Wafer processing equipment
By designing wafer processing equipment, automated classification and storage of wafers was achieved, solving the problems of low efficiency and damage caused by manual operation in existing technologies, improving storage efficiency and reducing wafer damage.
Patent Information
- Application Number
- CN202520855372.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-30
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-04-30
AI Technical Summary
In existing technologies, wafer sorting and stacking mainly rely on manual operation, which is inefficient and prone to damage or sorting errors.
Design a wafer processing equipment comprising a conveying component, a stripping component, a gripping component, and a storage component to achieve automatic classification and storage of wafers, and use a robotic arm to place the stripped wafers into the corresponding wafer cages.
It improves the efficiency of wafer classification and storage, and reduces the need for human resources and the possibility of wafer damage and classification errors.
Smart Images
Figure CN223872735U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of semiconductor manufacturing, especially relates to a wafer processing equipment. BACKGROUND
[0002] Wafer is the commonly used material for manufacturing semiconductor circuit, with the progress of microelectronic technology, the demand of wafer is increasing day by day.
[0003] Wafer is generally peeled from ingot by diamond wire cutting or laser cutting. At present, the wafer to be peeled is usually stored in a classified stacking mode so as to be taken for subsequent use.
[0004] However, the classification and stacking of wafer in the prior art are completed manually by workers, which consumes a large amount of human resources and is low in efficiency; meanwhile, wafer is easily damaged and misclassification occurs. SUMMARY
[0005] In order to solve the problems in the prior art, the utility model provides a wafer processing equipment, which can automatically classify and store wafer, improving the classification and storage efficiency of wafer.
[0006] In order to achieve the above object, the utility model adopts the following technical scheme:
[0007] A wafer processing equipment comprises a base, a conveying assembly, a peeling assembly, a grabbing assembly and a storage assembly; the conveying assembly is at least partially arranged on the base and extends along the front-rear direction of the processing equipment; the peeling assembly is arranged on the base and at least partially arranged above the conveying assembly; the grabbing assembly is arranged on the base and at least partially arranged on the left side or right side of the peeling assembly; the storage assembly is arranged on the base and arranged around the grabbing assembly, comprising a support and a plurality of wafer cages arranged on the support; each wafer cage stores one kind of wafer.
[0008] Further, the conveying assembly comprises a conveying track and a carrier; the conveying track is arranged on the base and extends along the front-rear direction of the processing equipment; the carrier is arranged on the conveying track.
[0009] Further, the processing equipment further comprises a discharging assembly; the discharging assembly is at least partially arranged on the base and arranged close to the grabbing assembly.
[0010] The utility model provides a wafer processing equipment, which is provided with a grabbing assembly and can automatically take off the wafer peeled on the conveying assembly and store it in the corresponding wafer cage, improving the classification and storage efficiency of wafer and reducing the possibility of wafer damage and misclassification. BRIEF DESCRIPTION OF DRAWINGS
[0011] Figure 1 This is a structural schematic diagram of the processing equipment provided by this utility model. Detailed Implementation
[0012] The technical solutions in the embodiments of this utility model will be clearly and completely described below. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.
[0013] In addition, to clearly illustrate the technical solution of this application, the following are also defined: Figure 1 The top, bottom, left, right, front, and back sides are shown.
[0014] like Figure 1 As shown, this embodiment provides a wafer processing apparatus. The wafer processing apparatus includes: a base 11, a transport assembly 12, a stripping assembly 13, a gripping assembly 14, and a storage assembly 15.
[0015] Specifically, the conveying assembly 12 is at least partially disposed on the base 11 and extends substantially along the front-back direction of the processing equipment for conveying the ingot.
[0016] The stripping assembly 13 is disposed on the base 11 and at least partially disposed above the conveying assembly 12, for stripping wafers from ingots.
[0017] The gripping component 14 is disposed on the base 11, at least partially disposed on the left or right side of the stripping component 13, and can identify the type of wafer, remove the stripped wafer from the transport component 12 and transport it to the storage component 15.
[0018] The storage component 15 is mounted on the base 11 and surrounds the gripping component 14. It includes a support 151 and several wafer cages 152 mounted on the support 151. Each wafer cage 152 can store a specific type of wafer. The gripping component 14 can remove wafers from the transport component 12 and store them in the corresponding wafer cage 152 according to the type of wafer.
[0019] With the above configuration, the wafer processing equipment can strip the wafer and remove it from the conveying component 12 by the gripping component 14, and transport it to the corresponding wafer cage 152 for storage, which improves the efficiency of wafer classification and storage, saves manpower, and reduces the possibility of wafer damage and classification errors.
[0020] More specifically, the conveying assembly 12 comprises a conveying track 121 and a carrier 122. The conveying track 121 is arranged on the base 11 and extends along the front-rear direction of the processing apparatus. The carrier 122 is arranged on the conveying track 121 and is used to carry the ingot.
[0021] The grabbing assembly 14 can be arranged as a mechanical arm so as to place the wafer into a wafer cage 152 arranged around the grabbing assembly 14.
[0022] Further, the processing apparatus further comprises a discharging assembly 16. The discharging assembly 16 is arranged at least partially on the base 11 and close to the grabbing assembly 14. When discharging the wafer, the grabbing assembly 14 can grab the wafer cage 152 and place it at the discharging assembly 16.
[0023] In summary, the present application provides a wafer processing apparatus. The processing procedure comprises: the conveying assembly 12 conveying the ingot to the lower side of the peeling assembly 13, the peeling assembly 13 peeling the wafer from the ingot, and the grabbing assembly 14 taking the wafer from the conveying assembly 12 and placing it into the wafer cage 152 of the storage assembly 15. Through the above arrangement, the wafer can be stored without manpower, which improves the wafer storage efficiency and reduces the possibility of wafer damage and classification errors. At the same time, the wafer processing apparatus has a compact structure and low space occupancy.
[0024] The above is the description of the embodiments of the present application. Through the above description of the disclosed embodiments, the person skilled in the art can implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art. The general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.
Claims
1. A wafer processing equipment, characterized in that, include: Base (11); A conveying assembly (12) is at least partially disposed on the base (11) and extends substantially along the front-rear direction of the processing equipment; A stripping assembly (13) is disposed on the base (11) and at least partially disposed above the conveying assembly (12); A gripping component (14) is disposed on the base (11) and is at least partially disposed on the left or right side of the peeling component (13); Storage component (15), which is disposed on the base (11) and surrounding the gripping component (14), includes a support (151) and a plurality of wafer cages (152) disposed on the support (151); each wafer cage (152) can store a corresponding wafer.
2. The wafer processing equipment as described in claim 1, characterized in that, The conveying assembly (12) includes a conveying track (121) and a carrier (122); the conveying track (121) is disposed on the base (11) and extends along the front-rear direction of the processing equipment; the carrier (122) is disposed on the conveying track (121).
3. The wafer processing equipment as described in claim 1, characterized in that, The processing equipment also includes a discharge assembly (16); the discharge assembly (16) is at least partially disposed on the base (11) and is located close to the gripping assembly (14).