Multi-chip packaging structure
By using a coolant circulation cooling structure within an L-shaped heat sink in a multi-chip package, combined with high thermal conductivity metal and thermally conductive adhesive, the problem of heat accumulation in multi-chip packages is solved, achieving efficient heat dissipation and mechanical stability, and ensuring chip performance and lifespan.
Patent Information
- Application Number
- CN202520437563.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2026-02-03
- Estimated Expiration
- 2035-03-12
AI Technical Summary
The vertical stacking structure in multi-chip packaging causes heat buildup.
It adopts a heat dissipation structure including L-shaped heat sinks, which are filled with coolant. The coolant circulates through vaporization and liquefaction within the cavity to dissipate heat. Combined with high thermal conductivity metal materials and thermally conductive adhesive, the supporting structure prevents deformation, and the shape of the heat sink can be flexibly selected to adapt to different needs.
It effectively reduces chip temperature, improves heat dissipation efficiency, prevents overheating, ensures stable chip performance, enhances mechanical stability, and reduces heat accumulation.
Smart Images
Figure CN223872754U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor packaging technology, and in particular to a multi-chip packaging structure. Background Technology
[0002] Multi-chip packaging technology has wide applications in the electronics industry, especially in high-performance computing, communication equipment, and consumer electronics. With the increasing complexity and miniaturization of electronic devices, multi-chip packaging technology not only improves integration but also effectively reduces system cost and size. By integrating multiple chips into a single package, higher performance and more stable signal transmission can be achieved, thus meeting the high-density and high-reliability requirements of modern electronic devices.
[0003] To achieve chip integration and considering circuit board space, multi-chip packaging structures often use vertical stacking of multiple chips. However, this structure is prone to heat buildup. Utility Model Content
[0004] This application provides a multi-chip packaging structure to solve the problem of heat accumulation caused by vertically stacking multiple chips.
[0005] A multi-chip package structure, comprising:
[0006] PCB board, including mounting surface;
[0007] A heat dissipation structure, fixed to the mounting surface, includes multiple L-shaped heat dissipation fins arranged circumferentially at intervals. Each heat dissipation fin includes a cavity filled with coolant, but the cavity is not completely filled with coolant.
[0008] Multiple chips are provided, each chip is disposed on the heat sink and electrically connected to the PCB board.
[0009] By adopting the above technical solution, the chip generates heat during operation. The heat sink absorbs the heat, which raises the temperature of the coolant in the cavity, causing it to vaporize and rise to meet the cooler upper wall of the cavity. The vaporized coolant then liquefies again and flows back down along the inner wall. This cycle of vaporization and liquefaction of the coolant is repeated to cool the chip.
[0010] In one embodiment, the heat dissipation structure further includes a heat dissipation body, to which a plurality of heat sinks are connected. The heat dissipation body also includes a cavity, and the cavity of the heat sink is in communication with the cavity of the heat dissipation body.
[0011] By adopting the above technical solution, when the chip generates heat and the heat sink absorbs heat, the coolant can diffuse the heat to a larger heat sink body through the connected cavity, making the heat distribution more uniform, avoiding local overheating, and improving the heat handling capacity of the entire heat dissipation structure for the chip.
[0012] In one embodiment, a high-power electronic device is disposed on the PCB board, and the heat sink is in the form of a sheet attached to the surface of the high-power electronic device.
[0013] By adopting the above technical solution, this close-fitting method can ensure that the heat generated by high-power electronic devices can be directly and efficiently conducted to the heat dissipation body, reducing the heat transfer path and thermal resistance, and preventing the electronic devices from experiencing performance degradation due to overheating.
[0014] In one embodiment, a high-power electronic device is disposed on the PCB board, and the heat dissipation body is ring-shaped and arranged around the high-power electronic device.
[0015] By adopting the above technical solution, the heat sink can provide heat dissipation protection for high-power electronic devices from all sides. For some high-power electronic devices with relatively uniform heat distribution in the surrounding area or that need to be dissipated from multiple directions, this ring-shaped heat sink can provide all-round heat dissipation support, ensuring that heat can be dissipated from all directions in a timely manner, avoiding heat accumulation inside the device, maintaining the temperature balance of the high-power electronic device, and ensuring its normal operation.
[0016] In one embodiment, the heat sink is an upright L-shape or an inclined L-shape, and the chip is electrically connected to the PCB via bonding leads.
[0017] By adopting the above technical solutions, the shape of the heat sink can be flexibly selected according to factors such as chip layout, installation space, and heat dissipation requirements. When space is limited, an inclined L-shaped heat sink may be more conducive to airflow and heat dissipation; while when a more direct heat conduction path is required, an upright L-shaped heat sink may be more suitable. The bonding leads have good electrical connection performance, ensuring stable and reliable signal transmission between the chip and the PCB board.
[0018] In one embodiment, the adjacent heat sinks are tilted in opposite directions.
[0019] By adopting the above technical solution, this arrangement results in a larger distance between adjacent heat sinks, a larger heat dissipation space for each heat sink, allowing air to come into more full contact with the heat sink and carry away more heat, while the heat emitted by adjacent heat sinks is less likely to affect each other.
[0020] In one embodiment, the chip is attached to the area of the heat sink where the coolant is present.
[0021] By adopting the above technical solution, the heat generated by the chip can be directly transferred to the coolant through the shortest path. This direct heat transfer method reduces thermal resistance during heat transfer, improves the efficiency of heat transfer from the chip to the coolant, ensures that the heat generated by the chip can be quickly absorbed and carried away by the coolant, effectively reduces the chip's operating temperature, and guarantees the chip's stable performance and normal operation.
[0022] In one embodiment, the heat dissipation structure is made of a metal with high thermal conductivity, and thermally conductive adhesive is disposed between the chip and the heat sink.
[0023] By adopting the above technical solutions, the high thermal conductivity of the metal material ensures rapid heat transfer within the heat dissipation structure, improving heat dissipation efficiency and allowing the heat generated by the chip to dissipate in a timely manner, preventing performance degradation and damage caused by overheating. Thermal adhesive further enhances the efficiency of heat transfer from the chip to the heat sink, filling any small gaps between the chip and the heat sink for a tighter fit and reduced thermal resistance. Furthermore, the thermal adhesive acts as a buffer, protecting the chip from mechanical stress caused by temperature changes, vibration, and other factors, ensuring its normal operation.
[0024] In one embodiment, the heat sink has a protruding support structure, which is located at both ends of the chip in the vertical direction and abuts against the chip.
[0025] By adopting the above technical solution, the support structure can restrict the position of the chip, further prevent the chip from moving in the vertical direction, and at the same time, it can protect the chip to a certain extent and reduce the risk of damage caused by vibration or impact.
[0026] In one embodiment, the support structure is further disposed on the side of the heat sink away from the chip and extends in a vertical direction.
[0027] By adopting the above technical solution, the support structure can support and fix the heat sink, preventing the heat sink from easily deforming or bending under stress.
[0028] In summary, this application includes at least one beneficial effect:
[0029] 1. When the chip is working, it generates heat. The heat sink absorbs the heat, which raises the temperature of the coolant inside the cavity, causing it to vaporize and rise to touch the cooler upper wall of the cavity. The vaporized coolant then liquefies again and slides down the inner wall of the cavity back to the inside. The heat is dissipated from above the heat sink. The vaporization and liquefaction of the coolant are then repeated to cool the chip.
[0030] 2. The shape of the heatsink can be flexibly selected based on factors such as chip layout, installation space, and heat dissipation requirements. When space is limited, an inclined L-shaped heatsink may be more conducive to airflow and heat dissipation; while when a more direct heat conduction path is required, an upright L-shaped heatsink may be more suitable. Bonding leads provide excellent electrical connection performance, ensuring stable and reliable signal transmission between the chip and the PCB board.
[0031] 3. Under conditions of external pressure, vibration, or thermal stress caused by temperature changes, the reinforcing column can prevent the cavity from deforming, cracking, or other damage, improve the mechanical stability and reliability of the heat dissipation structure, and ensure the normal operation of the heat dissipation system. Attached Figure Description
[0032] Figure 1 This is a schematic diagram of a structure for fixing a heat sink and a chip according to an embodiment of this application;
[0033] Figure 2 This is a schematic diagram of a heat dissipation structure provided in the second embodiment of the present application, which also includes a heat dissipation body and a support structure;
[0034] Figure 3 This is a schematic diagram of a polygonal heat dissipation body provided in the second embodiment of this application;
[0035] Figure 4 This is a schematic diagram of a circular heat dissipation body provided in the second embodiment of this application;
[0036] Figure 5 This is a schematic diagram of a ring-shaped heat dissipation body provided in the third embodiment of this application;
[0037] Figure 6 This is a schematic diagram of a heat sink with an inclined arrangement provided in the fourth embodiment of this application.
[0038] Explanation of reference numerals in the attached figures: 1. Multi-chip package structure; 11. PCB board; 111. Mounting surface; 12. Heat dissipation structure; 121. Heat sink; 122. Heat dissipation body; 13. Chip; 14. Support structure. Detailed Implementation
[0039] The following is in conjunction with the appendix Figure 1-6 The multi-chip packaging structure provided in this application will be described in further detail.
[0040] Example 1
[0041] Please see Figure 1-6 The multi-chip package structure 1 provided in this application embodiment includes a PCB board 11, a heat dissipation structure 12, and multiple chips 13.
[0042] like Figure 1 As shown, the PCB board 11 includes a mounting surface 111, and a heat dissipation structure 12 is fixed to the mounting surface 111. The heat dissipation structure 12 includes multiple L-shaped heat sinks 121, which are arranged circumferentially at intervals. Each heat sink 121 includes a cavity filled with coolant, but the cavity is not completely filled with coolant. Each of the multiple chips 13 is disposed on a region of the heat sink 121 containing coolant and is electrically connected to the PCB board 11.
[0043] Specifically, these heat sinks 121 are all vertically L-shaped. The heat sinks 121 can be made of high thermal conductivity metals such as aluminum or copper to improve heat dissipation efficiency. The connection between the heat sink 121 and the PCB board 11 can be achieved through insulating adhesive or other fixing methods, ensuring good contact between the heat sink 121 and the PCB board 11 for effective heat conduction, while also providing insulation between the heat sink 121 and the PCB board 11. The heat sink 121 has a hollow interior forming a cavity, and the coolant can be water or ethanol. The chip 13 is mounted parallel to the heat sink 121, resulting in a large contact area and secure fixation. The chip 13 is also perpendicular to the PCB board 11, and both sides of the chip 13 are electrically connected to the PCB board 11 via bonding leads. The bonding leads can be made of gold wire, aluminum wire, or other suitable materials, depending on the actual needs. To further improve heat dissipation, thermal conductive adhesive can be placed between chip 13 and heat sink 121. Thermal conductive adhesive has good thermal conductivity, which can reduce thermal resistance and improve heat dissipation efficiency.
[0044] The implementation principle of this embodiment is as follows: When the chip 13 is working, it generates heat and conducts it to the heat sink 121. The coolant can directly absorb heat within the cavity, vaporize, rise, touch the inner wall surface above the cavity, liquefy, and flow back. The heat is dissipated from above the heat sink 121, realizing the circulation of the coolant, thereby more effectively removing heat, reducing the operating temperature of the chip 13, and improving the chip 13's performance and lifespan. Simultaneously, the coolant circulates within the cavity, and the sealed cavity prevents coolant loss, saving costs. Furthermore, the heat sink 121 uses a high thermal conductivity metal material, further improving heat dissipation efficiency. The thermally conductive adhesive between the chip 13 and the heat sink 121 reduces thermal resistance, allowing heat to be conducted to the heat sink 121 more quickly, improving the overall heat dissipation performance of the package structure.
[0045] Example 2
[0046] like Figures 2 to 4 As shown, this embodiment differs from the previous embodiment in that the heat dissipation structure 12 further includes a heat dissipation body 122, with multiple heat sinks 121 connected to the heat dissipation body 122. The heat dissipation body 122 also includes a cavity, and the cavities of the heat sinks 121 communicate with the cavities of the heat dissipation body 122. The coolant does not completely fill the cavity of the heat dissipation structure 12. The heat dissipation body 122 can be plate-shaped, specifically circular or polygonal, with the heat sinks 121 arranged in a circumferential array around the heat dissipation body 122. The heat dissipation body 122 is also made of a metal material with high thermal conductivity to ensure rapid heat conduction.
[0047] The heat sink 121 may also be provided with a support structure 14, which is located at both ends of the chip 13 along the vertical direction and abuts against the chip 13. Specifically, the support structure 14 may be a bump, which may extend horizontally or be spaced apart, with the gaps in the middle facilitating chip heat dissipation; the support structure 14 may also be an elastic material, such as a spring or a rubber pad, to absorb vibration and impact, further improving the stability of the chip 13. In this embodiment, the support structure 14 may be a bump, and the bumps at both ends of the chip 13 extend horizontally, resulting in a large contact area between the two ends of the chip 13 and the bumps, thus improving stability.
[0048] The support structure 14 can also be located on the side of the heat sink 121 away from the chip 13 and set vertically, or the support structure 14 can be set at an angle and connect the two end faces of the heat sink away from the chip 13. Both can support and fix the heat sink 121 and prevent the heat sink 121 from bending and deforming under force.
[0049] The implementation principle of this embodiment is as follows: the cavity between the heat sink 122 and the heat sink 121 is connected, allowing the coolant to circulate through vaporization and liquefaction within the entire heat dissipation structure 12, thereby improving the heat handling capacity of the entire heat dissipation structure 12 for the chip 13; at the same time, the larger heat dissipation area further improves the heat dissipation efficiency. Furthermore, the heat sink 122 is in close contact with the high-power electronic device, allowing the heat from the high-power electronic device to be directly conducted to the heat sink 122, reducing thermal resistance. Simultaneously, the larger contact area allows heat to be conducted to the heat sink 122 more quickly, improving the overall heat dissipation performance of the packaging structure.
[0050] Example 3
[0051] like Figure 5 As shown, the difference between this embodiment and the previous embodiment is that the heat dissipation body 122 is ring-shaped and is arranged around the high-power electronic device. Specifically, the heat dissipation body 122 can be a circular ring or a polygonal ring.
[0052] The implementation principle of this embodiment is as follows: the heat dissipation body 122 can provide heat dissipation protection for high-power electronic devices from all sides, ensuring that heat can be dissipated in a timely manner from all directions, avoiding heat accumulation inside the device, maintaining the temperature balance of the high-power electronic devices, and ensuring their normal operation.
[0053] Example 4
[0054] like Figure 6 As shown, the difference between this embodiment and Embodiment 2 is that the heat sink 121 is an inclined "L" shape and adjacent heat sinks 121 are inclined in opposite directions. Specifically, the inclination angle of the heat sink 121 can be adjusted according to the actual situation, so that the angle of the heat sink 121 can be an acute angle or an obtuse angle. In this embodiment, the angles of adjacent heat sinks 121 on the heat sink body 122 are acute angles and obtuse angles, respectively.
[0055] The implementation principle of this embodiment is as follows: the adjacent heat sinks 121 are tilted in opposite directions, which makes the distance between adjacent heat sinks 121 larger and the heat dissipation space of each heat sink 121 larger, so that the air can come into full contact with the heat sink 121 and carry away more heat. At the same time, the heat emitted between adjacent heat sinks 121 will not affect each other, thus avoiding the formation of local hot spots.
[0056] The above are all preferred embodiments of this application, and are not intended to limit the scope of protection of this application. Therefore, all equivalent changes made in accordance with the structure, shape and principle of this application should be covered within the scope of protection of this application.
Claims
1. A multi-chip packaging structure, characterized in that, include: PCB board (11), including mounting surface (111); A heat dissipation structure (12) is fixed to the mounting surface (111). The heat dissipation structure (12) includes a plurality of L-shaped heat dissipation fins (121) arranged circumferentially. Each heat dissipation fin (121) includes a cavity filled with coolant, but the coolant does not completely fill the cavity. as well as Multiple chips (13), each chip (13) is disposed on the heat sink (121) and electrically connected to the PCB board (11).
2. The multi-chip packaging structure according to claim 1, characterized in that, The heat dissipation structure (12) further includes a heat dissipation body (122), and a plurality of heat sinks (121) are connected to the heat dissipation body (122). The heat dissipation body (122) also includes the cavity, and the cavity of the heat sink (121) is connected to the cavity of the heat dissipation body (122).
3. The multi-chip packaging structure according to claim 2, characterized in that, The PCB board (11) is provided with high-power electronic devices, and the heat dissipation body (122) is in the form of a sheet and is attached to the surface of the high-power electronic devices.
4. A multi-chip packaging structure according to claim 2, characterized in that, The PCB board (11) is equipped with high-power electronic devices, and the heat dissipation body (122) is ring-shaped and is arranged around the high-power electronic devices.
5. A multi-chip packaging structure according to claim 1, characterized in that, The heat sink (121) is in an upright L-shape or an inclined L-shape, and the chip (13) is electrically connected to the PCB through bonding wires.
6. A multi-chip packaging structure according to claim 2, characterized in that, The adjacent heat sinks (121) are tilted in opposite directions.
7. A multi-chip packaging structure according to claim 2, characterized in that, The chip (13) is attached to the area of the heat sink (121) where the coolant is present.
8. A multi-chip packaging structure according to claim 2, characterized in that, The heat dissipation structure (12) is made of a metal with high thermal conductivity, and thermally conductive adhesive is provided between the chip (13) and the heat sink (121).
9. A multi-chip packaging structure according to claim 8, characterized in that, The heat sink (121) has a protruding support structure (14), which is located at both ends of the chip (13) in the vertical direction and abuts against the chip (13).
10. A multi-chip packaging structure according to claim 9, characterized in that, The support structure (14) is also provided on the side of the heat sink (121) away from the chip (13) and extends in the vertical direction.