Wafer etching and cooling all-in-one machine

Abstract

The utility model provides a wafer etching and cooling all-in-one machine, which comprises an etching cavity, a cooling cavity and a cooling cavity, the mounting frame is located in the etching cavity and comprises a first mounting part and at least two second mounting parts, the first mounting part is vertically arranged, the at least two second mounting parts are vertically connected to the first mounting part, and the center point of the first mounting part is configured as a rotation center; the at least two cooling discs are respectively arranged on the surfaces, deviating from the rotating center, of the at least two second mounting parts and are used for adsorbing and fixing a wafer; the rotation driving part drives the first mounting part to rotate around the rotation center of the first mounting part by an angle alpha, so that the second mounting part at the highest position is in a horizontal state; the RPS mechanism is used for introducing process gas into the etching cavity; the etching process and the cooling process in the same chamber can be carried out at the same time, the waiting time and the transfer time for the wafers to enter and exit from different chambers are shortened, and the wafer processing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor manufacturing technology, and in particular to an integrated wafer etching and cooling machine. Background Technology

[0002] Etching is a crucial step in semiconductor manufacturing, microelectronics IC manufacturing, and micro / nano manufacturing processes. It is a primary patterning process associated with photolithography. In a narrow sense, etching is essentially photolithographic etching. First, photoresist is exposed to light using photolithography, and then other methods are used to etch away the unwanted portions. Etching is the process of selectively removing unwanted material from the surface of a silicon wafer using chemical or physical methods. Its basic goal is to accurately replicate the mask pattern on the coated silicon wafer. The simplest and most common classification of etching is: dry etching and wet etching.

[0003] The cooling chamber is an important component of the etching process. After the wafer etching is completed, if the wafer temperature is too high, it needs to be cooled. This requires the use of a robotic arm to transfer the wafer to the cooling chamber for cooling.

[0004] Due to the size limitations of the cooling chamber, the cooling chamber and the etching chamber are set up separately. This requires a large processing area, increases the cost of wafer manufacturing, and only one wafer can be cooled at a time in the cooling chamber, resulting in long wafer waiting times and low cooling efficiency. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides an integrated wafer etching and cooling machine that combines an etching chamber and a cooling chamber, increasing the number of processing stations and enabling simultaneous etching and cooling processes without interference. The technical solution adopted by this invention is as follows:

[0006] A wafer etching and cooling integrated machine, comprising:

[0007] The etching cavity has an inlet / outlet on its side for the wafer to enter and exit.

[0008] The mounting bracket, located inside the etching cavity, includes a first mounting part and at least two second mounting parts. The first mounting part is arranged vertically, and the at least two second mounting parts are respectively vertically connected to the first mounting part. The center point of the first mounting part is configured as a rotation center.

[0009] At least two cooling plates are respectively disposed on the surfaces of at least two second mounting portions opposite to the rotation center, for adsorbing and fixing the wafer;

[0010] A rotational drive unit drives the first mounting part to rotate around its rotation center by ∠α, so that the second mounting part at its highest point is in a horizontal state;

[0011] The RPS mechanism is used to introduce process gas into the etching chamber.

[0012] Furthermore, the rotary drive includes:

[0013] The first cylinder is located outside the etching cavity;

[0014] A guide portion is connected to the output end of the first cylinder. The guide portion extends into the etching cavity and is sealed to the etching cavity. A rack is provided on the guide portion.

[0015] The gear is connected to the rotation center and meshes with the rack.

[0016] Furthermore, the mounting bracket also includes:

[0017] A rotating shaft, the axis of which coincides with the rotation center, one end of which is connected to the first mounting part, and the gear is mounted on the rotating shaft.

[0018] Furthermore, the mounting bracket also includes:

[0019] A fixed frame is fixedly installed inside the etching cavity, and the rotating shaft is rotatably connected to the fixed frame.

[0020] Furthermore, the second mounting part is provided with a first cooling channel and a second cooling channel, and the cooling plate is provided with a third cooling channel, the first and second cooling channels being connected at their respective ends.

[0021] Furthermore, the second mounting part is provided with a first pipe connector and a second pipe connector on its side, the first pipe connector being connected to one end of the first cooling channel and the second pipe connector being connected to one end of the second cooling channel.

[0022] Furthermore, a fourth cooling channel is provided on the second mounting part, and a fifth cooling channel is provided in the cooling plate. The fourth cooling channel is connected to the fifth cooling channel. A plurality of air vents are provided on the surface of the cooling plate away from the second mounting part, and the air vents are connected to the fifth cooling channel.

[0023] The surface of the cooling plate away from the second mounting part has a protrusion.

[0024] Furthermore, the edge of the fifth cooling channel extends outward to form an extension channel, and one end of the air outlet extends to the extension channel.

[0025] Furthermore, a third pipe connector is provided on the side of the second mounting part, and the third pipe connector is connected to one end of the fourth cooling channel.

[0026] Furthermore, it also includes:

[0027] PIN pin;

[0028] A lifting drive is used to drive the PIN pin to rise or fall.

[0029] Advantages of this utility model:

[0030] By employing a multi-station placement of multiple wafers with the wafers facing outwards, etching and cooling processes can be performed simultaneously within the same chamber. This reduces the waiting time and transfer time for wafers entering and leaving different chambers, improves wafer processing efficiency, and lowers equipment costs.

[0031] The mounting bracket is rotated by the first cylinder, guide, and gear, which not only makes the rotation angle of the mounting bracket more accurate, but also makes the sealing between the guide and the etching cavity easier to handle.

[0032] The inert gas cooling path is increased by adding the fourth and fifth cooling channels, and the wafer cooling process is further accelerated by the contact between the inert gas and the wafer surface. Attached Figure Description

[0033] Figure 1 This is a first-view sectional view of the present invention.

[0034] Figure 2 This is a second-view sectional view of the present invention.

[0035] Figure 3 This is a third-view sectional view of the present invention.

[0036] Figure 4 This is a schematic diagram of the structure without the RPS mechanism.

[0037] Figure 5 This is a schematic diagram of the cooling plate.

[0038] Figure 6 This is a schematic diagram of the assembly of the second mounting section and the cooling plate.

[0039] Figure 7 This is a schematic diagram of the third cooling channel in the cooling plate.

[0040] Figure 8 This is a schematic diagram of the fifth cooling channel in the cooling plate.

[0041] In the diagram: 100 - Etching cavity, 110 - Inlet / outlet, 200 - Mounting bracket, 210 - First mounting section. 220 - Second mounting section, 221 - First cooling channel, 222 - Second cooling channel, 223 - First pipe connector, 224 - Second pipe connector, 225 - Fourth cooling channel, 226 - Third pipe connector, 230 - Rotating shaft, 240 - Fixing bracket, 300 - Cooling plate, 310 - Perforation, 320 - Third cooling channel, 330 - Fifth cooling channel, 331 - Vent, 332 - Extension channel, 340 - Protrusion, 400 - Rotary drive component, 410 - First cylinder, 420 - Lateral guide rod, 430 - First longitudinal guide rod, 440 - Second longitudinal guide rod, 450 - Gear, 460 - First sealing bushing, 500 - RPS mechanism, 600 - PIN pin, 700 - Lifting drive component, 710 - Second cylinder, 720 - Swing arm, 730 - Second sealing bushing, 740 - Cylinder bracket. Detailed Implementation

[0042] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0043] Please see the appendix Figure 1 - Appendix Figure 4 This application proposes a wafer etching and cooling integrated machine, comprising: an etching cavity 100 with inlet and outlet 110 for wafer entry and exit on its side; a mounting bracket 200 located within the etching cavity 100, including a first mounting portion 210 and at least two second mounting portions 220, wherein the first mounting portion 210 is vertically arranged, and the at least two second mounting portions 220 are respectively vertically connected to the first mounting portion 210, and the center point of the first mounting portion 210 is configured as a rotation center; and at least two cooling plates 300 respectively disposed on the surfaces of the at least two second mounting portions 220 opposite to the rotation center. The upper part is used to adsorb and fix the wafer; the rotation drive 400 drives the first mounting part 210 to rotate around its rotation center by ∠α, so that the second mounting part 220 at the highest point is in a horizontal state; the RPS mechanism 500 is used to introduce process gas into the etching cavity 100; PIN pin 600; lifting drive 700 is used to drive the PIN pin 600 to rise or fall; wherein, when the PIN pin 600 rises, the PIN pin 600 lifts the wafer on the horizontal cooling disk 300; when the PIN pin 600 falls, the wafer sits on the horizontal cooling disk 300.

[0044] In this application, the second mounting part 220 and the cooling plate 300 are combined to form a cooling station. In the cooling station opposite to the inlet and outlet 110, the second mounting part 220 and the cooling plate 300 are both arranged horizontally. In multiple cooling stations, the cooling plate 300 is arranged facing outward to ensure that the wafer on the surface of the cooling plate 300 can effectively contact the process gas. The PIN pin position 600 is lower than the highest cooling station and does not interfere with the rotation of other cooling stations.

[0045] In one embodiment, as shown in the appendix Figure 5 As shown, the second mounting part 220 and the cooling plate 300 are respectively provided with through holes 310 to facilitate the PIN pin 600 to contact the wafer surface through the through holes 310. The RPS mechanism 500 is located on the upper side of the etching chamber 100. The process gas enters the etching chamber 100 from the interface between the RPS mechanism 500 and the etching chamber 100. In the wafer etching and cooling combined process, the robot arm carrying the wafer enters the etching chamber 100 horizontally through the inlet and outlet 110. The PIN pin 600 is used to raise and lower the wafer to make it sit horizontally on the surface of the cooling plate 300 at the highest point. The electrostatic adsorption function of the cooling plate 300 is used to adsorb and fix the wafer on the surface of the cooling plate 300. The process gas enters the etching chamber 100 through the RPS mechanism 500 and the cooling plate 300. After being ionized in the PS mechanism 500, the wafer enters the etching chamber 100 and reacts with the adhesive on the surface of the highest cooling pad 300, thus removing the adhesive from the wafer. After adhesive removal, the second mounting part 220 and the cooling pad 300 rotate with the first mounting part 210 by ∠α, using the cooling function of the cooling pad 300 to cool the wafer. The next empty cooling pad 300 then receives the wafer at the inlet / outlet 110 for etching. After the lower wafer is cooled and the upper wafer is etched, the mounting bracket 200 reverses, and the corresponding cooling pad 300 rotates back to horizontal. The cooled wafer is then lifted by the PIN pin 600 and removed from the etching chamber 100, while the remaining wafers continue to cool. By combining the wafer etching and wafer cooling processes in the same chamber without interference between the processes, wafer processing efficiency is improved.

[0046] It is easy to understand that the electrostatic attraction force of the cooling plate 300 is much greater than the weight of the wafer, so even if the cooling station sways under the rotation of the mounting bracket 200, it will not affect the wafer fixation effect.

[0047] In one specific embodiment, there are two cooling stations, arranged in a mirror-symmetrical manner, i.e., ∠α=180°;

[0048] In the wafer etching and cooling step, the robotic arm carrying the first wafer enters the etching chamber 100 horizontally through the inlet / outlet 110, transferring the wafer to the upper cooling station. The PIN pin 600 rises to pick up the wafer, the robotic arm exits, the wafer sits on the PIN pin 600, the PIN pin 600 descends, and the wafer sits on the surface of the cooling tray 300 and is fixed in place, followed by the etching process. After etching is completed, the mounting bracket 200 rotates 180° around the rotation center, causing the upper and lower cooling stations to switch, that is, the cooling tray 300 carrying the first wafer is transferred to the lower position, and the empty cooling tray 300 is transferred to the upper position. Then, the lower cooling tray 300 cools the first wafer, and the upper cooling tray carries the wafer for the etching process. At this time, the wafers on the upper and lower cooling trays 300 are in two different process states.

[0049] Before the countdown ends and the second wafer is etched, the mounting bracket 200 reverses, and the two cooling trays 300 are swapped again. That is, the first wafer that was placed in the first position is aligned with the inlet / outlet 110 again after cooling or before. The robot arm takes out the cooled wafer and puts in a new wafer. The etched wafer below is then cooled. The above steps are repeated to achieve the picking, placing, etching, and cooling of multiple wafers.

[0050] In another specific embodiment, there are four cooling stations, which are arranged radially in front and behind and radially symmetrically in the top and bottom, i.e., ∠α=90°. In the wafer cold etching step, except for the different rotation angle of the mounting bracket 200 each time, the other steps are the same as the wafer etching and cooling steps under the two cooling station conditions, and will not be described in detail here.

[0051] In other embodiments, the number of cooling stations is three, with an included angle of 60°, i.e., ∠α=120°. In the wafer cooling step, except for the different rotation angle of the mounting bracket 200 each time, the other steps are the same as the wafer etching and cooling steps under the two cooling station conditions, and will not be described in detail here.

[0052] This application designs the structure of the mounting bracket 200 so that the rotation center of the mounting bracket 200 is a horizontal line, enabling the cooling stations to flip up and down or forward and backward, thus optimizing the space within the original etching cavity 100. The cooling stations are added without changing the original structure and volume of the etching cavity 100. At least two wafers can be accommodated in the same etching cavity 100, and the etching process and cooling process do not interfere with each other, improving the cooling efficiency of the wafers. It is also suitable for small and crowded spaces.

[0053] Please see the appendix Figure 3 and attached Figure 4The rotary drive 400 includes: a first cylinder 410 disposed outside the etching cavity 100; a guide portion connected to the output end of the first cylinder 410, the guide portion extending into the etching cavity 100 and being sealed to the etching cavity 100, the guide portion being provided with a rack; and a gear 450 connected to the rotation center and meshing with the rack.

[0054] The rotation process of the mounting bracket 200 is as follows: the linear motion of the first cylinder 410 transmits power to the rack through the guide, realizing the rack moving up and down in the vertical direction. Then, the meshing action of the rack and the gear 450 realizes the rotation of the gear, ultimately realizing the mounting bracket 200 rotating forward or backward at a certain ∠α. Through the rotational drive structure of the linkage of the first cylinder 410, the gear 450 and the rack, the predetermined stroke of the first cylinder 410 is combined with the specific transmission ratio of the gear and rack, so that the cooling plate 300 opposite to the inlet and outlet 110 is always in a horizontal state, preventing the cooling plate from tilting and improving the positioning effect of the wafer on the cooling plate 300.

[0055] In one embodiment, the guide portion includes a transverse guide rod 420, a first longitudinal guide rod 430, and a second longitudinal guide rod 440. The transverse guide rod 420 is arranged horizontally, while the first longitudinal guide rod 430 and the second longitudinal guide rod 440 are arranged vertically. One end of the first longitudinal guide rod 430 and the output end of the first cylinder 410 are respectively connected to the transverse guide rod 420. The first longitudinal guide rod 430 extends into the etching cavity 100 and is sealed to the etching cavity 100 through a sealing bushing 460. The second longitudinal guide rod 440 is fixedly connected to the first longitudinal guide rod 430 by a pin.

[0056] Using the first cylinder 410 as the power source, linear power is converted into rotational power. Compared with the direct drive of the motor, the sealing structure between the first longitudinal guide rod 430, which serves as the carrier of linear power, and the etching cavity 100 is easier to handle, which can achieve efficiency improvement and cost reduction to a certain extent.

[0057] Please see the appendix Figure 3 The mounting bracket 200 further includes a rotating shaft 230, whose axis coincides with the rotation center, and one end of which is connected to the first mounting part 210. The gear 450 is disposed on the rotating shaft 230. The rotating shaft 230 can increase the distance between the gear 450 and the first mounting part 210, and also avoids motion interference between the components. The gear 450 is keyed to the rotating shaft 230 for easy disassembly and assembly.

[0058] In one specific embodiment, please refer to the appendix. Figure 3The mounting bracket 200 further includes a fixing bracket 240, which is fixedly disposed within the etching cavity 100, and the rotating shaft 230 is rotatably connected to the fixing bracket 240. The fixing bracket 240 can further stabilize the rotation of the mounting bracket 200 within the etching cavity 100.

[0059] In another specific embodiment, the other end of the rotating shaft 230 is directly rotatably connected to the etching cavity 100 via a bearing.

[0060] Furthermore, the second longitudinal guide rod 440 and the fixed frame 240 are slidably connected by a slide rail and a slide groove, which can further improve the guiding performance of the guide part and ensure the meshing effect of the gear and rack.

[0061] Please see the appendix Figure 1 and attached Figure 3 In this application, the lifting drive 700 includes a second cylinder 710, a swing arm 720, a sealing bushing 730, and a cylinder bracket 740. The second cylinder 710 is fixed to the bottom of the etching cavity 100 via the cylinder bracket 740. The output end of the second cylinder 710 extends into the etching cavity 100 and connects to the swing arm 720. The sealing bushing 730 is fitted onto the output end of the second cylinder 710, and its two ends are respectively sealed to the swing arm 720 and the inner wall of the etching cavity 100 to prevent process gas from leaking downwards from the output end of the second cylinder 710. The swing arm 720 extends horizontally toward the first mounting portion 210, and the PIN pin 600 is fixed to the top of the swing arm 720. As the output end of the second cylinder 710 extends and retracts, the swing arm 720 and the PIN pin 600 rise and fall synchronously to complete the action of lifting or lowering the wafer. The swing arm 720 avoids the mounting position of the second mounting part 220 without interfering with the space required for the rotation of the second mounting part 220, thus preventing parts from colliding.

[0062] Please see the appendix Figure 6 The second mounting part 220 is provided with a first cooling channel 221 and a second cooling channel 222, and the cooling plate 300 is provided with a third cooling channel 320 inside, the first and second cooling channels 221 and 222 being connected at both ends of the third cooling channel 320 respectively.

[0063] The first cooling channel 221, the second cooling channel 222, and the third cooling channel 320 work together to achieve the flow of coolant within the cooling plate 300. The coolant can pass through the first cooling channel 221, the third cooling channel 320, and the second cooling channel 222 successively through the cooling plate 300, and exchange heat with the wafer on the cooling plate 300 to achieve wafer cooling. The coolant can also pass through the second cooling channel 222, the third cooling channel 320, and the first cooling channel 221 successively through the cooling plate 300, and exchange heat with the wafer on the cooling plate 300 to achieve wafer cooling.

[0064] Please see the appendix Figure 6 and attached Figure 7 In order to provide circulating coolant to the cooling plate 300 and to facilitate the installation and connection of coolant pipelines, the second mounting part 220 is provided with a first pipe joint 223 and a second pipe joint 224 on its side. The first pipe joint 223 is connected to one end of the first cooling channel 221, and the second pipe joint 224 is connected to one end of the second cooling channel 222.

[0065] It should be noted that, to avoid the coolant piping connecting the first pipe joint 223 and the second pipe joint 224 being affected by the rotation of the mounting bracket 200, the coolant piping is laid in the direction of rotation of the mounting bracket 200, that is, in the cooling station opposite to the inlet / outlet 110, the cooling pipe has the greatest stretch, thus avoiding pipe tangling and knotting; for example, with the attached... Figure 1 Based on the shown up, down, left, and right directions, the coolant piping can be understood to be laid in the following way: when there are two cooling stations arranged vertically, the upper coolant piping bends to the left and extends, while the lower coolant piping bends to the right. When the lower cooling plate 300 is placed on the wafer and rotated 180° counterclockwise, the cooling piping moves from the lower right of the cooling station to its upper right, while the upper left cooling piping moves from the upper left to the lower left.

[0066] In one specific embodiment, the second mounting part 220 is plate-shaped, the first cooling channel 221 and the second cooling channel 222 are holes, and the third cooling channel 320 is disc-shaped.

[0067] Please see the appendix Figure 6 and attached Figure 8 The second mounting part 220 is provided with a fourth cooling channel 225, and the cooling plate 300 is provided with a fifth cooling channel 330. The fourth cooling channel 225 is connected to the fifth cooling channel 330. The surface of the cooling plate 300 away from the second mounting part 220 is provided with a plurality of air vents 331, and the air vents 331 are connected to the fifth cooling channel 330. The surface of the cooling plate 300 away from the second mounting part 220 is provided with a protrusion 340.

[0068] The fourth cooling channel 225 and the fifth cooling channel 330 are used together to allow low-temperature inert gases such as helium to contact the wafer surface. For example, helium flows through the fourth cooling channel 225, the fifth cooling channel 330, and the vent 331 to the front side of the cooling pad 300 (i.e., the back side of the wafer). Because the protrusion 340 prevents the wafer surface from completely adhering to the cooling pad 300, the helium can flow from the gap at the protrusion 340 to the periphery of the wafer and finally to the front side of the wafer. Ultimately, the helium forms a helium layer on the surface of the cooling pad, which exchanges heat with the wafer surface to accelerate wafer cooling.

[0069] It is understandable that the third cooling channel 320 used for introducing coolant and the fifth cooling channel 330 used for introducing helium are not interconnected. Therefore, the third cooling channel 320 and the fifth cooling channel 330 inside the cooling plate 300 need to be arranged vertically or horizontally.

[0070] When considering the shape of the fifth cooling channel 330, since helium is blown onto the wafer surface and no circuit is required, designing the fifth cooling channel 330 as a ring and designing several vent holes 331 to form a ring can improve the uniformity of helium gas output.

[0071] In one specific embodiment, there are two fourth cooling channels 225 and two fifth cooling channels 330; wherein, in the axial direction of the cooling plate 300, the two fifth cooling channels 330 are located on the upper and lower sides of the third cooling channel 320 respectively, and in the radial direction of the cooling plate 300, the two fifth cooling channels 330 are located on the inner and outer sides of the third cooling channel 320 respectively; by increasing the number of fifth cooling channels 330, the flow rate of helium is increased, which is beneficial to improving the cooling effect.

[0072] To further expand the helium venting area, the attached... Figure 8 As shown, the edge of the fifth cooling channel 330 extends outward to form an extension channel 332, and one end of the air outlet 331 extends to the extension channel 332.

[0073] Please see the appendix Figure 6 and Figure 8 In order to provide process gas (i.e. helium) to the cooling plate 300 and to facilitate the installation and connection of gas pipelines, a third pipe connector 226 is provided on the side of the second mounting part 220, and the third pipe connector 226 is connected to one end of the fourth cooling channel 225.

[0074] It should be noted that, in order to avoid the gas pipeline connected to the third pipe joint 226 being affected by the rotation of the mounting bracket 200, the gas pipeline is laid in the direction of rotation of the mounting bracket 200. That is, in the cooling station opposite to the inlet and outlet 110, the gas pipeline is stretched the most, so as to avoid the pipeline from getting tangled and knotted. The specific understanding is the same as that of the liquid pipeline, and will not be repeated.

[0075] Finally, it should be noted that the above specific embodiments are only used to illustrate the technical solution of this utility model and not to limit it. Although this utility model has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A wafer etching and cooling integrated machine, characterized in that, include: The etching cavity (100) has an inlet and outlet (110) on its side for wafer entry and exit. Mounting bracket (200), located inside etching cavity (100), includes a first mounting part (210) and at least two second mounting parts (220). The first mounting part (210) is arranged vertically, and at least two second mounting parts (220) are respectively vertically connected to the first mounting part (210). The center point of the first mounting part (210) is configured as a rotation center. At least two cooling discs (300) are respectively disposed on the surfaces of at least two second mounting portions (220) opposite to the rotation center, for adsorbing and fixing the wafer; The rotation drive (400) drives the first mounting part (210) to rotate around its rotation center through ∠α, so that the second mounting part (220) at the highest point is in a horizontal state; RPS mechanism (500) is used to introduce process gas into the etching cavity (100).

2. The integrated wafer etching and cooling machine as described in claim 1, characterized in that, The rotary drive (400) includes: The first cylinder (410) is located outside the etching cavity (100); A guide portion is connected to the output end of the first cylinder (410). The guide portion extends into the etching cavity (100) and is sealed to the etching cavity (100). A rack is provided on the guide portion. The gear (450) is connected to the rotation center and meshes with the rack.

3. The integrated wafer etching and cooling machine as described in claim 2, characterized in that, The mounting bracket (200) also includes: A rotating shaft (230) has its axis coincident with the rotation center and one end is connected to the first mounting part (210). The gear (450) is disposed on the rotating shaft (230).

4. The integrated wafer etching and cooling machine as described in claim 3, characterized in that, The mounting bracket (200) also includes: A fixed frame (240) is fixedly installed inside the etching cavity (100), and the rotating shaft (230) is rotatably connected to the fixed frame (240).

5. The wafer etching and cooling integrated machine as described in any one of claims 1-4, characterized in that: The second mounting part (220) is provided with a first cooling channel (221) and a second cooling channel (222), and the cooling plate (300) is provided with a third cooling channel (320) inside. The first and second ends of the third cooling channel (320) are respectively connected to the first cooling channel (221) and the second cooling channel (222).

6. The wafer etching and cooling integrated machine as described in claim 5, characterized in that: The second mounting part (220) is provided with a first pipe connector (223) and a second pipe connector (224) on its side. The first pipe connector (223) is connected to one end of the first cooling channel (221), and the second pipe connector (224) is connected to one end of the second cooling channel (222).

7. The wafer etching and cooling integrated machine as described in any one of claims 1-4, characterized in that: The second mounting part (220) is provided with a fourth cooling channel (225), and the cooling plate (300) is provided with a fifth cooling channel (330). The fourth cooling channel (225) is connected to the fifth cooling channel (330). A plurality of air vents (331) are provided on the surface of the cooling plate (300) away from the second mounting part (220). The air vents (331) are connected to the fifth cooling channel (330). The surface of the cooling plate (300) away from the second mounting part (220) is provided with a protrusion (340).

8. The integrated wafer etching and cooling machine as described in claim 7, characterized in that: The edge of the fifth cooling channel (330) extends outward to form an extension channel (332), and one end of the air outlet (331) extends to the extension channel (332).

9. The integrated wafer etching and cooling machine as described in claim 7, characterized in that: The second mounting part (220) is provided with a third pipe connector (226) on its side, and the third pipe connector (226) is connected to one end of the fourth cooling channel (225).

10. The integrated wafer etching and cooling machine as described in claim 1, characterized in that, Also includes: PIN pins (600); A lifting drive (700) is used to drive the PIN pin (600) to rise or fall.

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