Semiconductor part positioning device

Abstract

The utility model belongs to the technical field of clamps, and discloses a semiconductor part positioning device, which comprises a clamp main body, the clamp main body is matched with a semiconductor part in appearance, the clamp main body is provided with a plurality of second positioning holes and a plurality of third positioning holes, and the second positioning holes and the first positioning holes are arranged in one-to-one correspondence. A first pin rod is inserted into each second positioning hole, and a second pin rod is inserted into each third positioning hole; wherein the semiconductor part is provided with a plurality of fourth positioning holes, the fourth positioning holes and the second pin rods are arranged in a one-to-one correspondence mode, and the fourth positioning holes are configured to be formed in the top face of the semiconductor part after the clamp body positions the semiconductor part through cooperation of the first pin rods and the first positioning holes. Through the arrangement of the second positioning hole and the third positioning hole, the fourth positioning hole for subsequent positioning is formed on the basis that the semiconductor part is positioned, and the yield and the consistency of the final finished product of the semiconductor part are effectively improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of fixture, especially relates to a semiconductor part positioning device. BACKGROUND

[0002] In the process of machining semiconductor parts from blank to terminal product, the inner and outer surfaces need to be finished, so as to obtain various hole and groove structures. After positioning the blank, the contact surface of the positioning fixture and the blank cannot be machined, and the blank posture needs to be changed in the subsequent process, and the blank is repositioned, so that the surface of the blank that cannot be machined before is machined. Because the blank posture is changed, the positioning structure required for positioning is also changed. The positioning device on the market is difficult to quickly fix the blank after changing the posture, and it is difficult to ensure the positioning accuracy of the blank of the semiconductor part before and after changing the posture, resulting in poor quality and low consistency of the semiconductor part. SUMMARY

[0003] The utility model discloses a semiconductor part positioning device, which is convenient and fast to position, has high clamping efficiency, and can ensure the positioning accuracy of the semiconductor part before and after changing the posture.

[0004] To achieve this purpose, the utility model adopts the following technical scheme: a semiconductor part positioning device is used for positioning a semiconductor part, the bottom surface of the semiconductor part is provided with a plurality of first positioning holes, the semiconductor part positioning device comprises a fixture main body, the fixture main body is matched with the shape of the semiconductor part, the fixture main body is provided with a plurality of second positioning holes and a plurality of third positioning holes, the second positioning holes and the first positioning holes are one-to-one correspondingly arranged, a first pin is inserted into each second positioning hole, and a second pin is inserted into each third positioning hole, wherein the semiconductor part is provided with a plurality of fourth positioning holes, the fourth positioning holes are one-to-one correspondingly arranged with the second pins, and the fourth positioning holes are configured to be opened on the top surface of the semiconductor part after the fixture main body positions the semiconductor part through cooperation of the first pins and the first positioning holes.

[0005] Preferably, the bottom surface of the semiconductor part is provided with a plurality of first screw holes, the fixture main body is provided with a plurality of second screw holes, and the first screw holes and the second screw holes are one-to-one correspondingly arranged.

[0006] Preferably, the semiconductor part comprises a part main body and cantilevers located on both sides of the part main body, the cantilevers are provided with blank parts to be milled, and the first positioning holes and part of the second screw holes are opened on the bottom surface of the blank parts.

[0007] Preferably, in the vertical direction, the depth of the first positioning hole and the depth of the second screw hole are both less than the height of the blank part.

[0008] As preferred, the top of the semiconductor part is provided with a flange part, the clamp body further comprises a plurality of detachable first pressing blocks, the first pressing blocks are located above the flange part and abut against the flange part, and the first pressing blocks are arranged at intervals along the circumference of the flange part.

[0009] As preferred, the first pressing block is provided with a first waist-shaped hole, and the clamp body is connected with a first screw, the first screw is arranged in the first waist-shaped hole.

[0010] As preferred, the clamp body further comprises a plurality of detachable second pressing blocks, the volume of the second pressing blocks is smaller than that of the first pressing blocks, the second pressing blocks are located above the flange part and abut against the flange part, and the second pressing blocks are arranged at intervals along the circumference of the flange part.

[0011] As preferred, the second pressing block is provided with a second waist-shaped hole, and the clamp body is connected with a second screw, the second screw is arranged in the second waist-shaped hole.

[0012] As preferred, the semiconductor part positioning device further comprises a zero-point clamp, and the zero-point clamp is used for positioning the clamp body on a horizontal plane.

[0013] As preferred, the clamp body is provided with a center hole, and the center hole penetrates through the clamp body.

[0014] The beneficial effects of the semiconductor part positioning device are as follows: when the semiconductor part is finished, the user can first position the semiconductor part to be machined through the first pin in the first positioning hole and the plug-in cooperation of the second positioning hole, so that the semiconductor part is in a normal posture, at this time, the user can machine the top surface of the semiconductor part, and at the same time, the fourth positioning hole is machined on the top surface of the semiconductor part. Then, the user can reposition the semiconductor part through the second pin and the fourth positioning hole, so that the semiconductor part is in an inverted posture, at this time, the user can finish machining the bottom surface, side surface and other parts of the semiconductor part which have not been machined before, so as to realize the finish machining of the semiconductor part. Through the setting of the second positioning hole and the third positioning hole, the first pin in the second positioning hole and the second pin in the third positioning hole position the semiconductor part twice, which can effectively reduce the clamping difficulty and improve the clamping efficiency. The cooperation of the first pin and the first positioning hole forms the fourth positioning hole for subsequent positioning on the basis of the positioning of the semiconductor part, which ensures the positioning accuracy before and after the change of the posture of the semiconductor part, so that the sizes of the semiconductor part positioned twice meet the finish machining requirements, and the yield rate and consistency of the final product of the semiconductor part are effectively improved. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a blank schematic view of the semiconductor part of the semiconductor part positioning device.

[0016] Figure 2 is a structure schematic view of a semiconductor part of an embodiment of the utility model;

[0017] Figure 3 is a structure schematic view of a clamp main body of an embodiment of the utility model;

[0018] Figure 4 is a schematic view of a semiconductor part positioning device of an embodiment of the utility model at a first process;

[0019] Figure 5 is a schematic view of a semiconductor part positioning device of an embodiment of the utility model at a second process and a third process;

[0020] Figure 6 is a schematic view of a semiconductor part positioning device of an embodiment of the utility model at a fourth process.

[0021] In the drawing:

[0022] 100, semiconductor part;110, first positioning hole;120, fourth positioning hole;130, first screw hole;140, part main body;150, cantilever;151, blank part;160, flanging part;

[0023] 200, clamp main body;210, second positioning hole;220, third positioning hole;230, second screw hole;240, first pressing block;241, first waist hole;242, first screw;250, second pressing block;251, second waist hole;252, second screw;260, center hole;

[0024] 300, zero clamp. DETAILED DESCRIPTION

[0025] The utility model will be further explained in detail below in combination with the drawings and embodiments.It can be understood that the specific embodiments described herein are only used to explain the utility model and not limit the utility model.In addition, it should be noted that in order to facilitate the description, only the part related to the utility model is shown in the drawings and not all structures.

[0026] In the description of the utility model, unless explicitly defined and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixed connection, or detachable connection, or integral;It can be mechanical connection, or electrical connection;It can be directly connected, or indirectly connected through intermediate medium, it can be the communication inside two elements or the interaction relationship of two elements.For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0027] In the utility model, unless another definite provision and limitation, first feature is "on" or "under" second feature can include that first and second features are in direct contact, also can include that first and second features are not in direct contact but contact through other feature between them.Moreover, first feature "on", "above" and "upper surface of" second feature includes that first feature is directly above and obliquely above second feature, or only indicates that first feature is higher than second feature in horizontal height.First feature "under", "below" and "under surface of" second feature includes that first feature is directly below and obliquely below second feature, or only indicates that first feature is lower than second feature in horizontal height.

[0028] In the description of the embodiment, the terms "upper", "lower", "right", "left", "horizontal", "vertical", and "radial" are terms that describe relative position or orientation, and these terms are used only to simplify description and facilitate understanding of the present application, and therefore should not be construed as limiting the present application to a particular orientation, configuration, or operation.

[0029] Referring to Figures 1 to 6 As shown in the figure, the semiconductor part positioning device provided by the embodiment of the present application is used for positioning a semiconductor part 100.The bottom surface of the semiconductor part 100 is provided with a plurality of first positioning holes 110, and the plurality of first positioning holes 110 are arranged at intervals along the circumference of the semiconductor part 100.The semiconductor part positioning device comprises a clamp body 200, the clamp body 200 and the semiconductor part 100 are matched in shape, the clamp body 200 is provided with a plurality of second positioning holes 210 and a plurality of third positioning holes 220, the second positioning holes 210 and the first positioning holes 110 are arranged one by one in correspondence, a first pin is inserted into each second positioning hole 210, and a second pin is inserted into each third positioning hole 220.

[0030] The semiconductor part 100 is provided with a plurality of fourth positioning holes 120, the fourth positioning holes 120 are arranged one by one in correspondence with the second pins, and the fourth positioning holes 120 are configured to be opened on the top surface of the semiconductor part 100 after the clamp body 200 positions the semiconductor part 100 through cooperation of the first pins and the first positioning holes 110.

[0031] It can be understood that when the semiconductor part 100 is finished, the user can first position the to-be-processed positioning semiconductor part 100 through the first pin in the first positioning hole 110 and the plug-in fit of the second positioning hole 210, so that the semiconductor part 100 is in a normal posture, at this time, the user can process the top surface and part of the side surface of the positioning semiconductor part 100, and at the same time, the fourth positioning hole 120 is processed on the top surface of the semiconductor part 100. Subsequently, the user can position the semiconductor part 100 again through the second pin and the fourth positioning hole 120, so that the semiconductor part 100 is in an inverted posture, at this time, the user can finish machining the bottom surface, side surface and other parts of the positioning semiconductor part 100 which have not been machined before, so as to realize the finish machining of the semiconductor part 100. Specifically, the finish machining of the semiconductor part 100 from the blank to the finished product includes the following processes:

[0032] The first process is to position the blank of the semiconductor part 100 to the clamp body 200 through the first positioning hole 110 and the first pin, and the user finishes machining the bottom surface of the semiconductor part 100 to obtain the bottom surface structure of the finished product of the semiconductor part 100 and the fourth positioning hole 120;

[0033] The second process is to turn over the semiconductor part 100 by 180°, position the blank of the semiconductor part 100 to the clamp body 200 through the fourth positioning hole 120 and the second pin, and the user finishes machining the top surface of the semiconductor part 100 to obtain the top surface structure of the finished product of the semiconductor part 100;

[0034] The third process is to continue machining the outer side wall of the blank of the semiconductor part 100 to obtain the outer side structure of the finished product of the semiconductor part 100;

[0035] The fourth process is to continue machining the inner side wall of the blank of the semiconductor part 100 to obtain the finished product of the semiconductor part 100.

[0036] By setting the second positioning hole 210 and the third positioning hole 220, the first pin in the second positioning hole 210 and the second pin in the third positioning hole 220 position the semiconductor part 100 twice, which can effectively reduce the clamping difficulty and improve the clamping efficiency. The cooperation of the first pin and the first positioning hole 110 enables the semiconductor part 100 to form the fourth positioning hole 120 for subsequent positioning on the basis of being positioned, ensures the positioning accuracy before and after the posture of the semiconductor part 100 is changed, makes the dimensions of the twice positioning of the semiconductor meet the finish machining requirements, and effectively improves the yield rate and consistency of the final product of the semiconductor part 100.

[0037] Further, the semiconductor part positioning device further comprises a zero-point clamp for positioning the clamp body 200 on a horizontal plane. Optionally, the zero-point clamp can be a single-format zero-point positioner, a zero-point quick-change clamp, etc. Since the zero-point clamp technology is mature, the user has many options, which will not be described here.

[0038] By setting the zero point clamp, the zero point clamp can first position the clamp body 200 before positioning the semiconductor part 100, providing positioning support for the clamp body 200, ensuring the installation stability and positioning accuracy of the clamp body 200, significantly improving production efficiency, reducing clamping time, improving machining precision and consistency.

[0039] Referring to Figure 3 It can be understood that the clamp body 200 is provided with a center hole 260 which penetrates through the clamp body 200.

[0040] By setting the center hole 260, on the one hand, the center hole 260 can reduce the weight of the clamp body 200 and save the material cost of the clamp body 200; on the other hand, the zero point clamp can be set as a chuck clamp, and the chuck clamp positions the center hole 260 and thus the clamp body 200 through a plurality of clamping jaws moving synchronously, improving the positioning accuracy of the zero point clamp.

[0041] Referring to Figures 1 to 5 It can be understood that the bottom surface of the semiconductor part 100 is provided with a plurality of first screw holes 130, the first screw holes 130 are arranged along the circumference of the semiconductor part 100, and the first screw holes 130 are provided with a plurality of second screw holes 230 along the clamp body 200, the first screw holes 130 and the second screw holes 230 are arranged one by one, and a connecting screw is installed in each first screw hole 130. The connecting screw can be connected with the second screw hole 230.

[0042] By setting the first screw hole 130 and the second screw hole 230, the user can fix the semiconductor part 100 through the cooperation of the connecting screw and the first screw hole 130 while positioning the semiconductor part 100 in the first process, effectively improving the positioning stability of the semiconductor part 100 and ensuring the machining precision of the fourth positioning hole 120.

[0043] Referring to Figure 1 and Figure 3 It can be understood that the semiconductor part 100 includes a part body 140 and cantilever arms 150 located on both sides of the part body 140, and the cantilever arms 150 are provided with a blank portion 151 to be milled, wherein the blank portion 151 is a protruding structure extending from the blank of the semiconductor part 100, and the blank portion 151 will be milled and removed in the subsequent third process. The first positioning hole 110 and part of the second screw hole 230 are opened on the bottom surface of the blank portion 151.

[0044] By opening the first positioning hole 110 and the second screw hole 230 on the bottom surface of the blank part 151, the blank state of the cantilever 150 can also be in contact with the clamp body 200, avoiding the gap between the clamp body 200 and the blank state of the cantilever 150, facilitating the cooperation of the first positioning hole 110 and the first pin rod to position the blank part 151, and the cooperation of the second screw hole 230 and the connecting screw to fix the blank part 151, ensuring the accurate positioning of the cantilever 150 part, thereby improving the overall positioning accuracy of the semiconductor part 100. At the same time, the blank part 151 can provide stable support for the cantilever 150 part in the first process, reducing the processing difficulty of the semiconductor part 100.

[0045] It should be noted that when the two sides of the semiconductor part 100 are provided with cantilevers 150, i.e., the semiconductor part 100 is not a standard circular part, the first positioning hole 110 can be provided with only two, and the two first positioning holes 110 are respectively opened on the blank parts 151 of the two cantilevers 150, thereby further improving the clamping efficiency of the clamp body 200.

[0046] Further, in the vertical direction, the depth of the first positioning hole 110 and the depth of the second screw hole 230 are both less than the height of the blank part 151.

[0047] By setting the depth of the first positioning hole 110 and the depth of the second screw hole 230 to be less than the height of the blank part 151, the user can ensure the flatness of the end surface of the cantilever 150 when milling the blank part 151 later, avoiding unnecessary hole and groove structures on the surface of the cantilever 150, and further improving the yield and integrity of the finished semiconductor part 100.

[0048] Referring to FIGS. 1-3, Figure 2 and Figure 5 It can be understood that the top of the semiconductor part 100 is provided with a flange part 160, and the flange part 160 is formed on the outer peripheral wall of the semiconductor part 100. The clamp body 200 further comprises a plurality of detachable first pressing blocks 240, which are located above the flange part 160 and abut against the flange part 160, and the plurality of first pressing blocks 240 are spaced apart along the circumference of the flange part 160.

[0049] In the second process and subsequent processes, since the first screw hole 130 on the semiconductor part 100 is flipped with the bottom surface of the semiconductor part 100, the user cannot fix the semiconductor part 100 by connecting screws. By providing a plurality of first pressing blocks 240, the plurality of first pressing blocks 240 press the flange part 160 from multiple points, thereby limiting the flange part 160 in the vertical direction, cooperating with the positioning of the second pin rod to the semiconductor part 100, and can fix the semiconductor part 100 on the clamp body 200, ensuring the installation stability of the semiconductor part 100 in the second process and subsequent processes.

[0050] Further, the first pressing block 240 is provided with a first waist-shaped hole 241, and the clamp body 200 is connected with a first screw 242, which is arranged in the first waist-shaped hole 241.

[0051] By arranging the first waist-shaped hole 241, the user can adjust the length of the first pressing block 240 extending out of the first screw 242 in the radial direction of the part body 140 by adjusting the position of the first screw 242 in the first waist-shaped hole 241, so that the first pressing block 240 can adapt to semiconductor parts 100 of different sizes, and the practicability of the clamp body 200 is effectively improved.

[0052] Referring to Figure 6 It can be understood that the clamp body 200 further comprises a plurality of detachable second pressing blocks 250, the volume of the second pressing block 250 is smaller than that of the first pressing block 240, the second pressing block 250 is located above the flange portion 160 and abuts against the flange portion 160, and the plurality of second pressing blocks 250 are arranged at intervals along the circumference of the flange portion 160.

[0053] In the fourth process, the inner wall of the semiconductor part 100 needs to be processed. By arranging the second pressing block 250 with a smaller volume than the first pressing block 240, the second pressing block 250 can replace the first pressing block 240 in the fourth process, thereby reducing the collision probability of the second pressing block 250 with the processing equipment under the premise of ensuring stable installation of the semiconductor part, and further improving the yield of the finished semiconductor part 100.

[0054] Further, the second pressing block 250 is provided with a second waist-shaped hole 251, and the clamp body 200 is connected with a second screw 252, which is arranged in the second waist-shaped hole 251.

[0055] By arranging the second waist-shaped hole 251, the user can adjust the length of the second pressing block 250 extending out of the second screw 252 in the radial direction of the part body 140 by adjusting the position of the second screw 252 in the second waist-shaped hole 251, so that the second pressing block 250 can also adapt to semiconductor parts 100 of different sizes, and the practicability of the clamp body 200 is ensured.

[0056] Obviously, the above embodiments of the utility model are only examples for clearly illustrating the utility model, and are not a limitation on the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, re-adjustment and replacement can be made without departing from the protection scope of the utility model. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claims.

Claims

1. A semiconductor component positioning device for positioning a semiconductor component (100) having a bottom surface provided with a plurality of first positioning holes (110), characterized by, The semiconductor part positioning device comprises: A clamp body (200) which is matched with the semiconductor part (100) in shape, and is provided with a plurality of second positioning holes (210) and a plurality of third positioning holes (220), the second positioning holes (210) and the first positioning holes (110) are arranged one by one, and each of the second positioning holes (210) is inserted with a first pin, and each of the third positioning holes (220) is inserted with a second pin; Wherein, the semiconductor part (100) is provided with a plurality of fourth positioning holes (120), the fourth positioning holes (120) are arranged one by one with the second pin, and the fourth positioning holes (120) are configured to be opened on the top surface of the semiconductor part (100) after the semiconductor part (100) is positioned by the clamp body (200) through the cooperation of the first pin and the first positioning hole (110).

2. The semiconductor component positioning apparatus according to claim 1, characterized by The bottom surface of the semiconductor part (100) is provided with a plurality of first screw holes (130), and the clamp body (200) is provided with a plurality of second screw holes (230), and the first screw holes (130) and the second screw holes (230) are arranged one by one.

3. The semiconductor component positioning apparatus according to claim 2, wherein The semiconductor part (100) comprises a part body (140) and cantilevers (150) located on both sides of the part body (140), the cantilevers (150) are provided with blank parts (151) to be milled, and the first positioning holes (110) and part of the second screw holes (230) are opened on the bottom surface of the blank parts (151).

4. The semiconductor component positioning apparatus according to claim 3, characterized by In the vertical direction, the depth of the first positioning hole (110) and the depth of the second screw hole (230) are both smaller than the height of the blank part (151).

5. The semiconductor component positioning apparatus according to any one of claims 1 to 4, characterized by The top of the semiconductor part (100) is provided with a flange part (160), and the clamp body (200) further comprises a plurality of detachable first pressing blocks (240), the first pressing blocks (240) are located above the flange part (160) and abut against the flange part (160), and a plurality of the first pressing blocks (240) are arranged at intervals along the circumference of the flange part (160).

6. The semiconductor component positioning apparatus according to claim 5, wherein The first pressing block (240) is provided with a first waist-shaped hole (241), and the clamp body (200) is connected with a first screw (242), and the first screw (242) is arranged in the first waist-shaped hole (241).

7. The semiconductor component positioning apparatus according to claim 5, wherein The clamp body (200) further comprises a plurality of detachable second pressing blocks (250), the volume of the second pressing block (250) is smaller than that of the first pressing block (240), the second pressing block (250) is located above the flange part (160) and abuts against the flange part (160), and a plurality of the second pressing blocks (250) are arranged at intervals along the circumference of the flange part (160).

8. The semiconductor component positioning apparatus according to claim 7, wherein The second pressing block (250) is provided with a second waist-shaped hole (251), and the clamp body (200) is connected with a second screw (252), and the second screw (252) is arranged in the second waist-shaped hole (251).

9. The semiconductor device positioning apparatus according to any one of claims 1 to 4, characterized by The semiconductor component positioning device further comprises a zero-point clamp (300) for positioning the clamp body (200) in a horizontal plane.

10. The semiconductor device positioning apparatus according to any one of claims 1 to 4, characterized by The clamp body (200) is provided with a central hole (260) which penetrates the clamp body (200).

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