Polishing equipment for silicon wafer manufacturing
By introducing a limiting cylinder, a guide trough, a guide frame, and a blowing assembly into the polishing equipment, the problem of flying debris during mechanical polishing is solved, achieving dual protection for equipment precision and worker health.
Patent Information
- Application Number
- CN202520312798.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-26
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-02-26
AI Technical Summary
During the mechanical polishing of silicon wafers, flying debris causes problems such as decreased equipment precision and health hazards to workers.
A polishing device for silicon wafer manufacturing was designed, which adopts a combination structure of limiting cylinder, guide trough, guide frame, collection component and blowing component. Polishing debris is collected through guide trough and guide pipe, and the blowing component guides the debris into the collection cylinder for sedimentation and collection.
It effectively avoids the accumulation of polishing debris in the gaps between equipment, protecting the precision and service life of the equipment, while preventing the debris from scattering and harming the health of workers.
Smart Images
Figure CN223876764U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the technical field of silicon wafer polishing, and particularly relates to a polishing equipment for silicon wafer manufacturing. BACKGROUND
[0002] Semiconductor silicon wafer is the main substrate material of modern ultra large scale integrated circuit, and is generally manufactured by processes such as crystal pulling, slicing, chamfering, wafer grinding (including grinding and polishing), etching, and polishing cleaning. Polishing is the final processing procedure of the silicon wafer, and the polished surface is required to have lattice integrity, high flatness, and cleanliness. A surface without processing metamorphic layer can be obtained by using mechanical and chemical polishing method. First, the silicon wafer surface is generally polished by a mechanical polishing disc, and then the final polishing is perfected by chemical polishing, so that the outer surface of the silicon wafer is smooth.
[0003] During the mechanical polishing of the silicon wafer by the mechanical polishing disc, a large amount of debris is generated. During the polishing process, the debris flies in the polishing site. On the one hand, the debris enters the gap of the polishing equipment, affecting the polishing accuracy and long service life of the polishing equipment. On the other hand, the debris is easily inhaled by the workers on site, causing physical harm.
[0004] Therefore, it is necessary to invent a polishing equipment for silicon wafer manufacturing to solve the above problems. SUMMARY
[0005] To solve the problems in the prior art, the polishing equipment for silicon wafer manufacturing is provided to solve the problem that a large amount of debris is generated during the mechanical polishing of the silicon wafer by the mechanical polishing disc, and the debris flies in the polishing site during the polishing process. On the one hand, the debris enters the gap of the polishing equipment, affecting the polishing accuracy and long service life of the polishing equipment. On the other hand, the debris is easily inhaled by the workers on site, causing physical harm.
[0006] To achieve the above object, the utility model adopts the following technical scheme:
[0007] The polishing equipment for silicon wafer manufacturing comprises a support plate, a limiting cylinder arranged at the center of the top surface of the support plate, a disc arranged in the limiting cylinder and longitudinally slidable along the inner wall of the limiting cylinder, a polishing disc arranged above the limiting cylinder and longitudinally slidable into the limiting cylinder, and the polishing disc is rotatable. A plurality of side material guiding grooves are arranged on the side wall of the limiting cylinder. A material guiding frame is detachably installed at each position of the side material guiding grooves on the outer side wall of the limiting cylinder. A collecting assembly for guiding and collecting the polishing debris is detachably installed at the center of the bottom surface of the support plate. The material guiding frame and the collecting assembly are detachably connected through a material guiding pipe.
[0008] As a preferred scheme of the utility model, the collecting assembly comprises a cylinder detachably installed at the center of the bottom surface of the support plate, an inclined cylinder installed at the bottom end of the cylinder and a collecting cylinder installed at the bottom end of the inclined cylinder, the cylinder is internally installed with a blowing assembly, the blowing assembly can generate wind blowing into the inclined cylinder, and the collecting cylinder is internally installed with water capable of collecting and settling the debris.
[0009] As a preferred scheme of the utility model, the center of the bottom surface of the support plate is provided with a mounting disc, the top end of the cylinder is detachably installed with the bottom end of the mounting disc, and the material guide pipe longitudinally penetrates through the support plate and is detachably connected with the circumferential sidewall of the cylinder.
[0010] As a preferred scheme of the utility model, the circumferential sidewall of the limiting cylinder is provided with a plurality of bases, the top end of the base is installed with an elastic piece capable of longitudinal expansion and contraction, the abutting disc is installed between the top ends of the plurality of elastic pieces, and the elastic piece is sleeved with a spring.
[0011] As a preferred scheme of the utility model, the top surface of the support plate is installed with a telescopic piece capable of longitudinal expansion and contraction at each of the four corners, a cross jib is detachably connected between the top ends of the plurality of telescopic pieces, the bottom end of the cross jib is installed with a driving piece capable of driving the polishing disc to rotate, and the polishing disc is installed at the output end of the driving piece.
[0012] As a preferred scheme of the utility model, the diameter of the polishing disc is smaller than the inner diameter of the limiting cylinder, and the diameter of the abutting disc is consistent with the inner diameter of the limiting cylinder.
[0013] In the above technical scheme, the utility model provides technical effects and advantages:
[0014] In the utility model, the silicon wafer is placed on the abutting disc in the limiting cylinder, then the polishing disc longitudinally slides into the limiting cylinder and mechanically polishes the silicon wafer through the rotation of the polishing disc, in the polishing process, the blowing assembly in the collecting assembly generates wind into the inclined cylinder, so that the debris in the limiting cylinder enters the material guide frame through the side material guide groove and enters the collecting assembly through the material guide pipe, and then is collected by the collecting assembly, thereby avoiding the debris generated in the polishing process from flying out of the limiting cylinder and flying in the polishing site, that is, avoiding the debris from entering the gap of the polishing equipment to affect the polishing precision and long service life of the polishing equipment, on the other hand, the debris can be avoided from being inhaled by the workers on site to cause physical harm. BRIEF DESCRIPTION OF DRAWINGS
[0015] Figure 1 It is the whole structure schematic view of the utility model;
[0016] Figure 2 It is the front view structure schematic view of the utility model;
[0017] Figure 3 It is the utility modelFigure 2 Cross-sectional structure schematic view at A-A.
[0018] Reference signs:
[0019] 1, support plate; 2, limiting cylinder; 3, telescopic part; 4, cross jacking frame; 5, driving part; 6, polishing disc; 7, base; 8, elastic part; 9, spring; 10, stop disc; 11, side material guiding groove; 12, material guiding frame; 13, mounting disc; 14, cylinder; 15, inclined cylinder; 16, collecting cylinder; 17, air blowing assembly; 18, material guiding pipe. DETAILED DESCRIPTION
[0020] The utility model will be further described below with reference to the drawings. The following examples are only used to more clearly illustrate the technical scheme of the utility model, and cannot limit the protection scope of the utility model.
[0021] The utility model provides a kind of polishing equipment for silicon wafer manufacturing as Figures 1-3 As shown in a kind of polishing equipment for silicon wafer manufacturing, including support plate 1, be located in the center of support plate 1 top face limiting cylinder 2, be located in limiting cylinder 2 and can be longitudinally slid along the inner wall of limiting cylinder 2 stop disc 10 and be located in the upper of limiting cylinder 2 and can be longitudinally slid and enter into limiting cylinder 2 inside polishing disc 6, and polishing disc 6 can rotate, limiting cylinder 2 side wall is equipped with multiple side material guiding grooves 11, limiting cylinder 2 outer circumferential side wall is detachably installed with material guiding frame 12 at each side material guiding groove 11 position, the bottom surface center of support plate 1 is detachably installed with the collection assembly that can guide and collect polishing debris, material guiding frame 12 and collection assembly are detachably connected by material guiding pipe 18, since stop disc 10 can be longitudinally elastically slid in limiting cylinder 2, avoid polishing disc 6 to press too much to cause silicon wafer surface damage.
[0022] Collection assembly includes that the bottom surface center of support plate 1 is detachably installed with cylinder 14, is installed with inclined cylinder 15 at the bottom end of cylinder 14 and is installed with collecting cylinder 16 at the bottom end of inclined cylinder 15, cylinder 14 is installed with air blowing assembly 17, air blowing assembly 17 can produce the wind that blows to inclined cylinder 15, collecting cylinder 16 is loaded with water that can collect debris by sedimentation, since air blowing assembly 17 can produce the wind to inclined cylinder 15, that is, can produce downward absorption airflow in passageway, and then the polishing debris generated in limiting cylinder 2 is absorbed into collecting cylinder 16 by side material guiding groove 11, material guiding frame 12, material guiding pipe 18 and cylinder 14.
[0023] The bottom surface center of support plate 1 is equipped with mounting disc 13, the top end of cylinder 14 is detachably installed with the bottom end of mounting disc 13, material guiding pipe 18 longitudinally penetrates support plate 1 and is detachably connected with the circumferential side wall of cylinder 14, and mounting disc 13 can provide the installation bearing of cylinder 14 on the bottom surface of support plate 1.
[0024] A plurality of seats 7 are arranged on the inner circumferential side wall of the limiting cylinder 2, and a longitudinal elastic member 8 is arranged on the top end of the seat 7, and a pressing disc 10 is arranged between the top ends of the plurality of elastic members 8, and the elastic member 8 is sleeved with a spring 9, and in the process of pressing the silicon wafer downward by the polishing disc 6, the elastic member 8 can automatically expand and contract longitudinally and drive the spring 9 to synchronously elastically contract, thereby avoiding the damage to the surface of the silicon wafer caused by the excessive pressing of the polishing disc 6.
[0025] The support plate 1 is provided with a longitudinal telescopic telescopic member 3 at the top of each corner, and a cross top frame 4 is detachably arranged between the top ends of the plurality of telescopic members 3, and a driving member 5 for driving the polishing disc 6 to rotate is arranged at the bottom end of the cross top frame 4, and the polishing disc 6 is arranged on the output end of the driving member 5, and the telescopic member 3 is longitudinally telescopic, thereby moving the polishing disc 6 into the limiting cylinder 2 and polishing the silicon wafer.
[0026] The diameter of the polishing disc 6 is smaller than the inner diameter of the limiting cylinder 2, and the diameter of the pressing disc 10 is consistent with the inner diameter of the limiting cylinder 2, and the diameter of the polishing disc 6 is smaller than the inner diameter of the limiting cylinder 2, so that the side wall of the polishing disc 6 is prevented from contacting the inner side wall of the limiting cylinder 2, thereby avoiding the damage to the side wall of the polishing disc 6 and the limiting cylinder 2.
[0027] In the utility model, the silicon wafer is placed on the pressing disc 10 in the limiting cylinder 2, and then the polishing disc 6 is longitudinally slid into the limiting cylinder 2 and rotates to mechanically polish the silicon wafer, and in the polishing process, the air blowing assembly 17 in the collecting assembly generates air into the inclined cylinder 15, thereby enabling the debris in the limiting cylinder 2 to enter the guide frame 12 through the side guide chute 11 and enter the collecting assembly through the guide pipe 18, thereby being collected by the collecting assembly, thereby avoiding the debris generated in the polishing process from flying out of the limiting cylinder 2 and flying in the polishing site, that is, avoiding the debris from entering the gap of the polishing equipment and affecting the polishing precision and long service life of the polishing equipment, and on the other hand, the debris can be prevented from being inhaled by the workers on site and causing physical harm.
[0028] The above is only the preferred embodiment of the utility model, and it should be pointed out that for ordinary skilled persons in the technical field, some improvements and deformations can be made without departing from the technical principles of the utility model, and these improvements and deformations should be regarded as the protection range of the utility model.
Claims
1. A polishing device for silicon wafer manufacturing, characterized in that: The utility model provides a polishing device, including support board (1), the limiting cylinder (2) of support board (1) top surface center, be located in limiting cylinder (2) and can along the longitudinal sliding of limiting cylinder (2) inner wall and enter the polishing disc (6) of limiting cylinder (2) just above and can longitudinal sliding, and the polishing disc (6) can rotate, the limiting cylinder (2) side wall is equipped with a plurality of side material guide groove (11), the limiting cylinder (2) outer side wall is detachably installed with material guide frame (12) at every side material guide groove (11) position, the bottom surface center of support board (1) is detachably installed with the collection assembly that can guide and collect polishing debris, and the material guide pipe (18) is detachably connected between material guide frame (12) and collection assembly.
2. The polishing apparatus for manufacturing a silicon wafer according to claim 1, wherein: The collection assembly includes a cylinder (14) detachably installed at the bottom center of the support plate (1), an inclined cylinder (15) installed at the bottom end of the cylinder (14), and a collection cylinder (16) installed at the bottom end of the inclined cylinder (15). The cylinder (14) is provided with a blowing assembly (17) installed therein, which can generate wind blowing into the inclined cylinder (15). The collection cylinder (16) is provided with water for sedimentation and collection of debris.
3. The polishing apparatus for manufacturing a silicon wafer according to claim 2, wherein: The bottom center of the support plate (1) is provided with a mounting disc (13), and the top end of the cylinder (14) is detachably installed with the bottom end of the mounting disc (13). The material guide pipe (18) longitudinally penetrates the support plate (1) and is detachably connected with the peripheral side wall of the cylinder (14).
4. The polishing apparatus for manufacturing a silicon wafer according to claim 1, wherein: The inner peripheral side wall of the limiting cylinder (2) is provided with a plurality of bases (7), the top end of the base (7) is provided with an elastic member (8) which can longitudinally extend and retract, the abutting disc (10) is installed between the top ends of a plurality of elastic members (8), and the elastic member (8) is sleeved with a spring (9).
5. The polishing apparatus for manufacturing a silicon wafer according to claim 1, wherein: The top surface of the support plate (1) is provided with a plurality of telescopic members (3) at the four corners, and a cross jacking frame (4) is detachably installed between the top ends of the telescopic members (3). The bottom end of the cross jacking frame (4) is provided with a driving member (5) which can drive the polishing disc (6) to rotate. The polishing disc (6) is installed at the output end of the driving member (5).
6. The polishing apparatus for manufacturing a silicon wafer according to claim 1, wherein: The diameter of the polishing disc (6) is smaller than the inner diameter of the limiting cylinder (2), and the diameter of the abutting disc (10) is consistent with the inner diameter of the limiting cylinder (2).