be obtained by those skilled in the art based on the concept of this utility model through logical analysis, reasoning, or limited experimentation on the basis of existing technology should be within the scope of protection defined by the claims.

Claims

1. A heat sink for a cloud computing host, characterized in that: It includes a main frame (1), several air-cooled units (2) and several pipe-cooled units (3); The main frame (1) has multiple front drawer frames (4) that can be pulled forward on the front side; The main frame (1) is provided with multiple rear drawer frames (5) that can be pulled out backward; The air-cooled unit (2) is mounted on the main frame (1) and located between the front drawer frame (4) and the rear drawer frame (5); The pipe cooling unit (3) is installed on the main frame (1) and located between the front drawer frame (4) and the rear drawer frame (5); The pipe cooling unit (3) is connected to the cooling system (6) through pipes to form a circulating cooling system.

2. The heat dissipation rack for a cloud computing host as described in claim 1, characterized in that: The number of front drawer frames (4) and the number of rear drawer frames (5) are the same and their positions correspond one-to-one.

3. The heat dissipation rack for a cloud computing host as described in claim 1, characterized in that: Each of the air-cooled units (2) consists of multiple fans arranged side by side; the working airflow directions of two adjacent fans are opposite.

4. A heat sink for a cloud computing host as described in any one of claims 1-3, characterized in that: Each of the tube cooling groups (3) consists of two tube coolers (3-1), which are located on the front and rear sides of the air cooling group (2).

5. The heat dissipation rack for a cloud computing host as described in claim 4, characterized in that: The tube cooler (3-1) is arranged in an S-shape.

6. The heat dissipation rack for a cloud computing host as described in claim 1, characterized in that: The bottom plate (4-1) of the front drawer frame (4) is provided with heat dissipation holes (4-11); the left and right baffles (4-2) of the front drawer frame (4) are provided with ventilation holes (4-21); the tail baffle (4-3) of the front drawer frame (4) is provided with wire threading holes (4-31).

7. The heat dissipation rack for a cloud computing host as described in claim 1, characterized in that: The front drawer frame (4) is equipped with rollers (4-4).

8. A heat sink for a cloud computing host as described in claim 6 or 7, characterized in that: The rear drawer frame (5) has the same structure as the front drawer frame (4).

9. The heat dissipation rack for a cloud computing host as described in claim 1, characterized in that: The inlet of each of the tube cooling units (3) is connected to the outlet pipe of the cooling system (6), and the outlet of each of the tube cooling units (3) is connected to the return pipe of the cooling system.

10. A heat dissipation rack for a cloud computing host as described in claim 1 or 9, characterized in that: The cooling system (6) is located at the top or bottom of the main frame (1).