Microfluidic chip

Abstract

The utility model relates to the technical field of cell sorting and detection, in particular to a micro-fluidic chip. The micro-fluidic chip comprises a substrate, a micro-fluidic chip, a micro-fluidic chip and a micro-fluidic chip, wherein a metal film layer is arranged on the substrate; the cover plate is at least provided with a micro-channel; the intermediate bonding layer is located between the substrate and the cover plate and covers the metal film layer; wherein the cover plate is a PDMS (Polydimethylsiloxane) prepolymer cover plate; the intermediate bonding layer is a silicon dioxide layer. According to the utility model, the problem that the PDMS prepolymer cover plate and the metal film layer substrate are difficult to directly bond can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to cell sorting detection technical field, concretely relates to a micro -fluidic chip. BACKGROUND

[0002] Microfluidics refers to the fluid is restricted in submillimeter scale, thereby reach the accurate control and the manipulation fluid behavior technology. Microfluidic technology creates the powerful tool for biologist to control analog complete cell microenvironment, wherein including the soluble factor such as adjusting cell structure, function, behavior and growth. The cell sorter based on micro -fluidic chip has the great single cell separation potential in microbiology and biotechnology, has the advantages such as accurate separation, disposable (thereby reducing cross contamination), easy to use, small scale, low cost and suitable for various sample sizes. The cell culture technology is combined with micro -fluidic chip, and the cultivation of single clone cell line is carried out in independent chamber, and fresh culture medium is continuously injected during the period, so that the cost and time of cell culture can be greatly reduced.

[0003] In the manufacturing process of micro -fluidic chip, the bonding of the substrate and the cover sheet is a crucial step, and the bonding effect can directly affect the structural stability and sealing effect of the chip. In order to enable the substrate to provide wear resistance, corrosion resistance, reflectivity and other effects, a metal film is usually provided on the substrate. PDMS prepolymer has good biocompatibility, good optical transparency, high chemical stability, low cost and easy processing, and is a mainstream choice for cover sheet. However, it is relatively difficult to directly bond metal or glass substrate and PDMS prepolymer, and there are significant differences in surface chemical properties and physical properties between the two. Direct bonding of the two usually results in weak adhesion due to interface incompatibility. UTILITY MODEL CONTENT

[0004] The utility model provides a kind of micro -fluidic chip, to solve the problem that PDMS prepolymer cover sheet and metal film layer substrate directly bond difficult.

[0005] The utility model provides a kind of micro -fluidic chip, comprising: substrate, the metal film layer is provided on the substrate;Cover sheet, the cover sheet is at least provided with micro -flow channel;Intermediary bonding layer is located between the substrate and the cover sheet, covers the metal film layer;The metal film layer is towards the cover sheet;Wherein, the cover sheet is PDMS prepolymer cover sheet;The intermediary bonding layer is silica layer.

[0006] Optionally, the metal film layer completely covers one side surface of the substrate;The intermediary bonding layer completely covers the metal film layer.

[0007] Optionally, the area of the metal film layer is less than the area of the intermediary bonding layer, the intermediary bonding layer completely covers the metal film layer, and extends the range of the metal film layer, and is directly connected with the substrate.

[0008] Optionally, the material of the substrate comprises silicon, glass, paper or PDMS prepolymer.

[0009] Optionally, the metal film layer comprises one of chromium, titanium, nickel or aluminum or an alloy thereof; and the thickness of the metal film layer is 10nm-100nm.

[0010] Optionally, the thickness of the intermediate bonding layer is 10nm-40nm.

[0011] The microfluidic chip has the advantages that:

[0012] The microfluidic chip provided by the utility model uses a silicon dioxide layer as the intermediate bonding layer of the substrate with a metal film layer and the PDMS prepolymer cover sheet, the silicon dioxide has good bonding capacity with the metal film layer and the PDMS, so that the substrate with the metal film layer and the PDMS prepolymer cover sheet are stably bonded, the silicon dioxide has high chemical stability and inertness and is not easy to degrade, so that long-term stable bonding effect is provided, the silicon dioxide is non-toxic to biological samples and can isolate the biological toxicity of part of the substrate material, so that it is suitable for biomedical and biological analysis applications, in addition, the silicon dioxide coating can withstand high temperature without degrading, so that it is suitable for applications requiring high temperature treatment. BRIEF DESCRIPTION OF DRAWINGS

[0013] In order to more clearly illustrate the specific embodiments of the utility model or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the specific embodiments or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained without creative labor according to these drawings.

[0014] Figure 1 The structure diagram of the microfluidic chip manufactured for an embodiment of the utility model is shown in the figure.

[0015] Figure 2 The actual photo of the microfluidic chip of an embodiment of the utility model is shown in the figure. DETAILED DESCRIPTION

[0016] The utility model provides a kind of microfluidic chip to solve the problem that DMS cover sheet and metal film layer substrate are directly bonded with difficulty.

[0017] The technical solutions of the present application will be described clearly and completely in connection with the drawings. Obviously, the described embodiments are some of the embodiments of the present application, but not all the embodiments. Based on the embodiments of the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0018] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like indicate the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first", "second", "third" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0019] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium; it can be the communication inside two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0020] In addition, the technical features involved in different embodiments of the present application described below can be combined with each other as long as there is no conflict.

[0021] Embodiments

[0022] Reference Figure 1 and Figure 2 The present embodiment provides a microfluidic chip, comprising:

[0023] A substrate 1, wherein a metal film layer 11 is arranged on the substrate;

[0024] A cover sheet 2, wherein the cover sheet 2 is provided with at least a microfluidic channel 21;

[0025] An intermediate bonding layer 3 is located between the substrate 1 and the cover sheet 2, covering the metal film layer 11; the metal film layer 11 faces the cover sheet 2;

[0026] Wherein, the cover sheet 2 is a PDMS prepolymer cover sheet; the intermediate bonding layer 3 is a silicon dioxide layer.

[0027] The microfluidic chip provided by the embodiment uses a silicon dioxide layer as the intermediate bonding layer 3 between the substrate 1 with the metal film layer 11 and the PDMS prepolymer cover sheet 2. Since the silicon dioxide has good bonding capacity with the metal film layer and the PDMS, the substrate with the metal film layer and the PDMS prepolymer cover sheet can be stably bonded. Moreover, the silicon dioxide has high chemical stability and inertness, is not easy to degrade, and provides long-term stable bonding effect. At the same time, the silicon dioxide is non-toxic to biological samples and can isolate the biological toxicity of part of the substrate material, which is suitable for biomedical and biological analysis applications. In addition, the silicon dioxide coating can withstand high temperature without degrading, which is suitable for applications that require high temperature processing.

[0028] Reference to physical conditions of a specific embodiment Figure 2 In the figure, the substrate 1 is covered when plated, and is exposed after plating. The material is glass. The metal film layer 11 on the surface of the substrate 1 is chromium film. The cover sheet 2 is transparent, which is a PDMS prepolymer cover sheet. Since the chromium film of the metal film layer 11 is dark, the transparent cover sheet 2 is also dark. Therefore, since the intermediate bonding layer 3 is a silicon dioxide layer, which is a transparent layer itself and has a relatively small thickness, it is difficult to visually distinguish in the figure, and actually covers the entire surface of the metal film layer 11. In addition, there is a light transparent part under the cover sheet 2 in the figure, which is the mirror image of the transparent cover sheet 2 on the intermediate bonding layer 3 / metal film layer 11, and is not a physical structure.

[0029] Further, the metal film layer 11 should at least cover the corresponding position of the microfluidic channel 21. In some embodiments, the metal film layer 11 completely covers one side surface of the substrate 1; and the intermediate bonding layer 3 completely covers the metal film layer 11. The metal film layer 11 completely covering the surface can be beneficial to provide sufficient light, heat, and electrical effects. At the same time, it can adapt to any microfluidic channel situation on the cover sheet. In addition, in different embodiments, the metal film layer 11 can also not be arranged on the entire surface, and the area of the metal film layer 11 can be smaller than the area of the intermediate bonding layer 3. The intermediate bonding layer completely covers the metal film layer 11 and extends the range of the metal film layer, and is directly connected with the substrate. Those skilled in the art can adjust according to actual needs. The completely covered intermediate bonding layer 3 can ensure the bonding strength at any position on the surface, and the intermediate bonding layer 3 can also be patterned according to needs.

[0030] Further, in some embodiments, the material of the substrate 1 comprises silicon, glass, paper or PDMS prepolymer; the metal film layer 11 comprises chromium, titanium, nickel or aluminum; the thickness of the metal film layer 11 is 10-100 nm, for example, it can be 10 nm, 20 nm, 50 nm, 80 nm or 100 nm; the thickness of the intermediate bonding layer 3 is 10-40 nm, for example, it can be 10 nm, 20 nm, 30 nm or 40 nm. The metal film layer 11 is selected according to the material, and different thicknesses have different effects on the absorption, reflection and transmission of light, as well as the degree of response to electricity and heat. The thickness is determined according to the actual detection function required. If the thickness of the intermediate bonding layer 3 is too thin, it will affect the bonding effect, making the connection not firm, and it may be difficult to isolate the adverse effects of the underlying metal film layer 11 on the detection flow channel. If the thickness is too thick, it may be too obstructive, making it difficult for the metal film layer 11 to achieve the expected design of light, heat and electricity, and also adversely affecting the detection effect.

[0031] The above microfluidic chip can be manufactured by the following method, comprising the following steps:

[0032] providing a substrate;

[0033] forming a metal film layer on one side surface of the substrate;

[0034] providing a cover sheet, which is provided with at least a microfluidic channel;

[0035] forming an intermediate bonding layer on the substrate to cover one side surface of the substrate on which the metal film layer is formed; and performing surface activation treatment on the intermediate bonding layer;

[0036] attaching the cover sheet to the intermediate bonding layer to bond the substrate and the cover sheet through the intermediate bonding layer; the structure of the microfluidic chip after bonding can refer to Figure 1 or Figure 2 .

[0037] In the above method, the cover sheet is a PDMS prepolymer cover sheet; and the intermediate bonding layer is a silicon dioxide layer.

[0038] Further, in some embodiments, in the step of forming an intermediate bonding layer on one side surface of the substrate with a metal film layer, a silicon dioxide layer is formed on one side surface of the substrate with a metal film layer by magnetron sputtering as the intermediate bonding layer; the metal film layer covers the entire surface of the substrate below, and the silicon dioxide layer covers the entire surface of the metal film layer.

[0039] In other embodiments, the area of the metal film layer is smaller than the area of the intermediate bonding layer, the intermediate bonding layer completely covers the metal film layer and extends beyond the range of the metal film layer, and is directly connected to the substrate.

[0040] Further, in some embodiments, in the step of surface activation treatment, the intermediate bonding layer is bombarded by plasma; in the process of plasma bombardment, the gas used is air or oxygen. The bombardment time is 20s-120s, for example, it can be 20s, 40s, 60s, 80s, 100s, 120s; the power is 50W-200W, for example, it can be 50w, 100w, 150w, 200w; the gas flow rate is 100μl / min. Further, in some embodiments, in the step of clamping the cover sheet to the intermediate bonding layer and bonding the cover sheet to the substrate through the intermediate bonding layer: the cover sheet is placed on the substrate in the corresponding position, and a tool is used to click the cover sheet, so that the cover sheet is air-vented and tightly bonded to the substrate; the process of air-venting and tightly bonding is completed in one click; the clicking process is completed within 10 minutes after the completion of the surface activation treatment; during the clicking process, the surface of the cover sheet is subjected to a pressure less than or equal to 3N. The tool can be a pair of tweezers or other hard objects that facilitate light and force.

[0041] Further, in some embodiments, in the step of forming a metal film layer on one side surface of the substrate, the forming process includes an evaporation process. According to the application requirements of the chip, different materials of the metal film can be selected for evaporation, and the metal film is connected to external equipment to provide corresponding light, heat, and electric field during detection, which is conducted through the silica layer to the microfluidic channel of the cover sheet to provide conditions for detection. The metal film layer needs to have a certain adhesion with the substrate material, and the thickness of the metal film layer is 10nm-100nm.

[0042] Further, in some embodiments, the method for manufacturing a microfluidic chip further comprises: before the step of forming a metal film layer on one side surface of the substrate, pre-cleaning the substrate; the pre-cleaning process includes water washing, organic solvent cleaning, or ultrasonic cleaning. Further, in some embodiments, the method for manufacturing a microfluidic chip further comprises: after clamping the cover sheet to the intermediate bonding layer and bonding the cover sheet to the substrate through the intermediate bonding layer, heating the bonded cover sheet and substrate to solidify the intermediate bonding layer; in the step of heat baking, the temperature is 60℃-70℃ constant temperature, for example, it can be 60℃, 65℃, 70℃ (referring to constant temperature heat baking at any value within the range, not fluctuating within the range), and the heat baking time is 10min-60min, for example, it can be 10min, 20min, 30min, 40min, 50min, 60min.

[0043] The utility model discloses has passed the example explanation as above, believe that the person skilled in the art has understood the utility model through the above example. Apparently, the above example is merely for clearly illustrating the example, and not the limitation of the implementation mode. For ordinary skilled person in the art, on the basis of the above description, other different forms of changes or changes can be made. Here, it is not necessary and impossible to exhaust all the implementation modes. The obvious changes or changes derived therefrom are still within the protection scope of the utility model creation.

Claims

1. A microfluidic chip, characterized by, The microfluidic chip comprises: a substrate, wherein a metal film layer is arranged on the substrate; a cover, wherein the cover is provided with at least a microfluidic channel; an intermediate bonding layer, which is located between the substrate and the cover and covers the metal film layer; and the metal film layer faces the cover. In the microfluidic chip, the cover is a PDMS prepolymer cover, and the intermediate bonding layer is a silica layer.

2. The microfluidic chip according to claim 1, wherein: the metal film layer completely covers one side surface of the substrate; and the intermediate bonding layer completely covers the metal film layer.

3. The microfluidic chip according to claim 1, wherein: the area of the metal film layer is smaller than the area of the intermediate bonding layer, the intermediate bonding layer completely covers the metal film layer and extends beyond the range of the metal film layer, and the intermediate bonding layer is directly connected to the substrate.

4. The microfluidic chip according to claim 1, wherein: the thickness of the metal film layer is 10 nm to 100 nm.

5. The microfluidic chip according to claim 1, wherein: the thickness of the intermediate bonding layer is 10 nm to 40 nm.

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