Mainboard device damping structure and electronic equipment

Abstract

The utility model relates to a mainboard device vibration reduction structure and electronic equipment, and is applied to the field of electronic equipment. The mainboard body comprises a mounting part, a vibration reduction sleeve and a fastener, the mounting part extends in the first direction and can be mounted on a shell of the electronic equipment, and the first direction is defined as the connecting direction of the mainboard body and the shell; the vibration reduction sleeve is made of a flexible material and can be arranged on the mainboard body in a penetrating mode in the first direction; the fastener penetrates through the vibration reduction sleeve in the first direction and is connected to the installation part so that the main board body can be connected to the installation part. According to the mainboard device vibration reduction structure, in the contact process of the mainboard body and the shell, through the design that the vibration reduction sleeve made of the flexible material is matched with the fastener, flexible buffering of the mainboard body is achieved. When the shell is subjected to external instantaneous impact force, the vibration reduction sleeve is flexibly connected between the mainboard body and the mounting part, and the impact force transmitted to the mainboard body by the shell can be buffered, so that the risk that internal devices are damaged due to the fact that the mainboard body is stressed in the falling process is reduced.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and in particular to a motherboard device vibration damping structure and electronic devices. Background Technology

[0002] A motherboard PCB (Printed Circuit Board) is a printed circuit board used on a computer motherboard. It is the physical foundation of the motherboard, used to connect and support various electronic components such as the processor, memory, expansion slots, and input / output interfaces. The quality of the motherboard PCB directly affects the stability and performance of the entire computer system.

[0003] In related technologies, the motherboard PCB is directly fastened to the housing with screws. When the housing is subjected to external forces, such as drops or vibrations, the force is transmitted to the PCB, causing damage to the connection points of precision components or large, multi-pin components, leading to motherboard malfunction. This problem is a pain point for customers of such products, and a good solution needs to be found. Utility Model Content

[0004] Therefore, it is necessary to provide a motherboard component vibration damping structure and electronic device to address the problem that the connection between the motherboard and the casing is damaged after being subjected to external impact, resulting in the failure of the motherboard function.

[0005] In a first aspect, this application provides a vibration damping structure for motherboard components, employing the following technical solution:

[0006] A motherboard device vibration damping structure is disclosed for connecting a motherboard body to the housing of an electronic device. The vibration damping structure includes a mounting portion, a vibration damping sleeve, and fasteners. The mounting portion extends along a first direction and can be mounted on the housing of the electronic device, the first direction being defined as the connection direction between the motherboard body and the housing. The vibration damping sleeve is made of a flexible material and can pass through the motherboard body along the first direction. The fasteners pass through the vibration damping sleeve along the first direction and are connected to the mounting portion to connect the motherboard body to the mounting portion.

[0007] In one embodiment, the vibration damping sleeve includes a fitting portion and a first abutting portion connected to the fitting portion. The fitting portion can pass through the motherboard body in a first direction, and the first abutting portion can be clamped between the mounting portion and the motherboard body.

[0008] In one embodiment, the vibration damping sleeve further includes a second abutting portion. In the first direction, the second abutting portion and the first abutting portion are disposed at opposite ends of the fitting portion and can be jointly clamped to the motherboard body.

[0009] In one embodiment, the radial dimensions of the first abutting portion and the second abutting portion projected onto the first reference plane are both greater than the radial dimension of the fitting portion projected onto the first reference plane, and the first reference plane is perpendicular to the first direction.

[0010] In one embodiment, the fastener includes a head and a rod extending along a first direction and connected to the head. The rod is capable of passing through the mounting portion along the first direction. After the rod is inserted into the mounting portion, the head abuts against the end face of the second abutment portion on the side opposite to the motherboard body.

[0011] In one embodiment, along the first direction, the mounting portion includes a receiving groove, the rod body can be inserted into the receiving groove along the first direction, the surface of the rod body has an external thread, the receiving groove is provided with an internal thread that mates with the external thread, and the rod body can be threadedly connected to the mounting portion.

[0012] In one embodiment, the flexible material includes at least one of thermoplastic elastomers, thermoplastic vulcanized rubber, polyisobutylene-based elastomers, silicone rubber, nylon elastomers, polyester elastomers, and polyamide elastomers.

[0013] Secondly, this application provides an electronic device that adopts the following technical solution:

[0014] An electronic device includes a housing, the aforementioned motherboard device vibration damping structure, and a motherboard body. The housing includes a mounting position, the motherboard device vibration damping structure is disposed at the mounting position, and the motherboard body is spaced apart from the housing in a first direction. The motherboard body is detachably connected to the housing by means of the motherboard device vibration damping structure.

[0015] In one embodiment, multiple vibration damping structures are provided for the motherboard device, and all of the motherboard device vibration damping structures are arranged in an array on the housing.

[0016] In one embodiment, the motherboard body is provided with a plurality of mounting holes through the first direction, and the mounting holes are provided one-to-one with the vibration damping structure of the motherboard device, and the vibration damping structure of the motherboard device can be inserted through the mounting holes along the first direction.

[0017] The aforementioned motherboard component vibration damping structure, through the design of a flexible vibration damping sleeve and fasteners, achieves flexible buffering of the motherboard body during contact with the housing. When the housing is subjected to an external instantaneous impact force, the vibration damping sleeve flexibly connects between the motherboard body and the mounting part, which can buffer the impact force transmitted from the housing to the motherboard body, thereby reducing the risk of damage to internal components of the motherboard body during a drop. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the assembly of an electronic device according to an embodiment of this application.

[0019] Figure 2 This is a schematic diagram of the structure of an electronic device in one embodiment of this application.

[0020] Figure 3 This is a schematic diagram of the structure of the motherboard body and the vibration damping sleeve in one embodiment of this application.

[0021] Figure 4 This is a cross-sectional schematic diagram of an electronic device according to an embodiment of this application.

[0022] Figure 5 for Figure 4 Enlarged view of part A in the middle.

[0023] Attached image annotations:

[0024] 1. Mainboard component vibration damping structure; 11. Mounting part; 111. Receiving groove; 12. Vibration damping sleeve; 121. Fitting part; 122. First abutting part; 123. Second abutting part; 13. Fastener; 131. Head; 132. Rod body; 2. Housing; 3. Mainboard body; 31. Mounting hole; F1. First direction; V1. First reference plane. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] It should be noted that if a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. If a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. Where applicable, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation. The "first direction" can refer to the connection direction between the motherboard body and the housing.

[0031] In existing designs, the motherboard PCB (Printed Circuit Board) is mainly secured to the housing by screws. When the housing is subjected to external impacts, such as drops or vibrations, the impact force is directly transmitted to the PCB, causing damage to the connection points of precision components or multi-pin, large-volume components on the PCB, resulting in the failure of the motherboard function.

[0032] This problem is a pain point for such products. To address this issue, this application provides a motherboard component vibration damping structure to achieve a flexible connection between the motherboard PCB and the housing, thereby providing flexible buffering of the impact force transmitted to the housing and effectively protecting the motherboard PCB.

[0033] The following is in conjunction with the appendix Figure 1-5 The embodiments of this application will be described in further detail.

[0034] See Figure 1 and Figure 2 As shown, Figure 1 This illustration shows an assembly diagram of an electronic device according to one embodiment of the present application. Figure 2 A schematic diagram of the structure of an electronic device according to an embodiment of this application is shown.

[0035] One embodiment of this application provides a motherboard device vibration damping structure 1 for connecting a motherboard body 3 to the housing 2 of an electronic device. The vibration damping structure includes a mounting part 11, a vibration damping sleeve 12, and a fastener 13. The mounting part 11 is configured to extend along a first direction F1 and be mounted on the housing 2 of the electronic device. The vibration damping sleeve 12 is configured to pass through along the first direction F1 and be pre-installed on the motherboard body 3. The fastener 13 can pass through the vibration damping sleeve 12 along the first direction F1 and be connected to the mounting part 11, thereby connecting the motherboard body 3 to the mounting part 11 to achieve the installation and fixation of the motherboard body 3.

[0036] In this embodiment, the mainboard body 3 is a common printed circuit board (PCB). The vibration damping sleeve 12 is made entirely of flexible materials, including at least one of thermoplastic elastomers, thermoplastic vulcanized rubber, polyisobutylene elastomers, silicone rubber, nylon elastomers, polyester elastomers, and polyamide elastomers.

[0037] Preferably, the vibration damping sleeve 12 in this embodiment is made of TPU (thermoplastic polyurethane elastomer). TPU is a polymer elastomer generated by the reaction of diisocyanate, polyol and chain extender. Its hardness range is usually between Shore 60A and Shore 70D. It has a relatively rough feel and strong friction resistance, which helps to achieve pre-fixation between the vibration damping sleeve 12 and the motherboard body 3.

[0038] When the motherboard body 3 is in contact with the housing 2, the flexible buffering of the vibration damping sleeve 12 and the locking operation of the fastener 13 can achieve flexible fixation of the motherboard body 3. Thus, when the housing 2 is subjected to an external instantaneous impact force, the vibration damping sleeve 12 flexibly connects between the motherboard body 3 and the mounting part 11, which can buffer the impact force transmitted from the housing 2 to the motherboard body 3, thereby reducing the risk of the motherboard body 3 being damaged by force during a drop.

[0039] Combination Figure 3 and Figure 4 As shown, Figure 3 This paper shows a schematic diagram of the structure of the motherboard body and the vibration damping sleeve in one embodiment of this application. Figure 4 A cross-sectional schematic diagram of an electronic device according to an embodiment of this application is shown. In some embodiments, the vibration damping sleeve 12 includes at least a fitting portion 121 and a first abutting portion 122 connected to one end of the fitting portion 121. Both the first abutting portion 122 and the fitting portion 121 are made of flexible material and are constructed as an integral structure.

[0040] Specifically, the fitting part 121 is constructed into a cylindrical structure and can pass through the motherboard body 3 along the first direction F1. After the fastener 13 passes through the vibration damping sleeve 12 along the first direction F1, the fitting part 121 surrounds the periphery of the fastener 13 and contacts the motherboard body 3, thereby enabling the motherboard body 3 and the fastener 13 to achieve flexible contact in the horizontal direction, thereby achieving flexible buffering of the motherboard body 3 in the horizontal direction.

[0041] Combination Figure 5 As shown, Figure 5 It shows Figure 4 Enlarged view of part A. In this embodiment, the first abutment portion 122 is disposed at one end of the fitting portion 121 that passes through the motherboard body 3, and can be clamped between the mounting portion 11 and the motherboard body 3 to achieve flexible contact between the motherboard body 3 and the mounting portion 11. This allows the impact force transmitted from the housing 2 to the motherboard body 3 through the mounting portion 11 when subjected to external impact to be buffered by the first abutment portion 122, thereby reducing the risk of damage to internal components of the motherboard body 3 during a drop.

[0042] In some other embodiments, the vibration damping sleeve 12 further includes a second abutment portion 123. In the first direction F1, the second abutment portion 123 and the first abutment portion 122 are respectively disposed at opposite ends of the fitting portion 121 and integrally formed with the fitting portion 121. Figure 5As shown in the example, along the first direction F1, the second abutting part 123 and the first abutting part 122 are respectively arranged at the upper and lower ends of the fitting part 121, and can be clamped together on the upper and lower end surfaces of the motherboard body 3 after the fitting part 121 passes through the motherboard body 3, so as to realize the flexible contact between the motherboard body 3 and the fastener 13, and between the motherboard body 3 and the mounting part, thereby avoiding the case where the impact force received by the shell 2 during the drop is transmitted to the motherboard body 3, causing the motherboard body 3 to fail.

[0043] The provision of the second contact part 123 and the mounting part 11 increases the distance between the motherboard body 3 and the housing 2, allowing the motherboard body 3 to be in an independent spatial position, making it less likely to come into contact or collide with other parts of the housing 2, thereby further avoiding damage to the motherboard body 3 when the housing 2 is dropped or vibrated.

[0044] Continue reading Figure 1 , Figure 4 and Figure 5 As shown, the projections of the first abutment portion 122 and the second abutment portion 123 onto the first reference plane V1 are hollow annular structures, and the projection of the fitting portion 121 onto the first reference plane V1 is also a hollow annular structure. In order to achieve flexible contact between the first abutment portion 122, the second abutment portion 123 and the motherboard body 3, the fastener 13 and the mounting portion 11, in this embodiment of the application, the radial dimensions of the first abutment portion 122 and the second abutment portion 123 are both set to be larger than the radial dimension of the fitting portion 121.

[0045] That is, the radial dimensions of the first abutment portion 122 and the second abutment portion 123 projected onto the first reference plane V1 are both larger than the radial dimension of the fitting portion 121 projected onto the first reference plane V1. This allows the first abutment portion 122 and the second abutment portion 123 to form an "overlapping" structure at both ends of the fitting portion 121, making it less likely for the vibration damping sleeve 12 to fall off when assembled inside the motherboard body 3, thus providing better initial positioning. When using the fastener 13 to fix the vibration damping sleeve 12, the torque is set evenly so that the fastener 13 will not cause significant deformation of the vibration damping sleeve 12 and the mounting portion 11 after insertion.

[0046] Continue reading Figure 5 As shown, the fastener 13 includes a head 131 and a rod 132 extending along the first direction F1 and connected to the head 131. In this embodiment, the rod 132 is integrally formed on the head 131. During assembly, the rod 132 can pass through the damping sleeve 12 along the first direction F1 and be inserted into the mounting part 11. After the rod 132 is inserted into the mounting part 11, the head 131 just abuts against the end face of the second abutment part 123 on the side opposite to the main board body 3, so as to achieve flexible fixation of the main board body 3 in the first direction F1.

[0047] Specifically, along the first direction F1, the mounting part 11 has a receiving groove 111, and the rod body 132 can be inserted into the receiving groove 111 along the first direction F1 to achieve fixation with the mounting part 11. In this embodiment, the rod body 132 is specifically a screw with external threads on its surface, and the receiving groove 111 has internal threads that cooperate with the external threads. The rod body 132 can be threadedly connected to the mounting part 11 to achieve connection and fixation between the main board body 3 and the housing 2.

[0048] Combination Figures 1 to 5 As shown, in some embodiments, this application also provides an electronic device, specifically a handheld PDA (Personal Digital Assistant) device with high-intensity drop or high-frequency vibration testing requirements. The electronic device includes a housing 2, a motherboard body 3, and a motherboard device vibration damping structure 1 as shown in any of the above embodiments. The motherboard body 3 can achieve flexible contact with the housing 2 through the motherboard device vibration damping structure 1, thereby achieving effective protection of the motherboard body 3 and its soldered components, and extending the service life of the electronic device.

[0049] Specifically, the housing 2 has an installation position, the mounting part 11 of the motherboard component vibration damping structure 1 is located at the installation position, and the motherboard body 3 is spaced apart from the housing 2 in the first direction F1, and can be detachably installed on the housing 2 by means of the motherboard component vibration damping structure 1. In this embodiment, the motherboard body 3 is fixed to the cover by fasteners 13, and a flexible connection is achieved by the setting of the vibration damping sleeve 12. When the housing 2 is subjected to a large impact force, the force on the housing 2 is not directly transmitted to the motherboard body 3, but is transmitted through the vibration damping sleeve 12. The motherboard body 3 can be fixed, but it is not completely fixed to the housing 2, but rather indirectly fixed.

[0050] In some other embodiments, multiple motherboard device vibration damping structures 1 are provided, and all motherboard device vibration damping structures 1 are arranged in an array on the surface of the housing 2. The motherboard body 3 is provided with multiple mounting holes 31 along the first direction F1, and the mounting holes 31 are provided one-to-one with the motherboard device vibration damping structures 1. The motherboard device vibration damping structures 1 can pass through the mounting holes 31 along the first direction F1 to achieve flexible fixation between the motherboard body 3 and the housing 2.

[0051] by Figure 1As shown in the example, the surface of the housing 2 has four mounting positions, and the motherboard body 3 also has four mounting holes 31 running through it along the first direction F1. The four mounting holes 31 are respectively located at the four top corners of the motherboard body 3. Each mounting position of the housing 2 is provided with a motherboard device vibration damping structure 1. The motherboard body 3 can be fixed at four points with the housing 2 by means of the motherboard device vibration damping structure 1 to ensure the stability of the connection between the motherboard body 3 and the housing 2 and to avoid damage to the motherboard body 3 due to abnormal displacement.

[0052] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0053] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A motherboard component vibration damping structure for connecting the motherboard body to the housing of an electronic device, characterized in that, The vibration damping structure includes: The mounting portion extends along a first direction and can be mounted on the housing of an electronic device, the first direction being defined as the connection direction between the motherboard body and the housing; The vibration damping sleeve is made of flexible material and can be inserted into the motherboard body along the first direction; and Fasteners are inserted through the vibration damping sleeve along the first direction and connected to the mounting portion to connect the motherboard body to the mounting portion.

2. The motherboard component vibration damping structure according to claim 1, characterized in that, The vibration damping sleeve includes a fitting portion and a first abutting portion connected to the fitting portion. The fitting portion can pass through the motherboard body in a first direction, and the first abutting portion can be clamped between the mounting portion and the motherboard body.

3. The motherboard component vibration damping structure according to claim 2, characterized in that, The vibration damping sleeve also includes a second abutting portion. In the first direction, the second abutting portion and the first abutting portion are disposed at opposite ends of the fitting portion and can be clamped together on the motherboard body.

4. The motherboard component vibration damping structure according to claim 3, characterized in that, The radial dimensions of the first abutting portion and the second abutting portion projected onto the first reference plane are both greater than the radial dimension of the fitting portion projected onto the first reference plane, and the first reference plane is perpendicular to the first direction.

5. The motherboard component vibration damping structure according to claim 3, characterized in that, The fastener includes a head and a rod extending along a first direction and connected to the head. The rod is capable of passing through the mounting portion along the first direction. After the rod is inserted into the mounting portion, the head abuts against the end face of the second abutment portion on the side opposite to the motherboard body.

6. The motherboard component vibration damping structure according to claim 5, characterized in that, Along the first direction, the mounting part includes a receiving groove, the rod body can be inserted into the receiving groove along the first direction, the surface of the rod body has an external thread, the receiving groove is provided with an internal thread that mates with the external thread, and the rod body can be threadedly connected to the mounting part.

7. The motherboard component vibration damping structure according to claim 1, characterized in that, The flexible material includes at least one of thermoplastic elastomers, thermoplastic vulcanized rubber, polyisobutylene-based elastomers, silicone rubber, nylon elastomers, polyester elastomers, and polyamide elastomers.

8. An electronic device, characterized in that, include: Housing, including the mounting location; The motherboard device vibration damping structure as described in any one of claims 1-7 is disposed at the mounting position; and The motherboard body is spaced apart from the housing in the first direction, and the motherboard body is detachably connected to the housing by means of the motherboard device vibration damping structure.

9. The electronic device according to claim 8, characterized in that, The motherboard device vibration damping structure is provided in multiple ways, and all of the motherboard device vibration damping structures are arranged in an array on the housing.

10. The electronic device according to claim 8, characterized in that, The motherboard body is provided with a plurality of mounting holes along the first direction. The mounting holes are provided one-to-one with the vibration damping structure of the motherboard components. The vibration damping structure of the motherboard components can be inserted through the mounting holes along the first direction.

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