Active heat dissipation device

Abstract

The utility model relates to an active heat dissipation device, which comprises a heat conduction plate main body, a heat dissipation plate main body, a heat dissipation plate main body, a heat dissipation plate main body and a heat dissipation plate main body, and a refrigerant damper disposed in the middle of the refrigerant flow space in the thickness direction, the refrigerant damper elastically absorbing volume expansion of the refrigerant after freezing without increasing the separation distance between one side surface and the other side surface of the refrigerant flow space when volume expansion is caused by freezing of the refrigerant, therefore, the device has the advantage of being capable of preventing products from being damaged in severe cold.

Description

TECHNICAL FIELD

[0001] The present utility model relates to an active heat dissipation apparatus, more specifically, an active heat dissipation apparatus capable of improving heat dissipation performance by actively transferring heat generated from a heat generating apparatus (for example, an electronic device) through phase change of a more effective refrigerant than the heat conduction material characteristic of itself. BACKGROUND

[0002] In various industrial fields such as communication, electronics, and electricity, related technologies are in a trend of continuous and high development in order to be applied to more advanced industries. In order to achieve high technology development, high output energy is required, and devices using high output energy inevitably face high heat generation problems, and thus a cooling system suitable for the level is required to be simultaneously developed.

[0003] A heat dissipation system is used in various industries such as air conditioning, mobile communication, data centers, aviation mobility, electric vehicles, energy storage devices, and displays. Such a heat dissipation system is one of the main causes of power consumption, and as the industry develops, power consumption is gradually increasing.

[0004] Generally, a heat dissipation apparatus is roughly divided into an active cooling device and a passive cooling device, the active cooling device mainly uses forced convection based on a fan, and the passive cooling device can be divided into a technology using natural convection without using a fan.

[0005] However, the existing heat dissipation system has limitations in releasing high heat generated according to the continuous development of high technology. Therefore, in the related industrial field, an innovative technology capable of solving such a problem is required, and as a link for solving such a problem, a heat dissipation apparatus is being developed.

[0006] Phase change refers to a phenomenon in which the inherent state of a liquid / gas / solid accumulates a large amount of energy or releases stored heat energy, and changes.

[0007] Phase change refers to a change in physical arrangement of molecules, not a chemical reaction such as chemical bonding or formation, and the heat of a substance in a state in which no phase change occurs when energy is applied is called sensible heat, and the heat used when a phase change occurs is called latent heat.

[0008] However, since the temperature is proportional to the pressure, there is a problem in that the pressure increases as the temperature of the heat dissipation device increases. In a sealed heat dissipation device, if the pressure increases due to the high temperature conducted from the heat generating body, the heat dissipation device itself can be broken. In order to solve the above problem, it is necessary to prevent the pressure from increasing, and in the heat dissipation device, a sufficient internal volume capable of achieving pressure balance during the phase change cycle of the substance is required.

[0009] In particular, the phase change substance is preferably capable of phase changing from a gas state to a liquid state in a small temperature range, and also satisfies the conditions of being inexpensive and having a small environmental impact, and a typical phase change substance can be water.

[0010] However, it is also pointed out that water, which freezes to ice in a solid state at 0°C or less, can cause damage to a component that houses water as a refrigerant due to the physical property of significantly increasing in volume when freezing. Invention Content

[0011] Technical Problem

[0012] To solve the above technical problem, the present application aims to provide an active heat dissipation device capable of improving the heat dissipation performance of a heat generating device (electronic device).

[0013] Further, another object of the present application is to provide an active heat dissipation device capable of maximizing the heat transfer capacity of a refrigerant filled therein.

[0014] In addition, still another object of the present application is to provide an active heat dissipation device having excellent manufacturability.

[0015] In addition, still another object of the present application is to provide an active heat dissipation device capable of exerting the same or higher effect than the existing heat dissipation performance while producing a low-cost product by replacing a metal material having low thermal conductivity.

[0016] In addition, still another object of the present application is to provide an active heat dissipation device capable of not only using water, which is inexpensive and has a small environmental impact, as a refrigerant, but also solving the problem of damage to a component due to an increase in volume when water freezes.

[0017] The technical problems expected to be solved by the utility model are not limited to the above-mentioned technical problems, and other technical problems not mentioned can be clearly understood by those skilled in the art through the following description.

[0018] Technical scheme

[0019] According to an embodiment of the active heat dissipation device of the utility model, the active heat dissipation device comprises: a heat conduction plate body internally provided with a refrigerant flow space for filling and flowing of refrigerant; and a refrigerant damper arranged in the middle of the thickness direction of the refrigerant flow space, which elastically absorbs the volume expansion of the refrigerant after freezing when the volume expansion of the refrigerant is caused by freezing.

[0020] The refrigerant flow space can comprise: a first refrigerant flow path storing liquid refrigerant in the refrigerant and provided in an evaporation area in which the stored liquid refrigerant is phase changed into a gas state by heat supplied from a heat dissipation housing body as a heat generation object; and a plurality of second refrigerant flow paths formed in the gravity direction or obliquely with respect to the gravity direction toward the first refrigerant flow path and guiding liquid refrigerant in the refrigerant phase changed from a gas state to a liquid state to flow to the first refrigerant flow path side, wherein the refrigerant damper is arranged at the second refrigerant flow path side.

[0021] In addition, the refrigerant damper can be arranged in a condensation area other than the evaporation area.

[0022] In addition, the heat conduction plate body can comprise: a one-side heat conduction plate forming one side of the refrigerant flow space; and another-side heat conduction plate forming the other side of the refrigerant flow space, wherein the refrigerant damper is fixed in the refrigerant flow space corresponding to the middle part of the one-side heat conduction plate and the other-side heat conduction plate.

[0023] In addition, one surface of the refrigerant damper can be arranged to have a predetermined interval distance from the inner side surface of the one-side heat conduction plate, and the other surface can be arranged to have a predetermined interval distance from the inner side surface of the other-side heat conduction plate.

[0024] In addition, the heat conduction plate body can further be formed with a plurality of strength reinforcing parts provided to protrude from the one-side heat conduction plate and the other-side heat conduction plate to the refrigerant flow space side, wherein the refrigerant damper is fixed by the plurality of strength reinforcing parts in the refrigerant flow space in mutual surface contact.

[0025] Further, the refrigerant damper can be formed with a plurality of through-holes formed therethrough so that the plurality of strength reinforcing portions formed in the one side heat conducting plate and the other side heat conducting plate are penetrated and surface-contacted within the refrigerant flow space.

[0026] Further, in a case where the plurality of strength reinforcing portions are formed with joint surfaces of a planar shape of a predetermined diameter at the respective front end portions, the plurality of through-holes formed in the refrigerant damper can be formed to have an inner diameter greater than the diameter of the joint surfaces of the plurality of strength reinforcing portions.

[0027] Further, the heat conducting plate main body can further be formed with a plurality of inclined guides which protrude from the one side heat conducting plate and the other side heat conducting plate toward the refrigerant flow space side and protrude to a depth at which the inclined guides do not surface-contact each other, and are inclined downward to guide the condensed liquid refrigerant to flow toward the inclined downward side with respect to the direction of gravity, one surface of the refrigerant damper being closely fitted to the inclined guide of the one side heat conducting plate, and the other surface of the refrigerant damper being closely fitted to the inclined guide of the other side heat conducting plate.

[0028] Further, the refrigerant damper can be made of an elastic material which is deformed in shape by an external force, and formed so that the thickness thereof in a state where the external force is not applied is greater than the minimum interval distance of the inclined guide of the one side heat conducting plate and the inclined guide of the other side heat conducting plate.

[0029] Further, when one surface and the other surface of the refrigerant damper are closely fitted to and fixed to the inclined guides formed on one surface and the other surface of the one side heat conducting plate and the other side heat conducting plate, respectively, the inner diameter of the plurality of through-holes formed in the refrigerant damper can be formed to be a size which does not contact the front end of the plurality of strength reinforcing portions.

[0030] Further, in a case where a single metal plate member is joined after being bent or two metal plate members are joined, a part of the plurality of strength reinforcing portions can surface-contact through the plurality of through-holes formed in the refrigerant damper, and then be joined to each other by welding.

[0031] Further, in a case where the heat conducting plate main body is fixed to a press-in portion formed in the back surface of the heat dissipation housing main body so as to be inclined with respect to the direction of gravity or the direction of gravity, the refrigerant damper can be disposed at a lower side position with respect to the direction of gravity in the heat conducting plate main body.

[0032] Further, the refrigerant damper can be made of an elastic material which includes a rubber material capable of elastically absorbing a volume corresponding to the expansion at least when the volume is expanded due to the freezing of the refrigerant.

[0033] Advantageous effects

[0034] According to one embodiment of the active heat dissipation device of this utility model, the following multiple effects can be achieved.

[0035] First, on the back of the heat dissipation housing, the heat concentration caused by the rising airflow is minimized, and active heat transfer based on the phase change of the refrigerant is achieved, thereby significantly improving the overall heat dissipation performance.

[0036] Secondly, by shortening the gas-liquid circulation cycle time of the refrigerant filled inside, the heat transfer capacity is maximized, thereby improving the heat dissipation performance.

[0037] Third, by replacing the material of the heat-conducting plate body that constitutes the refrigerant flow space for refrigerant phase change flow with stainless steel (SUS), a metal material lower than aluminum, the heat dissipation performance can be achieved better than that of the existing heat-conducting plate body made of aluminum.

[0038] Fourth, by clamping a refrigerant damper on the lower side of the main storage liquid refrigerant in the direction of gravity, the product can be prevented from being damaged by freezing during severe cold periods, even when distilled water (water) is used as the refrigerant filled in the SUS material heat-conducting plate body. Attached Figure Description

[0039] Figure 1 This is a perspective view showing an example of the arrangement of the rear part of the antenna device of an active heat dissipation device according to an embodiment of the present invention.

[0040] Figure 2 yes Figure 1 An exploded 3D diagram.

[0041] Figure 3 This is an unfolded view showing an active heat dissipation device according to an embodiment of the present invention.

[0042] Figure 4 It shows the basis Figure 3 A flowchart illustrating the manufacturing process of an active heat dissipation device according to an embodiment of the present invention, showing the bending method.

[0043] Figure 5 This is a plan view of an active heat dissipation device according to an embodiment of the present invention, and a perspective view showing its interior.

[0044] Figure 6 It is shown Figure 5 A three-dimensional view of the refrigerant flow space inside the main body of the heat-conducting plate, with one side of the heat-conducting plate removed.

[0045] Figure 7 yes Figure 6a partial enlarged perspective view thereof.

[0046] Figure 8 is a perspective view showing Figure 6 a refrigerant damper in the structure of

[0047] Figure 9 is a sectional view taken along the A-A line of Figure 5 and a partial enlarged view thereof.

[0048] Explanation of Reference Numerals

[0049] 100: antenna device; 110: heat dissipation case main body

[0050] 200: active heat dissipation device; 200-1: one side heat conducting plate

[0051] 200-2: other side heat conducting plate; 201: press-in end portion

[0052] 203: heat dissipation plate portion; 205: refrigerant flow space

[0053] 210: first refrigerant flow path; 215: inclined guide

[0054] 220: second refrigerant flow path; 230: third refrigerant flow path

[0055] 240: plurality of strength reinforcing portions; 250: refrigerant damper

[0056] 255: through hole; 300: absorber

[0057] T: arbitrary reference line DETAILED DESCRIPTION

[0058] Hereinafter, an embodiment of an active heat dissipation device according to the present application will be described in detail with reference to the drawings.

[0059] Note that, in assigning reference numerals to the constituent elements of each drawing, the same constituent element is assigned the same reference numeral as much as possible even if the reference numeral is marked on different drawings. Further, in explaining the embodiment of the present application, in a case where it is judged that a detailed explanation of a related known structure or function hinders the understanding of the embodiment of the present application, the detailed explanation thereof is omitted.

[0060] In describing the constituent elements of embodiments of this utility model, terms such as first, second, A, B, (a), and (b) may be used. These terms are used only to distinguish one constituent element from other constituent elements, and the nature, order, or sequence of the corresponding constituent elements are not limited by these terms. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary knowledge in the art to which this utility model pertains. Terms identical to those defined in commonly used dictionaries should be interpreted as having the same meaning as in the context of the related art, and should not be construed as having an ideal or overly formal meaning unless expressly defined in this application.

[0061] Typically, heat-generating devices (electronic devices) are manufactured in various forms throughout the industry, but the applicant of this utility model is an enterprise engaged in the manufacturing of other wireless communication equipment. A typical heat-generating device (electronic device) in wireless communication equipment is an antenna device, and the antenna device will be used as a specific example for illustration below.

[0062] However, the active heat dissipation device according to the embodiments of the present invention described below should not be construed as being limited to application in antenna devices.

[0063] like Figure 1 and Figure 2 As shown, the antenna device 100 of the active heat dissipation device 200 according to an embodiment of the present invention includes: a heat dissipation housing body 110, which forms a receiving space with an opening in front and is formed into a cuboid shape with a front and rear receiving width that is generally longer and thinner in the vertical direction.

[0064] The heat sink housing body 110 may be made of a thermally conductive material (especially a metal material) so that heat can be effectively transferred to the heat-generating element (not shown) through surface thermal contact.

[0065] Although not shown, a motherboard can be stacked inside the receiving space of the heat sink housing body 110, using a clamshell as a medium, to serve as a substrate for a power amplifier unit (PAU) and a digital transceiver unit (DTU). The motherboard can have multiple micro bellows filter (MBF) elements mounted on its front surface and a heat-generating element mounted on its back surface.

[0066] Among them, the main board can be defined as a heat generating element such as a radio frequency integrated circuit (RFIC: Radio Frequency Integrated Circuit) element or a power amplifier (PA: Power Amplifier) that generates a large amount of heat when driven. However, it should be noted that in the embodiments of the present application, only electronic devices are used as antenna devices for explanation, and the heat generating element is not limited to the above configuration. For example, semiconductors or CPUs of PCs, etc. as typical heat generating elements can also be used as heat generating elements.

[0067] The front surface of the heat dissipation housing body 110 can be provided with an antenna cover panel 50, so that the radiation element implemented as an antenna element can be protected from external influences, while the radiation element can be smoothly radiated.

[0068] However, as described above, the antenna device with a large heat dissipation requirement in the electronic device is provided with an antenna cover panel 50 which is not suitable for heat dissipation along the front surface of the heat dissipation housing body 110, so that the requirement for concentrated heat dissipation through the remaining part other than the front surface of the heat dissipation housing body 110 is greater, and an effective heat dissipation design through limited heat dissipation area is required.

[0069] In addition, the back surface of the heat dissipation housing body 110 can be provided with an active heat dissipation device 200 according to an embodiment of the present application.

[0070] The active heat dissipation device 200 according to an embodiment of the present application is equipped in the form of a heat dissipation fin, strictly speaking, which is different from the fixed type heat dissipation fin 200F-1, 200F-2 described later, characterized by being equipped as a vapor chamber type with a relatively thin thickness filled with refrigerant inside, wherein the refrigerant is a substance that must be phase changed by heat supplied from the outside.

[0071] Among them, the inside of the active heat dissipation device 200 according to an embodiment of the present application can include an absorber (not shown) that absorbs and retains liquid refrigerant in the refrigerant near the heat generating element, and promotes evaporation of the liquid refrigerant to gaseous refrigerant.

[0072] The concept of retaining liquid refrigerant by the absorber is not limited to simply absorbing and storing liquid refrigerant, but can be understood as including the concept of flowing at least liquid refrigerant in the opposite direction (upper side) with respect to the direction of gravity higher than its water surface by the absorption force (or capillary force).

[0073] Generally, in the interior of the well-known (already known) vapor chamber, a wick member having a wick structure formed with a plurality of air holes is generally equipped. The wick member here can be manufactured in a form in which a powder of a metal material is sintered to form a plurality of air holes that allow a liquid refrigerant filled in the interior of a panel member of a heat conductive material to move to a side equipped with a heating element by capillary force while allowing a gaseous refrigerant to freely flow to the outside.

[0074] However, the wick member is not limited to the sintered metal wick member described above, and in particular, in the range in which it can absorb and disperse a liquid refrigerant or promote vaporization, it can be defined as a concept including all possible materials such as a fiber material, regardless of the name such as the absorber 300.

[0075] As shown in FIGS. 1 and 2, the heat dissipation housing body 110 can be provided with a plurality of protrusions 150 on the back surface thereof. Figure 1 Figure 2 As shown in FIGS. 1 and 2, the heat dissipation housing body 110 can be provided with a trench structure 170 in which a portion dividing a middle portion between left and right ends upward and downward is empty.

[0076] In the back surface of the heat dissipation housing body 110 corresponding to the left and right sides of the trench structure 170, a plurality of protrusions 150 are provided so that the plurality of active heat dissipation devices 200 according to an embodiment of the present application are respectively inclined upward toward the left end and the right end. That is, the protrusions 150 are provided to respectively face upward toward the left and right, with the trench structure 170 as a center, so that the pair of active heat dissipation devices 200 fixed thereto can be arranged in a pattern in the upward and downward directions while forming a "V" shape.

[0077] In addition, the active heat dissipation device 200 according to an embodiment of the present application can be provided in a plurality, and all are formed in a rectangular shape having the same size formed longer in the same length direction, as shown in FIGS. 1 and 2. Figure 1 Figure 2 As shown in FIGS. 1 and 2, in the case where the active heat dissipation devices 200 of the same size are provided in the plurality of protrusions 150, one position of an inverted triangular shape on the upper portion of the back surface of the heat dissipation housing body 110 and two positions of right triangular shapes on the left and right sides of the lower portion of the back surface of the heat dissipation housing body 110 are not occupied by the active heat dissipation devices 200, and in this case, the fixed-type heat dissipation fins 200F-1 and 200F-2 can be arranged.

[0078] As shown in FIGS. 1 and 2, the heat dissipation housing body 110 can be provided with a plurality of protrusions 150 on the back surface thereof. Figure 2 ​​As shown, the fixed-type heat dissipation fins 200F-1, 200F-2 include: an upper fixed-type heat dissipation fin 200F-1 arranged on the upper side of the back surface portion of the heat dissipation housing body 110 not occupied by the active heat dissipation device 200 according to an embodiment of the present application; and a lower fixed-type heat dissipation fin 200F-2 arranged on the left and right lower sides of the back surface portion of the heat dissipation housing body 110 not occupied by the active heat dissipation device 200 according to an embodiment of the present application.

[0079] Unlike the active heat dissipation device 200 according to an embodiment of the present application, the fixed-type heat dissipation fins 200F-1, 200F-2 described above are equipped in the form of ordinary heat dissipation fins that do not include a refrigerant inside, and can be processed using an aluminum material or an aluminum alloy material having excellent thermal conductivity among metal materials.

[0080] In the region equipped with the groove structure 170 formed on the back surface of the heat dissipation housing body 110 implemented through the first setting implementation example and in the region (inverted triangular region) 130 in which the upper fixed-type heat dissipation fin 200F-1 of the fixed-type heat dissipation fins 200F-1, 200F-2 is provided, a heat transfer medium (not shown) formed using a general vapor chamber type can be provided.

[0081] In addition, as shown in FIG. 1, Figure 2 On the back surface of the heat dissipation housing body 110, a press-in portion 150 provided for press-in of a plurality of active heat dissipation devices 200 according to an embodiment of the present application can be formed.

[0082] At this time, although not shown, the press-in portion 150 is preferably press-inserted after thermal epoxy treatment to improve heat transfer efficiency.

[0083] Figure 3 FIG. 1 is a perspective view showing an active heat dissipation device according to an embodiment of the present application, Figure 4 FIG. 2 is a perspective view showing a bending method of the active heat dissipation device according to an embodiment of the present application, Figure 3 FIG. 3 is a flowchart showing a manufacturing process of the active heat dissipation device according to an embodiment of the present application.

[0084] As shown in FIG. 1, Figure 3 and Figure 4 The active heat dissipation device 200 according to an embodiment of the present application includes: thermally conductive plate bodies 200-1, 200-2 equipped as a single metal plate member with a refrigerant flow space in which a refrigerant is filled and flows inside after bending through a bonding process.

[0085] That is, the active heat dissipation device 200 according to an embodiment of the present application can be manufactured to have a refrigerant flow space in which a refrigerant is filled and flows inside after bending through a bonding process with reference to Figure 4The heat conducting plate body 200-1, 200-2, which is a single metal plate member, is bent and then bonded, thereby forming a sealed refrigerant flow space 205 inside.

[0086] The heat conducting plate body 200-1, 200-2, which is a single metal plate member, is bent and then bonded, thereby forming a sealed refrigerant flow space 205 inside.

[0087] The refrigerant flow space 205 can include a first refrigerant flow path 210 provided at a position on the lower side with respect to the direction of gravity so as to collect or store liquid refrigerant, and form an evaporation region in which liquid refrigerant is phase-changed into gaseous refrigerant, and a second refrigerant flow path 220 provided at a condensation region other than the first refrigerant flow path 210, and guide liquid refrigerant phase-changed from gaseous refrigerant to the evaporation region.

[0088] That is, when a position formed by the bending is defined as an evaporation region in which liquid refrigerant in the refrigerant is evaporated, and a remaining position other than the evaporation region is defined as a condensation region, the second refrigerant flow path 220 can be provided at the condensation region.

[0089] In particular, the first refrigerant flow path 210 is a portion that is shape-deformed by the bending in the predetermined method of the single metal plate member, and is formed so that liquid refrigerant in the refrigerant is filled between interval distances based on the thickness of the material of the metal plate member, with respect to the heat generating element or the press-in portion 150 provided with the heat generating element.

[0090] In this case, the first refrigerant flow path 210, which is a portion that stores and retains liquid refrigerant filled in the refrigerant flow space 205, can be arranged vertically up and down in the direction of gravity or at least the upper end and the lower end with respect to the direction of gravity. Accordingly, the liquid refrigerant stored in the first refrigerant flow path 210 is located at a position closer to the lower end among the at least inclinedly arranged upper end and lower end.

[0091] However, the first refrigerant flow path 210 is not a concept that is physically completely separated (divided) from the condensing region in which the plurality of second refrigerant flow paths 220 are formed, and even if defined as the first refrigerant flow path 210, as described above, a portion below the water surface of the refrigerant is filled with the refrigerant, but there can be a first refrigerant flow path 210 above the water surface of the refrigerant, and a structure such as an adsorber for raising the stored refrigerant to the first refrigerant flow path 210 above the water surface thereof can be required.

[0092] In addition, the active heat dissipation device 200 according to an embodiment of the present application can be manufactured by bending and joining the single heat conducting plate bodies 200-1, 200-2 with a predetermined arbitrary reference line T (see FIG. 2) as a reference, thereby forming a sealed refrigerant flow space 205 inside. Figure 4

[0093] Therefore, the first refrigerant flow path 210, as a portion deformed by the bending, can be defined as a refrigerant filling and flow space that is filled with liquid refrigerant in the refrigerant between the interval distance based on the thickness of the material of the metal plate member with respect to the heat generating element or the press-in portion 150 provided with the heat generating element.

[0094] However, as described above, the manufacturing method of the active heat dissipation device according to the present application is not limited to the case of manufacturing a single metal plate member by bending, and two metal plate members can be directly joined without a bending process.

[0095] In addition, the second refrigerant flow path 220 is formed in the condensing region in a plurality of numbers in addition to the first refrigerant flow path 210, and functions as a flow path for the liquid refrigerant condensed from a gaseous state to a liquid state in the refrigerant from the other end portion of the heat conducting plate body 200-1, 200-2 in the width direction to the first refrigerant flow path 210 side by surface tension or gravity.

[0096] In more detail, if the gaseous refrigerant (gaseous refrigerant) is condensed into a liquid refrigerant (liquid refrigerant) by heat exchange with the outside air in the condensing region, the volume of the original position of the second refrigerant flow path 220 in the refrigerant flow space 205 in which condensation is performed gradually increases, and when flowing in the direction of gravity, a flow path is provided in a manner of supplying a uniform amount of liquid refrigerant to the first refrigerant flow path 210 side.

[0097] ​In particular, as described below, the second refrigerant flow path 220 can be defined between the plurality of inclined guides 215, and when the liquid refrigerant condensed in the condensing region flows to the first refrigerant flow path 210 side, dispersion flow to the second refrigerant flow path 220 side adjacent to the second refrigerant flow path 220 as the flow path of itself can be inhibited by surface tension.

[0098] That is, since the flow space of the plurality of inclined guides 215 is smaller than the flow space of the second refrigerant flow path 220, surface tension acts to thereby inhibit flow toward the adjacent second refrigerant flow path 220 side.

[0099] As described above, if dispersion flow of the condensed liquid refrigerant is inhibited by the plurality of inclined guides 215 and the second refrigerant flow path 220, it is ultimately possible to minimize the phenomenon of the liquid refrigerant falling vertically in the direction of gravity, and by the respective lower ends connected at uniform intervals with respect to the first refrigerant flow path 210, the liquid refrigerant condensed in the condensing region is not biased, and it is possible to supply to the first refrigerant flow path 210 side in a uniform amount.

[0100] Also, the plurality of second refrigerant flow paths 220 can be defined between the plurality of inclined guides 215 protruding symmetrically from the inside of the refrigerant flow space 205 of the facing surfaces of the thermally conductive plate body 200-1, 200-2.

[0101] Referring to Figure 4 (a), the active heat dissipation device 200 according to an embodiment of the present application can simultaneously form the first refrigerant flow path 210 and the second refrigerant flow path 220 described above and the plurality of inclined guides 215 described below for implementing the same by a stamping process before bending the thermally conductive plate body 200-1, 200-2 made of a single member using a predetermined thermally conductive material.

[0102] At this time, in the case where the thermally conductive plate body 200-1, 200-2 in a flat and unfolded state before the bending process is formed in a rectangular shape having a width in the left-right direction smaller than the length in the up-down direction on the drawing of Figure 4 the above-described reference line T is a central portion disposed to pass through the left and right ends in the up-down direction, and can serve as a reference at the time of bending. At this time, the central portions of the left and right ends of the thermally conductive plate body 200-1, 200-2 are intermediate portions, and can be understood as boundary portions of the one-side thermally conductive plate 200-1 and the other-side thermally conductive plate 200-2.

[0103] Referring to Figure 4The (b) and (c) of FIG. 1 can be bent by a bending jig or the like not shown so as to be in contact with each other with respect to an arbitrary reference line T, such that the one side heat conducting plate 200-1 corresponding to the left side and the other side heat conducting plate 200-2 corresponding to the right side are in contact with each other.

[0104] At this time, in addition to the first refrigerant flow path 210 and the second refrigerant flow path 220, a third refrigerant flow path 230 additionally formed according to an embodiment can be formed, and a plurality of strength reinforcing portions 240 required for bonding can be formed to be in surface contact with each other.

[0105] Referring to Figure 4 (d), if the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 of the heat conducting plate body 200-1, 200-2 are in surface contact with each other, each of the plurality of strength reinforcing portions 240 in surface contact with each other can be bonded to each other by a predetermined bonding method while being bonded to each other along the edge end portions thereof.

[0106] At this time, in order for a refrigerant filling process and a caulking process to be described later, one end and the other end of the first refrigerant flow path 210 formed by the bending process can be formed to be in communication with the outside of the refrigerant flow space 205, and the remaining portion (the heat radiating plate portion 203) can be sealingly bonded so as to completely block the refrigerant flow space 205 from the outside.

[0107] In more detail, as Figure 4 shown in FIG. 1, the active heat dissipation device 200 according to an embodiment of the present application can include, with respect to an arbitrary reference line T defined in a straight line shape in the upward and downward directions, a one side heat conducting plate 200-1 forming a left side end portion before bending, and an other side heat conducting plate 200-2 forming a right side end portion before bending. The one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 can be understood as the heat conducting plate body 200-1, 200-2 before the bending process.

[0108] For example, the heat conducting plate body 200-1, 200-2, as a portion formed by the bending process and the bonding, can be defined to include a press-in end portion 201 press-in bonded to the press-in portion 150 formed to be inclined upward to the left side and the right side, respectively, with the groove structure 170 formed on the back surface of the heat radiating housing body 110 as a center, and a heat radiating plate portion 203 defined as a portion of the edge end portion of the heat conducting plate body 200-1, 200-2 other than the press-in end portion 201, performing heat dissipation according to phase change of the refrigerant and heat exchange with the outside air (ambient air).

[0109] That is, the heat sink portion 203, as a part other than the aforementioned press-in end 201, is preferably defined as all areas where heat dissipation is performed after the refrigerant (especially gaseous refrigerant) filled inside exchanges heat with the outside air. The heat exchange between the gaseous refrigerant in the heat sink portion 203 and the outside air means that the gaseous refrigerant condenses and changes phase into liquid refrigerant.

[0110] In addition, the heat sink portion 203 may have a plurality of strength reinforcement portions 240 protruding from the inner surface of one side heat conduction plate 200-1 and the inner surface of the other side heat conduction plate 200-2, which are separated along the thickness direction, into the refrigerant flow space 205.

[0111] Furthermore, as described below, multiple strength-enhancing portions 240 are formed simultaneously with the second refrigerant flow path 220, the third refrigerant flow path 230, and multiple inclined guides 215 through a stamping process, and after joining, when viewed from the outside, they can be understood as being formed recessed from the outside of the heat sink portion 203.

[0112] The first refrigerant flow path 210 can be defined as a flow path that performs the following function: if the refrigerant, which is mainly in a liquid phase in the refrigerant flow space 205 and is located on the lower side with reference to the direction of gravity, flows downward along the direction of gravity, then while being captured on the same inclined guide 215, the liquid refrigerant is uniformly moved and dispersed throughout the entire evaporation region by the heat transferred from the heating element of the heat dissipation housing body 110 to become gaseous. At this time, the uniform movement and dispersion of the liquid refrigerant in the function of the first refrigerant flow path 210 can refer to the concept of moving the liquid refrigerant in a direction at least different from the direction of gravity by means of the absorber described later.

[0113] Furthermore, in the function of the first refrigerant flow path 210, the uniform movement and dispersion of liquid refrigerant can be understood as the concept of uniformly supplying and transferring liquid refrigerant by means of multiple second refrigerant flow paths 220 or multiple inclined guides 215 formed at an inclination relative to the single first refrigerant flow path 210.

[0114] An absorber, described later, is inserted inside the first refrigerant flow path 210, thereby promoting the capture and dispersion of the liquid refrigerant and its movement in a direction different from the direction of gravity.

[0115] Among them, such as Figure 5 As shown, after bending, the first refrigerant flow path 210 can be formed symmetrically with respect to each other along the thickness direction of the refrigerant flow space 205 with any reference line T as a reference.

[0116] For transferring the heat generated by the heat generating body to the refrigerant filled in the refrigerant flow space 205, the most widely used material in the current industry is aluminum in the metal material constituting the heat conducting plate body 200-1, 200-2 which plays the role of the actual medium.

[0117] As is well known, aluminum (Al) material has a thermal conductivity of about 230 W / m.K and a specific gravity as small as 2.7, and thus aluminum (Al) material is one of the most commonly used materials for heat dissipation elements.

[0118] However, although the thermal conductivity and specific gravity of aluminum material are good, the cost price thereof is relatively high, and it has the disadvantage that the type of refrigerant filled therein is limited. In particular, in the case where the refrigerant is distilled water (water), the aluminum material can have a predetermined chemical reaction with the water in contact therewith, thereby generating a hydrogen compound in the closed refrigerant flow space 205, and thus there is a problem of increasing the internal pressure, and among the alternative refrigerants, distilled water (water) which is inexpensive and has no environmental pollution at all must be excluded.

[0119] Hereinafter, in the active heat dissipation device 200 according to an embodiment of the present application, as described above, in order to solve the problems of cost increase and exclusion of distilled water (water) when aluminum material is selected as the material of the heat conducting plate body 200-1, 200-2, stainless steel (SUS) material which can have a very small chemical reaction with distilled water (water) when in contact therewith and has a relatively low manufacturing cost can be used as the refrigerant, but the description is made on the premise of ensuring the thermal conductivity (heat dissipation performance) corresponding to the case where aluminum material is used.

[0120] Figure 6 is a plan view of the active heat dissipation device according to an embodiment of the present application, and is a perspective view showing the inside thereof, Figure 5 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figure 7 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figure 6 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figure 8 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figure 6 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figure 9 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figure 5 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of Figures 5 to 9 is a perspective view showing the inside of the refrigerant flow space in a state where one side heat conducting plate of the heat conducting plate body of

[0121] Hereinafter, the case where distilled water (water) is selected as the refrigerant will be defined and described, and the description will be made on the premise of the phase change characteristics of water in a natural state.

[0122] In the active heat dissipation device 200 according to an embodiment of the present application, the refrigerant filled in the refrigerant flow space 205 is distilled water (water), and considering the volume change when it changes phase, it can be filled to the extent of the water surface in a liquid refrigerant state formed at the lower side with respect to the gravity direction.

[0123] For example, if the refrigerant changes phase from a liquid refrigerant to a gaseous refrigerant, its volume becomes very large, and considering this, a small amount of liquid refrigerant can be filled in advance.

[0124] In addition, for the active heat dissipation device 200 according to an embodiment of the present application, only the case in which the refrigerant is evaporated from a liquid state and changes phase to a gaseous state and the refrigerant is condensed from a gaseous state and changes phase to a liquid state is expected, and during a state in which the operation of the antenna device is stopped or a severe cold period in which the outside air temperature sharply decreases, the liquid state refrigerant can freeze in the closed refrigerant flow space 205.

[0125] In particular, as in the active heat dissipation device 200 according to an embodiment of the present application, when the material of the heat conducting plate body 200-1, 200-2 can be SUS material and the refrigerant filled in the inside thereof can be water, at an air temperature of zero or less, which is the freezing point of water, a problem in which the liquid refrigerant can easily freeze can occur.

[0126] The freezing of the liquid refrigerant in the closed refrigerant flow space 205 actually starts from the inside surface of the one side heat conducting plate 200-1 and the inside surface of the other side heat conducting plate 200-2, which are in contact with the outside air (ambient air), toward the middle portion of the refrigerant flow space 205, and when it freezes, the expansion rate of water is 10%, and by the expansion of the frozen volume, the engagement force of the plurality of strength reinforcing portions 240 is weakened, and in some cases, a problem in which the product itself can be damaged can occur.

[0127] The active heat dissipation device 200 according to an embodiment of the present application, in order to prevent the product damage caused by the freezing of the refrigerant as described above, as shown in Figure 9 may further include a refrigerant damper 250 disposed in the middle of the thickness direction of the refrigerant flow space 205 and elastically absorbing the volume expansion of the refrigerant after freezing without increasing the interval distance between the one side surface and the other side surface of the refrigerant flow space 205 when the volume expansion is caused by the freezing of the refrigerant.

[0128] The refrigerant damper 250 can be fixed in the refrigerant flow space 205 corresponding to the middle portions of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2.

[0129] At this time, as Figure 7As shown, one surface of the refrigerant damper 250 can be disposed to have a predetermined spaced distance from the inner side surface of the one side heat conducting plate 200-1, and the other surface can be disposed to have a predetermined spaced distance from the inner side surface of the other side heat conducting plate 200-2.

[0130] Through the spaced spaces between one surface of the refrigerant damper 250 and the inner side surface of the one side heat conducting plate 200-1 and between the other surface of the refrigerant damper 250 and the inner side surface of the other side heat conducting plate 200-2, the gaseous refrigerant (water vapor) evaporated on the first refrigerant flow path 210 side corresponding to the evaporation region can be diffused and flowed in the condensation region where the refrigerant damper 250 is disposed.

[0131] Therefore, in order not to hinder the evaporation activity of the refrigerant on the first refrigerant flow path 210 side, the refrigerant damper 250 can be defined to be disposed in the condensation region other than the evaporation region where the first refrigerant flow path 210 is formed.

[0132] In addition, the refrigerant damper 250 can be fixed by the plurality of strength reinforcing portions 240 equipped in the refrigerant flow space 205 in a manner of mutually surface contact.

[0133] In more detail, as shown, Figure 7 The plurality of strength reinforcing portions 240 protrude from the inner side surfaces of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 toward the refrigerant flow space 205 side, and the joint surfaces 240P of predetermined diameters are formed at the front end portions, and the joint surfaces 240P of the respective front end portions are joined in the refrigerant flow space 205 by a joining method such as welding.

[0134] Among them, the refrigerant damper 250 can be formed with a plurality of through holes 255 formed to be penetrated, so that the plurality of strength reinforcing portions 240 formed in the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 are penetrated and surface contact in the refrigerant flow space 205.

[0135] At this time, as shown, Figure 7 The plurality of through holes 255 formed in the refrigerant damper 250 can be formed to have an inner diameter D greater than the diameters of the joint surfaces 240P of the plurality of strength reinforcing portions 240.

[0136] In addition, as described above, the heat conducting plate bodies 200-1, 200-2 are further formed with a plurality of inclined guides 215 protruding from the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 toward the refrigerant flow space 205 side, respectively, and protruding to a depth not surface contacting each other, to incline downward to guide the condensed liquid refrigerant to flow in a manner of flowing downward with respect to the direction of gravity.

[0137] One surface of the refrigerant damper 250 can be closely adhered to the inclined guide 215 of the one side heat conducting plate 200-1, and the other surface of the refrigerant damper 250 can be closely adhered to the inclined guide 215 of the other side heat conducting plate 200-2.

[0138] That is, when the refrigerant damper 250 is disposed in the refrigerant flow space 205 between the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2, the plurality of strength reinforcing portions 240 are respectively penetrated through the plurality of through holes 255 and are engaged with each other, so that the one surface and the other surface are fixed to the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2 in a closely adhered manner by the plurality of inclined guides 215 respectively protruding toward the refrigerant flow space 205 side while being fixed by the plurality of strength reinforcing portions 240, so that stable fixation can be achieved without flowing due to external force transmitted from the outside or internal pressure change by phase change of the refrigerant.

[0139] Here, as described below, on the premise that the refrigerant damper 250 is provided in an elastic material that is deformed in shape by external force, the thickness t in a state where no external force is provided can be formed to be greater than the minimum interval distance of the inclined guides 215 of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2.

[0140] This is because, when the refrigerant flow space 205 is formed by the engagement of the respective edge end portions of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2, the refrigerant damper 250 is stably fixed by shape deformation caused by compression of the respective inclined guides 215 of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2.

[0141] However, a part of the plurality of strength reinforcing portions 240 (the strength reinforcing portion 240 arranged on the lower side portion with reference to the gravitational direction as described later) can be mutually engaged by welding after being engaged with a single metal plate member or two metal plate members after surface contact through the plurality of through holes 255 formed in the refrigerant damper 250.

[0142] Since welding heat at this time can affect the refrigerant damper 250, as shown in FIG. 6, when the one surface and the other surface of the refrigerant damper 250 are closely adhered and fixed to the inclined guides 215 formed on the one surface and the other surface of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2, respectively, the inner diameter D of the plurality of through holes 255 formed in the refrigerant damper 250 is preferably formed to be a size not in contact with the front end of the plurality of strength reinforcing portions 240 (including the edge of the engagement surface 240P). ​ Since welding heat at this time can affect the refrigerant damper 250, as shown in FIG. 6, when the one surface and the other surface of the refrigerant damper 250 are closely adhered and fixed to the inclined guides 215 formed on the one surface and the other surface of the one side heat conducting plate 200-1 and the other side heat conducting plate 200-2, respectively, the inner diameter D of the plurality of through holes 255 formed in the refrigerant damper 250 is preferably formed to be a size not in contact with the front end of the plurality of strength reinforcing portions 240 (including the edge of the engagement surface 240P).

[0143] In particular, in the case where the heat conducting plate body 200-1, 200-2 is fixed to the press-in portion 150 formed on the back surface of the heat dissipation housing body 110 in the direction of gravity or inclined with respect to the direction of gravity, the refrigerant damper 250 can be disposed at a lower side portion with respect to the direction of gravity in the refrigerant flow space 205 of the heat conducting plate body 200-1, 200-2. This is because, as described above, considering the phase change, the ratio of the liquid refrigerant is only a part of the entire volume of the refrigerant flow space, and the liquid refrigerant is stored at the lower side portion in the direction of gravity.

[0144] The refrigerant damper 250 can be made of an elastic material including a rubber material that can elastically absorb the expanded volume at least when the volume is expanded due to freezing of the refrigerant.

[0145] As described above, in the active heat dissipation device 200 according to an embodiment of the present application, the refrigerant damper 250 is fixed and disposed at a position corresponding to the lower portion with respect to the direction of gravity in which the liquid refrigerant is mainly stored in the refrigerant flow space 205, thereby having the advantage of preventing damage to the product by actively absorbing the expanded volume when the refrigerant equipped with distilled water (water) is frozen.

[0146] In addition, during the phase change of the refrigerant, even if the refrigerant damper 250 is affected by an external force such as a change in internal pressure within the refrigerant flow space 205 or any vibration transmitted from the outside, the refrigerant damper 250 can be stably fixed without flowing (shaking), thereby having the advantage of being able to improve the durability of the product.

[0147] The above has been described in detail with reference to the accompanying drawings with respect to an embodiment of the active heat dissipation device according to the present application. However, the embodiment of the present application is not limited to the above-described embodiment, and it is natural that a person having ordinary knowledge in the technical field to which the present application pertains can make various modifications and implement them within an equivalent scope. Therefore, the true scope of the present application should be determined by the claims.

Claims

1. An active heat dissipation device, characterized in that, include: The heat-conducting plate body is equipped with a refrigerant flow space inside for refrigerant filling and flow; as well as A refrigerant damper is arranged in the middle of the thickness direction of the refrigerant flow space. When the volume of the refrigerant expands due to freezing, it elastically absorbs the volume expansion of the refrigerant after freezing without increasing the distance between one side surface and the other side surface of the refrigerant flow space.

2. The active heat dissipation device according to claim 1, characterized in that, The refrigerant flow space includes: A first refrigerant flow path stores liquid refrigerant and is equipped in an evaporation region where the stored liquid refrigerant is converted into a gaseous state by heat supplied from the heat dissipation housing body, which is a heat source; and Multiple second refrigerant flow paths are formed along or inclined relative to the direction of gravity toward the first refrigerant flow path, and guide the liquid refrigerant that has changed from a gaseous state to a liquid state in the refrigerant to flow toward the first refrigerant flow path side. The refrigerant damper is located on the second refrigerant flow path side.

3. The active heat dissipation device according to claim 2, characterized in that, The refrigerant damper is arranged in the condensation region, in addition to the evaporation region.

4. The active heat dissipation device according to claim 1, characterized in that, The heat-conducting plate body includes: A heat-conducting plate on one side forms one side of the refrigerant flow space; and The other side heat-conducting plate forms the other side of the refrigerant flow space. The refrigerant damper is fixed in the refrigerant flow space at the middle part corresponding to the heat-conducting plate on one side and the heat-conducting plate on the other side.

5. The active heat dissipation device according to claim 4, characterized in that, One surface of the refrigerant damper is arranged at a predetermined distance from the inner surface of the heat-conducting plate on one side, and the other surface is arranged at a predetermined distance from the inner surface of the heat-conducting plate on the other side.

6. The active heat dissipation device according to claim 4, characterized in that, The heat-conducting plate body also has multiple strength-reinforcing sections, which are configured to protrude from one side of the heat-conducting plate and the other side of the heat-conducting plate toward the refrigerant flow space. The refrigerant damper is fixed by a plurality of strength-reinforcing parts that are in mutual surface contact in the refrigerant flow space.

7. The active heat dissipation device according to claim 6, characterized in that, The refrigerant damper has a plurality of through holes formed through it, so that a plurality of strength reinforcing portions formed on the heat-conducting plate on one side and the heat-conducting plate on the other side can pass through and make surface contact within the refrigerant flow space.

8. The active heat dissipation device according to claim 7, characterized in that, When the plurality of strength-reinforcing parts each have a planar joint surface of a predetermined diameter at their respective front ends, The multiple through holes formed in the refrigerant damper are configured to have an inner diameter larger than the diameter of the joint surface of the multiple strength reinforcements.

9. The active heat dissipation device according to claim 7, characterized in that, The heat-conducting plate body also has multiple inclined guide members, which protrude from one side of the heat-conducting plate and the other side toward the refrigerant flow space to a depth where they do not make surface contact with each other, and are inclined downwards to guide the condensed liquid refrigerant to flow relative to gravity toward the inclined downwards. One surface of the refrigerant damper is in close contact with the inclined guide of the heat-conducting plate on one side, and the other surface of the refrigerant damper is in close contact with the inclined guide of the heat-conducting plate on the other side.

10. The active heat dissipation device according to claim 9, characterized in that, The refrigerant damper is made of an elastic material that deforms by external force, and is formed such that its thickness, when no external force is applied, is greater than the minimum spacing between the inclined guides of the heat-conducting plate on one side and the inclined guides of the heat-conducting plate on the other side.

11. The active heat dissipation device according to claim 9, characterized in that, When one surface and the other surface of the refrigerant damper are tightly attached and fixed to the inclined guide formed on one surface and the other surface of the heat-conducting plate on one side and the heat-conducting plate on the other side, the inner diameter of the plurality of through holes formed in the refrigerant damper is formed to a size that does not contact the front end of the plurality of strength reinforcements.

12. The active heat dissipation device according to claim 7, characterized in that, When joining a single metal plate component after bending or joining two metal plate components, a portion of the plurality of strength reinforcements make surface contact through the plurality of through holes formed in the refrigerant damper, and then join them together by welding.

13. The active heat dissipation device according to claim 2, characterized in that, When the heat-conducting plate body is fixed to the press-in portion formed on the back side of the heat dissipation housing body along the direction of gravity or inclined relative to the direction of gravity, the refrigerant damper is arranged in the lower part of the heat-conducting plate body relative to the direction of gravity.

14. The active heat dissipation device according to claim 1, characterized in that, The refrigerant damper is made of an elastic material, which includes a rubber material that can elastically absorb at least the volume equivalent to the expansion caused by the freezing of the refrigerant.

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