Vehicle communication module heat dissipation structure and vehicle with same

Abstract

The utility model discloses a vehicle communication module heat dissipation structure and a vehicle with the same, the vehicle communication module heat dissipation structure comprises a radiator, the radiator comprises a substrate, the substrate is attached to a vehicle communication module, and the vehicle communication module is connected with the substrate. The heat dissipation device comprises a substrate, a plurality of heat dissipation tooth sheets, the plurality of heat dissipation tooth sheets are formed on the substrate and are arranged on the substrate at intervals, and the thickness of each heat dissipation tooth sheet is 1.5-2.5 mm. The heat dissipation structure of the vehicle communication module has the advantages of being good in heat dissipation effect and the like.

Description

Technical Field

[0001] This utility model relates to the field of vehicle engineering technology, and more specifically, to a heat dissipation structure for a vehicle communication module and a vehicle having the heat dissipation structure for the vehicle communication module. Background Technology

[0002] The vehicle-mounted telematics-box (TBOX) in related technologies has a large heat dissipation structure consisting of two radiators, one above the other, which occupy a significant amount of space and increase the difficulty of interior layout. Reducing the size of the radiators would affect the heat dissipation effect, leading to overheating of the TBOX and affecting its lifespan. This is especially true for 5G-TBOX, which generates more heat than 4G-TBOX and is more prone to overheating. Utility Model Content

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention proposes a heat dissipation structure for a vehicle communication module, which has advantages such as good heat dissipation performance.

[0004] This utility model also proposes a vehicle having the aforementioned vehicle communication module heat dissipation structure.

[0005] To achieve the above objectives, a heat dissipation structure for a vehicle communication module is proposed according to an embodiment of the first aspect of the present invention. The heat dissipation structure for the vehicle communication module includes: a heat sink, the heat sink including: a substrate, the substrate being bonded to the vehicle communication module; and a plurality of heat dissipation fins, the plurality of heat dissipation fins being formed on the substrate and arranged at intervals on the substrate, each heat dissipation fin having a thickness of 1.5-2.5 mm.

[0006] The heat dissipation structure of the vehicle communication module according to the embodiment of this utility model has the advantages of good heat dissipation effect.

[0007] In addition, the vehicle communication module heat dissipation structure according to the above embodiments of this utility model may also have the following additional technical features:

[0008] According to one embodiment of the present invention, the thickness of the substrate is 2.5-4.5 mm.

[0009] According to one embodiment of the present invention, the length and width of the substrate are both less than or equal to 40 mm, and the height of the heat sink is less than or equal to 9 mm.

[0010] According to one embodiment of the present invention, the heat dissipation fins are 3-7 in number.

[0011] According to one embodiment of the present invention, the plurality of heat dissipation fins are oriented along the width direction of the substrate and spaced apart along the length direction of the substrate.

[0012] According to one embodiment of the present invention, the heat dissipation structure of the vehicle communication module further includes a thermal pad, which is sandwiched between the substrate and the vehicle communication module.

[0013] According to one embodiment of the present invention, the vehicle communication module is disposed on a circuit board, and the circuit board is provided with an electrical connector, the electrical connector and the vehicle communication module being located on two opposite surfaces of the circuit board respectively.

[0014] According to one embodiment of the present invention, the heat sink is a cast aluminum component.

[0015] According to one embodiment of the present invention, the heat dissipation structure of the vehicle communication module further includes a mounting bracket, the mounting bracket being connected to the substrate, and the substrate being recessed in the mounting bracket toward the vehicle communication module.

[0016] According to a second aspect of the present invention, a vehicle is provided, the vehicle including a vehicle communication module heat dissipation structure according to a first aspect of the present invention.

[0017] The vehicle according to the embodiments of the present invention has advantages such as good heat dissipation effect by utilizing the vehicle communication module heat dissipation structure according to the first aspect of the present invention.

[0018] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0019] The above and / or additional aspects and advantages of this utility model will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0020] Figure 1 This is a schematic diagram of the heat dissipation structure of the vehicle communication module according to an embodiment of the present utility model.

[0021] Figure 2 This is a schematic diagram of the heat dissipation structure of the vehicle communication module according to an embodiment of the present utility model.

[0022] Figure 3 This is a partial cross-sectional view of the heat dissipation structure of the vehicle communication module according to an embodiment of the present utility model.

[0023] Reference numerals: 1. Heat sink for vehicle communication module heat dissipation structure; 10. Base plate; 11. Heat dissipation fins; 12. Thermal pad; 20. Mounting bracket; 30. Vehicle communication module; 2. Circuit board; 3. Electrical connector; 4. Detailed Implementation

[0024] This application is based on the inventor's discoveries and understanding of the following facts and problems:

[0025] The vehicle-mounted telematics-box (TBOX) in related technologies has a large heat dissipation structure consisting of two radiators, one above the other, which occupy a significant amount of space and increase the difficulty of interior layout. Reducing the size of the radiators would affect the heat dissipation effect, leading to overheating of the TBOX and affecting its lifespan. This is especially true for 5G-TBOX, which generates more heat than 4G-TBOX and is more prone to overheating.

[0026] Specifically, the heat sink used in TBOX mainly consists of a base plate and fins. Since the overall size of the heat sink is limited by the installation space, its heat dissipation effect primarily depends on the arrangement of the fins. Those skilled in the art generally believe that increasing the number of fins improves the heat dissipation effect. Therefore, heat sinks in related technologies typically employ thinner fins in greater numbers, with a fin thickness of 0.5-1 mm. However, the inventors of this application, through extensive research, have discovered that the number of fins has a relatively small impact on the heat dissipation effect; in contrast, the fin thickness has a greater impact.

[0027] Furthermore, since the overall height of the heat sink is limited by the installation space, when the overall height of the heat sink is fixed, the greater the thickness of the substrate, the smaller the height of the heat dissipation fins. Heat sinks in related technologies generally adopt an implementation method with larger fin height and thinner substrate thickness. However, the inventors of this application have found through extensive research that the fin height has little impact on the heat dissipation effect of the heat sink. In contrast, the thickness of the substrate has a greater impact on the heat dissipation effect of the heat sink.

[0028] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this utility model, and should not be construed as limiting this utility model.

[0029] In the description of this utility model, it should be understood that the terms "center," "longitudinal," "transverse," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential," etc., indicating the orientation or positional relationship shown in the accompanying drawings, are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model. Furthermore, features defined with "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, unless otherwise stated, "a plurality of" means two or more.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0031] The heat dissipation structure 1 of the vehicle communication module according to an embodiment of the present invention is described below with reference to the accompanying drawings.

[0032] like Figures 1-3 As shown, the vehicle communication module heat dissipation structure 1 according to an embodiment of the present utility model includes a heat sink 10.

[0033] The heat sink 10 includes a substrate 11 and a plurality of heat dissipation fins 12.

[0034] The substrate 11 is bonded to the vehicle communication module 2. Multiple heat dissipation fins 12 are formed on the substrate 11 and are spaced apart on the substrate 11, and the thickness of each heat dissipation fin 12 is 1.5-2.5 mm.

[0035] It is important to understand that the thickness of the heat sink fin 12 refers to its thickness perpendicular to the length and height directions. The figure shows an implementation where the thickness of the heat sink fin 12 is along the left-right direction (the up-down, left-right, and front-back directions are shown by arrows in the figure and are only for ease of description, not a limitation on the actual installation direction).

[0036] Specifically, the heat from the vehicle communication module 2 is transferred through the substrate 11 to multiple heat dissipation fins 12 and further dissipated into the environment, thereby achieving heat dissipation for the vehicle communication module 2.

[0037] In some specific embodiments, the thickness of each heat dissipation fin 12 can be 1.75-2.25 mm. Preferably, it is 2 mm. This further improves the heat dissipation effect of the heat sink 10.

[0038] According to the vehicle communication module heat dissipation structure 1 of the present utility model embodiment, by making the heat dissipation fins 12 have a larger thickness, the heat dissipation effect of the radiator 10 can be improved. Compared with the technical solutions of using thinner and more fins in related technologies, the heat dissipation effect can be further improved, so that the radiator 10 can meet the heat dissipation requirements of vehicle communication modules, especially 5G communication modules.

[0039] Furthermore, by making the heat dissipation fins 12 have a larger thickness, the heat dissipation effect of the radiator 10 is improved, which makes it easier to reduce the size of the radiator 10, reduce the overall space occupied by the vehicle communication module heat dissipation structure 1, and make it easier to set the vehicle communication module heat dissipation structure 1 in a smaller vehicle interior space, thus facilitating the layout of the vehicle space.

[0040] Therefore, the vehicle communication module heat dissipation structure 1 according to the embodiment of the present utility model has the advantages of good heat dissipation effect.

[0041] The following description, with reference to the accompanying drawings, describes a heat dissipation structure 1 for a vehicle communication module according to a specific embodiment of the present invention.

[0042] In some specific embodiments of this utility model, such as Figures 1-3 As shown, it includes a heat sink 10. The heat sink 10 includes a substrate 11 and a plurality of heat dissipation fins 12.

[0043] Specifically, the length and width of the substrate 11 are both less than or equal to 40 mm, and the height of the heat sink 10 is less than or equal to 9 mm. This allows the heat sink 10 to have a smaller size, making it easier to install in a smaller space and reducing the overall space occupied by the vehicle communication module heat dissipation structure 1.

[0044] Advantageously, the thickness of the substrate 11 is 2.5-4.5 mm. Specifically, since the overall height of the heat sink is limited by the installation space, with a fixed overall height, the greater the thickness of the substrate, the smaller the height of the heat dissipation fins. Heat sinks in related technologies generally adopt an implementation with larger fin height and a thinner substrate. However, the inventors of this application have discovered through extensive research that the fin height has a relatively small impact on the heat dissipation effect of the heat sink; in comparison, the thickness of the substrate has a greater impact on the heat dissipation effect. The thickness of the substrate 11 can be 2.75-4.25 mm. Preferably, it is 3-4 mm. By making the thickness of the substrate 11 2.5-4.5 mm, the heat dissipation effect of the heat sink 10 can be further improved, thereby facilitating a reduction in the size of the heat sink 10.

[0045] Optionally, such as Figures 1-3 As shown, there are 3-7 heat dissipation fins 12. Preferably, there are 5. This allows for a smaller number of heat dissipation fins 12, making it easier to increase their thickness.

[0046] Figures 1-3 A heat dissipation structure 1 for a vehicle communication module according to some examples of the present invention is shown. For example... Figures 1-3 As shown, multiple heat dissipation fins 12 are oriented along the width direction of the substrate 11 and spaced apart along the length direction of the substrate 11. Specifically, the figure shows a technical solution in which the heat dissipation fins 12 are oriented in the front-back direction and spaced apart in the left-right direction. This facilitates the arrangement of the heat dissipation fins 12 and allows for increasing the thickness of the heat dissipation fins 12.

[0047] Advantageously, such as Figure 2 and Figure 3 As shown, the vehicle communication module heat dissipation structure 1 also includes a thermal pad 20, which is sandwiched between the substrate 11 and the vehicle communication module 2. Specifically, the thermal conductivity of the thermal pad 20 can be 3 watts per meter degree. This facilitates the transfer of heat from the vehicle communication module 2 to the heat sink 10, and avoids the impact on heat dissipation caused by uneven surfaces when the heat sink 10 and the vehicle communication module 2 are in direct contact, which would affect the contact area and thus the heat dissipation effect.

[0048] Specifically, such as Figure 2 and Figure 3 As shown, the vehicle communication module 2 is mounted on a circuit board 3, and the circuit board 3 has an electrical connector 4. The electrical connector 4 and the vehicle communication module 2 are located on two opposite surfaces of the circuit board 3. In other words, the circuit board 3 can have a front and a back. Components such as the electrical connector 4 are located on the front of the circuit board 3, and the vehicle communication module 2 is located on the back of the circuit board 3. The figure shows an embodiment where the upper surface of the circuit board 3 is the back and the lower surface is the front. This allows the electrical connector 4 and the vehicle communication module 2 on the circuit board 3 to be located on different surfaces, facilitating centralized heat dissipation for the vehicle communication module 2 by the heat sink 10.

[0049] Alternatively, the radiator 10 can be made of cast aluminum. This allows the radiator 10 to have better heat dissipation performance compared to materials such as galvanized steel.

[0050] The vehicle communication module heat dissipation structure 1 also includes a mounting bracket 30, which is connected to the base plate 11. The base plate 11 is recessed in the mounting bracket 30 towards the vehicle communication module 2. Specifically, the base plate 11 can be integrally formed with the mounting bracket 30. The figure shows the technical solution where the base plate 11 is recessed downwards on the upper surface of the mounting bracket 30. This facilitates the installation of the vehicle communication module heat dissipation structure 1. The recess of the base plate 11 towards the vehicle communication module 2 in the mounting bracket 30 can reduce the space occupied by the heat dissipation fins 12, improve space utilization, and also prevent the mounting bracket 30 from interfering with the heat dissipation fins 12 for heat dissipation.

[0051] The length, width, tooth thickness, number of teeth, and substrate thickness of the heat sink 10 of the vehicle communication module heat dissipation structure 1 according to the embodiment of this utility model were tested. The smaller the test result, the better the heat dissipation effect. The results are shown in the table below:

[0052] Radiator length and width 37 39 39 39 39 41 41 41 Tooth thickness 1 1 1 1 2 1 1 2 Number of teeth 5 5 5 5 5 5 10 5 substrate thickness 2 2 1 3 3 2 2 2 Test Results 7.348 7.15 7.331 7.031 6.995 6.983 7.108 6.934

[0053] It can be seen that, with other parameters being equal, heat sinks with larger length and width have better heat dissipation, heat sinks with thicker fins have better heat dissipation, heat sinks with more fins have worse heat dissipation, and heat sinks with thicker substrates have better heat dissipation.

[0054] Excluding implementations with dimensions greater than 40, the implementation with the best heat dissipation effect is one where the heat sink has a length and width of 39, a tooth thickness of 2, a number of teeth of 5, and a substrate thickness of 3.

[0055] The vehicle according to an embodiment of the present invention is described below. The vehicle according to an embodiment of the present invention includes a heat dissipation structure 1 for a vehicle communication module according to the above embodiment of the present invention.

[0056] The vehicle according to the present invention has advantages such as good heat dissipation effect by utilizing the vehicle communication module heat dissipation structure 1 according to the above embodiment of the present invention.

[0057] Other components and operations of the vehicle according to embodiments of the present invention are known to those skilled in the art and will not be described in detail here.

[0058] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0059] Although embodiments of the present invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation structure for a vehicle communication module, characterized in that, Includes a heat sink, the heat sink comprising: A substrate, which is bonded to the vehicle communication module; Multiple heat dissipation fins are formed on the substrate and arranged at intervals on the substrate, and the thickness of each heat dissipation fin is 1.5-2.5 mm.

2. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, The thickness of the substrate is 2.5-4.5 mm.

3. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, The length and width of the substrate are both less than or equal to 40 mm, and the height of the heat sink is less than or equal to 9 mm.

4. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, The heat dissipation fins consist of 3-7 fins.

5. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, The plurality of heat dissipation fins are oriented along the width direction of the substrate and spaced apart along the length direction of the substrate.

6. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, It also includes a thermal pad, which is sandwiched between the substrate and the vehicle communication module.

7. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, The vehicle communication module is mounted on a circuit board, and the circuit board is equipped with an electrical connector. The electrical connector and the vehicle communication module are located on two opposite surfaces of the circuit board, respectively.

8. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, The radiator is made of cast aluminum.

9. The heat dissipation structure for the vehicle communication module according to claim 1, characterized in that, It also includes a mounting bracket, which is connected to the substrate, and the substrate is recessed in the mounting bracket toward the vehicle communication module.

10. A vehicle, characterized in that, Includes a heat dissipation structure for a vehicle communication module according to any one of claims 1-9.

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