Wafer cutting auxiliary jig

Abstract

The utility model discloses an auxiliary jig for wafer cutting, which relates to the technical field of wafer processing and mainly comprises an accommodating seat and supporting columns, the accommodating seat is used for accommodating a wafer, the supporting columns are uniformly arranged in the accommodating seat, and the distance between the top surfaces of any two adjacent supporting columns is not greater than the radius of a cut finished product. The multiple supporting columns are evenly distributed, so that finished product cutting can be carried out in any area selected at any position, cutting can be carried out by avoiding a damaged area, and the distance between any two supporting columns is smaller than or equal to the radius of a finished product; the finished product can be supported by at least three supporting columns distributed in a triangular mode at any position, the risk that the finished product falls off does not exist, and the cutting yield is high.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing technology, and in particular to an auxiliary fixture for wafer dicing. Background Technology

[0002] The micro / nano grating cathode assembly (AVGG) is composed of an anti-halo glass input window and a micro / nano grating substrate bonded together. The micro / nano grating substrate is obtained by laser cutting wafers. Cutting is a critical process that directly affects the product yield.

[0003] Currently, the most widely used cutting method is to first mark the scratches, damage, dirt and other defective areas on the wafer as invalid areas, and then use a laser cutting machine to cut the valid areas according to the finished product (micro-nano grating substrate) size. The cut product will fall directly onto a clean cloth. During the process of the micro-nano grating substrate being cut, debris may fall at the same time. The debris will cause wear and scratches on the micro-nano grating substrate, affecting the quality of the finished product.

[0004] An existing wafer dicing apparatus has a support platform with protrusions to support the wafer. Each small protrusion unit is located within a square area. After dicing, the finished product is positioned within this square area. Since the final supported area, i.e., the square area, is fixed in position, dicing must be performed within this square area. However, there may be damaged areas on the wafer that need to be avoided during dicing. Using the aforementioned wafer dicing support platform to support the wafer may lead to a decrease in yield and a waste of resources. Even if damaged areas are actively avoided during dicing, the finished product may still fall between two square areas, posing a risk of damage.

[0005] Therefore, there is an urgent need for a wafer dicing auxiliary fixture to solve the above-mentioned technical problems. Utility Model Content

[0006] The purpose of this invention is to provide an auxiliary fixture for wafer dicing to solve the problems existing in the prior art, thereby increasing the yield of wafer dicing, reducing damage, and saving resources.

[0007] To achieve the above objectives, this utility model provides the following solution:

[0008] This utility model provides a wafer dicing auxiliary fixture, including a receiving seat and support columns. The receiving seat is used to receive the wafer, and the support columns are evenly arranged inside the receiving seat, and the distance between the top surfaces of any two adjacent support columns is not greater than the radius of the finished product after dicing.

[0009] In some embodiments, the accommodating seat comprises a base and an annular sidewall fixedly connected above the base, the supporting column is fixedly connected with the base and arranged inside the annular sidewall, and a stepped surface is arranged at an end of the annular sidewall away from the base, the stepped surface is used for supporting the wafer, and the distance between the stepped surface and the base is not less than the height of the supporting column.

[0010] In some embodiments, the distance between the stepped surface and the base is a first distance, the height of the supporting column is a second distance, the first distance is greater than the second distance, and the difference between the first distance and the second distance is the thickness of the wafer + 0.05mm-0.1mm.

[0011] In some embodiments, the width of the stepped surface is a, and 0mm

[0012] In some embodiments, the top surface of the supporting column is a conical surface, and the distance between the tips of any two adjacent supporting columns is less than the radius of the finished product.

[0013] In some embodiments, the accommodating seat further comprises an opening arranged on the annular sidewall.

[0014] In some embodiments, four openings are arranged, and the four openings are uniformly arranged along the circumference of the annular sidewall.

[0015] In some embodiments, the bottom surface of the opening is lower than the stepped surface.

[0016] In some embodiments, the diameter of the annular sidewall above the stepped surface is equal to the diameter of the wafer.

[0017] In some embodiments, the material of the supporting column is a soft material.

[0018] The utility model discloses the following technical effects are obtained relative to prior art:

[0019] The wafer cutting auxiliary jig comprises an accommodating seat and a supporting column, the accommodating seat is used for accommodating a wafer, the supporting column is evenly arranged inside the accommodating seat, and the distance between the top surfaces of any two supporting columns is not greater than the radius of a finished product after cutting, a plurality of supporting columns are evenly distributed, so that a cutting area can be selected at any position, cutting can be carried out to avoid damaging the area, the distance between any two supporting columns is less than or equal to the radius of the finished product, at least three supporting columns in a triangular distribution can support the finished product at any position of the finished product, the finished product does not have the risk of falling, and the cutting yield is high. BRIEF DESCRIPTION OF DRAWINGS

[0020] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed in the embodiments. Obviously, the drawings described below only constitute some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0021] Figure 1 A structure diagram of a wafer cutting auxiliary jig in some embodiments of the present application is shown.

[0022] Figure 2 A front view of a wafer cutting auxiliary jig in some embodiments of the present application is shown.

[0023] Figure 3 A structure diagram of a wafer cutting auxiliary jig in some embodiments of the present application is shown. Figure 2 A sectional view of B-B.

[0024] In the figure: 1 - step surface; 2 - opening; 3 - support column; 4 - annular side wall; 5 - base. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments only constitute some embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] The purpose of the present application is to provide a wafer cutting auxiliary jig to solve the problems existing in the prior art, so that the wafer cutting yield is high, not easy to damage, and resources are saved.

[0027] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the present application will be described in further detail below with reference to the drawings and specific embodiments.

[0028] As shown in Figures 1-3 The present application provides a wafer cutting auxiliary jig, which comprises a containing seat and a support column 3. The containing seat is used to contain a wafer. The support column 3 is evenly arranged in the interior of the containing seat. The distance between the top surfaces of any two adjacent support columns 3 is not greater than the radius of the finished product after cutting. A plurality of support columns 3 are evenly distributed, so that the area can be selected at any position for finished product cutting, which can avoid cutting in the damaged area, save cost, and the distance between any two adjacent support columns 3 is less than or equal to the radius of the finished product. The finished product can be guaranteed to be supported by at least three support columns 3 in a triangular distribution at any position, so that the finished product has no risk of falling, and the cutting yield is high.

[0029] In some embodiments, the accommodating seat comprises a base 5 and an annular sidewall 4 fixedly connected above the base 5, the support column 3 is fixedly connected with the base 5 and arranged inside the annular sidewall 4, and a stepped surface 1 is arranged at an end of the annular sidewall 4 away from the base 5, the stepped surface 1 is used for supporting the wafer, and the distance between the stepped surface 1 and the base 5 is not less than the height of the support column 3. The stepped surface 1 can provide a flat and stable support plane for the wafer, so as to ensure that the wafer remains horizontal and stable during the cutting process, reduce the possibility of shaking and displacement, and thus improve the cutting precision and quality. At the same time, since the distance between the stepped surface 1 and the base 5 is not less than the height of the support column 3, the support column 3 does not directly contact the wafer, so as to avoid scratching the wafer during cutting. The annular sidewall 4 can limit and position the wafer, so that the position of the wafer in the accommodating seat is more accurate, and the cutting equipment can be conveniently and accurately cut. During the cutting process, the wafer is not easy to deviate, which helps to ensure the accuracy and consistency of cutting and improve the cutting yield.

[0030] In some embodiments, the diameter of the annular sidewall 4 above the stepped surface 1 is equal to the diameter of the wafer. The diameter of the annular sidewall 4 is equal to the diameter of the wafer, which can provide accurate positioning for the wafer, so as to ensure that the position of the wafer placed in the jig each time is basically consistent. During the cutting process, the strict fixing of the position of the wafer helps to improve the cutting precision and repeatability, reduce the cutting error caused by the deviation of the position of the wafer, and improve the yield of finished products.

[0031] In some embodiments, the distance between the stepped surface 1 and the base 5 is a first distance, the height of the support column 3 is a second distance, the first distance is greater than the second distance, and the difference between the first distance and the second distance is the thickness of the wafer + 0.05mm-0.1mm. The first distance is greater than the second distance, so that the wafer placed on the stepped surface 1 does not directly contact the support column 3, thereby preventing the support column 3 from causing damage such as scratches and indentations to the surface of the wafer, protecting the integrity and surface quality of the wafer. At the same time, the difference in distance is close to the thickness of the wafer but slightly greater than the thickness of the wafer, so that the finished product after cutting falls on the support column 3, the bottom surface of the finished product contacts the support column 3 while the top surface is at a horizontal height lower than the height of the bottom surface of the wafer. When the wafer is removed, even if the wafer is displaced, it will not scratch the finished product, ensuring the yield. Moreover, the small height difference makes the finished product fall on the support column 3 without a large impact force, which can also protect the finished product to some extent.

[0032] In some embodiments, the width of the stepped surface 1 is greater than 0mm and less than or equal to 5mm, and is preferably 3mm, which can accurately limit the placement position of the wafer, so that the position of the wafer in the accommodating seat is more accurate and fixed. This width range can basically ensure that the edge dead zone of the wafer is exactly on the stepped surface 1 for support.

[0033] In some embodiments, the top surface of the support column 3 is a conical surface, and the distance between the tips of any two adjacent support columns 3 is less than the radius of the finished product. The design of the conical surface makes the contact area between the support column 3 and the wafer smaller, which can more accurately support the wafer and reduce the damage such as surface scratches and indentation caused by the large-area contact between the support column 3 and the wafer, thereby helping to protect the surface quality of the wafer and improve the yield of the product. At the same time, the distance between the tips is less than the radius of the finished product, which can ensure that even if the wafer moves or shakes slightly during the cutting process, there will always be enough support columns 3 (at least three) to support it, avoiding the wafer from falling or being damaged due to the loss of support.

[0034] Moreover, the design of the conical surface is not conducive to the accumulation of impurities. The debris, dust and other impurities generated during the cutting process are not easy to adhere to the conical surface, but are more likely to slide off the conical surface, thereby reducing the residue of impurities on the support column 3, facilitating the cleaning and maintenance of the jig, maintaining the good performance of the jig, and reducing the problems such as wafer contamination and cutting quality degradation caused by the residue of impurities.

[0035] It should be noted that the support column 3 can also be a straight prism or a cylinder with a flat top surface, as long as it can effectively support the finished product.

[0036] In some embodiments, the wafer cutting auxiliary jig further comprises an opening 2, which is located on the annular side wall 4. The size of the opening 2 is generally larger than that of the tweezers gripping end, so that the tweezers can extend into the opening 2 to grip the wafer.

[0037] In some embodiments, four openings 2 are provided, which are uniformly arranged along the circumference of the annular side wall 4, so that the operator can easily approach the wafer from any direction for operation. When gripping the wafer, the most convenient opening 2 can be selected according to the operation habit and actual working scene, and the jig position does not need to be adjusted frequently. Moreover, the operator can also select two symmetrical openings 2 to grip the wafer, thereby improving the stability of gripping. It should be noted that the number of openings 2 can be set as needed, and at least one opening 2 is required.

[0038] In some embodiments, the bottom surface of the opening 2 is lower than the stepped surface 1, that is, the height from the bottom of the opening 2 to the top surface of the annular side wall 4 is greater than the height from the stepped surface 1 to the top surface of the annular side wall 4, that is, the bottom plane of the opening 2 is located below the stepped surface 1, so that when the wafer is placed, the wafer can be placed on the stepped surface 1, and there is no free-falling condition of the wafer, thereby ensuring the stability of the wafer placement.

[0039] In some embodiments, the material of the support column 3 is soft, but the elasticity should not be too high, and can be rubber, silica gel or other mixed soft materials. The soft material of the support column 3 can effectively buffer and disperse the pressure when in contact with the finished product, so as to avoid scratches, cracks or other damage to the wafer caused by excessive local pressure.

[0040] As a preferred embodiment, the base 5, the annular side wall 4 and the support column 3 are integrally formed and made of the same material, which can ensure the stability of the connection of the support column 3.

[0041] The principle and implementation mode of the specific examples applied in the utility model are described, and the above embodiment is only used to help understand the method and core idea of the utility model; meanwhile, for the general technical personnel in the field, the specific implementation mode and application range will be changed according to the idea of the utility model. In conclusion, the content of the specification should not be understood as the limitation of the utility model.

Claims

1. A wafer cutting auxiliary jig characterized by: The application relates to a wafer support device, which comprises a containing seat for containing a wafer and support columns uniformly arranged in the containing seat, and the distance between the top surfaces of any two adjacent support columns is not greater than the radius of the finished product after cutting.

2. The wafer cutting assist jig of claim 1, wherein: The containing seat comprises a base and an annular sidewall fixedly connected to the top of the base, the support columns are fixedly connected to the base and arranged in the annular sidewall, a stepped surface is arranged at the end of the annular sidewall away from the base, the stepped surface is used for supporting the wafer, and the distance between the stepped surface and the base is not less than the height of the support columns.

3. The wafer cutting assist jig of claim 2, wherein: The distance between the stepped surface and the base is a first distance, the height of the support columns is a second distance, the first distance is greater than the second distance, and the difference between the first distance and the second distance is the thickness of the wafer plus 0.05mm-0.1mm.

4. The wafer cutting assist jig of claim 2, wherein: The width of the stepped surface is a, and 0mm 5. The wafer cutting assist tool of claim 1, wherein: The top surface of the support column is a conical surface, and the distance between the tips of any two adjacent support columns is less than the radius of the finished product.

6. The wafer cutting assist tool of claim 2, wherein: The application further comprises an opening arranged on the annular sidewall.

7. The wafer cutting assist tool of claim 6, wherein: The four openings are uniformly arranged along the circumference of the annular sidewall.

8. The wafer cutting assist tool of claim 6, wherein: The bottom surface of the opening is lower than the stepped surface.

9. The wafer cutting assist tool of claim 2, wherein: The diameter of the annular sidewall above the stepped surface is equal to the diameter of the wafer.

10. The wafer cutting assist tool of claim 1, wherein: The material of the support column is a soft material.

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