Metallic bond sintering grinding rod
By setting heat dissipation rings and grooves on the sintered grinding rod and utilizing the design of the copper base block, the problem of poor heat dissipation of the substrate is solved, achieving efficient heat dissipation and waste management of the grinding rod, extending the service life of the grinding rod and improving safety.
Patent Information
- Application Number
- CN202422942296.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-30
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2034-11-30
AI Technical Summary
The substrate of existing sintered grinding rods has poor heat dissipation, which leads to severe wear of the abrasive and a shortened service life.
A heat dissipation ring is set on the surface of the substrate rod and a heat dissipation groove is set inside. A copper base block is fixedly connected to the bottom of the coupling seat. The conical design of the copper base block and the chip removal groove structure are used to achieve rapid heat dissipation and chip removal.
It improves the heat dissipation efficiency of the grinding rod, extends its service life, enhances the bonding strength between the abrasive and the substrate, prevents abrasive shedding and waste accumulation, and improves safety.
Smart Images
Figure CN223876827U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to sintered abrasive stick technical field, concretely relates to a metal bond sintered abrasive stick. BACKGROUND
[0002] The development of manufacturing industry and the development of grinding technology complement each other. Composite grinding materials are widely used in aerospace, automobile, oil drilling, construction engineering, machining, military industry and other industries, especially in the field of geological mining and ore processing, diamond abrasive stick plays an irreplaceable role.
[0003] The sintered abrasive stick in the prior art includes abrasive and base material, the abrasive is mostly installed at the bottom end of the base material through the hot-pressing sintering mode, when grinding, the friction between the abrasive and the product generates heat, the heat dissipation effect of the traditional abrasive stick base material is poor, if the heat dissipation is not in time, the abrasive will be abraded, and the service life of the abrasive stick is reduced.
[0004] Therefore, how to provide a metal bond sintered abrasive stick to solve the problems existing in the prior art is of great significance to its application. UTILITY MODEL CONTENT
[0005] Therefore, the purpose of the present application is to provide a metal bond sintered abrasive stick to solve the problems in the prior art that the sintered abrasive stick includes abrasive and base material, the abrasive is mostly installed at the bottom end of the base material through the hot-pressing sintering mode, when grinding, the friction between the abrasive and the product generates heat, the heat dissipation effect of the traditional abrasive stick base material is poor, if the heat dissipation is not in time, the abrasive will be abraded, and the service life of the abrasive stick is reduced.
[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:
[0007] A metal bond sintered abrasive stick, comprising a base material rod body and an abrasive, the bottom end of the base material rod body is fixedly connected with a bonding bottom ring, the middle part of the bottom end of the bonding bottom ring is fixedly connected with a bonding seat, the abrasive is hot-pressing sintering connected around the bonding seat, the bottom end of the abrasive is provided with a chip removal groove, the surface of the base material rod body is equidistantly provided with a plurality of heat dissipation rings, the inside of the base material rod body is provided with a heat dissipation groove, and the bottom end of the heat dissipation groove penetrates the bonding bottom ring and extends to the inside of the bonding seat.
[0008] Preferably, the bottom end of the bonding seat is fixedly connected with a copper base block through a fixed screw.
[0009] Preferably, the shape of the copper base block is conical.
[0010] Preferably, the bottom end of the copper base block is a sharp end, and the height of the sharp end is level with the height of the chip removal groove.
[0011] Preferably, the inner wall of the heat dissipation groove is provided with vertical heat dissipation strips.
[0012] Compared with the prior art, the utility model has the beneficial effects that:
[0013] 1、 the utility model discloses a plurality of heat dissipation rings are arranged on the surface of the base material rod body, when the grinding bar rotates, external airflow can pass through the surface of the heat dissipation ring quickly, and the heat generated when the abrasive rubs is transferred to the heat dissipation ring through the combination of the bottom ring and the base material rod body, thereby realizing rapid heat dissipation and improving the service life of the grinding bar.
[0014] 2、 the utility model discloses a combination seat and a combination bottom ring, the combination area of the abrasive and the base material rod body is increased, effectively avoiding the abrasive from falling off, and greatly improving the safety.
[0015] 3、 the utility model discloses a high copper base block in the chip removal groove, thereby reminding the abrasive consumption in time, when the abrasive chip removal groove is worn out, the copper base block can contact the product earlier than the combination seat at this time, avoiding damaging the product, and the conical copper base block can quickly remove the chips, avoiding the waste chips from gathering in the abrasive.
[0016] The above description is only a summary of the technical scheme of the application, in order to more clearly understand the technical means of the application, so that the content of the specification can be implemented, and in order to make the above and other purposes, characteristics and advantages of the application more obvious and easy to understand, the following will be described in detail with the preferred embodiments of the application and the accompanying drawings.
[0017] According to the detailed description of the specific embodiments of the application in the following text combined with the drawings, those skilled in the art will more clearly understand the above and other purposes, advantages and characteristics of the application. DETAILED DESCRIPTION
[0018] In order to more clearly illustrate the technical scheme in the embodiments of the application or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, obviously, the drawings in the following description are some embodiments of the application, and those skilled in the art can also obtain other drawings according to these drawings without creating creative labor. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, each element or part is not necessarily drawn according to the actual proportion.
[0019] Fig. 1 It is a structural schematic view of the utility model;
[0020] Fig. 2 It is a sectional view of the utility model.
[0021] In the figure: 1, base material stick body; 2, heat dissipation ring; 3, heat dissipation groove; 4, combined bottom ring; 5, chip removal groove; 6, abrasive; 7, combined seat; 8, copper base block; 9, fixing screw; 10, heat dissipation strip. DETAILED DESCRIPTION
[0022] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, rather than all the embodiments. In the following description, specific details such as specific configurations and components are provided only to help a comprehensive understanding of the embodiments of the present application. Therefore, those skilled in the art should understand that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of the present application. In addition, descriptions of known functions and structures are omitted in the embodiments for the sake of clarity and conciseness.
[0023] In addition, reference numerals and / or letters can be repeated in different examples in the present application. Such repetition is for the purpose of simplification and clarity, and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed.
[0024] The term "and / or" herein is only used to describe an association relationship of associated objects, and can represent three cases, for example, A and / or B can represent three cases of A alone, B alone, and A and B together. The term "and" herein is used to describe another association relationship of associated objects, and can represent two cases, for example, A and B can represent two cases of A alone and A and B together. In addition, the character " / " herein generally represents an "or" relationship between the associated objects before and after it.
[0025] It should also be noted that the relationship terms such as first and second in the present application are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between the entities or operations. Moreover, the terms "include", "contain" or any other variants thereof are intended to cover non-exclusive inclusion.
[0026] Please refer to Figs. 1-2 The technical scheme of the metal bond sintered abrasive stick provided by the present application comprises a base material stick body 1 and an abrasive 6. The bottom end of the base material stick body 1 is fixedly connected with a combined bottom ring 4. The middle part of the bottom end of the combined bottom ring 4 is fixedly connected with a combined seat 7. The abrasive 6 is hot-pressed and sintered around the combined seat 7. The bottom end of the abrasive 6 is provided with a chip removal groove 5. The surface of the base material stick body 1 is equidistantly provided with a plurality of heat dissipation rings 2. The inside of the base material stick body 1 is provided with a heat dissipation groove 3. The bottom end of the heat dissipation groove 3 penetrates through the combined bottom ring 4 and extends to the inside of the combined seat 7.
[0027] The bottom end of the connecting seat 7 is fixedly connected with a copper base 8 by a fixing screw 9, the copper base 8 is in a conical shape, the bottom end of the copper base 8 is a pointed end, and the height of the pointed end is flush with the height of the chip removal groove 5.
[0028] In the embodiment, when the chip removal groove 5 of the abrasive 6 is worn out, the copper base 8 can contact the product earlier than the connecting seat 7, so as to avoid damaging the product, and the conical copper base 8 can quickly remove chips, so as to avoid the accumulation of waste chips in the interior of the abrasive 6.
[0029] The inner wall of the heat dissipation groove 3 is provided with a vertical heat dissipation strip 10, the contact area of the interior of the base material rod body 1 with air is increased, and the heat dissipation effect is improved.
[0030] In specific use, the abrasive 6 contacts the product, the abrasive 6 rotates at high speed to grind the product, when the grinding rod rotates, external airflow can quickly pass through the surface of the heat dissipation ring 2, the heat generated by the abrasive 6 during friction is transmitted to the heat dissipation ring 2 through the connecting bottom ring 4 and the base material rod body 1, so as to realize rapid heat dissipation and improve the service life of the grinding rod, when the chip removal groove 5 of the abrasive is worn out, the copper base 8 can contact the product earlier than the connecting seat 7, so as to avoid damaging the product, and the conical copper base 8 can quickly remove chips, so as to avoid the accumulation of waste chips in the interior of the abrasive 6.
[0031] The above only describes preferred embodiments of the present application, and does not limit the protection scope of the present application, for those skilled in the art, the present application can have various changes and variations. Any change, modification, replacement, integration and parameter change of the embodiments within the spirit and principle of the present application, which can realize the same function without departing from the principle and spirit of the present application, falls within the protection scope of the present application.
Claims
1. A metal bond sintered abrasive stick, characterized by: The utility model relates to a kind of abrasive rod bodies (1) and abrasive (6), the bottom end of the substrate rod body (1) is fixedly connected with the binding bottom ring (4), the bottom end of the binding bottom ring (4) is fixedly connected with the binding seat (7), the abrasive (6) is hot-pressed sintering and is connected around the binding seat (7), the bottom end of the abrasive (6) is provided with the chip removal groove (5), the surface of the substrate rod body (1) is equidistantly mounted with multiple heat dissipation rings (2), the inside of the substrate rod body (1) is provided with heat dissipation groove (3), the bottom end of the heat dissipation groove (3) is through the binding bottom ring (4) and extends to the inside of binding seat (7).
2. A metal bond sintered abrasive stick as claimed in claim 1, wherein: The bottom end of the binding seat (7) is fixedly connected with copper base block (8) by fixed screw (9).
3. A metal bond sintered abrasive stick as claimed in claim 2, wherein: The shape of the copper base block (8) is conical.
4. A metal bond sintered abrasive stick as claimed in claim 3, wherein: The bottom end of the copper base block (8) is a sharp end, and the height of the sharp end is level with the height of the chip removal groove (5).
5. A metal bond sintered abrasive stick as claimed in claim 1 wherein: The inner wall of the heat dissipation groove (3) is provided with vertical heat dissipation strips (10).