Universal tool for packaging power tube shell

Abstract

The utility model provides a universal tool for packaging a power tube shell, which belongs to the technical field of electronic packaging and comprises a tube shell. The plurality of chips are arranged on the inner surface of the tube shell; a tube shell assembly area is arranged at the upper end of the tube shell fixing tool, the inner surface of the tube shell assembly area is in sliding connection with the outer surface of the tube shell, and ventilation holes are formed in the inner surface of the tube shell assembly area; the pressing block containing area is formed in the upper end of the tube shell fixing tool, a second pressing block is slidably connected to the inner surface of the pressing block containing area, and a first threaded hole is formed in the upper end of the second pressing block; the problem that the tube shells and the tool jig are repeatedly disassembled one by one from the beginning of tube shell packaging to the completion of tube shell cover plate sealing is solved, the problem that products are collided or damaged is avoided, and the production efficiency and the yield of power device packaging are improved.

Description

Technical Field

[0001] This utility model belongs to the field of electronic packaging technology, specifically relating to a general tooling for power transistor packaging. Background Technology

[0002] A typical chip packaging and testing process includes eutectic bonding, chip mounting, reflow soldering, vapor phase cleaning, gold wire bonding, capping, and testing. The main equipment involved includes eutectic bonding machines, automatic dispensing machines, chip mounters, reflow ovens, vapor phase cleaning machines, bonding machines, and parallel seam soldering machines. Because the working principles and operating methods of each piece of equipment differ, it is necessary to design corresponding tooling and fixtures specifically for each piece of equipment to ensure the smooth operation of each process.

[0003] Due to different tooling, the tube shell needs to be disassembled from the tooling of the previous process and installed on the tooling of the next process during the circulation process. During the disassembly and assembly of each tube shell, due to manual operation, the product is prone to bumping or damage, and manual disassembly and assembly results in low production efficiency. Utility Model Content

[0004] The purpose of this utility model is to provide a universal tooling for power tube packaging, which aims to solve the problem in the prior art where, due to different tooling, the tube needs to be disassembled from the tooling of the previous process and installed on the tooling of the next process during the circulation process. In the process of disassembling and assembling each tube individually, due to manual operation, the product is prone to bumps or damage, and manual disassembly and assembly results in low production efficiency.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A general-purpose tooling for power transistor packages, comprising:

[0007] Tube shell;

[0008] Multiple chips, all of which are disposed on the inner surface of the casing;

[0009] A pipe shell fixing fixture has a pipe shell assembly area at its upper end. The inner surface of the pipe shell assembly area is slidably connected to the outer surface of the pipe shell. Ventilation holes are provided on the inner surface of the pipe shell assembly area.

[0010] A pressure block placement area is provided at the upper end of the tube shell fixing fixture. A second pressure block is slidably connected to the inner surface of the pressure block placement area. A first threaded hole is provided at the upper end of the second pressure block.

[0011] A dispensing and bonding mechanism is disposed on the outer surface of a housing fixing fixture to perform dispensing and bonding work on multiple chips.

[0012] A gold wire bonding mechanism, wherein the gold wire bonding mechanism is disposed on the outer surface of a housing fixing fixture to realize the gold wire bonding of multiple chips; and

[0013] A parallel sealing welding mechanism is provided on the outer surface of the pipe shell fixing fixture to perform the work of sealing the pipe shell fixing fixture with an airtight seal.

[0014] As a preferred embodiment of this utility model, one end of the tube shell fixing fixture has two first conical positioning holes, and the other end of the tube shell fixing fixture is fixedly connected to two conical positioning posts. The inner surfaces of the two first conical positioning holes and the outer surfaces of the two conical positioning posts are slidably connected.

[0015] As a preferred embodiment of this utility model, a first pressure block is slidably connected to the inner surface of the tube assembly area, and a first threaded hole is provided at the upper end of the first pressure block.

[0016] As a preferred embodiment of this utility model, the dispensing and patching mechanism includes:

[0017] A dispensing and patching fixture base is provided on the outer surface of a tube shell fixing fixture. The upper end of the dispensing and patching fixture base is provided with a first pressure strip and a second pressure strip. Two second conical positioning holes are opened on one side end of the dispensing and patching fixture base. Multiple second threaded holes are opened on the upper ends of the first pressure strip and the second pressure strip.

[0018] As a preferred embodiment of this utility model, the gold wire bonding mechanism includes:

[0019] A bonding fixture base is provided on the outer surface of the tube shell fixing fixture. The upper end of the bonding fixture base is provided with a third pressure strip and a fourth pressure strip. Two third conical positioning holes are opened on one side end of the bonding fixture base. Two third threaded holes are opened on the upper end of the third pressure strip and the fourth pressure strip.

[0020] As a preferred embodiment of this utility model, the parallel sealing welding mechanism includes:

[0021] A sealing welding fixture base is provided on the outer surface of the pipe shell fixing fixture. The upper end of the sealing welding fixture base is provided with a fifth pressure strip, a sixth pressure strip, and a seventh pressure strip. A plurality of fourth conical positioning holes are opened on one side end of the sealing welding fixture base. A plurality of fourth threaded holes are opened on the upper end of the fifth pressure strip, the sixth pressure strip, and the seventh pressure strip. A cover plate is provided on the outer surface of the pipe shell.

[0022] As a preferred embodiment of this utility model, it further includes a reflux mechanism, the reflux mechanism comprising:

[0023] A return tray is disposed on the outer surface of the tube shell fixing fixture, and two tray supports are fixedly connected to the lower end of the return tray.

[0024] As a preferred embodiment of this utility model, it further includes a cleaning mechanism, which comprises:

[0025] The suspended platform is disposed on the outer surface of the pipe shell fixing fixture, and a placement rack is disposed on the inner surface of the suspended platform. The outer surface of the placement rack is slidably connected to the outer surface of the pipe shell fixing fixture.

[0026] Compared with the prior art, the beneficial effects of this utility model are:

[0027] 1. In this solution, the housing, as the main part of the packaging structure, is used to accommodate and protect multiple chips, providing physical protection and environmental isolation. The housing fixing fixture installs and places the housing containing the chips. The interior of the housing assembly area is recessed to accommodate the housing. The inner surface of the housing assembly area slides with the outer surface of the housing, allowing the housing to move freely within it for easy installation and removal. The ventilation holes reduce the heat absorption of the fixture during reflow soldering. The pressure block placement area places and installs the second and first pressure blocks, applying uniform pressure during dispensing and placement to ensure accurate device positioning. Simultaneously, bolts or other fasteners are used in conjunction with nine first threaded holes to fix six second pressure blocks and three first pressure blocks in place, ensuring their stability. This applies pressure during dispensing and placement to ensure correct chip bonding. This solution solves the problem of repeatedly disassembling and assembling the housing and fixture one by one from the start of housing packaging to the completion of housing cover sealing, avoiding product bumps or damage, and improving the production efficiency and yield of power device packaging.

[0028] 2. In this solution, two conical positioning posts are fixed to one end of the tube shell fixing fixture to provide precise positioning when docking with other fixture bases or multiple tube shell fixing fixtures. Based on the two first conical positioning holes, the two conical positioning posts are used in conjunction to ensure precise docking between multiple tube shell fixing fixtures. Attached Figure Description

[0029] The accompanying drawings are provided to further illustrate the present invention and form part of the specification. They are used together with the embodiments of the present invention to explain the present invention, but do not constitute a limitation thereof. In the drawings:

[0030] Figure 1 This is a perspective view of the tube shell of this utility model;

[0031] Figure 2 This is a drawing of the outer shell of the present invention;

[0032] Figure 3 This is a side view of the casing of this utility model;

[0033] Figure 4 This is a schematic diagram of the tube shell fixing fixture of this utility model;

[0034] Figure 5 This is a side view of the tube shell fixing fixture of this utility model;

[0035] Figure 6 This is a schematic diagram of the pressing block of this utility model;

[0036] Figure 7 This is a side sectional view of the pressure block of this utility model;

[0037] Figure 8 This is a schematic diagram of the tube shell and tooling assembly of this utility model;

[0038] Figure 9 This is a side sectional view of the assembly of the tube shell and tooling of this utility model;

[0039] Figure 10 This is the first exploded view of the dispensing and patching fixture of this utility model;

[0040] Figure 11 This is the second exploded view of the dispensing and patching fixture of this utility model;

[0041] Figure 12 This is a schematic diagram of the assembly of the patch tooling and the tube shell tooling of this utility model;

[0042] Figure 13 This is a side sectional view of the assembly of the patch tooling and the tube shell tooling of this utility model;

[0043] Figure 14 This is a top view of the return tray of this utility model;

[0044] Figure 15 This is a side view of the return tray of this utility model;

[0045] Figure 16 This is a front view of the suspended platform of this utility model;

[0046] Figure 17 This is a top view of the suspended platform of this utility model;

[0047] Figure 18 This is the first exploded view of the bonding tooling of this utility model;

[0048] Figure 19 This is a second exploded view of the bonding tooling of this utility model;

[0049] Figure 20 This is a schematic diagram of the bonding tooling assembly of this utility model;

[0050] Figure 21 This is the first exploded view of the parallel sealing welding fixture of this utility model;

[0051] Figure 22 This is the second exploded view of the parallel sealing welding fixture of this utility model;

[0052] Figure 23 This is a top view of the assembly tooling of this utility model;

[0053] Figure 24 This is a side sectional view of the assembly tooling of this utility model.

[0054] In the diagram: 1. Tube shell; 2. Chip; 3. Tube shell fixing fixture; 4. Tube shell assembly area; 5. Ventilation hole; 6. First threaded hole; 7. Press block placement area; 8. Conical positioning post; 9. First conical positioning hole; 10. First pressing block; 11. Second pressing block; 12. Dispensing and patch mounting fixture base; 13. First pressing strip; 14. Second pressing strip; 15. Second threaded hole; 16. Second conical positioning hole; 17. Return tray; 18. Tray support; 19. Bonding fixture base; 20. Third pressing strip; 21. Fourth pressing strip; 22. Third conical positioning hole; 23. Third threaded hole; 24. Hanging basket; 25. Sealing and welding fixture base; 26. Fifth pressing strip; 27. Sixth pressing strip; 28. Seventh pressing strip; 29. ​​Fourth threaded hole; 30. Fourth conical positioning hole; 31. Cover plate; 32. Placement rack. Detailed Implementation

[0055] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0056] Example 1

[0057] Please see Figure 1-24 The present invention provides the following technical solution:

[0058] A general-purpose tooling for power transistor packages, comprising:

[0059] Shell 1;

[0060] Multiple chips 2 are disposed on the inner surface of the housing 1;

[0061] The tube shell fixing fixture 3 has a tube shell assembly area 4 at its upper end. The inner surface of the tube shell assembly area 4 is slidably connected to the outer surface of the tube shell 1. The inner surface of the tube shell assembly area 4 has ventilation holes 5.

[0062] The pressure block placement area 7 is located at the upper end of the tube shell fixing fixture 3. The inner surface of the pressure block placement area 7 is slidably connected to a second pressure block 11, and the upper end of the second pressure block 11 is provided with a first threaded hole 6.

[0063] The dispensing and mounting mechanism is set on the outer surface of the tube housing fixing fixture 3 to realize the dispensing and mounting work of multiple chips 2.

[0064] The gold wire bonding mechanism is disposed on the outer surface of the housing fixing fixture 3 to realize the gold wire bonding of multiple chips 2; and

[0065] The parallel sealing welding mechanism is set on the outer surface of the pipe shell fixing fixture 3 to perform the work of sealing the pipe shell fixing fixture 3 with airtightness.

[0066] In a specific embodiment of this utility model, the housing 1, as the main part of the packaging structure, is used to accommodate and protect multiple chips 2, providing physical protection and environmental isolation. The housing 1 is a conventional and typical housing form, and the specific tooling form can be designed according to the external dimensions. Multiple chips 2 are disposed on the inner surface of the housing 1 and are the main working elements responsible for processing microwave signals. The housing fixing fixture 3 provides basic support for the entire packaging process, ensuring that each component can be accurately aligned and operated. There are six housing assembly areas 4, all of which are located on the surface of the housing fixing fixture 3. The housing assembly areas 4 are all groove-shaped, thus serving to place the housing 1. The inner surface of the housing assembly area 4 is slidably connected to the outer surface of the housing 1, allowing the housing 1 to move freely within it for easy installation and disassembly. At the same time, there are six ventilation holes 5, all located on the inner surface of the housing assembly area 4. Since hot air circulation is required to heat the housing 1 during reflow soldering to melt the solder for welding and solidification, the six ventilation holes 5 reduce the heat absorption of the tooling. The upper end of the tooling 3 has a pressure block placement area 7, which has nine sections arranged in a nine-square grid. This area serves to place and install six second pressure blocks 11 and three first pressure blocks 10, applying uniform pressure during the dispensing and mounting process to ensure accurate device positioning. It also facilitates the opening of the nine first threaded holes 6. The six second pressure blocks 11 are placed on the upper and lower sides, while the three first pressure blocks 10 are placed in the middle. The six second pressure blocks 11 secure the outer surfaces of the six internal tube housings 1, while the three in the middle... The first pressure block 10 fixes the inner sides of the six adjacent housings 1, thereby using bolts or other fasteners to cooperate with the nine first threaded holes 6 to fix the six second pressure blocks 11 and the three first pressure blocks 10 in place, ensuring their stability. This applies pressure during the dispensing and bonding process, ensuring that the chip 2 is correctly bonded. This solves the problem of repeatedly disassembling and assembling the housing and tooling fixture one by one from the beginning of housing packaging to the completion of housing cover 31 sealing, avoiding product bumps or damage, and improving the production efficiency and yield of power device packaging.

[0067] Please refer to the details. Figure 4 and Figure 5 Two first conical positioning holes 9 are provided at one end of the tube shell fixing fixture 3, and two conical positioning posts 8 are fixedly connected at the other end of the tube shell fixing fixture 3. The inner surfaces of the two first conical positioning holes 9 and the outer surfaces of the two conical positioning posts 8 are slidably connected.

[0068] In this embodiment: two conical positioning posts 8 are fixed to one end of the tube shell fixing fixture 3 to provide precise positioning when docking with other fixture bases or multiple tube shell fixing fixtures 3. According to the two first conical positioning holes 9, the two conical positioning posts 8 are used in conjunction to ensure precise docking between multiple tube shell fixing fixtures 3.

[0069] Please refer to the details. Figure 8 The inner surface of the tube assembly area 4 is slidably connected to a first pressure block 10, and the upper end of the first pressure block 10 is provided with a first threaded hole 6.

[0070] In this embodiment: three first pressure blocks 10 are installed inside the three tube shell assembly areas 4 located in the middle, and at the same time, bolts or other fasteners are used in conjunction with the three first threaded holes 6 to fix the inner sides of the six tube shells 1 that are close to each other, thereby ensuring their stability.

[0071] Please refer to the details. Figures 10-13 The dispensing and bonding mechanism includes:

[0072] The dispensing and patching fixture base 12 is disposed on the outer surface of the tube shell fixing fixture 3. The upper end of the dispensing and patching fixture base 12 is provided with a first pressure strip 13 and a second pressure strip 14. Two second conical positioning holes 16 are opened on one side end of the dispensing and patching fixture base 12. Multiple second threaded holes 15 are opened on the upper end of the first pressure strip 13 and the second pressure strip 14.

[0073] In this embodiment: Three tube shell fixing fixtures 3 can be placed on the dispensing and patching fixture base 12. The length and width of the dispensing and patching fixture base 12 can be designed according to the equipment stroke and the size of the tube shell 1. One dispensing and patching fixture base 12 can hold multiple tube shell fixing fixtures 3, which is convenient for mass production. At the same time, the three tube shell fixing fixtures 3 are precisely connected and assembled. According to the two second conical positioning holes 16 opened at one end of the dispensing and patching fixture base 12, they can be inserted and assembled with the two conical positioning posts 8 fixed by the third tube shell fixing fixture 3 to ensure positional accuracy and facilitate dispensing and patching programming. The first pressure strip 13 and the second pressure strip 14 are set to fix and limit the two sides of the three tube shell fixing fixtures 3 to ensure stability during dispensing and patching processing.

[0074] Please refer to the details. Figures 18-20 The gold wire bonding mechanism includes:

[0075] A bonding fixture base 19 is provided on the outer surface of the tube shell fixing fixture 3. A third pressure strip 20 and a fourth pressure strip 21 are provided at the upper end of the bonding fixture base 19. Two third conical positioning holes 22 are opened on one side end of the bonding fixture base 19. Two third threaded holes 23 are opened at the upper end of the third pressure strip 20 and the fourth pressure strip 21.

[0076] In this embodiment: the thickness of the bonding fixture base 19 is thinner than that of the dispensing and bonding fixture base 12, which facilitates heating of the vacuum adsorption platform. The third pressure strip 20 and the fourth pressure strip 21 fix the two sides of the surface of the housing fixing fixture 3 to maintain the positional stability of the chip 2 during the gold wire bonding process. The bonding fixture base 19 can only hold one housing fixing fixture 3, thus providing a stable platform for the gold wire bonding process. The two third conical positioning holes 22 are used to provide precise positioning when docking with the housing fixing fixture 3. The four third threaded holes 23 on the upper end of the third pressure strip 20 and the fourth pressure strip 21 are used to fix it to the surface of the bonding fixture base 19 with bolts and other fasteners, ensuring the stability when processing multiple chips 2 inside.

[0077] Please refer to the details. Figures 21-24 The parallel sealing welding mechanism includes:

[0078] A sealing welding fixture base 25 is provided on the outer surface of the pipe shell fixing fixture 3. The upper end of the sealing welding fixture base 25 is provided with a fifth pressure strip 26, a sixth pressure strip 27 and a seventh pressure strip 28. A plurality of fourth conical positioning holes 30 are opened on one side end of the sealing welding fixture base 25. A plurality of fourth threaded holes 29 are opened on the upper end of the fifth pressure strip 26, the sixth pressure strip 27 and the seventh pressure strip 28. A cover plate 31 is provided on the outer surface of the pipe shell 1.

[0079] In this embodiment: the sealing welding fixture base 25 is rectangular, facilitating the rotation of the sealing welding table by the turntable. Simultaneously, the fifth pressure strip 26, the sixth pressure strip 27, and the seventh pressure strip 28 space the surface of the sealing welding fixture base 25. Six pipe shell fixing fixtures 3 can be machined onto the surface of the sealing welding fixture base 25, arranged in two horizontal rows, with three fixtures in each row. The fifth pressure strip 26, the sixth pressure strip 27, and the seventh pressure strip 28 fix and limit the placement of the six pipe shell fixing fixtures 3, maintaining the positional stability of the pipe shell 1 and the pipe shell fixing fixtures 3 during the sealing welding process. The four fourth conical positioning holes 30 facilitate precise positioning when docking with the four conical positioning posts 8 on the surfaces of the two rightmost tube shell fixing fixtures 3. The nine fourth threaded holes 29 facilitate the fixing of the fifth pressure strip 26, the sixth pressure strip 27, and the seventh pressure strip 28 to the surface of the sealing welding fixture base 25 using fasteners such as bolts, thereby providing installation and positioning for the six tube shell fixing fixtures 3. Multiple cover plates 31 are provided on the surfaces of multiple tube shells 1, and the cover plates 31 are parallelly welded to the surfaces of the tube shells 1 using a parallel sealing welding machine to complete the airtight sealing of the inside of the tube shells 1, ensuring the stability of the internal environment and dustproof and waterproof performance.

[0080] Please refer to the details. Figures 14-15It also includes a return mechanism, which includes:

[0081] The return tray 17 is set on the outer surface of the tube shell fixing fixture 3, and two tray supports 18 are fixedly connected to the lower end of the return tray 17.

[0082] In this embodiment: the reflow tray 17 supports the tube shell fixing fixture 3 after the adhesive patch is applied, and then it is placed in the reflow oven for heating and welding to complete the secondary reflow welding of the internal chip 2. The two fixed tray supports 18 are fixed at the lower end of the reflow tray 17 to provide support and ensure that the tray remains stable during transportation and heating.

[0083] Please refer to the details. Figure 16 and Figure 17 It also includes cleaning facilities, which include:

[0084] The suspended basket 24 is disposed on the outer surface of the tube shell fixing fixture 3. The inner surface of the suspended basket 24 is provided with a placement rack 32, and the outer surface of the placement rack 32 is slidably connected to the outer surface of the tube shell fixing fixture 3.

[0085] In this embodiment: the basket 24 is used to support the components to be cleaned during the cleaning process. The mounting bracket 32 ​​facilitates the tilting of the casing fixing fixture 3 after reflow soldering. After the soldering is completed, the flux, solder balls and other materials inside the casing need to be cleaned. Conventional chip casing packaging uses a vapor phase cleaning method, which involves cleaning the casing by soaking, boiling and cooling the casing with a solution.

[0086] The working principle and usage process of this utility model are as follows: First, the chip 2 is pasted into the inside of the housing 1. Then, the housing 1 containing the chip 2 is placed into the housing assembly area 4 of the housing fixing fixture 3. Next, the second pressure block 11 and the first pressure block 10 are placed into their corresponding pressure block placement areas 7. Then, the second pressure block 11 and the first pressure block 10 are installed and fixed with bolts. Pressure is applied during the dispensing and placement process to ensure that the chip 2 is correctly pasted. Then, the assembled housing fixing fixture 3 is installed on the surface of the dispensing and placement fixture base 12. The first pressure strip 13 and the second pressure strip 14 are fixed with bolts to limit and fix the housing fixing fixture 3. Then, it enters the dispensing machine and the placement machine to dispense solder paste or epoxy glue and paste the chip. After the dispensing and placement are completed, the housing fixing fixture 3 is removed. Then, it is placed on the surface of the reflow tray 17 and directly placed into the reflow oven for heating and soldering. After soldering, the inside of the housing needs to be cleaned. The flux and solder balls are cleaned. The casing fixing fixture 3 is placed on the surface of the placement rack 32. The casing fixing fixture 3 in the basket 24 is cleaned by soaking, boiling, cooling and drying with a solution. After cleaning, the casing fixing fixture 3 is placed on the surface of the bonding fixture base 19. The third pressure strip 20 and the fourth pressure strip 21 are installed according to the bolts to fix the casing fixing fixture 3. Then, it is placed in the gold wire bonding machine to perform gold wire bonding on the chip 2 inside the casing 1 to realize signal transmission between the chips. After bonding, the casing needs to be hermetically sealed. Then, the casing fixing fixture 3 is placed on the surface of the parallel sealing welding fixture base 25. The fifth pressure strip 26, the sixth pressure strip 27 and the seventh pressure strip 28 are fixed according to the bolts to complete the limiting and fixing of the casing fixing fixture 3. Then, the corresponding cover plate 31 is placed on the surface of the casing 1 and the cover plate 31 is parallelly welded to the surface of the casing 1 according to the parallel sealing welding machine.

[0087] Finally, it should be noted that the above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A universal tooling for power transistor packaging, characterized in that, include: Tube shell (1); Multiple chips (2), all of which are disposed on the inner surface of the housing (1); The upper end of the tube shell fixing fixture (3) is provided with a tube shell assembly area (4), the inner surface of the tube shell assembly area (4) is slidably connected to the outer surface of the tube shell (1), and the inner surface of the tube shell assembly area (4) is provided with ventilation holes (5). The pressure block placement area (7) is located at the upper end of the tube shell fixing fixture (3). The inner surface of the pressure block placement area (7) is slidably connected to a second pressure block (11). The upper end of the second pressure block (11) is provided with a first threaded hole (6). The dispensing and bonding mechanism is disposed on the outer surface of the tube shell fixing fixture (3) to realize the dispensing and bonding of multiple chips (2). A gold wire bonding mechanism, wherein the gold wire bonding mechanism is disposed on the outer surface of the housing fixing fixture (3) to realize the gold wire bonding of multiple chips (2); and Parallel sealing welding mechanism, which is set on the outer surface of the tube shell fixing fixture (3) to realize the work of airtight sealing of the tube shell fixing fixture (3).

2. The universal tooling for power transistor packaging according to claim 1, characterized in that: Two first conical positioning holes (9) are opened at one end of the tube shell fixing fixture (3), and two conical positioning columns (8) are fixedly connected at the other end of the tube shell fixing fixture (3). The inner surfaces of the two first conical positioning holes (9) and the outer surfaces of the two conical positioning columns (8) are slidably connected respectively.

3. The universal tooling for power transistor packaging according to claim 2, characterized in that: The inner surface of the tube assembly area (4) is slidably connected to a first pressure block (10), and the upper end of the first pressure block (10) is provided with a first threaded hole (6).

4. The universal tooling for power transistor packaging according to claim 3, characterized in that: The dispensing and patching mechanism includes: The dispensing and patching fixture base (12) is disposed on the outer surface of the tube shell fixing fixture (3). The upper end of the dispensing and patching fixture base (12) is provided with a first pressure strip (13) and a second pressure strip (14). Two second conical positioning holes (16) are opened on one side end of the dispensing and patching fixture base (12). Multiple second threaded holes (15) are opened on the upper end of the first pressure strip (13) and the second pressure strip (14).

5. The universal tooling for power transistor packaging according to claim 4, characterized in that: The gold wire bonding mechanism includes: A bonding fixture base (19) is provided on the outer surface of the tube shell fixing fixture (3). The upper end of the bonding fixture base (19) is provided with a third pressure strip (20) and a fourth pressure strip (21). Two third conical positioning holes (22) are opened on one side end of the bonding fixture base (19). Two third threaded holes (23) are opened on the upper end of the third pressure strip (20) and the fourth pressure strip (21).

6. A universal tooling for power transistor packaging according to claim 5, characterized in that: The parallel sealing welding mechanism includes: A sealing welding fixture base (25) is provided on the outer surface of the tube shell fixing fixture (3). The upper end of the sealing welding fixture base (25) is provided with a fifth pressure strip (26), a sixth pressure strip (27) and a seventh pressure strip (28). A plurality of fourth conical positioning holes (30) are opened on one side end of the sealing welding fixture base (25). A plurality of fourth threaded holes (29) are opened on the upper end of the fifth pressure strip (26), the sixth pressure strip (27) and the seventh pressure strip (28). A cover plate (31) is provided on the outer surface of the tube shell (1).

7. A universal tooling for power transistor packaging according to claim 6, characterized in that: It also includes a reflux mechanism, which comprises: Return tray (17) is disposed on the outer surface of the tube shell fixing fixture (3), and two tray supports (18) are fixedly connected to the lower end of the return tray (17).

8. A universal tooling for power transistor packaging according to claim 7, characterized in that: It also includes a cleaning mechanism, which comprises: The suspended basket (24) is disposed on the outer surface of the tube shell fixing fixture (3), and the inner surface of the suspended basket (24) is provided with a placement rack (32). The outer surface of the placement rack (32) and the outer surface of the tube shell fixing fixture (3) are slidably connected.

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