Heat dissipation device for quick-response photosensitive diode sensor

Abstract

The utility model discloses a heat dissipation device for a quick response photosensitive diode sensor, which comprises a lower circular shell, an annular piece placing cavity is arranged on the inner wall of the upper end of the lower circular shell, a piece placing disc is arranged in the annular piece placing cavity, and a sensor body is arranged at the central position of the top end of the piece placing disc. A plurality of lower positioning seats are arranged on the outer wall of the lower circular shell, lower threaded holes are formed in the centers of the interiors of the lower positioning seats, the top ends of the lower threaded holes extend to the exteriors of the lower positioning seats, an upper circular shell is installed at the top end of the part containing disc, and a plurality of upper positioning seats are arranged on the outer wall of the upper circular shell; and upper positioning holes are formed in the central positions in the upper positioning seats. According to the utility model, the purpose of easily dismounting the whole heat dissipation device is achieved, the convenience of the heat dissipation device during maintenance is improved, the purpose of easily and quickly mounting the sensor body is achieved, and the purpose of easily carrying out air cooling heat dissipation on the sensor body is achieved.

Description

Technical Field

[0001] This utility model relates to the field of photodiode sensor technology, specifically a heat dissipation device for a fast-response photodiode sensor. Background Technology

[0002] A photodiode sensor is a device that converts light signals into electrical signals and is widely used in optical communication, optical measurement, optical control and other fields. However, under long-term operation or high-temperature environment, photodiode sensors are prone to performance degradation or even damage due to overheating. In order to improve this phenomenon, it is particularly important to develop a heat dissipation device for fast-response photodiode sensors.

[0003] Referring to CN210671107U, a heat dissipation device for sensors that is easy to install includes a sensor body, which is composed of a shell, a detection head, and terminals. The detection head is located at the bottom of the shell, and an external threaded sleeve is fitted onto the upper part of the outer circumferential surface of the shell. The external threaded sleeve is welded to the outer circumferential surface of the shell. A cooling structure is fitted onto the sensor body, and the cooling structure is composed of a cooling sleeve with an internal hollow structure. A shunt box is evenly arranged along the circumferential direction on the bottom surface of the cooling sleeve, and an installation nut is fixed to the top of the cooling sleeve. The installation nut is threadedly connected to the external threaded sleeve. This device can quickly install the heat dissipation device on the sensor, thereby dissipating heat and cooling the sensor, thus preventing the sensor from deviating from its detection accuracy during high-temperature use, which would reduce the accuracy and lifespan of the sensor. As can be seen from the above, although this device can be applied well, it is usually not convenient to quickly disassemble the entire heat dissipation device, which makes the maintenance of the heat dissipation device inconvenient and often troublesome for users. Utility Model Content

[0004] The purpose of this invention is to provide a heat dissipation device for a fast-response photodiode sensor, in order to solve the problem that although the device proposed in the background art can be applied well, it is usually not convenient to quickly disassemble the entire heat dissipation device, which makes the maintenance of the heat dissipation device inconvenient.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a heat dissipation device for a fast-response photodiode sensor, comprising a lower circular housing, an annular placement cavity on the inner wall of the upper end of the lower circular housing, a placement disk installed inside the annular placement cavity, a sensor body installed at the center of the top of the placement disk, a plurality of lower positioning seats on the outer wall of the lower circular housing, each lower positioning seat having a lower threaded hole at its center, the top of the lower threaded hole extending to the outside of the lower positioning seat, an upper circular housing installed at the top of the placement disk, a plurality of upper positioning seats on the outer wall of the upper circular housing, each upper positioning seat having an upper positioning hole at its center, both ends of the upper positioning hole extending to the outside of the upper positioning seat, a locking bolt installed inside the upper positioning hole, the bottom end of the locking bolt penetrating the upper positioning hole and threadedly connected to the lower threaded hole, and wire holes spaced at equal intervals on the surface of the upper circular housing.

[0006] Preferably, air inlets are provided on the outer walls of both sides of the upper circular shell, and one end of each air inlet extends into the interior of the upper circular shell. The air inlets allow outside air to flow into the interior of the upper circular shell.

[0007] Preferably, a heat dissipation unit is provided at the center of the top of the upper circular shell, the bottom of the heat dissipation unit is connected to the top of the upper circular shell, and an air outlet is provided at the center of the top of the heat dissipation unit so that the air inside the upper circular shell can flow out to the outside environment.

[0008] Preferably, the heat dissipation body has a hollow base frame inside, and a cooling fan is installed at the top of the hollow base frame to provide air cooling for the sensor body.

[0009] Preferably, the outer wall of the sensor body is provided with a plurality of pins, each of which has a pin hole inside. Both ends of the pin hole extend to the outside of the sensor body. The pin holes are provided to accommodate the positioning pins.

[0010] Preferably, a positioning pin is installed inside the pin hole, and the bottom end of the positioning pin passes through the pin hole and is threaded to the top end of the placement plate. The sensor body is bolted and placed on the top end of the placement plate by the bottom end of the positioning pin passing through the pin hole and screwing into the top end of the placement plate.

[0011] Compared with the prior art, the beneficial effects of this utility model are: the heat dissipation device for the fast response photodiode sensor not only achieves the purpose of easy disassembly and assembly of the heat dissipation device as a whole, so as to improve the convenience of heat dissipation device maintenance, but also achieves the purpose of easy and quick installation of the sensor body, and also achieves the purpose of easy air cooling of the sensor body.

[0012] (1) By using a tool to tighten the locking bolt, the lower end of the locking bolt passes through the upper positioning hole and is screwed into the lower threaded hole, so that the upper circular shell can be stably installed on the top of the placement plate. When the locking bolt is tightened and its lower end is screwed out to the outside of the lower threaded hole, the upper circular shell can be pulled upward to remove it from the top of the placement plate, so as to facilitate the disassembly and assembly of the heat dissipation device as a whole, thereby improving the convenience of heat dissipation device maintenance.

[0013] (2) By turning the positioning pin, the lower end of the positioning pin passes through the pin hole and is screwed into the top of the placement plate, so that the sensor body can be bolted and placed on the top of the placement plate, thereby achieving the purpose of easy and quick installation of the sensor body.

[0014] (3) By starting the cooling fan, the air inside the upper circular housing is blown to the outside environment through the air outlet, and the outside air flows into the inside of the upper circular housing through the air inlet, thereby achieving the purpose of easy air cooling of the sensor body. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the left-side structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the right-side structure of this utility model;

[0017] Figure 3 This is a frontal cross-sectional view of the present invention.

[0018] Figure 4 This is a top view of the sensor body of this utility model.

[0019] Figure 5 This is a top view of the lower circular shell structure of this utility model.

[0020] In the diagram: 1. Lower circular shell; 2. Upper circular shell; 3. Lower positioning seat; 4. Upper positioning seat; 5. Upper positioning hole; 6. Locking bolt; 7. Wire hole; 8. Heat sink body; 9. Air outlet; 10. Air inlet; 11. Component tray; 12. Sensor body; 13. Hollow base frame; 14. Cooling fan; 15. Lower threaded hole; 16. Pin; 17. Pin hole; 18. Positioning pin; 19. Annular component cavity. Detailed Implementation

[0021] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.

[0022] Please see Figure 1-5 An embodiment of this utility model provides a heat dissipation device for a fast-response photodiode sensor, including a lower circular housing 1. An annular placement cavity 19 is provided on the inner wall of the upper end of the lower circular housing 1. A placement disk 11 is installed inside the annular placement cavity 19. A sensor body 12 is installed at the center of the top of the placement disk 11. A plurality of pins 16 are provided on the outer wall of the sensor body 12. Each pin 16 has a pin hole 17 inside. Both ends of the pin hole 17 extend to the outside of the sensor body 12.

[0023] In use, the positioning pin 18 is installed through the pin hole 17;

[0024] A positioning pin 18 is installed inside the pin hole 17. The bottom end of the positioning pin 18 passes through the pin hole 17 and is threadedly connected to the top end of the mounting plate 11.

[0025] In use, the bottom end of the positioning pin 18 passes through the pin hole 17 and is screwed into the top of the placement plate 11 so that the sensor body 12 can be bolted and placed on the top of the placement plate 11.

[0026] The outer wall of the lower circular housing 1 is provided with several lower positioning seats 3. The center of each lower positioning seat 3 is provided with a lower threaded hole 15. The top of the lower threaded hole 15 extends to the outside of the lower positioning seat 3. The top of the placement plate 11 is equipped with an upper circular housing 2. The outer walls on both sides of the upper circular housing 2 are provided with air inlets 10. One end of each air inlet 10 extends into the interior of the upper circular housing 2.

[0027] In use, the air inlet 10 allows outside air to flow into the interior of the upper circular housing 2.

[0028] A heat dissipation unit 8 is provided at the center of the top of the upper circular shell 2. The bottom of the heat dissipation unit 8 is connected to the top of the upper circular shell 2. An air outlet 9 is provided at the center of the top of the heat dissipation unit 8.

[0029] When in use, the air outlet 9 is designed to allow the air inside the upper circular housing 2 to flow out to the outside environment;

[0030] The heat dissipation unit 8 has a hollow base frame 13 inside, and a cooling fan 14 is installed on the top of the hollow base frame 13;

[0031] During use, the sensor body 12 is cooled by air through the cooling fan 14.

[0032] The outer wall of the upper circular housing 2 is provided with several upper positioning seats 4. Each upper positioning seat 4 has an upper positioning hole 5 at its center. Both ends of the upper positioning hole 5 extend to the outside of the upper positioning seat 4. A locking bolt 6 is installed inside the upper positioning hole 5. The bottom end of the locking bolt 6 passes through the upper positioning hole 5 and is threadedly connected to the lower threaded hole 15. The surface of the upper circular housing 2 is provided with equally spaced wire holes 7.

[0033] In this embodiment, the sensor body 12 is first secured to the top of the mounting plate 11 by screwing the positioning pin 18 through the pin hole 17 and into the top of the mounting plate 11. This facilitates quick installation of the sensor body 12. When the lower end of the positioning pin 18 is screwed out of the mounting plate 11, the sensor body 12 can be removed from the top of the mounting plate 11 for easy disassembly and maintenance. Then, the cooling fan 14 is activated to blow air from inside the upper circular housing 2 through the air outlet 9 to the outside environment, and outside air flows into the housing through the air inlet 10. The sensor body 12 can be cooled by air cooling inside the upper circular housing 2. Finally, by using a tool to tighten the locking bolt 6, the lower end of the locking bolt 6 passes through the upper positioning hole 5 and is screwed into the lower threaded hole 15, so that the upper circular housing 2 can be stably installed on the top of the placement plate 11. When the lower end of the locking bolt 6 is tightened out to the outside of the lower threaded hole 15, the upper circular housing 2 can be pulled upward to remove it from the top of the placement plate 11. At this time, the placement plate 11 can be pulled upward to remove it from the outside of the annular placement cavity 19. The entire heat dissipation device can then be disassembled and maintained, thus completing the use of the heat dissipation device.

Claims

1. A heat sink for a fast-response photodiode sensor, characterized by: The utility model provides a sensor body (12) is equipped with a plurality of pin posts (16) on the outer wall, the inside of pin post (16) is equipped with pin hole (17), and both ends of pin hole (17) extend to the outside of sensor body (12), the inside of pin hole (17) is installed with the positioning pin (18), and the bottom of positioning pin (18) penetrates pin hole (17) and is connected with the top of component disc (11) threadedly.

2. The heat sink for a fast-response photosensitive diode sensor according to claim 1, characterized by: The utility model discloses a sensor body (12) is equipped with a plurality of pin posts (16) on the outer wall, the inside of pin post (16) is equipped with pin hole (17), and both ends of pin hole (17) extend to the outside of sensor body (12), the inside of pin hole (17) is installed with the positioning pin (18), and the bottom of positioning pin (18) penetrates pin hole (17) and is connected with the top of component disc (11) threadedly.

3. The heat sink for a fast-response photodiode sensor according to claim 1, wherein: The utility model discloses a sensor body (12) is equipped with a plurality of pin posts (16) on the outer wall, the inside of pin post (16) is equipped with pin hole (17), and both ends of pin hole (17) extend to the outside of sensor body (12), the inside of pin hole (17) is installed with the positioning pin (18), and the bottom of positioning pin (18) penetrates pin hole (17) and is connected with the top of component disc (11) threadedly.

4. The heat sink for a fast-response photodiode sensor according to claim 3, wherein: The utility model discloses a sensor body (12) is equipped with a plurality of pin posts (16) on the outer wall, the inside of pin post (16) is equipped with pin hole (17), and both ends of pin hole (17) extend to the outside of sensor body (12), the inside of pin hole (17) is installed with the positioning pin (18), and the bottom of positioning pin (18) penetrates pin hole (17) and is connected with the top of component disc (11) threadedly.

5. The heat sink for a fast-response photosensitive diode sensor according to claim 1, wherein: The utility model discloses a sensor body (12) is equipped with a plurality of pin posts (16) on the outer wall, the inside of pin post (16) is equipped with pin hole (17), and both ends of pin hole (17) extend to the outside of sensor body (12), the inside of pin hole (17) is installed with the positioning pin (18), and the bottom of positioning pin (18) penetrates pin hole (17) and is connected with the top of component disc (11) threadedly.

6. The heat sink for a fast-response photodiode sensor according to claim 5, wherein: ​

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