Automatic semiconductor material carrying device and semiconductor material conveying system

Abstract

An embodiment of the utility model provides an automatic semiconductor material handling device and a semiconductor material transmission system, and relates to the technical field of semiconductors, the automatic semiconductor material handling device comprises an electrical switch, a semiconductor handling assembly and a transmission assembly, and a controller of the transmission assembly is electrically connected with a power supply of the transmission assembly through the electrical switch. When the semiconductor carrying assembly is located at the initial position, the semiconductor carrying assembly is electrically connected with the electrical switch, the electrical switch is driven to be powered on, and it is ensured that the electrical switch is closed, so that safe starting of the conveying assembly is achieved, and the situation that the conveying assembly starts to work under the condition that the semiconductor carrying assembly is not completely reset is effectively prevented; therefore, the generation efficiency of the semiconductor material is improved.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and more specifically, to an automatic semiconductor material handling device and a semiconductor material transfer system. Background Technology

[0002] With the development of semiconductor manufacturing technology, semiconductor physical processing equipment is also constantly evolving. Current semiconductor physical processing equipment, such as the semiconductor material handling system widely used in semiconductor manufacturing workshops, achieves fully automated feeding through EAP (Equipment Automation Program). Although this system greatly improves production efficiency and reliability, there is a possibility that the semiconductor material may be damaged because the semiconductor handling components have not been fully reset before the conveying components start working, thereby reducing the semiconductor material production efficiency. Utility Model Content

[0003] The purpose of this invention is to provide an automatic semiconductor material handling device and a semiconductor material transfer system to solve the problem of reduced semiconductor material production efficiency caused by semiconductor material damage.

[0004] In a first aspect, this utility model provides an automatic semiconductor material handling device, which includes an electrical switch, a semiconductor handling component, and a conveying component. The controller of the conveying component is electrically connected to the power supply of the conveying component through the electrical switch.

[0005] The semiconductor handling component is used to automatically return to its initial position after handling semiconductor materials to the conveying component;

[0006] The semiconductor transport assembly is also configured to electrically connect to the electrical switch and drive the electrical switch to power on when in the initial position; the semiconductor transport assembly is also configured to drive the electrical switch to power off when in a non-initial position;

[0007] The electrical switch is used to close when power is applied and to connect the power source to the controller so that the transmission component can start operating.

[0008] In an optional implementation, the electrical switch includes a relay; the controller is electrically connected to the power supply via the relay.

[0009] The relay is used to close when power is applied and open when power is removed; wherein, when the relay is in the closed state, the power supply is connected to the controller; when the relay is in the open state, the power supply is disconnected from the controller.

[0010] In an optional embodiment, the relay includes a coil and a contact switch; one end of the contact switch is electrically connected to the controller, and the other end of the contact switch is electrically connected to the power supply.

[0011] When the semiconductor transport assembly is in its initial position, the coil is electrically connected to the semiconductor transport assembly and energized to close the contact switch.

[0012] When the semiconductor transport assembly is in a non-initial position, the coil is disconnected from the semiconductor transport assembly and energized to open the contact switch.

[0013] In an optional embodiment, the contact switch includes a normally open contact switch; one end of the normally open contact switch is electrically connected to the controller, and the other end of the normally open contact switch is electrically connected to the power supply.

[0014] In an optional implementation, the power supply and the controller are electrically connected via a two-wire connection; one of the two wires is equipped with the normally open contact switch.

[0015] In an optional implementation, the semiconductor handling assembly includes a robotic arm;

[0016] The robotic arm is used to move the semiconductor material to the conveying assembly;

[0017] The robotic arm is also used to automatically return to its initial position after transporting semiconductor materials to the transfer assembly.

[0018] In an optional embodiment, the semiconductor handling assembly further includes a position detection sensor and a control module; the position detection sensor is electrically connected to the control module; the control module is electrically connected to the electrical switch.

[0019] The position detection sensor is used to output a reset signal to the control module when it detects that the robotic arm is in the initial position;

[0020] The control module is used to output the first signal to the electrical switch when it receives the reset signal, so as to close the electrical switch.

[0021] In an optional implementation, the position detection sensor is further configured to output a non-reset signal to the control module when it detects that the robotic arm is in the non-initial position;

[0022] The control module is also configured to output the second signal to the electrical switch when the non-reset signal is received, so as to disconnect the electrical switch.

[0023] In an optional implementation, the electrical switch includes a relay, the coil of which is electrically connected to the control module.

[0024] Secondly, the present invention provides a semiconductor material transport system, the semiconductor material transport system including the semiconductor material automatic handling device and the conveying component described in any of the foregoing embodiments.

[0025] The present invention provides an automatic semiconductor material handling device and a semiconductor material transmission system. The automatic semiconductor material handling device includes an electrical switch, a semiconductor handling component, and a transmission component. The controller of the transmission component is electrically connected to the power supply of the transmission component through the electrical switch. When the semiconductor handling component is in its initial position, the semiconductor handling component is electrically connected to the electrical switch and drives the electrical switch to power on, ensuring that the electrical switch is closed, thereby realizing the safe start of the transmission component. This effectively prevents the transmission component from starting to work before the semiconductor handling component is fully reset, thus preventing damage to the semiconductor material and improving the semiconductor material production efficiency. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This diagram illustrates an automatic semiconductor material handling device provided in an embodiment of the present invention.

[0028] Figure 2 This illustration shows yet another schematic diagram of the automatic semiconductor material handling device provided in an embodiment of the present invention;

[0029] Figure 3 Another schematic diagram of the automatic semiconductor material handling device provided in this embodiment of the present invention is shown;

[0030] Figure 4 This illustration shows another schematic diagram of the automatic semiconductor material handling device provided in an embodiment of the present invention;

[0031] Figure 5 This illustration shows yet another schematic diagram of the automatic semiconductor material handling device provided in an embodiment of the present invention.

[0032] Icons: 100 - Electrical switch; 111 - Coil; 112 - Contact switch; 200 - Semiconductor handling assembly; 210 - Robotic arm; 220 - Position detection sensor; 230 - Control module; 300 - Conveying assembly; 320 - Power supply; 310 - Controller. Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The components of the embodiments of this utility model described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without inventive effort are within the scope of protection of the present invention.

[0035] It should be noted that relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0036] Please see Figure 1 , Figure 1 This diagram illustrates an automatic semiconductor material handling device according to an embodiment of the present invention. The automatic semiconductor material handling device includes an electrical switch 100, a semiconductor handling component 200, and a conveying component 300. The controller 310 of the conveying component 300 and the power supply 320 of the conveying component 300 are electrically connected through the electrical switch 100.

[0037] The semiconductor handling assembly 200 is used to automatically return to its initial position after handling semiconductor materials to the conveying assembly 300.

[0038] The initial position is the position where the semiconductor handling assembly 200 begins to handle semiconductor materials. The semiconductor handling assembly 200 may include Standard Mechanical Interface (SMIF) devices, etc., which are not limited here. The semiconductor materials may be SMIF PODs (Standard Mechanical Interface Pods) and Cassettes, etc., which are not limited here.

[0039] It should be noted that SMIF is a standardized wafer transport component used in semiconductor manufacturing, SMIF POD is a dedicated container for transporting and storing wafers, and Cassette is a container used to carry, transport, and protect wafers. A Cassette is placed inside an SMIF Pod.

[0040] In some implementations, the SMIF (Semiconductor Transfer Component 200) can open the SMIF POD (Semiconductor Material) and transfer the Cassette (Semiconductor Material) to the load platform of the transfer component 300.

[0041] The semiconductor handling assembly 200 is also used to electrically connect to the electrical switch 100 and drive the electrical switch 100 to power on when it is in the initial position; the semiconductor handling assembly 200 is also used to drive the electrical switch 100 to power off when it is in a non-initial position.

[0042] That is, the semiconductor transport component 200 continuously outputs a high-level signal. When the semiconductor transport component 200 moves to the initial position, it is electrically connected to the electrical switch 100, driving the electrical switch 100 to power on. When the semiconductor transport component 200 is not in the initial position, it is not electrically connected to the electrical switch 100, which is equivalent to no high-level signal being input to the electrical switch 100, so the electrical switch 100 is powered off.

[0043] The electrical switch 100 is used to close when power is applied and connect the power supply 320 to the controller 310 so that the transmission assembly 300 can start working.

[0044] In some embodiments, the controller 310 can control a motor that drives the load platform of the transfer assembly 300. After the power supply 320 is connected to the controller 310, the controller 310 controls the motor to operate, so that the motor drives the load platform of the transfer assembly 300 to move and transfer semiconductor materials.

[0045] The automatic semiconductor material handling device provided in this embodiment includes an electrical switch, a semiconductor handling component, and a conveying component. The controller of the conveying component is electrically connected to the power supply of the conveying component through the electrical switch. When the semiconductor handling component is in its initial position, the semiconductor handling component is electrically connected to the electrical switch and drives the electrical switch to power on, ensuring that the electrical switch is closed, thereby realizing the safe start of the conveying component. This effectively prevents the conveying component from starting to work before the semiconductor handling component is fully reset, thus preventing damage to the semiconductor material and improving the semiconductor material production efficiency.

[0046] To improve the efficiency of semiconductor material handling, such as Figure 2 As shown, the electrical switch 100 includes a relay, and the controller 310 is electrically connected to the power supply 320 via the relay.

[0047] A relay is used to close when power is applied and to open when power is removed.

[0048] When the relay is in the closed state, the power supply 320 is connected to the controller 310; when the relay is in the open state, the power supply 320 is disconnected from the controller 310.

[0049] It is understandable that a relay is an electrical switch 100 that can respond quickly to signals. Therefore, in the process of handling semiconductor materials, it is necessary to frequently start or stop the handling action. The relay can quickly respond to complete the switching between the closed state and the open state, thereby realizing the rapid control of the relay and improving the speed and reliability of semiconductor material handling.

[0050] In some implementations, such as Figure 3 As shown, the relay includes a coil 111 and a contact switch 112. One end of the contact switch 112 is electrically connected to the controller 310, and the other end of the contact switch 112 is electrically connected to the power supply 320.

[0051] When the semiconductor transport assembly 200 is in its initial position, the coil 111 is electrically connected to the semiconductor transport assembly 200 and is energized to close the contact switch 112.

[0052] When the semiconductor transport assembly 200 is in a non-initial position, the coil 111 is disconnected from the semiconductor transport assembly 200 and the coil 111 is energized to open the contact switch 112.

[0053] It should be noted that when the relay coil 111 is energized, the coil 111 generates a magnetic field, which attracts the movable metal piece to move. The movement of the metal piece will cause the contacts of the contact switch 112 to close, thereby enabling the power supply 320 of the transmission component 300 to be connected to the controller 310 of the transmission component 300.

[0054] In some embodiments, the contact switch 112 includes a normally open contact switch; one end of the normally open contact switch is electrically connected to the controller 310, and the other end of the normally open contact switch is electrically connected to the power supply 320.

[0055] It should be noted that when coil 111 is energized, the normally open contact switch is closed; when coil 111 is de-energized, the normally open contact switch is open.

[0056] In some implementations, such as Figure 4 As shown, the power supply 320 and the controller 310 are electrically connected via a two-wire system (the two wires include wire 410 and wire 420); one of the two wires (i.e., wire 420) is equipped with a normally open contact switch.

[0057] Please see Figure 4 Pin 11 of the first terminal 2J22 is connected to the output terminal of the power supply 320. Pin 11 of the second terminal 2P22 is connected to pin 11 of the first terminal 2J22, outputting the power supply 320 to pin 1 of the third terminal 12P1. Pin 1 of the third terminal 12P1 is electrically connected to pin 1 of the fourth terminal 12J1, which is connected to the power supply 320 input terminal of the controller 310, supplying power to the controller 310. Pin 12 of the first terminal 2J22 is connected to the common terminal of the power supply 320. Pin 12 of the second terminal 2P22 is electrically connected to pin 2 of the third terminal 12P1, and pin 2 of the fourth terminal 12J1 is electrically connected to the controller 310. The entire circuit forms a loop. A normally open contact switch is connected between pin 11 of the second terminal 2P22 and pin 1 of the third terminal 12P1.

[0058] Understandably, when the automated semiconductor material handling device malfunctions, the connection between the second wiring port 2P22 and the first wiring port 2J22, as well as the connection between the third wiring port 12P1 and the fourth wiring port 12J1, can be disconnected. This allows the normally open contact switch and the semiconductor handling assembly 200 to be removed for maintenance. This eliminates the need to maintain the entire semiconductor material handling system; only the normally open contact switch and the semiconductor handling assembly 200 need to be maintained, thereby improving the maintainability and flexibility of the semiconductor material handling system.

[0059] In order to handle semiconductor materials, the semiconductor handling assembly 200 includes a robotic arm 210.

[0060] The robotic arm 210 is used to move semiconductor materials to the transfer assembly 300.

[0061] The robotic arm 210 is also used to automatically return to its initial position after transporting semiconductor materials to the transfer assembly 300.

[0062] In some implementations, such as Figure 5 As shown, the semiconductor handling assembly 200 also includes a position detection sensor 220 and a control module 230. The position detection sensor 220 is electrically connected to the control module 230, and the control module 230 is electrically connected to the electrical switch 100.

[0063] The position detection sensor 220 is used to output a reset signal to the control module 230 when it detects that the robotic arm 210 is in the initial position; the control module 230 is used to output a first signal to the electrical switch 100 when it receives the reset signal, so that the electrical switch 100 is closed.

[0064] The position detection sensor 220 is also used to output a non-reset signal to the control module 230 when it detects that the robotic arm 210 is in a non-initial position; the control module 230 is used to output a second signal to the electrical switch 100 when it receives the non-reset signal, so as to disconnect the electrical switch 100.

[0065] In some implementations, such as Figure 5 As shown, the electrical switch 100 may include a relay, the coil 111 of which is electrically connected to the control module 230. The relay includes a coil 111 and a contact switch 112.

[0066] One end of coil 111 is electrically connected to control module 230, and coil 111 is also grounded. One end of contact switch 112 is electrically connected to power supply 320, and the other end of contact switch 112 is electrically connected to controller 310.

[0067] In one implementation, the contact switch 112 includes a normally open contact switch. One end of the normally open contact switch is electrically connected to the controller 310 and the coil 111, and the other end of the normally open contact switch is electrically connected to the power supply 320 and the coil 111. The first signal is a high-level signal, and the second signal is a low-level signal.

[0068] It should be noted that when coil 111 is energized, the normally open contact switch is closed; when coil 111 is de-energized, the normally open contact switch is open.

[0069] When the robotic arm 210 is in the initial position, the control module 230 outputs a high-level signal to the coil 111. The coil 111 is powered on according to the high-level signal. The coil 111 is used to control the normally open contact switch to close when powered on.

[0070] When the robotic arm 210 is in a non-initial position, the control module 230 outputs a low-level signal to the coil 111. The coil 111 is energized according to the high-level signal. The coil 111 is used to control the normally open contact switch to close when energized.

[0071] The voltage value of the high-level signal output by the semiconductor handling component 200 can be set according to the actual situation.

[0072] In another implementation, the contact switch 112 includes a normally closed contact switch, one end of which is electrically connected to the controller 310, and the other end of which is electrically connected to the power supply 320. The first signal is a low-level signal, and the second signal is a high-level signal.

[0073] It should be noted that when coil 111 is energized, the normally closed contact switch is open; when coil 111 is de-energized, the normally closed contact switch is closed.

[0074] When the robotic arm 210 is in the initial position, the control module 230 outputs a low-level signal to the coil 111. The coil 111 is energized according to the low-level signal. The coil 111 is used to control the normally closed contact switch to close when energized.

[0075] When the robotic arm 210 is in a non-initial position, the control module 230 outputs a high-level signal to the coil 111. The coil 111 is powered on according to the high-level signal. The coil 111 is used to control the normally closed contact switch to open when powered on.

[0076] That is, when the control module 230 is in a non-initial position, it continuously outputs a high level to the coil 111. The coil 111 is continuously energized according to the high level signal, and the normally closed contact switch is closed. When the robotic arm 210 is in the initial position, the control module outputs a low level to the coil 111, and the coil 111 closes the normally closed contact switch according to the low level signal.

[0077] This utility model embodiment also provides a semiconductor material transport system, which includes the above-mentioned automatic semiconductor material handling device and the conveying component 300.

[0078] In the several embodiments provided by this utility model, it should be understood that the disclosed apparatus and methods can also be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show the architecture, functions, and operations of possible implementations of apparatus, methods, and computer program products according to various embodiments of this utility model. In this regard, each block in a flowchart or block diagram may represent a module, segment, or part of code, which contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than those marked in the drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in a block diagram and / or flowchart, and combinations of blocks in block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or action, or using a combination of dedicated hardware and computer instructions.

[0079] If the functionality is implemented as a software module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of this utility model, or the part that contributes to the prior art, or a portion of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods of the various embodiments of this utility model. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0080] The above are merely preferred embodiments of this utility model and are not intended to limit the scope of this utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. An automated semiconductor material handling device, characterized in that, The automatic semiconductor material handling device includes an electrical switch, a semiconductor handling component, and a conveying component. The controller of the conveying component is electrically connected to the power supply of the conveying component through the electrical switch. The semiconductor handling component is used to automatically return to its initial position after handling semiconductor materials to the conveying component; The semiconductor transport assembly is also configured to electrically connect to the electrical switch and drive the electrical switch to power on when in the initial position; the semiconductor transport assembly is also configured to drive the electrical switch to power off when in a non-initial position; The electrical switch is used to close when power is applied and to connect the power source to the controller so that the transmission component can start operating.

2. The automatic semiconductor material handling device according to claim 1, characterized in that, The electrical switch includes a relay; the controller is electrically connected to the power supply via the relay. The relay is used to close when power is applied and open when power is removed; wherein, when the relay is in the closed state, the power supply is connected to the controller; when the relay is in the open state, the power supply is disconnected from the controller.

3. The automatic semiconductor material handling device according to claim 2, characterized in that, The relay includes a coil and a contact switch; one end of the contact switch is electrically connected to the controller, and the other end of the contact switch is electrically connected to the power supply. When the semiconductor transport assembly is in its initial position, the coil is electrically connected to the semiconductor transport assembly and energized to close the contact switch. When the semiconductor transport assembly is in a non-initial position, the coil is disconnected from the semiconductor transport assembly and energized to open the contact switch.

4. The automatic semiconductor material handling device according to claim 3, characterized in that, The contact switch includes a normally open contact switch; one end of the normally open contact switch is electrically connected to the controller, and the other end of the normally open contact switch is electrically connected to the power supply.

5. The automatic semiconductor material handling device according to claim 4, characterized in that, The power supply is electrically connected to the controller via a two-wire connection; one of the two wires is equipped with the normally open contact switch.

6. The automatic semiconductor material handling device according to claim 1, characterized in that, The semiconductor handling assembly includes a robotic arm; The robotic arm is used to move the semiconductor material to the conveying assembly; The robotic arm is also used to automatically return to its initial position after transporting semiconductor materials to the transfer assembly.

7. The automatic semiconductor material handling device according to claim 6, characterized in that, The semiconductor handling assembly further includes a position detection sensor and a control module; the position detection sensor is electrically connected to the control module; the control module is electrically connected to the electrical switch; The position detection sensor is used to output a reset signal to the control module when it detects that the robotic arm is in the initial position; The control module is used to output a first signal to the electrical switch when it receives the reset signal, so as to close the electrical switch.

8. The automatic semiconductor material handling device according to claim 7, characterized in that, The position detection sensor is also used to output a non-reset signal to the control module when it detects that the robotic arm is in the non-initial position; The control module is also configured to output a second signal to the electrical switch when the non-reset signal is received, so as to disconnect the electrical switch.

9. The automatic semiconductor material handling device according to claim 8, characterized in that, The electrical switch includes a relay, and the coil of the relay is electrically connected to the control module.

10. A semiconductor material transport system, characterized in that, The semiconductor material transport system includes the automatic semiconductor material handling device as described in any one of claims 1-9 and the transport component.

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