Domain controller and vehicle
By employing air cooling in the domain controller, utilizing structures such as a base, heat dissipation structure, fan, air duct, and vents to achieve air circulation, the problems of high heat dissipation complexity and coolant leakage risk in existing technologies are solved, thereby improving heat dissipation performance and vehicle safety.
Patent Information
- Application Number
- CN202520359272.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-03
AI Technical Summary
Existing domain controllers have complex and costly cooling methods that pose a risk of coolant leakage, making it difficult to effectively ensure vehicle safety.
Air cooling is used for heat dissipation. By designing a base, heat dissipation structure, fan, air duct and vent in the domain controller, air circulation between the internal and external environments is achieved. The fan operation introduces low-temperature air from the outside and exhausts high-temperature air, forming an effective heat dissipation path.
This reduces the complexity and cost of the cooling system, avoids the risk of coolant leakage, and improves the heat dissipation performance of the domain controller and the safety of the vehicle.
Smart Images
Figure CN223872642U_ABST
Abstract
Description
Technical Field
[0001] This disclosure relates to driving technology, and in particular to a domain controller and a vehicle. Background Technology
[0002] Assisted driving and autonomous driving technologies have become hot research topics in recent years. The domain controller is a core component for realizing assisted driving and autonomous driving technologies in vehicles, and the heat dissipation performance of the domain controller is of great significance to ensuring vehicle safety. Utility Model Content
[0003] This disclosure is made to ensure the heat dissipation performance of the domain controller. Embodiments of this disclosure provide a domain controller and a vehicle.
[0004] According to one aspect of the present disclosure, a domain controller is provided, comprising:
[0005] A first housing, comprising a base and a heat dissipation structure protruding from the base, wherein the heat dissipation structure is recessed in a direction toward the base;
[0006] A fan, which is installed within the housing;
[0007] A cover plate is located on the side of the fan away from the base. The cover plate covers the heat dissipation structure to form an air duct defined by the cover plate, the heat dissipation structure and the base. The air duct is connected to the external environment. A ventilation opening is provided in the area of the cover plate opposite to the fan. The ventilation opening is connected to the external environment and the air duct respectively.
[0008] A circuit board is located on the side of the base away from the heat dissipation structure, and the heat generated by the circuit board is conducted sequentially to the base and the heat dissipation structure.
[0009] According to another aspect of the present disclosure, a vehicle is provided, including the domain controller described above.
[0010] In the embodiments of this disclosure, the cover plate and the heat dissipation structure can be closed to form an air duct defined by the cover plate, the heat dissipation structure, and the base. A vent connected to the air duct can be opened in the area of the cover plate opposite the fan. This allows for the establishment of a target path for airflow within the domain controller (along this target path, air passes through both the air duct and the vent). Furthermore, both the air duct and the vent are connected to the external environment. Thus, air circulation between the internal environment of the domain controller and the external environment can be achieved while the fan is running. This involves introducing cooler air from the external environment into the target path and expelling warmer air, after heat exchange with the heat dissipation structure, to the external environment. In other words, in the embodiments of this disclosure, heat transferred to the heat dissipation structure can be carried to the external environment through air cooling, thereby achieving heat dissipation for the domain controller. Therefore, the domain controller provided by the embodiments of this disclosure has excellent heat dissipation performance, which is beneficial for ensuring vehicle safety.
[0011] It should be noted that domain controllers in related technologies typically use liquid cooling for heat dissipation, thus requiring the construction of a dedicated liquid cooling system or relying on the vehicle's liquid cooling system, resulting in high complexity, high cost, and the risk of coolant leakage. In contrast, the domain controller provided in the embodiments of this disclosure uses air cooling for heat dissipation, with its heat dissipation specifically relying on the domain controller's own structure (e.g., base, heat dissipation structure, fan, air duct, vents, etc.), thus resulting in lower complexity, lower cost, and avoiding the risk of coolant leakage. Attached Figure Description
[0012] Figure 1 This is one of the schematic diagrams of the assembly structure of a domain controller provided in some exemplary embodiments of this disclosure.
[0013] Figure 2 This is an exploded view of a domain controller provided in some exemplary embodiments of this disclosure.
[0014] Figure 3 This is one of the structural schematic diagrams of the first housing in a domain controller provided by some exemplary embodiments of this disclosure.
[0015] Figure 4 This is a second schematic diagram of the structure of the first housing in a domain controller provided in some exemplary embodiments of this disclosure.
[0016] Figure 5 This is the second schematic diagram of the assembly structure of a domain controller provided in some exemplary embodiments of this disclosure.
[0017] Figure 6 This is the third of several exemplary embodiments of the domain controller provided in this disclosure.
[0018] Figure 7This is a schematic diagram of the structure of a circuit board in a domain controller provided by some exemplary embodiments of this disclosure.
[0019] Figure 8 This is the third of three schematic diagrams of the structure of the first housing in a domain controller provided in some exemplary embodiments of this disclosure.
[0020] Figure 9 This is the fourth of several exemplary embodiments of the first housing in a domain controller provided in this disclosure.
[0021] Figure 10 This is a schematic diagram illustrating how a control chip in a domain controller controls a fan, as provided in some exemplary embodiments of this disclosure. Detailed Implementation
[0022] Hereinafter, exemplary embodiments according to the present disclosure will be described in detail with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of the present disclosure, and not all embodiments of the present disclosure, and it should be understood that the present disclosure is not limited to the exemplary embodiments described herein.
[0023] In the description of this disclosure, the terms "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this disclosure and simplifying the description, and are not intended to indicate or imply that the device referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this disclosure.
[0024] In the description of this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.
[0025] Exemplary Overview
[0026] A domain controller is a high-performance, high-reliability vehicle control system that enables vehicle control and management. For example, by integrating sensors and controllers, a domain controller can centrally manage the vehicle's Electronic Control Unit (ECU), thereby achieving comprehensive vehicle perception and intelligent control and management. Domain controllers can be a core component in vehicles that enable driver assistance and autonomous driving technologies.
[0027] With the development of assisted driving and autonomous driving technologies, the functions of domain controllers are becoming more and more powerful, and the power consumption of domain controllers is also increasing. As a result, domain controllers generate a lot of heat during operation. If this heat cannot be dissipated in time, it will affect the normal operation of the domain controller, thereby affecting the safety of the vehicle.
[0028] Exemplary Structure
[0029] Embodiments of this disclosure provide a domain controller. For example... Figure 1 , Figure 2 As shown, the domain controller provided in the embodiments of this disclosure may include:
[0030] The first housing 10 includes a base 101 and a heat dissipation structure 103 protruding from the base 101. The heat dissipation structure 103 is recessed in the direction close to the base 101.
[0031] Fan 20 is installed inside the housing.
[0032] The cover plate 30 is located on the side of the fan 20 away from the base 101. The cover plate 30 covers the heat dissipation structure 103 to form an air duct defined by the cover plate 30, the heat dissipation structure 103 and the base 101. The air duct is connected to the external environment. A ventilation opening 301 is provided in the area of the cover plate 30 opposite to the fan 20. The ventilation opening 301 is connected to the external environment and the air duct respectively.
[0033] Circuit board 40 is located on the side of base 101 away from heat dissipation structure 103. The heat generated by circuit board 40 is conducted to base 101 and heat dissipation structure 103 in sequence.
[0034] Optionally, the base 101 can be a structure capable of providing support for other components / structures within the domain controller. The heat dissipation structure 103 can be a structure capable of effectively dissipating heat. For example... Figure 3 As shown, the base 101 may include a first surface S1, and the heat dissipation structure 103 may protrude from the first surface S1. The heat dissipation structure 103 may have a recessed receiving portion in the direction close to the first surface S1, and the fan 20 may be installed in the receiving portion. For example, the receiving portion may have a receiving space, the fan 20 may be placed in the receiving space, and the fan 20 and the heat dissipation structure 103 may be relatively fixed by means of screws or the like to achieve reliable installation of the fan 20.
[0035] Alternatively, the cover plate 30 can be a flat plate structure. The cover plate 30 can be located on the side of the fan 20 away from the base 101. For example, in the relative position of the fan 20 and the base 10, as shown... Figure 2In the illustrated case, the cover plate 30 can be located to the left of the fan 20. The cover plate 30 can be closed with the heat dissipation structure 103. For example, the cover plate 30 can contact and cover the top of the heat dissipation structure 103 (at this time, the fan 20 installed in the receiving part is also covered), and the cover plate 30 and the heat dissipation structure 103 can be relatively fixed to each other by means of screws or the like. By closing the cover plate 30 with the heat dissipation structure 103, an air duct can be formed by the cover plate 30, the heat dissipation structure 103 and the base 101; wherein, the air duct can be a channel for guiding airflow to assist heat dissipation, and the air duct can be connected to the external environment, which can be understood as the environment located outside the domain controller. In addition, a vent 301 can be provided in the area of the cover plate 30 opposite to the fan 20; wherein, the vent 301 can be an opening for allowing air to pass through to assist heat dissipation, and the vent 301 can be connected to the air duct and can also be connected to the external environment.
[0036] Optionally, the circuit board 40 may be a hardware integrated circuit for supporting software, algorithms, etc., related to the vehicle's intelligent driving system. The circuit board 40 may be located on the side of the base 101 away from the heat dissipation structure 103. For example, the relative positions of the base 101 and the heat dissipation structure 103 may be as follows: Figure 2 In the illustrated case, the circuit board 40 can be located on the right side of the base 101. The circuit board 40 generates a large amount of heat during operation, which can be conducted to the base 101. Since the heat dissipation structure 103 protrudes from the base 101 and contacts the base 101, the heat conducted to the base 101 can be further conducted to the heat dissipation structure 103.
[0037] In the embodiments of this disclosure, the cover plate 30 and the heat dissipation structure 103 can be closed to form an air duct defined by the cover plate 30, the heat dissipation structure 103, and the base 101. A vent 301 communicating with the air duct can be opened in the area of the cover plate 30 opposite to the fan 20. This allows for the establishment of a target path for airflow within the domain controller (along the target path, air passes through both the air duct and the vent 301). Furthermore, both the air duct and the vent 301 are connected to the external environment. Thus, air circulation between the internal environment of the domain controller and the external environment can be achieved while the fan 20 is running. This involves introducing cooler air from the external environment into the target path and expelling the warmer air, after heat exchange with the heat dissipation structure 103, to the external environment. In other words, in the embodiments of this disclosure, heat transferred to the heat dissipation structure 103 can be carried to the external environment through air cooling, thereby achieving heat dissipation for the domain controller. Therefore, the domain controller provided by the embodiments of this disclosure has good heat dissipation performance, which is beneficial for ensuring vehicle safety.
[0038] It should be noted that domain controllers in related technologies typically use liquid cooling for heat dissipation, thus requiring the construction of a dedicated liquid cooling system or relying on the vehicle's liquid cooling system, resulting in high complexity, high cost, and the risk of coolant leakage. In contrast, the domain controller provided in the embodiments of this disclosure uses air cooling for heat dissipation, which specifically relies on the structure of the domain controller itself (e.g., base 101, heat dissipation structure 103, fan 20, air duct, vent 301, etc.), thus having lower complexity, lower cost, and avoiding the risk of coolant leakage.
[0039] In some optional examples, such as Figure 3 , Figure 4 As shown, the heat dissipation structure 103 may include:
[0040] Multiple heat dissipation fins 1031 are radially distributed and enclose a hollow area opposite to the rotating shaft of the fan 20. The ends of the multiple heat dissipation fins 1031 facing the hollow area are recessed towards the base 101 to form a receiving part. Furthermore, any two adjacent heat dissipation fins 1031, together with the cover plate 30 and the base 101, form an air duct.
[0041] Optionally, all of the multiple heat dissipation fins 1031 can be straight fins. Alternatively, all of the multiple heat dissipation fins 1031 can be curved fins, so that the multiple heat dissipation fins 1031 have a larger surface area, thereby increasing the contact area between the multiple heat dissipation fins 1031 and the air, and thus improving the heat dissipation performance.
[0042] Optionally, the multiple heat dissipation fins 1031 can be radially distributed and do not contact each other, so that the multiple heat dissipation fins 1031 surround a hollow region opposite to the rotation axis of the fan 20. That is, the multiple heat dissipation fins 1031 can be radially distributed around the hollow region. For ease of understanding, the ends of the multiple heat dissipation fins 1031 facing the hollow region can be referred to as target ends. Each target end of the multiple heat dissipation fins 1031 can be recessed towards the first surface S1, so that a recessed space can be formed around the hollow region. This recessed space and the hollow region can be combined to form a receiving space, which can serve as a receiving part for mounting the fan 20. In addition, for any two adjacent heat dissipation fins 1031 among the multiple heat dissipation fins 1031, the lower ends of the two heat dissipation fins 1031 are supported by the base 101, and the upper ends are covered by the cover plate 30. This allows for the definition of a space with a portion of the target surface (specifically the surface of the cover plate 30 facing the base 101) as the top surface, a portion of the first surface S1 as the bottom surface, and the two opposing surfaces of the two heat dissipation fins 1031 as the sides. This space can serve as the air duct formed by the two heat dissipation fins 1031, the cover plate 30, and the base 101.
[0043] In the embodiments of this disclosure, any two adjacent heat dissipation fins 1031, together with the cover plate 30 and the base 101, form an air duct. This allows for the formation of multiple air ducts, each capable of airflow. Therefore, the entire heat dissipation structure 103 has a very large convective heat transfer area, which is beneficial for improving the heat dissipation performance of the domain controller. Furthermore, by making the ends of the multiple heat dissipation fins 1031 facing the hollow region recessed towards the base 101, a receiving portion can be formed. The formation of the receiving portion is relatively simple and easy to implement.
[0044] In some optional examples, for any two adjacent heat dissipation fins 1031 among a plurality of heat dissipation fins 1031, the width of the corresponding air duct gradually increases along the direction away from the hollow region.
[0045] Optionally, the width of the air duct corresponding to any two adjacent heat dissipation fins 1031 can also be called the fin gap of the air duct. Along the direction away from the hollow area, the fin gap can gradually increase, for example, linearly or non-linearly. This helps to reduce the wind resistance between the fin gaps, ensure smooth air circulation between the internal and external environments of the domain controller, and improve the heat dissipation performance of the domain controller.
[0046] In some optional examples, such as Figure 3 , Figure 4 As shown, the heat dissipation structure 103 may also include:
[0047] Multiple baffle columns 1033 are located in the hollow region and are evenly distributed.
[0048] Optionally, the multiple baffle pillars 1033 may all protrude from the first surface S1. Any two baffle pillars 1033 may be parallel to each other. The multiple baffle pillars 1033 may be evenly distributed. For example, the multiple baffle pillars 1033 may be evenly distributed in a circular shape.
[0049] It should be noted that, since the hollow area is opposite to the fan 20's shaft, if no additional structure is provided in the hollow area, eddies may be generated, causing the hollow area to become a stall area (i.e., the air in this area has no velocity). In this case, if heat is conducted to the hollow area, it cannot be carried away by the flowing air, thus reducing the domain controller's heat dissipation performance. Therefore, in the embodiments of this disclosure, multiple baffle columns 1033 can be provided in the hollow area. These baffle columns 1033 can act as baffles, preventing the generation of eddies. Consequently, the hollow area will not become a stall area, and heat conducted to the hollow area can be quickly carried away, which is beneficial to improving the domain controller's heat dissipation performance.
[0050] In some alternative examples, when the fan 20 is running, air from the outside environment enters through the vent 301 and carries the heat from the heat dissipation structure 103 to the outside environment through the air duct.
[0051] Optionally, the vent 301 can serve as an air inlet, such as when the fan 20 is running. Figure 5 As shown, cooler air from the external environment can enter the domain controller through vent 301 in the direction indicated by arrow J1. The cooler air then flows through the heat dissipation structure 103 and exchanges heat with it, resulting in a significant increase in air temperature. Subsequently, the warmer air is exhausted to the external environment through the air duct in the directions indicated by arrows J2, J3, J4, and J5, thus carrying the heat transferred to the heat dissipation structure 103 to the external environment. It should be noted that... Figure 5 In this case, the domain controller has top air intake and side air exhaust. In this case, the function of fan 20 can be considered as blowing air.
[0052] In the embodiments of this disclosure, when the vent 301 is used as an air inlet, air circulation between the internal and external environments of the domain controller can be achieved by blowing air, so as to effectively dissipate heat from the domain controller through air cooling.
[0053] In some alternative examples, when the fan 20 is running, air from the outside environment enters through the air duct and carries the heat from the heat dissipation structure 103 to the outside environment through the vent 301.
[0054] Optionally, the vent 301 can serve as an air outlet, such as when the fan 20 is running. Figure 6 As shown, cooler air from the external environment enters the domain controller from the point where the duct connects to the external environment, following the directions indicated by arrows R1, R2, R3, and R4. The cooler air then flows through the heat dissipation structure 103 and exchanges heat with it, resulting in a significant increase in air temperature. Subsequently, the warmer air is exhausted to the external environment through the vent 301, following the direction indicated by arrow R5, thus carrying the heat transferred to the heat dissipation structure 103 to the external environment. It should be noted that... Figure 6 In this case, the domain controller has air intake from all sides and air exhaust from the top. In this case, the function of fan 20 can be considered as ventilation.
[0055] Assumption Figure 2 The function of fan 20 is to blow air, which can be achieved by... Figure 2 The fan 20 is rotated 180 degrees (that is, the surface of the fan 20 that was originally facing the cover plate 30 is adjusted to face away from the cover plate 30), so that the function of the fan 20 becomes ventilation.
[0056] In the embodiments of this disclosure, when the vent 301 is used as an air outlet, air circulation between the internal and external environments of the domain controller can be achieved by exhaust, so as to effectively dissipate heat from the domain controller through air cooling.
[0057] In some embodiments, there may be multiple fans 20, some of which can assist in heat dissipation by blowing air, while others can assist in heat dissipation by drawing air.
[0058] In some alternative examples, the circuit board 40 may include a plurality of heating elements 401 for generating heat (the heating elements 401 can be found in...). Figure 7 Multiple heat-generating components 401 can be, for example, multiple chips. As an example, multiple chips can include, but are not limited to, intelligent driving chips, intelligent cockpit chips, etc.
[0059] like Figure 8 As shown, the domain controller provided in the embodiments of this disclosure may further include:
[0060] The thermally conductive reinforcing member 50 is fixed relative to the base 101, and heat can be conducted between the thermally conductive reinforcing member 50 and the base 101.
[0061] A heat dissipation boss 60 is provided on the heat-conducting reinforcement member 50.
[0062] A heat-conducting medium is sandwiched between the heat dissipation boss 60 and the target heat-generating element. The target heat-generating element is the heat-generating element 401 among a plurality of heat-generating elements 401 that meets the preset power consumption conditions.
[0063] Optionally, the thermally conductive reinforcement 50 can be a thermally conductive component with a thermal conductivity far exceeding that of ordinary metal components. The thermally conductive reinforcement 50 can include, but is not limited to, heat pipes, vapor chambers (VC), thermoelectric coolers (TEC), etc. The thermally conductive reinforcement 50 and the base 101 can be fixedly connected by welding, bonding, or other methods, ensuring that heat conduction can occur between the thermally conductive reinforcement 50 and the base 101. The thermally conductive reinforcement 50 can support the heat dissipation boss 60, and the heat dissipation boss 60 can be welded to the thermally conductive reinforcement 50.
[0064] Optionally, the heating element 401 among the plurality of heating elements 401 that meets the preset power consumption condition can refer to: the high-power heating element among the plurality of heating elements 401, that is, the target heating element can be a high-power heating element. For example, the target heating element can be a heating element 401 with a thermal resistance greater than a preset thermal resistance. As another example, the target heating element can be a heating element 401 with a thermal resistance much greater than that of the other heating elements 401 among the plurality of heating elements 401.
[0065] Optionally, the thermally conductive medium may include, but is not limited to, thermally conductive silicone, thermally conductive gel, thermally conductive grease, etc.
[0066] In the embodiments of this disclosure, a thermally conductive medium is sandwiched between the heat dissipation protrusion 60 and the target heat-generating component. The thermally conductive medium fills the gap between the heat dissipation protrusion 60 and the target heat-generating component caused by tolerances, processing, or other factors, preventing the gap from being filled by air with high thermal resistance. This allows the heat generated by the target heat-generating component to be effectively conducted to the heat dissipation protrusion 60 via the thermally conductive medium. Since the heat dissipation protrusion 60 protrudes from the thermally conductive reinforcement 50, and heat can be conducted between the thermally conductive reinforcement 50 and the base 101, the heat conducted to the heat dissipation protrusion 60 can be further conducted to the thermally conductive reinforcement 50. Furthermore, because the thermally conductive reinforcement 50 has excellent thermal conductivity, the heat conducted to the thermally conductive reinforcement 50 can be quickly and effectively conducted to the base 101, and then further conducted to the heat dissipation structure 103 for heat dissipation. Thus, for the target heat-generating component, which is a high-power heat-generating component, the provision of the thermally conductive reinforcement 50 helps to quickly reduce its temperature, thereby ensuring the normal operation of the target heat-generating component. Generally speaking, high-power heat-generating components are core components of circuit board 40. For example, a high-power heat-generating component can be an intelligent driving chip. Ensuring the normal operation of the target heat-generating component helps to ensure the normal operation of circuit board 40 and even the entire domain controller.
[0067] As described above, the base 101 may include a first surface S1, and the heat dissipation structure 103 may protrude from the first surface S1 of the base 101. In some alternative examples, the base 101 may further include Figure 8 The second surface S2 shown can be arranged opposite to the first surface S1. Therefore, the thermally conductive reinforcement 50 and the base 101 can satisfy the following:
[0068] The thermally conductive reinforcing member 50 protrudes from the second surface S2 in a direction away from the first surface S1, and the thermally conductive reinforcing member 50 is bonded to the base 101.
[0069] or,
[0070] The base 101 has a recessed groove from the second surface S2 toward the first surface S1, and the heat-conducting reinforcement 50 is embedded in the groove and welded to the base 101.
[0071] If the thermally conductive reinforcement 50 cannot be welded to other structural components, for example, if the thermally conductive reinforcement is a thermoelectric cooler, then the thermally conductive reinforcement 50 can be self-contained. Figure 8 The second surface S2 protrudes upward, and the thermally conductive reinforcing member 50 can be bonded to the base 101 with an adhesive, so that the thermally conductive reinforcing member 50 can be reliably fixed to the base 101.
[0072] If the thermally conductive reinforcement 50 can be welded to other structural components, for example, if the thermally conductive reinforcement is a heat pipe or a heat spreader, then the base 101 can be self-contained. Figure 8The second surface S2 is recessed downwards to form a groove. The shape of the groove can be adapted to the shape of the heat-conducting reinforcement 50, so that the heat-conducting reinforcement 50 can be firmly embedded in the groove. Furthermore, the heat-conducting reinforcement 50 can be soldered to the base 101, thus reliably fixing the heat-conducting reinforcement 50 to the base 101. It should be noted that in this case, the top surface of the heat-conducting reinforcement 50 can be flush with or substantially flush with the second surface S2. The heat-conducting reinforcement 50 is essentially installed in a built-in manner, which can minimize the occupation of the second surface S2 by the heat-conducting reinforcement 50, thereby avoiding other structures that need to be set on the second surface S2.
[0073] The above describes how the thermally conductive reinforcement 50 can more effectively dissipate heat from high-power heat-generating components. Among the multiple heat-generating components 401, besides the high-power heat-generating component, there are other heat-generating components 401, which can be referred to as low-power heat-generating components. For low-power heat-generating components, it is not necessary to set up the thermally conductive reinforcement 50 accordingly; instead, they can be... Figure 9 As shown, corresponding heat dissipation bosses 60 are directly set on the second surface S2 through machining, die casting, welding, etc., so that the heat generated by the low-power heat-generating component can be dissipated. Figure 9 The heat dissipation protrusion 60 shown conducts heat to the base 101, and further to the heat dissipation structure 103 for heat dissipation.
[0074] In some alternative examples, instead of setting a thermally conductive reinforcement 50 corresponding to a high-power heat-generating component, a heat dissipation boss 60 corresponding to a high-power heat-generating component can be set directly on the second surface S2 through machining, die casting, welding, or other methods, similar to a low-power heat-generating component.
[0075] In some optional examples, such as Figure 7 As shown, circuit board 40 may include:
[0076] substrate 403;
[0077] Multiple heating elements 401 are disposed on the substrate 403, and the multiple heating elements 401 are used to generate heat.
[0078] A temperature sensor (not shown) and a control chip (not shown) are both mounted on a substrate 403. The control chip includes a first interface, a second interface, and a third interface. The first interface is connected to the temperature sensor to acquire the temperature information collected by the temperature sensor. The second interface acquires the junction temperature information of the heat-generating element 401 (i.e., the target heat-generating element) that meets the preset power consumption conditions among multiple heat-generating elements 401. The third interface is connected to the fan 20 to output a control signal adapted to the temperature information and the junction temperature information to the fan 20.
[0079] Optionally, substrate 403 can be a printed circuit board (PCB), and correspondingly, circuit board 40 can be a printed circuit board assembly (PCBA). The multiple heat-generating elements 401 can be multiple chips, and all of the multiple heat-generating elements 401 can be soldered to substrate 403. Temperature sensors and control chips can also be soldered to substrate 403.
[0080] In actual operation, the temperature sensor can collect temperature information of the substrate 403. This temperature information can be in the form of a temperature value, such as T_pcb. Since the first interface is connected to the temperature sensor (e.g., electrically), the control chip can obtain T_pcb from the first interface. Additionally, the control chip can obtain the junction temperature information of the target heat-generating component from the system software of the domain controller via the second interface. This junction temperature information can also be in the form of a temperature value, such as T_j (which refers to the highest temperature of the target heat-generating component). Since the third interface is connected to the fan 20 (e.g., electrically), the control chip can output a control signal from the third interface to the fan 20 that is compatible with both T_pcb and T_j. This control signal can be used to control the duty cycle of the fan 20 to adjust its speed. Figure 10 As shown, the control chip can control the fan 20 via control signals according to the following rules:
[0081] (1) When T_pcb < the first temperature value and T_j < the second temperature value, control the fan 20 to stop rotating; where the first temperature value and the second temperature value are both preset temperature values, and the second temperature value can be greater than the first temperature value;
[0082] (2) When the first temperature value ≤ T_pcb < the third temperature value or the second temperature value ≤ T_j < the fourth temperature value, the fan 20 operates according to the first duty cycle; wherein the third temperature value and the fourth temperature value are preset temperature values, and the first duty cycle is greater than 0;
[0083] (3) When the third temperature value ≤ T_pcb < the fifth temperature value or the fourth temperature value ≤ T_j < the sixth temperature value, the fan 20 operates according to the second duty cycle; where the fifth temperature value and the sixth temperature value are preset temperature values, and the second duty cycle is greater than the first duty cycle;
[0084] (4) When the fifth temperature value ≤ T_pcb < the seventh temperature value or the sixth temperature value ≤ T_j < the eighth temperature value, the fan 20 operates according to the third duty cycle; where the seventh temperature value and the eighth temperature value are preset temperature values, and the third duty cycle is greater than the second duty cycle;
[0085] (5) When the seventh temperature value ≤ T_pcb < the ninth temperature value or the eighth temperature value ≤ T_j < the tenth temperature value, the fan 20 operates according to the fourth duty cycle; where the ninth and tenth temperature values are preset temperature values, and the fourth duty cycle is greater than the third duty cycle;
[0086] (6) When T_pcb ≥ the ninth temperature value or T_j ≥ the tenth temperature value, fan 20 operates according to the fifth duty cycle.
[0087] Optionally, the ambient temperature can be represented as T_a. For the case using rule (1) above, T_a satisfies: the eleventh temperature value ≤ T_a < the twelfth temperature value, and fan 20 does not generate noise, with the domain controller in natural cooling mode. For the case using rule (2) above, T_a satisfies: the twelfth temperature value ≤ T_a < the thirteenth temperature value, and the noise generated by fan 20 can be at the first decibel level. For the case using rule (3) above, T_a satisfies: the thirteenth temperature value ≤ T_a < the fourteenth temperature value, and the noise generated by fan 20 can be at the second decibel level. For the case using rule (4) above, T_a satisfies: the fourteenth temperature value ≤ T_a < the fifteenth temperature value, and the noise generated by fan 20 can be at the third decibel level. For the case using rule (5) above, T_a satisfies: the fifteenth temperature value ≤ T_a < the sixteenth temperature value, and the noise generated by fan 20 can be at the fourth decibel level. For the case where rule (6) is applied above, T_a satisfies: T_a ≥ the sixteenth temperature value, and the noise generated by fan 20 can be the fifth decibel. Among them, the second decibel can be greater than the first decibel, the third decibel can be greater than the second decibel, the fourth decibel can be greater than the third decibel, and the fifth decibel can be greater than the fourth decibel.
[0088] In the embodiments of this disclosure, the control chip can adaptively control the fan 20 based on the temperature information collected by the temperature sensor and the junction temperature information of the target heat-generating component. This helps to avoid the fan 20 from running for a long time at high speed and high noise, reduces the environmental noise of the whole vehicle, extends the service life of the fan 20, and also ensures the reliability of the fan 20.
[0089] In some alternative examples, the base 101 may have an opening Figure 4 The inlet port 1011 is shown.
[0090] like Figure 7 As shown, circuit board 40 may include:
[0091] substrate 403;
[0092] A heating element 401 is disposed on a substrate 403 and is used to generate heat.
[0093] Power supply terminal 405 is disposed on substrate 403. The power supply harness of fan 20 passes through inlet 1011 and is connected to power supply terminal 405.
[0094] Optionally, the substrate 403 can be a PCB. The heat-generating component 401 can be a chip, such as a smart driving chip. The heat-generating component 401 can be soldered to the substrate 403. The power supply terminal 405 can also be soldered to the substrate 403.
[0095] In the embodiments of this disclosure, since the power supply harness of the fan 20 passes through the inlet 1011 and is connected to the power supply terminal 405 (e.g., electrically connected), the circuit board 40 can supply power to the fan 20 in sequence through the power supply terminal 405 and the power supply harness of the fan 20, thereby enabling the fan 20 to be powered and start running.
[0096] In some embodiments, in addition to the substrate 403, heating element 401, power supply terminal 405, and power supply, the circuit board 40 may also include Figure 7 The connector 407 shown can be used to connect to a camera, radar, power supply, etc. The radar here could be, for example, a lidar or millimeter-wave radar.
[0097] In some optional examples, such as Figure 2 As shown, the domain controller provided in the embodiments of this disclosure may further include:
[0098] The second housing 70 is located on the side of the circuit board 40 away from the base 101;
[0099] The connector 80 is sequentially inserted through the second housing 70 and the circuit board 40 and connected to the base 101, so that the second housing 70 and the circuit board 40 are both fixed relative to the base 101.
[0100] Optionally, the normal operating state of the domain controller provided in the embodiments of this disclosure (see [link to relevant documentation]) Figure 1 In this configuration, the first housing 10 can serve as the upper housing of the domain controller, and the second housing 70 can serve as the lower housing of the domain controller. The second housing 70 can assist in fixing the circuit board 40 and protect it. The second housing 70 can be located on the side of the circuit board 40 away from the base 101. For example, the relative positions of the circuit board 40 and the base 101 may be as follows: Figure 2 In the case shown, the second housing 70 can be located on the right side of the base 101.
[0101] Optionally, the connector 80 can be a threaded component, such as a connecting screw or bolt. Taking the case where the connector 80 is a connecting screw as an example, the screw shank can pass through the second housing 70 and the circuit board 40 in sequence and be screwed onto the base 101. Furthermore, there can be multiple connecting screws. With the combined action of multiple connecting screws, the second housing 70 and the circuit board 40 can be securely fixed to the base 101.
[0102] In the embodiments of this disclosure, the circuit board 40 can be reliably installed by the arrangement of the second housing 70 and the connector 80.
[0103] In some optional examples, such as Figures 1 to 6 ,as well as Figures 8 to 9 As shown, the first housing 10 may also include a mounting lug 105, which may have a connection hole 1051. The domain controller can be fixed to the vehicle by screwing through the mounting lug 105 with the connection hole 1051. For example, mounting brackets can be provided in the vehicle's seats, trunk, or other locations. The mounting brackets and the mounting lug 105 can be fixed to each other by screwing, thereby achieving the fixation of the domain controller in the vehicle.
[0104] In summary, in the embodiments of this disclosure, the multiple heat dissipation fins 1031 of the heat dissipation structure 103 can be radially distributed on the base 101. Along the direction away from the hollow region, the gap between any two adjacent heat dissipation fins 1031 gradually increases, and the multiple heat dissipation fins 1031 are all slightly curved, which helps to increase the contact area with air. Air can flow out or in along the multiple heat dissipation fins 1031, maximizing the convective heat transfer area of the heat dissipation structure 103, effectively reducing wind resistance, and increasing the available airflow. The control chip can be configured according to a tiered control strategy (see [reference needed]). Figure 10 Controlling the fan 20 facilitates noise control and prevents it from operating at high speeds and high noise levels for extended periods, thus reducing overall vehicle noise, extending the fan 20's lifespan, and ensuring its reliability. Furthermore, the introduction of the thermally conductive reinforcement 50 allows for efficient and rapid heat transfer from high-power heat-generating components to the heat dissipation structure 103. Therefore, the embodiments of this disclosure can support domain controllers with higher performance, higher power consumption, and more stringent heat dissipation requirements.
[0105] Embodiments of this disclosure also provide a vehicle including the domain controller from any of the above embodiments. Specific implementations of the domain controller can be found in the description above. Since the domain controller possesses the aforementioned technical effects, the vehicle including the domain controller also exhibits corresponding technical effects, and will not be elaborated further here.
[0106] It should be noted that the various optional embodiments and implementation methods disclosed above can be flexibly selected and combined as needed to achieve the corresponding functions and effects, and this disclosure does not list them all.
[0107] The basic principles of this disclosure have been described above with reference to specific embodiments. However, it should be noted that the advantages, benefits, and effects mentioned in this disclosure are merely examples and not limitations, and should not be considered as essential features of each embodiment of this disclosure. Furthermore, the specific details disclosed above are for illustrative and facilitative purposes only, and are not limitations. These details do not limit the scope of this disclosure to the necessity of employing the aforementioned specific details for implementation.
[0108] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.
[0109] Various modifications and variations can be made to this disclosure without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.
Claims
1. A domain controller, comprising: A first housing (10) includes a base (101) and a heat dissipation structure (103) protruding from the base (101), wherein the heat dissipation structure (103) is recessed in a direction close to the base (101); A fan (20) is installed within the receiving portion; A cover plate (30) is located on the side of the fan (20) away from the base (101). The cover plate (30) covers the heat dissipation structure (103) to form an air duct defined by the cover plate (30), the heat dissipation structure (103) and the base (101). The air duct is connected to the external environment. A ventilation opening (301) is provided in the area of the cover plate (30) opposite to the fan (20). The ventilation opening (301) is connected to the external environment and the air duct respectively. The circuit board (40) is located on the side of the base (101) away from the heat dissipation structure (103), and the heat generated by the circuit board (40) is conducted to the base (101) and the heat dissipation structure (103) in sequence.
2. The domain controller according to claim 1, wherein, When the fan (20) is running, the air in the external environment enters through the vent (301) and carries the heat conducted to the heat dissipation structure (103) to the external environment through the air duct. And / or, When the fan (20) is running, the air in the external environment enters through the air duct and carries the heat conducted to the heat dissipation structure (103) to the external environment through the vent (301).
3. The domain controller according to claim 1, wherein, The heat dissipation structure (103) includes: Multiple heat dissipation fins (1031) are arranged radially and surround a hollow area opposite to the rotating shaft of the fan (20). The ends of the multiple heat dissipation fins (1031) facing the hollow area are recessed towards the base (101) to form the receiving portion. Any two adjacent heat dissipation fins (1031) together with the cover plate (30) and the base (101) form an air duct.
4. The domain controller according to claim 3, wherein, The heat dissipation structure (103) also includes: Multiple baffle columns (1033) are located in the hollow region and are evenly distributed.
5. The domain controller according to claim 3, wherein, For any two adjacent heat dissipation fins (1031) among the plurality of heat dissipation fins (1031), the width of the corresponding air duct gradually increases along the direction away from the hollow region; And / or, All of the aforementioned heat dissipation fins (1031) are curved fins.
6. The domain controller according to claim 1, wherein, The circuit board (40) includes a plurality of heating elements (401) for generating heat; The domain controller also includes: A thermally conductive reinforcing member (50) is fixed relative to the base (101), and heat can be conducted between the thermally conductive reinforcing member (50) and the base (101); A heat dissipation boss (60) is provided on the heat-conducting reinforcement member (50); A thermally conductive medium is sandwiched between the heat dissipation protrusion (60) and the target heat-generating element, wherein the target heat-generating element is one of the multiple heat-generating elements (401) that meets the preset power consumption conditions.
7. The domain controller according to claim 6, wherein, The heat dissipation structure (103) protrudes from the first surface (S1) of the base (101), and the second surface (S2) of the base (101) is disposed opposite to the first surface (S1); The thermally conductive reinforcing member (50) protrudes from the second surface (S2) in a direction away from the first surface (S1), and the thermally conductive reinforcing member (50) is bonded to the base (101); or, The base (101) has a recessed groove from the second surface (S2) toward the first surface (S1), and the heat-conducting reinforcement (50) is embedded in the groove and welded to the base (101).
8. The domain controller according to claim 1, wherein, The circuit board (40) includes: substrate(403); Multiple heating elements (401) are disposed on the substrate (403), and the multiple heating elements (401) are used to generate heat; A temperature sensor and a control chip are both disposed on the substrate (403). The control chip includes a first interface, a second interface, and a third interface. The first interface is connected to the temperature sensor to obtain temperature information collected by the temperature sensor. The second interface obtains junction temperature information of a plurality of heating elements (401) that meet preset power consumption conditions. The third interface is connected to the fan (20) to output a control signal adapted to the temperature information and the junction temperature information to the fan (20).
9. The domain controller according to claim 1, wherein, The base (101) is provided with a cable inlet; The circuit board (40) includes: substrate(403); A heating element (401) is disposed on the substrate (403) and is used to generate heat; A power supply terminal (405) is disposed on the substrate (403), and the power supply harness of the fan (20) passes through the inlet and is connected to the power supply terminal (405).
10. The domain controller of claim 1, further comprising: A second housing (70) is located on the side of the circuit board (40) away from the base (101); A connector (80) is sequentially inserted through the second housing (70) and the circuit board (40) and connected to the base (101) so that the second housing (70) and the circuit board (40) are both fixed relative to the base (101).
11. A vehicle comprising a domain controller as described in any one of claims 1-10.