Electroplating device

Abstract

The utility model discloses an electroplating device, which comprises a first electroplating unit, a second electroplating unit and a third electroplating unit, the second electroplating unit is used for electroplating a second area of the photovoltaic cell; the first liquid removing unit is arranged between the first electroplating unit and the second electroplating unit and is used for removing electroplating liquid carried by the photovoltaic cell after the photovoltaic cell passes through the first electroplating unit; and the conveying unit can convey the photovoltaic cells to sequentially pass through the first electroplating unit, the first liquid removing unit and the second electroplating unit. By means of the electroplating device, the influence of electroplating liquid carried by the photovoltaic cell from the first electroplating unit on the second area of the photovoltaic cell is reduced, and the risk that the first area of the photovoltaic cell is electroplated again in the second electroplating unit is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to photovoltaic cell technical field, concretely relates to a kind of electroplating device. BACKGROUND

[0002] The electroplating device is used for electroplating photovoltaic cell, and generally uses step-by-step multi-layer electroplating to improve the electroplating efficiency. The step-by-step multi-layer electroplating is illustrated as follows: the electroplating area on the photovoltaic cell is divided into area A, area B and area C, and the area A, area B and area C are sequentially electroplated to form a first layer of plating layer on the entire electroplating area, and then the area A, area B and area C are sequentially electroplated to form a second layer of plating layer on the entire electroplating area, until the electroplating on the photovoltaic cell is completed. In this case, the prior electroplating area will carry the electroplating solution into the downstream electroplating tank after being electroplated in the upstream electroplating tank, and the prior electroplating area will contact the cathode connecting piece in the downstream electroplating tank, which will cause the prior electroplating area to be electroplated again, affecting the uniformity of the electroplating of the photovoltaic cell, and the cathode connecting piece in the downstream electroplating tank will also be electroplated. For example, the area A will carry the electroplating solution into the downstream electroplating tank after being electroplated in the upstream electroplating tank, and the area A will contact the cathode connecting piece in the downstream electroplating tank, which will cause the area A to be electroplated again, and the cathode connecting piece in the downstream electroplating tank will also be electroplated.

[0003] Specifically, in some horizontal electroplating devices that use conveying rollers to convey photovoltaic cells, the photovoltaic cells are driven and conveyed by the conductive rollers, which also serve as cathode connecting pieces to conduct electricity. After the prior electroplating area is electroplated in the upstream electroplating tank, it will carry the electroplating solution into the downstream electroplating tank, and the prior electroplating area will contact the conductive roller in the downstream electroplating tank, which will cause the prior electroplating area to be electroplated again, affecting the uniformity of the electroplating of the photovoltaic cell, and the conductive roller in the downstream electroplating tank will also be electroplated, causing the resistance of the conductive roller in the downstream electroplating tank to change, further affecting the uniformity of the electroplating of the photovoltaic cell, and the electroplated conductive roller will also affect the transmission of the photovoltaic cell. SUMMARY

[0004] The purpose of the utility model is to provide an electroplating device to solve one of the problems in the background art.

[0005] To achieve the above-mentioned purpose, the technical scheme provided in the embodiments of the utility model is as follows.

[0006] The embodiments of the utility model provide an electroplating device, which comprises:

[0007] The first electroplating unit is used for electroplating the first area of the photovoltaic cell.

[0008] The second electroplating unit is used for electroplating the second area of the photovoltaic cell.

[0009] a first liquid removing unit arranged between the first electroplating unit and the second electroplating unit, for removing the electroplating solution carried by the photovoltaic cell after passing through the first electroplating unit;

[0010] a conveying unit capable of conveying the photovoltaic cell to sequentially pass through the first electroplating unit, the first liquid removing unit and the second electroplating unit.

[0011] In some embodiments, the first region and the second region form all the electroplating regions on the photovoltaic cell.

[0012] In some embodiments, the first electroplating unit comprises a first electroplating main tank and at least a first buffer tank arranged downstream of the first electroplating main tank, the first electroplating main tank being communicated with the first buffer tank through an overflow port, so that the electroplating solution in the first electroplating main tank can overflow into the first buffer tank;

[0013] the second electroplating unit comprises a second electroplating main tank and at least a second buffer tank arranged upstream of the second electroplating main tank, the second electroplating main tank being communicated with the second buffer tank through an overflow port, so that the electroplating solution in the second electroplating main tank can overflow into the second buffer tank;

[0014] the conveying roller comprises a conveying roller and a conductive roller, the conductive roller being located in the first buffer tank and the second buffer tank.

[0015] In some embodiments, the first liquid removing unit comprises a plurality of first liquid removing sub-units arranged in sequence along the conveying direction, for multiple times of liquid removing of the photovoltaic cell.

[0016] In some embodiments, the first electroplating unit has a two-layer structure, the upper layer of the first electroplating unit comprises a first electroplating main tank and at least a first buffer tank arranged downstream of the first electroplating main tank, the lower layer of the first electroplating unit comprises a first reflux tank, the first buffer tank is communicated with the first reflux tank, and the electroplating solution in the first reflux tank is pumped back to the first electroplating main tank by a pump;

[0017] and / or, the second electroplating unit has a two-layer structure, the upper layer of the second electroplating unit comprises a second electroplating main tank and at least a second buffer tank arranged upstream of the second electroplating main tank, the lower layer of the second electroplating unit comprises a second reflux tank, the second buffer tank is communicated with the second reflux tank, and the electroplating solution in the second reflux tank is pumped back to the second electroplating main tank by a pump.

[0018] In some embodiments, a second liquid removing unit is arranged downstream of the second electroplating unit, for removing the electroplating solution carried by the photovoltaic cell after passing through the second electroplating unit;

[0019] The second liquid removing unit comprises a plurality of second liquid removing sub-units arranged in sequence along the conveying direction to remove liquid from the photovoltaic cell multiple times.

[0020] In some embodiments, the first electroplating main tank is provided with an anode for electroplating the lower surface of the photovoltaic cell.

[0021] The second electroplating main tank is provided with an anode for electroplating the lower surface of the photovoltaic cell.

[0022] The conductive roller is connected to the negative pole of the electroplating power supply, and the anode is connected to the positive pole of the electroplating power supply.

[0023] In some embodiments, the first electroplating main tank is further provided with an anode above the first electroplating main tank for electroplating the upper surface of the photovoltaic cell. The anode above the first electroplating main tank is referred to as an upper anode. The upper anode is a hollow structure. A spraying mechanism is further provided above the upper anode for spraying electroplating liquid onto the upper surface of the photovoltaic cell through the upper anode.

[0024] The second electroplating main tank is further provided with an anode above the second electroplating main tank for electroplating the upper surface of the photovoltaic cell. The anode above the second electroplating main tank is referred to as an upper anode. The upper anode is a hollow structure. A spraying mechanism is further provided above the upper anode for spraying electroplating liquid onto the upper surface of the photovoltaic cell through the upper anode.

[0025] The conductive rollers are arranged oppositely in up and down directions. The photovoltaic cell passes between the oppositely arranged conductive rollers.

[0026] In some embodiments, a liquid blocking roller is arranged above the tank wall between the first electroplating main tank and the first buffer tank to prevent the electroplating liquid on the upper surface of the photovoltaic cell from flowing to the conductive roller.

[0027] In some embodiments, the first electroplating unit, the first liquid removing unit, and the second electroplating unit for continuously electroplating one photovoltaic cell are referred to as one electroplating channel. The electroplating device comprises a plurality of electroplating channels for synchronously electroplating a plurality of photovoltaic cells. The electroplating channels are arranged in vertical layers or in horizontal arrays.

[0028] With the technical scheme, the embodiment of the present application has the following advantages compared with the prior art: the first electroplating unit is used to electroplate the previous electroplating area (for example, the first area) of the photovoltaic cell piece, the first liquid removing unit is used to remove the electroplating liquid carried by the photovoltaic cell piece from the first electroplating unit, and the second electroplating unit is used to electroplate the subsequent electroplating area (for example, the second area) of the photovoltaic cell piece, so that the influence of the electroplating liquid carried by the photovoltaic cell piece from the first electroplating unit on the subsequent electroplating area of the photovoltaic cell piece is reduced, and the risk of the previous electroplating area of the photovoltaic cell piece being electroplated again in the second electroplating unit is reduced. BRIEF DESCRIPTION OF DRAWINGS

[0029] BRIEF DESCRIPTION OF DRAWINGS Figure 1 It is a first overall layout schematic diagram of the electroplating device in the embodiment of the present application.

[0030] BRIEF DESCRIPTION OF DRAWINGS Figure 2 It is a structure schematic diagram of the first electroplating device in the embodiment of the present application.

[0031] BRIEF DESCRIPTION OF DRAWINGS Figure 3 It is a structure schematic diagram of the groove body in the embodiment of the present application.

[0032] BRIEF DESCRIPTION OF DRAWINGS Figure 4 It is a structure schematic diagram of the second electroplating device in the embodiment of the present application.

[0033] BRIEF DESCRIPTION OF DRAWINGS Figure 5 It is a second overall layout schematic diagram of the electroplating device in the embodiment of the present application.

[0034] The meanings of the reference signs are as follows:

[0035] The photovoltaic cell piece 1, the conveying roller 11, the conductive roller 12, the liquid blocking roller 13, the first electroplating unit 21, the first electroplating main groove 211, the first buffer groove 212, the first backflow groove 213, the second electroplating unit 22, the second electroplating main groove 221, the second buffer groove 222, the first liquid removing unit 31, the first cleaning unit 311, the second cleaning unit 312, the third cleaning unit 313, the first mounting cavity 314, the second liquid removing unit 32, the fourth cleaning unit 321, the fifth cleaning unit 322, the sixth cleaning unit 323, the second mounting cavity 324, the anode piece 4, and the spraying mechanism 5. DETAILED DESCRIPTION

[0036] The preferred embodiments of the present application will be described in detail below with reference to the drawings, so that the advantages and features of the present application can be more easily understood by those skilled in the art. It should be noted that the description of the embodiments is used to help understand the present application, but does not constitute a limitation on the present application.

[0037] As Figure 1As shown, the embodiment of the present application provides an electroplating device, which comprises a first electroplating unit 21 for electroplating a first region of a photovoltaic cell 1, a second electroplating unit 22 for electroplating a second region of the photovoltaic cell 1, a first liquid removing unit 31 and a conveying unit. The first liquid removing unit 31 is arranged between the first electroplating unit 21 and the second electroplating unit 22, and is used for removing the electroplating liquid carried by the photovoltaic cell 1 after passing through the first electroplating unit 21. The conveying unit is capable of conveying the photovoltaic cell 1 to sequentially pass through the first electroplating unit 21, the first liquid removing unit 31 and the second electroplating unit 22. The first electroplating unit 21 is used for electroplating the previous electroplating region (for example, the first region) of the photovoltaic cell 1, the first liquid removing unit 31 is used for removing the electroplating liquid carried by the photovoltaic cell 1 from the first electroplating unit 21, and the second electroplating unit 22 is used for electroplating the subsequent electroplating region (for example, the second region) of the photovoltaic cell 1. In this way, the influence of the electroplating liquid carried by the photovoltaic cell 1 from the first electroplating unit 21 on the subsequent electroplating region of the photovoltaic cell 1 is reduced, and the risk of the previous electroplating region of the photovoltaic cell 1 being electroplated again in the second electroplating unit 22 is reduced.

[0038] In some embodiments, the first region and the second region are formed as all the electroplating regions on the photovoltaic cell 1. The electroplating device realizes the electroplating of the entire photovoltaic cell 1 through two times of electroplating, so that the overall structure of the electroplating device is simple.

[0039] Specifically, when the photovoltaic cell 1 is a single-side electroplating structure, the first region and the second region are both located on one side of the photovoltaic cell 1; when the photovoltaic cell 1 is a double-side electroplating structure, the first region and the second region are both located on two sides of the photovoltaic cell 1; so that the electroplating of the first region and the second region is completed, that is, the electroplating of the entire photovoltaic cell 1 is completed.

[0040] In some embodiments, as shown, Figure 2 The first electroplating unit 21 comprises a first electroplating main tank 211 and at least a first buffer tank 212 arranged downstream of the first electroplating main tank 211, and the first electroplating main tank 211 is connected to the first buffer tank 212 through an overflow port, so that the electroplating liquid in the first electroplating main tank 211 can overflow into the first buffer tank 212;

[0041] The second electroplating unit 22 comprises a second electroplating main tank 221 and at least a second buffer tank 222 arranged upstream of the second electroplating main tank 221, and the second electroplating main tank 221 is connected to the second buffer tank 222 through an overflow port, so that the electroplating liquid in the second electroplating main tank 221 can overflow into the second buffer tank 222;

[0042] The conveying roller comprises a conveying roller 11 and a conductive roller 12, and the conductive roller 12 is located in the first buffer tank 212 and the second buffer tank 222.

[0043] The electroplating solution flows into the first buffer groove 212 without contacting the conductive roller 12 near the groove opening of the first buffer groove 212, avoiding wetting the conductive roller 12 by the electroplating solution and avoiding causing the conductive roller 12 to be electroplated. The electroplating solution flows into the second buffer groove 222 without contacting the conductive roller 12 near the groove opening of the second buffer groove 222, avoiding wetting the conductive roller 12 by the electroplating solution and avoiding causing the conductive roller 12 to be electroplated.

[0044] Preferably, the first electroplating main groove 211 is provided with the first buffer groove 212 upstream and downstream, so that the electroplating solution can uniformly overflow from the first buffer groove 212. The second electroplating main groove 221 is provided with the second buffer groove 222 upstream and downstream, so that the electroplating solution can uniformly overflow from the second buffer groove 222.

[0045] In some embodiments, as shown in FIG. 1, the first electroplating unit 21 is a two-layer structure, and the upper layer of the first electroplating unit 21 includes the first electroplating main groove 211 and the first buffer groove 212 arranged downstream of the first electroplating main groove 211. The lower layer of the first electroplating unit 21 includes the first backflow groove 213, and the first buffer groove 212 is communicated with the first backflow groove 213. The electroplating solution in the first backflow groove 213 is pumped back to the first electroplating main groove 211 by a pump. Figure 3 In some embodiments, as shown in FIG. 1, the first electroplating unit 21 is a two-layer structure, and the upper layer of the first electroplating unit 21 includes the first electroplating main groove 211 and the first buffer groove 212 arranged downstream of the first electroplating main groove 211. The lower layer of the first electroplating unit 21 includes the first backflow groove 213, and the first buffer groove 212 is communicated with the first backflow groove 213. The electroplating solution in the first backflow groove 213 is pumped back to the first electroplating main groove 211 by a pump.

[0046] For example, the first liquid removing unit 31 is a cleaning unit, and the first liquid removing sub-unit includes a first cleaning unit 311, a second cleaning unit 312, and a third cleaning unit 313 arranged in sequence, which respectively clean the photovoltaic cell 1 three times. The cleaning liquid flows from the third cleaning unit 313 to the second cleaning unit 312 and the first cleaning unit 311 in sequence, so as to improve the cleaning effect. The first liquid removing unit 31 is a two-layer structure, and the upper layer of the first liquid removing unit 31 includes the first liquid removing sub-unit. The lower layer of the first liquid removing unit 31 includes a first installation cavity 314 for installing pipelines and other accessories.

[0047] In some embodiments, the first electroplating unit 21 is a two-layer structure, and the upper layer of the first electroplating unit 21 includes the first electroplating main groove 211 and the first buffer groove 212 arranged downstream of the first electroplating main groove 211. The lower layer of the first electroplating unit 21 includes the first backflow groove 213, and the first buffer groove 212 is communicated with the first backflow groove 213. The electroplating solution in the first backflow groove 213 is pumped back to the first electroplating main groove 211 by a pump.

[0048] In some embodiments, the second electroplating unit 22 is a two-layer structure, and the upper layer of the second electroplating unit 22 includes the second electroplating main groove 221 and the second buffer groove 222 arranged upstream of the second electroplating main groove 221. The lower layer of the second electroplating unit 22 includes the second backflow groove 223, and the second buffer groove 222 is communicated with the second backflow groove 223. The electroplating solution in the second backflow groove 223 is pumped back to the second electroplating main groove 221 by a pump.

[0049] The electroplating solution flows sequentially from the first main electroplating tank 211 to the first buffer tank 212 and the first return tank 213, and then flows back from the first return tank 213 to the first main electroplating tank 211, realizing the recycling of the electroplating solution and ensuring its uniformity. Similarly, the second electroplating unit 22 can also realize the recycling of the electroplating solution.

[0050] In some embodiments, a second liquid removal unit 32 is provided downstream of the second electroplating unit 22 to remove the electroplating solution carried by the photovoltaic cell 1 after passing through the second electroplating unit 22.

[0051] The second liquid removal unit 32 includes a plurality of second liquid removal sub-units arranged sequentially along the conveying direction to perform multiple liquid removals on the photovoltaic cell 1.

[0052] For example, the second liquid removal subunit is a cleaning unit, which includes a fourth cleaning unit 321, a fifth cleaning unit 322, and a sixth cleaning unit 323 arranged sequentially. These units perform three cleaning operations on the photovoltaic cell 1, with the cleaning solution flowing sequentially from the sixth cleaning unit 323 to the fifth cleaning unit 322 and the fourth cleaning unit 321. The second liquid removal unit 32 has a two-layer structure. The upper layer of the second liquid removal unit 32 includes the second liquid removal subunit, and the lower layer includes the second mounting cavity 324 for installing pipes and other accessories.

[0053] In some embodiments, when the photovoltaic cell 1 has a single-sided electroplating structure, an anode 4 is provided in the first electroplating main tank 211 for electroplating the lower surface of the photovoltaic cell 1; an anode 4 is provided in the second electroplating main tank 221 for electroplating the lower surface of the photovoltaic cell 1; the conductive roller 12 is connected to the negative terminal of the electroplating power supply, and the anode 4 is connected to the positive terminal of the electroplating power supply.

[0054] Furthermore, such as Figure 4 As shown, when the photovoltaic cell 1 has a double-sided electroplating structure, an anode 4 is also provided above the first electroplating main tank 211 for electroplating the upper surface of the photovoltaic cell 1. The anode 4 located above the first electroplating main tank 211 is called the upper anode. The upper anode has a hollow structure. A spraying mechanism 5 is also provided above the upper anode for spraying electroplating liquid onto the upper surface of the photovoltaic cell 1 through the upper anode. An anode 4 is also provided above the second electroplating main tank 221 for electroplating the upper surface of the photovoltaic cell 1. The anode 4 located above the second electroplating main tank 221 is called the upper anode. The upper anode has a hollow structure. A spraying mechanism 5 is also provided above the upper anode for spraying electroplating liquid onto the upper surface of the photovoltaic cell 1 through the upper anode. The conductive rollers 12 are arranged vertically opposite each other, and the photovoltaic cell 1 passes through the vertically opposite conductive rollers 12.

[0055] In some embodiments, a liquid-blocking roller 13 is provided above the tank wall between the first main electroplating tank 211 and the first buffer tank 212 to prevent the electroplating solution on the upper surface of the photovoltaic cell 1 from flowing to the conductive roller 12. Preferably, there are two liquid-blocking rollers 13 arranged at an upstream and downstream interval, and a liquid accumulation area is formed between the two liquid-blocking rollers 13. The liquid accumulation area can collect the electroplating solution to facilitate electroplating on the upper surface of the photovoltaic cell 1.

[0056] In some implementations, such as Figure 5 As shown, the first electroplating unit 21, the first descaling unit 31, and the second electroplating unit 22 for continuously electroplating a photovoltaic cell 1 are referred to as an electroplating channel. The electroplating apparatus includes multiple electroplating channels to simultaneously electroplat multiple photovoltaic cells 1, enabling the electroplating apparatus to be used for mass production of photovoltaic cells 1. In one specific embodiment, the multiple electroplating channels are arranged in a vertically stacked or horizontally arrayed manner. For example, the electroplating apparatus includes three vertically stacked electroplating channels, or it includes four horizontally arrayed electroplating channels. In another specific embodiment, the multiple electroplating channels are arranged in a vertically stacked and horizontally arrayed manner. For example, the electroplating apparatus includes three horizontally arrayed electroplating channels, each row including three vertically stacked electroplating channels.

[0057] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be covered within the protection scope of this utility model.

Claims

1. An electroplating apparatus characterized by comprising: The first plating unit is used for plating the first region of the photovoltaic cell piece; The second plating unit is used for plating the second region of the photovoltaic cell piece; The first liquid removing unit is arranged between the first plating unit and the second plating unit, and is used for removing the plating liquid carried by the photovoltaic cell piece after passing through the first plating unit; The conveying unit can convey the photovoltaic cell piece to pass through the first plating unit, the first liquid removing unit and the second plating unit in sequence. The first region and the second region form all plating regions on the photovoltaic cell piece.

2. The electroplating apparatus of claim 1, wherein: The first plating unit comprises a first plating main groove and at least a first buffer groove arranged downstream of the first plating main groove, the first plating main groove is communicated with the first buffer groove through an overflow port, so that the plating liquid in the first plating main groove can overflow into the first buffer groove; 3. The electroplating apparatus of claim 1, wherein: The second plating unit comprises a second plating main groove and at least a second buffer groove arranged upstream of the second plating main groove, the second plating main groove is communicated with the second buffer groove through an overflow port, so that the plating liquid in the second plating main groove can overflow into the second buffer groove; The conveying unit comprises conveying rollers, and the conveying rollers comprise conveying rollers and conductive rollers, the conductive rollers are located in the first buffer groove and the second buffer groove. The first liquid removing unit comprises a plurality of first liquid removing sub-units arranged in sequence along the conveying direction, so as to remove the plating liquid from the photovoltaic cell piece for multiple times.

4. The electroplating apparatus of claim 3, wherein: The first plating unit has a two-layer structure, the upper layer of the first plating unit comprises the first plating main groove and the first buffer groove arranged downstream of the first plating main groove, the lower layer of the first plating unit comprises a first reflux groove, the first buffer groove is communicated with the first reflux groove, and the plating liquid in the first reflux groove is pumped back to the first plating main groove through a pump; 5. The electroplating apparatus of claim 3, wherein: And / or, the second plating unit has a two-layer structure, the upper layer of the second plating unit comprises the second plating main groove and the second buffer groove arranged upstream of the second plating main groove, the lower layer of the second plating unit comprises a second reflux groove, the second buffer groove is communicated with the second reflux groove, and the plating liquid in the second reflux groove is pumped back to the second plating main groove through a pump. A second liquid removing unit is arranged downstream of the second plating unit, and is used for removing the plating liquid carried by the photovoltaic cell piece after passing through the second plating unit; 6. The electroplating apparatus of claim 1, wherein: The second liquid removing unit comprises a plurality of second liquid removing sub-units arranged in sequence along the conveying direction, so as to remove the plating liquid from the photovoltaic cell piece for multiple times. An anode member is arranged in the first plating main groove, and is used for plating the lower surface of the photovoltaic cell piece; 7. The electroplating apparatus of claim 3, wherein: An anode member is arranged in the second plating main groove, and is used for plating the lower surface of the photovoltaic cell piece; The conductive roller is connected to the negative pole of the plating power supply, and the anode member is connected to the positive pole of the plating power supply.

8. The plating device according to claim 7, wherein: ​ The first electroplating main groove is further provided with an anode member above the first electroplating main groove for electroplating the upper surface of the photovoltaic cell piece, the anode member above the first electroplating main groove is referred to as an upper anode member, the upper anode member is a hollow structure, and the upper anode member is further provided with a spraying mechanism above the upper anode member for spraying the electroplating solution to the upper surface of the photovoltaic cell piece through the upper anode member; The second electroplating main groove is further provided with an anode member above the second electroplating main groove for electroplating the upper surface of the photovoltaic cell piece, the anode member above the second electroplating main groove is referred to as an upper anode member, the upper anode member is a hollow structure, and the upper anode member is further provided with a spraying mechanism above the upper anode member for spraying the electroplating solution to the upper surface of the photovoltaic cell piece through the upper anode member; The conductive rollers are oppositely arranged, and the photovoltaic cell piece passes between the oppositely arranged conductive rollers.

9. The electroplating apparatus of claim 8, wherein: The upper surface of the photovoltaic cell piece passes between the oppositely arranged conductive rollers.

10. The electroplating apparatus of claim 1, wherein: The first electroplating main groove and the first buffer groove are provided with a liquid blocking roller above the groove wall between the first electroplating main groove and the first buffer groove to prevent the electroplating solution on the upper surface of the photovoltaic cell piece from flowing to the conductive roller. The first electroplating unit, the first liquid removing unit and the second electroplating unit for continuously electroplating one photovoltaic cell piece are referred to as one electroplating channel, the electroplating device comprises a plurality of electroplating channels for synchronously electroplating a plurality of photovoltaic cell pieces, and the electroplating channels are vertically stacked and / or horizontally arranged in an array.

Images