Wafer thinning equipment

Abstract

The utility model provides a wafer thinning device. The wafer thinning equipment comprises a grinding module, the grinding module comprises a base table and a multi-station rotary table, and the multi-station rotary table is rotatably arranged on the base table through a rotary transmission system; the rotary transmission system comprises a synchronous belt, a driving assembly and a tensioning device, wherein the synchronous belt is configured to drive the multi-station rotary table to achieve station rotation, the driving assembly is configured to drive the synchronous belt, and the tensioning device is configured to control tensioning of the synchronous belt in real time. According to the wafer thinning equipment, the tensioning force of the synchronous belt can be monitored and adjusted in real time, and the transmission precision of the synchronous belt is ensured, so that the multi-station rotary table of the wafer thinning equipment has relatively high positioning precision during station rotation, and further wafer grinding and thinning precision is ensured.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor manufacturing; more particularly, the present application relates to a wafer thinning device. BACKGROUND

[0002] The semiconductor wafer thinning device in the prior art adopts a multi-station grinding system, which is composed of multiple workstations, each of which is rotated to a required station by a rotary table. The rotary table carrying multiple workstations is driven by a motor, and the multi-station rotation is achieved through synchronous belt transmission. Since the rotary table has a very large diameter, a relatively heavy mass, and a high positioning accuracy, the requirements for the synchronous belt are relatively high. In addition to the high accuracy and quality of the synchronous belt itself, the tension of the synchronous belt is particularly important.

[0003] At present, the rotary transmission system of the thinning machine achieves the tensioning effect by stretching the synchronous belt, and the tensioning force is measured by a tension measuring instrument during the assembly of the base. This method can only set the tensioning force preset value in the early stage of the base, but the tensioning force cannot be detected during the operation of the base and after a long time of operation of the base, which may affect the rotation result of the rotary table. CONTENT OF THE UTILITY MODEL

[0004] Therefore, the present application provides a wafer thinning device, thereby solving or at least alleviating one or more of the above-mentioned problems and other aspects in the prior art.

[0005] In order to achieve the foregoing purpose, the first aspect of the present application provides a wafer thinning device, which comprises a grinding module, the grinding module comprising a base, a multi-station rotary table, the multi-station rotary table being rotatably arranged on the base via a rotary transmission system; the rotary transmission system comprising: a synchronous belt configured to drive the multi-station rotary table to realize station rotation, a drive assembly configured to drive the synchronous belt, and a tensioning device configured to control the tensioning of the synchronous belt in real time.

[0006] Optionally, the rotary transmission system further comprises a drive assembly, the drive assembly comprising a rotary motor, a speed reducer, and a pulley connected to the output shaft of the speed reducer, the rotary motor being configured to drive the synchronous belt through the speed reducer and the pulley.

[0007] Optionally, the tensioning device comprises a slide plate seat fixed on the base and a slide plate slidably mounted on the slide plate seat, the rotary motor and the speed reducer being arranged on the slide plate and being capable of moving with the slide plate, the slide plate being capable of being controlled to slide away from the multi-station rotary table to tension the synchronous belt through the pulley.

[0008] Optionally, the rotary motor is located above the speed reducer, the speed reducer passes through the slide plate downwardly so that an output shaft of the speed reducer is located below the slide plate, and the pulley sleeve is connected to the output shaft of the speed reducer.

[0009] Optionally, the rotary transmission system comprises first and second tension pulleys arranged between the pulley and the multi-station rotary table, the first and second tension pulleys are arranged on two sides of the pulley respectively, the synchronous belt is wrapped around the pulley with its inner side, and the first and second tension pulleys abut against the outer side of the synchronous belt.

[0010] Optionally, the first and second tension pulleys are arranged at a distance such that the synchronous belt is parallel on both sides of the pulley.

[0011] Optionally, the first and second tension pulleys are fixed in parallel to a tension pulley seat, and the tension pulley seat is fixed to the base.

[0012] Optionally, an end of the slide plate seat opposite to the multi-station rotary table is provided with a motor seat, the motor seat is provided with a tension motor, the tension motor is connected to the slide plate through a lead screw and controls the sliding of the slide plate.

[0013] Optionally, the motor seat is a Z-shaped plate, the Z-shaped plate comprises a first end plate, a second end plate and an intermediate connecting plate between the first end plate and the second end plate, the first end plate is connected to an end face of the slide plate seat, the second end plate is used for fixing the tension motor, the intermediate connecting plate extends horizontally along the sliding direction of the slide plate, the first end plate extends vertically downward from an end of the intermediate connecting plate facing the slide plate seat, and the second end plate extends vertically upward from an end of the intermediate connecting plate away from the slide plate seat.

[0014] Optionally, a lead screw rack is arranged on the intermediate connecting plate of the motor seat, the lead screw is supported by the lead screw rack and connected to an output shaft of the tension motor through a shaft coupling.

[0015] Optionally, the output shaft of the tension motor passes through the first end plate, and the tension motor and the shaft coupling are located on two sides of the first end plate respectively.

[0016] Optionally, the slide plate and the slide plate seat are connected through a guide rail and sliding groove structure, a first end of the guide rail and sliding groove structure is close to the multi-station rotary table, a second end of the guide rail and sliding groove structure is away from the multi-station rotary table, and the guide rail and sliding groove structure comprises two guide rails parallel to the lead screw and two sliding grooves matched with the two guide rails respectively.

[0017] Optionally, the rotary transmission system has a control device and a tension sensor for measuring the tension of the synchronous belt, the tension sensor feeding a tension signal to the control device, the control device controlling the tension motor according to the tension signal to adjust the tension of the synchronous belt.

[0018] Optionally, the control device is configured to:

[0019] when the tension is a preset value, determining that the rotary transmission system is normal, and controlling the tension motor to stop;

[0020] when the tension does not reach the preset value, determining that the rotary transmission system is abnormal, and controlling the tension motor to start stretching the synchronous belt;

[0021] when the tension exceeds the preset value, determining that the rotary transmission system is abnormal, and controlling the tension motor to start releasing the synchronous belt; and

[0022] when the tension suddenly changes, determining that the synchronous belt is abnormal, and issuing an alarm.

[0023] Optionally, the tension sensor is arranged at the first tension pulley and / or the second tension pulley.

[0024] Optionally, the rotary transmission system has a tension motor sensor for measuring the elongation of the synchronous belt, wherein:

[0025] when the elongation of the synchronous belt reaches a preset value, prompting replacement of the synchronous belt;

[0026] when the elongation of the synchronous belt does not reach the preset value, the tension motor sensor continues to detect the elongation of the synchronous belt.

[0027] As can be seen from the above technical solutions, the present application discloses a wafer thinning device, which can monitor and adjust the tension of the synchronous belt in real time, ensure the transmission accuracy of the synchronous belt, and thus make the multi-station rotary table of the wafer thinning device have high positioning accuracy when the stations are switched, and ensure further wafer grinding and thinning accuracy. BRIEF DESCRIPTION OF DRAWINGS

[0028] The disclosure of the present application will be more apparent with reference to the accompanying drawings. It should be understood that the drawings are only for the purpose of illustration, and are not intended to limit the scope of protection of the present application. In the drawings:

[0029] Figure 1 is a plan view of an embodiment of the wafer thinning device according to the present application;

[0030] Figure 2Fig. 1 is a schematic diagram of a wafer thinning apparatus according to an embodiment of the present application;

[0031] Figure 3 Fig. 2 is a schematic diagram of a grinding unit of the wafer thinning apparatus according to an embodiment of the present application; Figure 2 Fig. 3 is a schematic diagram of an embodiment of a rotary transmission system of the grinding unit;

[0032] Figure 4 Fig. 4 is a schematic diagram of a longitudinal section of the rotary transmission system; and Figure 3

[0033] Fig. 5 is a schematic diagram of an embodiment of a tensioning motor control method of the wafer thinning apparatus according to the present application. Figure 5 Fig. 1 is a schematic diagram of a wafer thinning apparatus according to an embodiment of the present application; Fig. 2 is a schematic diagram of a grinding unit of the wafer thinning apparatus according to an embodiment of the present application; Fig. 3 is a schematic diagram of an embodiment of a rotary transmission system of the grinding unit; Fig. 4 is a schematic diagram of a longitudinal section of the rotary transmission system; and Fig. 5 is a schematic diagram of an embodiment of a tensioning motor control method of the wafer thinning apparatus according to the present application.

[0034] DETAILED DESCRIPTION

[0035] The structure, composition, features and advantages of the rotary transmission system, wafer thinning apparatus and control method thereof according to the present application will be described below in an exemplary manner with reference to the accompanying drawings and specific embodiments, however, all the descriptions should not be used to form any limitation on the present application.

[0036] For any single technical feature described or implied in the embodiments mentioned herein, or any single technical feature shown or implied in the drawings, the present application still allows any combination or deletion to be continued between these technical features (or their equivalents) without any technical obstacles, so it should be considered that more embodiments according to the present application are also within the scope of the description herein.

[0037] ​Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature.

[0038] Figure 1 This is a plan view of one embodiment of the wafer thinning apparatus according to this application.

[0039] As shown in the figure, the wafer thinning equipment 1 includes a front-end module 31, a polishing module 32, a grinding module 33, and a conveying component 34.

[0040] The front-end module 31 is used to realize the entry and exit of wafers, and is located at the front end of the wafer thinning equipment 1. The front-end module 31 is a transition module that realizes the transfer of wafers from the outside to the inside of the equipment base, and is used to realize the entry and exit of wafers.

[0041] The grinding module 33 is used to grind and thin the wafer. The grinding can include rough grinding and fine grinding. The grinding module 33 is, for example, located at the end of the wafer thinning equipment 1.

[0042] The grinding module 33 may include a grinding unit 35, a cleaning unit 36, and a grinding robot 37. The grinding unit 35 is used to perform wafer grinding and thickness measurement. Figure 1 As shown, the grinding unit 35 includes a base 3, a rotary table 39 mounted on the base 3, a worktable 40 disposed on the rotary table 39, and grinding wheels 41 corresponding to the positions of the worktable 40. The worktable 40 is used to support the wafer and can also be called a wafer support stage. The rotary table 39 can rotate around its vertical central axis to drive the worktable 40 to change positions. Figure 1 As shown, in one embodiment, the worktable 40 has three stations that can rotate between the coarse grinding station, the fine grinding station, and the loading and unloading station.

[0043] Two grinding wheels 41 perform rough grinding and fine grinding respectively. It is understandable that... Figure 1 This is just one example; the number of worktables 40 and grinding wheels 41 can also be other values. The cleaning unit 36 ​​can be used to clean, grind, and clean the wafers on the worktables 40. The grinding robot 37 is used to transfer wafers between the grinding unit 35 and the transport assembly 34. The grinding robot 37 picks up wafers from the transport assembly 34 and feeds them into the grinding unit 35 for grinding. After grinding and cleaning, the grinding robot picks up the wafers from the grinding unit 35 and places them in the transport assembly 34 for subsequent wafer transport. The grinding robot 37 has internal vacuum lines to achieve vacuum wafer adsorption. Alternatively, the grinding robot 37 can also be implemented by a mechanism with clamping wheels. In one embodiment, the grinding robot 37 can also rotate the wafers.

[0044] As Figure 1 shown in the figure, in one embodiment of the present application, the grinding module 33 can also include a cleaning device 42, which is installed on the base 3 of the grinding module 33, beside the rotary table 39 and on the moving track of the grinding robot 37, for cleaning the bottom surface of the wafer after grinding during the wafer transfer by the grinding robot 37.

[0045] The polishing module 32 is used for chemical mechanical polishing of the wafer after the grinding is completed, and also has the function of transporting the wafer between the three modules (the front-end module 31, the grinding module 33 and the polishing module 32), and the polishing module 32 is arranged between the front-end module 31 and the grinding module 33.

[0046] The conveying assembly 34 is located at the edge side of the polishing module 32 and is distributed along the length direction of the equipment, and can be connected to the front-end module 31 and the grinding module 33.

[0047] In the wafer processing process, the wafer is transported to the grinding module 33 for grinding through the conveying assembly 34 after being taken out from the front-end module 31; the wafer is carried to the polishing module 32 for polishing through the conveying assembly 34 and the polishing robot 27 after the grinding in the grinding module 33 is completed; after the polishing is completed, the wafer is sequentially transported to the cleaning system 28 and the drying system 29, and after being cleaned and dried, the wafer is conveyed back to the front-end module 31. The rear-end measuring device 30 and the like are also shown in the figure.

[0048] It can be understood that, Figure 1 the wafer thinning equipment shown in the figure is only an example, and in other implementations, the polishing module 32 can be omitted, and only the front-end module 31 and the grinding module 33 are retained, in addition, the grinding module 32 can also include multiple grinding, such as three, four, five and the like. Similar embodiments of these variations should fall within the protection scope of the present application as long as the wafer grinding thinning can be realized.

[0049] Figure 2 is a perspective view of a grinding unit of another embodiment of the wafer thinning equipment according to the present application.

[0050] As shown in the figure, the grinding unit can include a base 3, on which a multi-station rotary table 4, a grinding spindle 24 and a rotary transmission system 2 are arranged. The grinding unit in the figure is different from that in Figure 1 , specifically, in Figure 2 the example, the multi-station rotary table 4 is provided with four worktables 40, i.e. wafer carrying tables, while Figure 1 is shown as three worktables 40.

[0051] The grinding unit in this embodiment can be integrally installed on the base 3 of the wafer thinning device for wafer thinning. The multi-station rotary table 4 is installed on the base 3 and can be driven on the base 3 to rotate between the loading and unloading station and different grinding stations. As shown in the figure, three grinding stations are shown, corresponding to the positions of the three grinding spindles 24 in the figure. The loading and unloading station can be close to the grinding manipulator of the grinding module to facilitate the loading and unloading of the wafer. In the figure, the three grinding spindles 24 are provided with grinding wheels, which can grind the wafer when the worktable is in the grinding station.

[0052] As shown in the figure, two of the three grinding spindles 24 of the grinding unit are arranged side by side at the end of the base, and the other grinding spindle is arranged at the opposite end. The rotary transmission system 2 is arranged on the base 3 between the two grinding spindles at the end. The rotary transmission system 2 can include a rotary motor 6, a speed reducer 7, and a synchronous belt 5, which can be wound around the outer periphery of the multi-station rotary table 4 or the outer periphery of the rotating shaft at the bottom of the multi-station rotary table 4. The rotary motor 6 drives the synchronous belt 5 through the speed reducer 7, and the synchronous belt 5 drives the multi-station rotary table 4 to rotate, realizing the rotation of the station, i.e. the rotation. The rotary motor 6 can be a servo motor.

[0053] In Figure 2 The cleaning unit, grinding manipulator, etc. that can be arranged on the base 3 of the grinding unit are omitted, and these devices can be arranged on the base according to the needs in the specific implementation.

[0054] Figure 3 For Figure 2 The perspective view of an embodiment of the rotary transmission system of the grinding module. Figure 4 Is Figure 3 The longitudinal section view of the rotary transmission system in the embodiment. In combination with Figure 3 And Figure 4 It is easier to understand the structure, working principle, function, etc. of the rotary transmission system.

[0055] As shown in the figure, the rotary transmission system 2 can include a synchronous belt 5 for driving the multi-station rotary table 4 to rotate, a driving assembly for driving the synchronous belt 5, and a tensioning device configured to control the tension of the synchronous belt in real time. Specifically, the driving assembly includes a rotary motor 6, a speed reducer 7, and a pulley 9 connected to the output shaft 8 of the speed reducer, the synchronous belt 5 is sleeved on the pulley 9 of the output shaft 8 of the speed reducer, and the rotary motor 6 is configured to drive the synchronous belt 5 through the speed reducer 7 and the pulley 9. The tensioning device includes a slide plate seat 26 fixed on the base 3 and a slide plate 10 slidably mounted on the slide plate seat 26. The rotary motor 6 and the speed reducer 7 are arranged on the slide plate 10 and can move with the slide plate 10. Under the action of the tensioning motor 14 driving the lead screw 15, the movement of the slide plate 10 can drive the rotary motor 6, the speed reducer 7 and the pulley 9 to move close to or away from the multi-station rotary table 4, so as to adjust the tension of the synchronous belt 5. Such a rotary transmission system 2 can adjust the tension of the synchronous belt during the operation of the wafer thinning equipment and after the wafer thinning equipment is operated for a long time, which is beneficial to the correct rotation of the rotary table and improves the processing reliability of the wafer thinning equipment.

[0056] In Figure 2 , the slide plate seat 26 remains fixed, and the tensioning pulley seat 19 remains fixed relative to the slide plate seat 26. Both can be fixed on the base 3 at the same time. The multi-station rotary table 4 is also fixed on the base 3, and as described above, the multi-station rotary table 4 can rotate on the base 3 to rotate the stations. In order to make the rotary transmission system 2 more clear, the station rotary table 4 is not shown in the figure, but the position of the multi-station rotary table 4 can be judged from the expanded profile of the synchronous belt 5 extending between the first tensioning pulley 11 and the second tensioning pulley 12. The synchronous belt 5 extending outwardly between the first tensioning pulley 11 and the second tensioning pulley 12 is wrapped on the outer circumferential side of the multi-station rotary table 4, and almost wraps the entire circumference of the multi-station rotary table 4, so that the synchronous belt 5 can tightly wrap the multi-station rotary table 4 to prevent the synchronous belt 5 from accidentally detaching from the multi-station rotary table 4.

[0057] The first tensioning pulley 11 and the second tensioning pulley 12 of the tensioning device are used to tighten the synchronous belt 5, and then the synchronous belt 5 passes through the first tensioning pulley 11 and the second tensioning pulley 12 from between the first tensioning pulley 11 and the second tensioning pulley 12 and wraps on the pulley 9 on the output shaft 8 of the speed reducer. The first tensioning pulley 11 and the second tensioning pulley 12 abut against the outer side of the synchronous belt 5, and the synchronous belt 5 wraps the pulley 9 with its inner side. The "inner side" refers to the side of the synchronous belt 5 in contact with the outer circumferential side of the multi-station rotary table 4, and the "outer side" refers to the side of the synchronous belt 5 facing away from the multi-station rotary table 4.

[0058] The rotary motor 6 and the speed reducer 7 can be vertically mounted to the slide plate 10. As Figure 4As shown, the rotary motor 6 is vertically connected to the reducer 7, and the output shaft of the rotary motor 6 extends downward. Similarly, the reducer 7 is vertically fixed to the slide 10, and the output shaft 8 of the reducer extends downward through the slide 10, such that the pulley 9 on the output shaft 8 is located below the slide 10, and the synchronous belt 5 is wound around the pulley 9 below the slide 10. Figure 2 and Figure 3 It is understandable that an extension groove 25 is provided on the upper part of the slide seat 26. When the slide 10 drives the rotary motor 6 and the reducer 7 to move along the slide seat 26, the pulley 9 and the timing belt 5 can move within the extension groove 25 to provide movement space for the pulley 9 when adjusting the tension of the timing belt 5 and avoid movement interference.

[0059] A guide rail groove structure 16 is connected between the slide 10 and the slide seat 26. The first end of the guide rail groove structure 16 is close to the multi-station rotary table 4, and the second end of the guide rail groove structure 16 is away from the multi-station rotary table 4. Thus, when the slide 10 moves on the slide seat 26, the distance between the pulley 9 and the multi-station rotary table 4 is adjusted, thereby controlling the tension of the synchronous belt. It should be understood that, in the preferred embodiment, the pulley 9 moves in the radial direction of the multi-station rotary table 4, that is, its moving direction passes through the center of the multi-station rotary table 4, and the sliding direction of the slide plate 10, the extension direction of the guide rail groove structure 16, and the lead screw 15 are parallel to the moving direction of the pulley 9. The synchronous belt 15 between the pulley 9 and the first tensioning wheel 11 and the second tensioning wheel 12 is parallel to the moving direction of the pulley 9, so that the synchronous belt 15 is symmetrical about the moving direction of the pulley 9, making the synchronous belt 15 more evenly stressed, avoiding uneven wear, and the tension generated by the pulley 9 on the synchronous belt 15 can be directly transmitted to the synchronous belt 15, without the tension generated by the pulley 9 on the synchronous belt 15 being only partially used for tensioning the synchronous belt 15 due to the skewness of the synchronous belt 15.

[0060] like Figure 2 and 3 As shown, the guide rail and slide groove structure 16 includes two guide rails located on both sides of the lead screw 15 and parallel to the lead screw 15, and two slide grooves that respectively cooperate with the two slide rails. For example, guide rails are respectively provided on both sides of the upper surface of the base 3. The two guide rails are parallel, with one end close to the first tensioning pulley 11 and the second tensioning pulley 12, and the other end away from the first tensioning pulley 11 and the second tensioning pulley 12. Thus, when the slide 10 moves away from the multi-station rotary table 4 along the guide rails, the pulley 9 can tension the synchronous belt 5. Cooperating with the guide rails, a slide groove is formed on the lower surface of the slide 10. The slide groove cooperates with the guide rails, allowing the slide 10 to slide on the slide seat 26. In the illustrated example, the extending direction of the guide rails and slide grooves can be parallel to the extending direction between the first tensioning pulley 11 and the second tensioning pulley 12, or towards the rotation center direction of the multi-station rotary table 4.

[0061] In alternative embodiments, other mechanical guiding mechanisms can be used instead of the rail and slot structure.

[0062] Also as Figure 3 The tensioning motor 14 is connected to the end of the platen 26 through the motor base 13, the output shaft 20 of the tensioning motor is connected to the lead screw 15 through the coupling 18, the lead screw 15 is engaged with the nut 21, and the nut 21 can be fixed to the platen 10 through screws. For example, a receiving hole can be provided in the platen 10, the nut 21 extends into the receiving hole, and a gap fit with the nut can be configured. After the tensioning motor 14 is started, the output shaft 20 of the tensioning motor drives the lead screw 15 to rotate, the lead screw 15 pulls the platen 10 through the nut 21, and the platen 10 slides on the platen 26, thereby tensioning the synchronous belt 5. The tensioning motor 14 can be a servo motor, which can feed back a current signal and / or a torque signal for control. For example, the tensioning motor can receive feedback signals of the tensioning force sensor and the servo motor sensor, and control the tensioning motor based on the feedback signals. The specific control method can be seen from the description of the tensioning force sensor and the servo motor sensor.

[0063] As can be seen from the figure, the motor base 13 is a Z-shaped plate. The Z-shaped plate includes two end plates, which are a first end plate and a second end plate, and a middle connecting plate between the first end plate and the second end plate. The first end plate of the Z-shaped plate is connected to the end face of the platen 26, the second end plate of the Z-shaped plate is used to fix the tensioning motor 14, the middle connecting plate extends horizontally along the sliding direction of the platen 10, the first end plate extends vertically downward from the end of the middle connecting plate toward the platen 26, and the second end plate extends vertically upward from the end of the middle connecting plate away from the platen 26.

[0064] The output shaft 20 of the tensioning motor passes through the second end plate of the Z-shaped plate, and the tensioning motor 14 and the coupling 18 are located on the two sides of the second end plate, respectively. The middle connecting plate of the Z-shaped plate is provided with a lead screw bracket 17, and the end of the lead screw 15 connected to the coupling 18 passes through the lead screw bracket and is kept in place by the lead screw bracket 17. In addition, the middle connecting plate and the first end plate of the Z-shaped plate are lower than the platen 10 and lower than the nut 21, so that the platen 10 does not interfere with the Z-shaped plate when it moves close to the Z-shaped plate.

[0065] To measure the tension of the synchronous belt 5, a tension sensor 22 can be provided at one or both of the first and second tension pulleys 11, 12, as shown in the figure, which can be in communication with a machine interface (not shown) of the wafer thinning apparatus 1 and the tension motor 14. The tension sensor 22 can be provided with a preset value of tension, and if the tension sensor measures that the tension of the synchronous belt 5 reaches the preset value, a signal is transmitted to the machine interface to display normal at the machine interface of the wafer thinning apparatus 1; if the tension of the synchronous belt 5 exceeds or does not reach the preset value, the tension sensor 22 feeds back a signal to the tension motor 14, and the tension motor 14 stretches or contracts the synchronous belt 5 by transmission to make it reach the preset value.

[0066] A servo motor sensor (not shown) can be provided at the tension motor 14 to monitor the elongation of the synchronous belt 5. For example, the servo motor sensor can be a displacement sensor. The displacement sensor can be provided with a preset value of elongation, which monitors the elongation of the synchronous belt 5 in real time, and when the elongation of the synchronous belt 5 reaches the preset value, the machine interface prompts to replace the synchronous belt 5; when the elongation of the synchronous belt 5 does not reach the preset value, it continues to be monitored. Here, when the elongation reaches the preset value, it is considered that the synchronous belt has reached the fatigue limit, and a warning can be given to maintain the synchronous belt.

[0067] In addition, when the monitored value of the tension sensor changes suddenly, it is determined that the synchronous belt 5 is damaged or abnormal, and an alarm prompt can be given in time to avoid unnecessary dangerous situations.

[0068] In an optional embodiment, the tension and elongation can be monitored double, making the system more secure and reliable.

[0069] Figure 5 A flowchart of an embodiment of a tension motor control method for a wafer thinning apparatus according to the present application.

[0070] The rotary transmission system of the present application can have a control device (not shown). The control device can receive feedback signals from the tension sensor and the tension motor sensor, and control the tension motor or issue an alarm according to the feedback signals from the tension sensor and the tension motor sensor.

[0071] As described above, the tension sensor is used to measure the tension of the synchronous belt. When the tension is abnormal, the tension of the synchronous belt can be adjusted by the tension motor. Specifically, the tension sensor feeds back a tension signal to the control device, and the control device controls the tension motor 14 to adjust the tension of the synchronous belt 5 according to the tension signal. The tension motor sensor (not shown) is used to measure the elongation of the synchronous belt, and when the elongation is abnormal, the synchronous belt can be considered for replacement.

[0072] In combination withFigure 5 It can be understood that one embodiment of the wafer thinning motor or rotary transmission system can be controlled by a control device, and the control method can include steps I to III. Steps I to III can be performed in real time.

[0073] Step I: Monitor whether the tension of the synchronous belt is suddenly changed. If yes, it is determined that the synchronous belt is damaged, and an alarm prompt is sent by the machine interface of the wafer thinning device.

[0074] The sudden change of the tension of the synchronous belt can be monitored by the tension sensor. Based on the sudden change of the tension of the synchronous belt, it can be determined that the synchronous belt has been damaged, and an alarm prompt can be sent by the machine interface of the wafer thinning device to warn the abnormality of the synchronous belt. When no sudden change of the tension is monitored, the tension value of the synchronous belt can also be continuously monitored, as described in step II.

[0075] Step II: Monitor whether the tension of the synchronous belt is a preset value. If yes, the machine interface displays that the synchronous belt is normal, otherwise the tension motor stretches or releases the synchronous belt to reach the preset value.

[0076] The synchronous belt needs to work under appropriate tension to work in the best state without accelerated fatigue wear or slipping. Therefore, in this step, it is monitored and determined whether the tension of the synchronous belt is a preset value. When the tension of the synchronous belt is a preset value, the machine interface displays that the synchronous belt is normal; when the tension of the synchronous belt is not a preset value, the tension motor stretches or releases the synchronous belt to reach the preset value.

[0077] Step III: Based on the feedback information of the tension motor sensor, it is monitored in real time whether the elongation of the synchronous belt is a preset value. If yes, the machine interface prompts to replace the synchronous belt, otherwise the rotary transmission system operates normally.

[0078] The tension motor sensor is used to monitor the elongation of the synchronous belt. Based on the feedback information of the tension motor sensor, the elongation of the synchronous belt is calculated to determine whether the elongation of the synchronous belt is a preset value. If the elongation of the synchronous belt does not reach the preset value, the rotary transmission system operates normally; if the elongation of the synchronous belt reaches the preset value, the machine interface prompts to replace the synchronous belt, and the specific prompt mode can be to display "replace the synchronous belt" on the machine interface.

[0079] Because the rotary table of the wafer thinning device has a large diameter, a heavy mass, and a high positioning accuracy, the requirements for the synchronous belt are relatively high. In addition to high requirements for the accuracy and quality of the synchronous belt itself, the tension of the synchronous belt is also particularly important. As can be seen from the above embodiments, by monitoring and controlling the tension and elongation of the synchronous belt, the rotary transmission system can be maintained in safe and stable operation.

[0080] The various embodiments in the specification are described in progressive manner, and each embodiment focuses on the difference from other embodiments, and the same or similar parts between the embodiments can be mutually referred to.

[0081] Although the optional embodiments of the present application have been described, those skilled in the art can make further changes and modifications to the embodiments once they know the basic inventive concept. Therefore, the additional claims are intended to cover the optional embodiments and the changes and modifications falling within the scope of the embodiments of the present application.

[0082] In this document, such as "comprising", "containing" or any other variant, is intended to cover non-exclusive inclusion, so that the process, method, article or other terminal device including a series of elements not only includes those elements, but also includes other elements not explicitly listed, and the elements fixed for such process, method, article and terminal device. Without more limitations, the element defined by the statement "including a" does not exclude the existence of other same elements in the process, method, article or terminal device including the element.

[0083] The above describes the technical solutions provided by the present application in detail, and the principle and implementation mode of the present application are described by applying specific examples; the above embodiment description is only for helping to understand the method and core idea of the present application; at the same time, for those skilled in the art, according to the idea of the present application, the specific implementation mode and application range will be changed, and the above description of the specification should not be understood as the limitation of the present application.

Claims

1. A wafer thinning device, characterized in that, The wafer thinning device (1) comprises a grinding module, the grinding module comprises a base (3), a multi-station rotary table (4), the multi-station rotary table (4) is rotatably arranged on the base (3) through a rotary transmission system (2); the rotary transmission system (2) comprises: A synchronous belt (5) configured to drive the multi-station rotary table (4) to rotate; A driving assembly configured to drive the synchronous belt (5); and A tensioning device configured to control the tensioning of the synchronous belt (5) in real time.

2. The wafer thinning apparatus of claim 1, wherein, The driving assembly comprises a rotary motor (6), a speed reducer (7) and a pulley (9) connected to the output shaft (8) of the speed reducer, the rotary motor (6) is configured to drive the synchronous belt (5) through the speed reducer (7) and the pulley (9).

3. The wafer thinning apparatus of claim 2, wherein, The tensioning device comprises a slide plate seat (26) fixed on the base (3) and a slide plate (10) slidably mounted on the slide plate seat (26), the rotary motor (6) and the speed reducer (7) are arranged to the slide plate (10) and can move with the slide plate (10), the slide plate (10) can be controlled to slide away from the multi-station rotary table (4) to tension the synchronous belt (5) through the pulley (9).

4. The wafer thinning apparatus of claim 3, wherein, The rotary motor (6) is located above the speed reducer (7), the speed reducer (7) passes through the slide plate (10) downwardly so that the output shaft (8) of the speed reducer is located below the slide plate (10), and the pulley (9) is sleeved to the output shaft (8) of the speed reducer.

5. The wafer thinning apparatus according to any one of claims 2 to 4, wherein The rotary transmission system (2) comprises a first tensioning wheel (11) and a second tensioning wheel (12) arranged between the pulley (9) and the multi-station rotary table (4), the first tensioning wheel (11) and the second tensioning wheel (12) are arranged on both sides of the pulley (9) respectively, the synchronous belt (5) is wrapped around the pulley (9) on its inner side, and the first tensioning wheel (11) and the second tensioning wheel (12) abut against the outer side of the synchronous belt (5).

6. The wafer thinning apparatus of claim 5, wherein, The distance between the first tensioning wheel (11) and the second tensioning wheel (12) is arranged so that the synchronous belt (5) is parallel on both sides of the pulley (9).

7. The wafer thinning apparatus of claim 5, wherein, The first tensioning wheel (11) and the second tensioning wheel (12) are fixed in parallel to a tensioning wheel seat (19), and the tensioning wheel seat (19) is fixed to the base (3).

8. The wafer thinning apparatus of claim 3, wherein, The end of the slide plate seat (26) facing away from the multi-station rotary table (4) is provided with a motor seat (13), the motor seat (13) is provided with a tensioning motor (14), the tensioning motor (14) is connected through a lead screw (15) and controls the sliding of the slide plate (10).

9. The wafer thinning apparatus of claim 8, wherein, The motor base (13) is a Z-shaped plate, which comprises a first end plate, a second end plate and an intermediate connecting plate between the first end plate and the second end plate, the first end plate is connected to the end face of the slide plate base (26), the second end plate is used for fixing the tensioning motor (14), the intermediate connecting plate extends horizontally along the sliding direction of the slide plate (10), the first end plate extends vertically downward from the end of the intermediate connecting plate which is towards the slide plate base (26), and the second end plate extends vertically upward from the end of the intermediate connecting plate which is away from the slide plate base (26).

10. The wafer thinning apparatus of claim 9, wherein, A screw rod bracket (17) is arranged on the intermediate connecting plate of the motor base (13), the screw rod (15) is supported by the screw rod bracket (17) and connected to the output shaft (20) of the tensioning motor through a shaft coupling (18).

11. The wafer thinning apparatus of claim 10, wherein, The output shaft (20) of the tensioning motor passes through the first end plate, and the tensioning motor (14) and the shaft coupling (18) are respectively located on the two sides of the first end plate.

12. The wafer thinning apparatus of claim 8, wherein, The slide plate (10) and the slide plate base (26) are connected through a guide rail and sliding groove structure (16), the first end of the guide rail and sliding groove structure (16) is close to the multi-station rotary table (4), the second end of the guide rail and sliding groove structure (16) is away from the multi-station rotary table (4), and the guide rail and sliding groove structure (16) comprises two guide rails which are located on the two sides of the screw rod (15) and parallel to the screw rod (15) and two sliding grooves which are matched with the two guide rails respectively.

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