Chip power supply adaptability testing device
By combining the test socket, chassis, negative pressure pump, negative pressure suction cup, and slide rail slider structure, the problem that existing chip test sockets can only test chips of a single specification is solved, realizing flexible fixation and testing of chips of different specifications, and improving the adaptability and ease of operation of the test socket.
Patent Information
- Application Number
- CN202423012492.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-06
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2034-12-06
AI Technical Summary
Existing chip test sockets can only test chips of a single specification, which is inflexible and cannot meet the testing needs of chips of different specifications.
The device employs a combination design of a test holder, chassis, negative pressure pump, negative pressure suction cup, and through holes. It uses negative pressure to adsorb and fix chips of different specifications, and adjusts the position of the test claws through a slide rail and slider structure, thereby achieving flexible fixation and testing of chips of different specifications.
It enables flexible fixing and testing of chips of different specifications, improves the application range and flexibility of the test socket, is easy to operate, and improves testing efficiency.
Smart Images
Figure CN223883705U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to chip testing technical field especially relates to a chip power adaptability testing device. BACKGROUND
[0002] Chip refers to the silicon chip containing integrated circuit, and the volume is very small, often is the part of computer or other electronic equipment, after chip manufacturing is completed, it needs to be tested, and the power adaptability is one of them.
[0003] The test seat is a kind of tool used for testing semiconductor chip, and after chip positioning, it is transmitted electric signal to external detection equipment through circuit board, so as to achieve the effect of inspection and testing, and a large number of test seats are needed to test to ensure the electrical performance quality of semiconductor chip.
[0004] The existing chip test seat can only test single specification chip, so when facing different specification chips, different size test seats need to be designed, and the flexibility is poor.
[0005] Therefore, it is necessary to provide a kind of chip power adaptability testing device to solve the above technical problems. UTILITY MODEL CONTENTS
[0006] The utility model provides a kind of chip power adaptability testing device, solve the problem in background art.
[0007] To solve the above technical problems, the utility model provides a kind of chip power adaptability testing device, including test seat, the test seat bottom end is provided with machine case, the machine case is internally installed with negative pressure pump, the negative pressure stick output end is provided with negative pressure chuck, the negative pressure chuck is in contact with the test seat bottom end surface, the test seat inside bottom end middle position is penetrated and is provided with through-hole, the through-hole is provided with multiple, and the diameter of the circle surrounded by multiple through-holes is equal to the diameter of the outside of negative pressure chuck, by the cooperation of test seat, machine case, negative pressure pump, negative pressure chuck and through-hole, it is convenient to make the test seat fix different specification chips, so that when power adaptability test is carried out to chip, staff places chip on the through-hole in the test seat, then starts negative pressure pump, then under the action of negative pressure pump, negative pressure chuck is fixed to chip through through-hole, so as to complete the fixation of chip, this mode is simple in operation, and the fixation of chip is contacted, it is convenient to make the test seat fix different specification chips, improve its use range.
[0008] Preferably, the test seat top surface is provided with a first sliding rail, a first sliding block is slidably connected in the first sliding rail, a moving plate is arranged at the top end of the first sliding block, a first mounting seat is slidably arranged on the top surface of the moving plate, a second mounting seat is movably connected to the first mounting seat through a pin shaft, and a test claw is arranged at one end of the second mounting seat.
[0009] Preferably, one end of the test claw is connected with an external power supply through a power line, a contact foot is arranged at one end of the test claw, and a driving rod is arranged on the top surface of the test claw.
[0010] Preferably, a maintenance door is movably arranged on the outer surface of the case through a hinge, and a handle is arranged on the surface of the maintenance door.
[0011] Preferably, a controller is arranged on the outer surface of the test seat and electrically connected with the negative pressure pump.
[0012] Compared with the related art, the chip power adaptability testing device has the following beneficial effects:
[0013] Compared with the prior art, the chip power adaptability testing device has the following beneficial effects:
[0014] Compared with the prior art, the chip power adaptability testing device is convenient for the front and back movement of the moving plate in the first sliding rail through the first sliding block, convenient for the front and back adjustment of the testing claw, convenient for the left and right adjustment of the testing claw on the moving plate through the cooperation of the second sliding block and the second sliding rail, the operation of this mode is simple, the flexible adjustment of the testing claw is facilitated, the testing of the chip is facilitated, and the flexibility of use is improved.
[0015] The parts not involved in the device are the same as or can be realized by the prior art. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 A structural schematic view of a chip power adaptability testing device provided by the utility model is provided.
[0017] Figure 2 An internal structural schematic view of a chip power adaptability testing device provided by the utility model is provided.
[0018] Figure 3 A driving rod structural schematic view of a chip power adaptability testing device provided by the utility model is provided.
[0019] Figure 4 A local enlarged view of a chip power adaptability testing device A provided by the utility model is provided.
[0020] Figure 5 A negative pressure suction disc structural schematic view of a chip power adaptability testing device provided by the utility model is provided.
[0021] Reference numerals in the drawings:
[0022] 1, test seat; 2, case; 3, access door; 4, moving plate; 5, testing claw; 6, first sliding rail; 7, through hole; 8, negative pressure suction disc; 9, negative pressure pump; 10, driving rod; 11, first mounting seat; 12, contact foot; 13, second sliding block; 14, second mounting seat; 15, second sliding rail; 16, first sliding block; 17, controller. DETAILED DESCRIPTION
[0023] The utility model will be further described below in combination with the drawings and embodiments.
[0024] First embodiment
[0025] Please refer to Figures 1-5A kind of chip power supply adaptability testing device, including test seat 1, the bottom of the test seat 1 is provided with machine case 2, negative pressure pump 9 is installed in the inside of the machine case 2, negative pressure sucker 8 is provided at the output end of the negative pressure rod, the negative pressure sucker 8 is in contact with the bottom end surface of test seat 1, the through hole 7 is passed through in the inside bottom end middle position of test seat 1, the through hole 7 is provided with multiple, and the circular diameter surrounded by multiple through holes 7 is equal to the outside diameter of negative pressure sucker 8, by the cooperation of test seat 1, machine case 2, negative pressure pump 9, negative pressure sucker 8 and through hole 7, it is convenient to make test seat 1 to fix different specifications of chip, so that when power supply adaptability of chip is tested, staff places chip on the through hole 7 in the inside of test seat 1, then starts negative pressure pump 9, then under the action of negative pressure pump 9, negative pressure sucker 8 is fixed to chip through the through hole 7, to complete the fixation of chip, this mode is simple to operate, by the fixation of chip without contact, it is convenient to make test seat 1 to fix different specifications of chip, improve its use range.
[0026] The working principle of the chip power supply adaptability testing device provided by the utility model is as follows:
[0027] The chip power supply adaptability testing device is convenient for staff to place chip on the through hole 7 in the inside of test seat 1 when power supply adaptability of chip is tested, then starts negative pressure pump 9, then under the action of negative pressure pump 9, negative pressure sucker 8 is fixed to chip through the through hole 7, to complete the fixation of chip, this mode is simple to operate, by the fixation of chip without contact, it is convenient to make test seat 1 to fix different specifications of chip, improve its use range, by the cooperation of first sliding rail 6, first sliding block 16, moving plate 4, first mounting seat 11, second mounting seat 14 and test claw 5, it is convenient to make moving plate 4 move forward and backward in first sliding rail 6 through first sliding block 16, the forward and backward direction of test claw 5 is adjusted, by the cooperation of second sliding block 13 and second sliding rail 15, it is convenient to make test claw 5 adjust left and right on moving plate 4, this mode is simple to operate, it is convenient to adjust test claw 5 flexibly, it is convenient to test chip, improve its flexibility.
[0028] Compared with the related art, the chip power supply adaptability testing device provided by the utility model has the following beneficial effects:
[0029] The chip power adaptability testing device, through the cooperation of the test seat 1, the case 2, the negative pressure pump 9, the negative pressure suction cup 8 and the through hole 7, the test seat 1 can be used for fixing different specifications of chips, so that when the power adaptability of the chip is tested, the staff places the chip on the through hole 7 in the test seat 1, then starts the negative pressure pump 9, and then the negative pressure suction cup 8 is fixed to the chip through the through hole 7 under the action of the negative pressure pump 9, so that the fixing of the chip is completed, and the operation is simple. Through the cooperation of the first sliding rail 6, the first sliding block 16, the moving plate 4, the first mounting seat 11, the second mounting seat 14 and the test claw 5, the moving plate 4 can move forward and backward in the first sliding rail 6 through the first sliding block 16, so that the forward and backward directions of the test claw 5 can be adjusted. Through the cooperation of the second sliding block 13 and the second sliding rail 15, the test claw 5 can be adjusted left and right on the moving plate 4. This way is simple to operate, and the test claw 5 can be adjusted flexibly, which is convenient for testing the chip and improves the flexibility of use.
[0030] Second embodiment
[0031] Please refer to Figures 1-5 Based on the first embodiment of the present application, another chip power adaptability testing device is provided in the second embodiment. The second embodiment is only a preferred mode of the first embodiment, and the implementation of the second embodiment does not affect the separate implementation of the first embodiment.
[0032] Based on the first embodiment, refer to Figures 1-5 The first sliding rail 6 is arranged on the top surface of the test seat 1, the first sliding block 16 is slidably connected in the first sliding rail 6, the moving plate 4 is arranged at the top end of the first sliding block 16, the first mounting seat 11 is slidably arranged on the top surface of the moving plate 4, the second mounting seat 14 is movably connected to the first mounting seat 11 through a pin shaft, the test claw 5 is arranged at one end of the second mounting seat 14, the second sliding rail 15 is arranged on the top surface of the moving plate 4, and the second sliding block 13 is arranged at the bottom end of the first mounting seat 11. The second sliding block 13 is slidably connected with the second sliding rail 15. Through the cooperation of the first sliding rail 6, the first sliding block 16, the moving plate 4, the first mounting seat 11, the second mounting seat 14 and the test claw 5, the moving plate 4 can move forward and backward in the first sliding rail 6 through the first sliding block 16, so that the forward and backward directions of the test claw 5 can be adjusted. Through the cooperation of the second sliding block 13 and the second sliding rail 15, the test claw 5 can be adjusted left and right on the moving plate 4. This way is simple to operate, and the test claw 5 can be adjusted flexibly, which is convenient for testing the chip and improves the flexibility of use.
[0033] On the basis of embodiment one, refer to Figures 1-3 One end of the test claw 5 is connected with external power supply through power line, one end of the test claw 5 is provided with contact foot 12, and the top surface of the test claw 5 is provided with driving rod 10. Through the driving rod 10, the operation of the test claw 5 is facilitated, and the chip is tested by the contact foot 12.
[0034] On the basis of embodiment one, refer to Figure 1 The outer surface of the case 2 is movably provided with an access door 3 through a hinge, and the surface of the access door 3 is provided with a handle. Through the setting of the access door 3, the internal negative pressure pump 9 is convenient to overhaul.
[0035] On the basis of embodiment one, refer to Figure 1 The outer surface of the test seat 1 is provided with a controller 17, and the controller 17 is electrically connected with the negative pressure pump 9. Through the setting of the controller 17, the negative pressure pump 9 is controlled, the chip is fixed by the negative pressure suction disc 8, the stability during testing is improved, the control circuit is controlled by the setting of the control panel, the programming of the technical personnel in the field is simple, it belongs to the common knowledge in the field, only the use is described, the control mode and the circuit connection are not improved, so the control mode and the circuit connection are not described in detail.
[0036] It should be noted that all kinds of components used in the present application are standard components and can be purchased from the market. The specific connection mode of each part adopts the conventional means of bolt, rivet and welding in the prior art. The mechanical, parts and electrical equipment adopt the conventional type in the prior art. The circuit connection adopts the conventional connection mode in the prior art. The electrical equipment is in communication with the external safe power supply. The specific description is not made here.
[0037] The above is only an embodiment of the present application, and does not limit the patent range of the present application. Any equivalent structure or equivalent process conversion, or direct or indirect application in other related technical fields, is also included in the patent protection range of the present application.
Claims
1. A chip power supply adaptability testing device comprising a test seat (1), characterized in that, The bottom end of the test seat (1) is provided with a machine box (2), a negative pressure pump (9) is installed inside the machine box (2), a negative pressure suction disc (8) is arranged at the output end of the negative pressure pump (9), the negative pressure suction disc (8) is in contact with the bottom end surface of the test seat (1), a through hole (7) is arranged at the middle position of the bottom end inside the test seat (1), a plurality of through holes (7) are arranged, and the diameter of the circle surrounded by the plurality of through holes (7) is equal to the outer diameter of the negative pressure suction disc (8).
2. The chip power supply adaptability test apparatus according to claim 1, wherein A first sliding rail (6) is arranged on the top surface of the test seat (1), a first sliding block (16) is slidably connected inside the first sliding rail (6), a moving plate (4) is arranged at the top end of the first sliding block (16), a first mounting seat (11) is slidably arranged on the top surface of the moving plate (4), a second mounting seat (14) is movably connected to the first mounting seat (11) through a pin shaft, and a test claw (5) is arranged at one end of the second mounting seat (14).
3. The chip power supply adaptability test apparatus according to claim 2, wherein A second sliding rail (15) is arranged on the top surface of the moving plate (4), a second sliding block (13) is arranged at the bottom end of the first mounting seat (11), and the second sliding block (13) is slidably connected with the second sliding rail (15).
4. The chip power supply adaptability test apparatus according to claim 2, wherein One end of the test claw (5) is connected with an external power supply through a power line, a contact foot (12) is arranged at one end of the test claw (5), and a driving rod (10) is arranged on the top surface of the test claw (5).
5. The chip power supply adaptability test apparatus according to claim 1, wherein A maintenance door (3) is movably mounted on the outer surface of the machine box (2) through a hinge, and a handle is arranged on the surface of the maintenance door (3).
6. The chip power supply adaptability test apparatus according to claim 1, wherein A controller (17) is mounted on the outer surface of the test seat (1), and the controller (17) is electrically connected with the negative pressure pump (9).