Electronic device

Abstract

The utility model relates to an electronic device. According to one embodiment of the utility model, the electronic device comprises a display layer; a sensor layer defining a sensing region including a first region and a second region separated from the first region; and a sensor driving part, in which the sensor layer may include: a (1-1)-th electrode disposed in the first region and extending in a first direction; a 2-1 electrode disposed in the first region, extending in a second direction intersecting the first direction, and intersecting the 1-1 electrode in an insulated manner; a first-second electrode disposed in the second region and extending in the second direction; a 2-2 electrode disposed in the second region, extending in the first direction, and intersecting with the 1-2 electrode in an insulated manner; a first line connected to the (1-1) th electrode and the (1-2) th electrode; a second-1 line connected to the second-1 electrode; and a second-second line connected to the second-second electrode.

Description

TECHNICAL FIELD

[0001] The utility model relates to an electronic device with improved touch reliability. BACKGROUND

[0002] Multimedia electronic devices such as televisions, portable phones, tablet computers, navigation devices, game consoles, etc. have electronic devices for displaying images. In addition to conventional input methods such as buttons, keyboards, mice, etc., electronic devices can also have input sensors that can provide touch-based input methods, allowing users to easily and intuitively input information or instructions. SUMMARY

[0003] The utility model discloses an electronic device with improved touch reliability.

[0004] An electronic device according to an embodiment of the utility model can include: a display layer; a sensor layer arranged on the display layer, defining a sensing area including a first area and a second area separated from the first area; and a sensor driving part driving the sensor layer, wherein the sensor layer can include: a first-1 electrode arranged in the first area, extending in a first direction; a second-1 electrode arranged in the first area, extending in a second direction intersecting the first direction, insulated from the first-1 electrode; a first-2 electrode arranged in the second area, extending in the second direction; a second-2 electrode arranged in the second area, extending in the first direction, insulated from the first-2 electrode; a first line connected with the first-1 electrode and the first-2 electrode; a second-1 line connected with the second-1 electrode; and a second-2 line connected with the second-2 electrode.

[0005] The sensing area can also include: a boundary area arranged between the first area and the second area, wherein the sensor layer can also include: a protection electrode arranged in the boundary area.

[0006] The protection electrode can be provided with a ground voltage.

[0007] The protection electrode can be in a floating state.

[0008] The protection electrode can be arranged in the same layer as the first-1 electrode.

[0009] The protection electrode can include a first sub-protection electrode and a second sub-protection electrode arranged in the first direction, wherein each of the first sub-protection electrode and the second sub-protection electrode can extend in the second direction.

[0010] The voltage levels of the first sub-protection electrode and the second sub-protection electrode can be different from each other.

[0011] The protection electrode can further include a third sub-protection electrode spaced apart from the first sub-protection electrode in the first direction across the second sub-protection electrode.

[0012] The voltage supplied to the first sub-protection electrode and the third sub-protection electrode can be different from the voltage supplied to the second sub-protection electrode.

[0013] The first line, the 2-1 line, and the 2-2 line can be electrically connected to the sensor driving part.

[0014] The size of the 1-1 electrode can be different from the size of the 1-2 electrode.

[0015] The sensor driving part can supply the same sensing signal to the 1-1 electrode and the 1-2 electrode through the first line.

[0016] The 1-1 electrode and the 1-2 electrode can be electrically connected to each other.

[0017] An electronic device according to an embodiment of the present disclosure can include a display layer, a sensor layer disposed on the display layer and defining a sensing area including a first area and a second area adjacent to the first area, and a sensor driving part driving the sensor layer, wherein the sensor layer can include a plurality of 1-1 electrodes disposed in the first area, respectively extending in a first direction, and arranged in a second direction crossing the first direction, a plurality of 2-1 electrodes disposed in the first area, respectively extending in the second direction, and arranged in the first direction, a plurality of 1-2 electrodes disposed in the second area, respectively extending in the second direction, and arranged in the first direction, and a plurality of 2-2 electrodes disposed in the second area, respectively extending in the first direction, and arranged in the second direction, and the sensor driving part can supply the same sensing signal to a first 1-1 electrode of the plurality of 1-1 electrodes and a first 1-2 electrode of the plurality of 1-2 electrodes.

[0018] The number of the plurality of 1-1 electrodes and the plurality of 1-2 electrodes can be the same.

[0019] The sensing area can further include a boundary area disposed between the first area and the second area, and the sensor layer can further include a protection electrode disposed in the boundary area.

[0020] The protection electrode can be supplied with a ground voltage.

[0021] The guard electrode can be in a floating state.

[0022] The plurality of first-1 electrodes and the plurality of first-2 electrodes can be electrically connected to each other, respectively.

[0023] The size of the first-1 electrode can be different from the size of the first-2 electrode.

[0024] As described above, the sensor driving part can transmit the same sensing signal to the plurality of first-1 electrodes of the first area and the plurality of first-2 electrodes of the second area, respectively, so that the first reception signal for the first area and the second reception signal for the second area can be received separately. The ghost touch phenomenon that can occur in the case where the sensing area is not electrically insulated and separated can be removed or prevented. Accordingly, an electronic device having improved touch reliability can be provided.

[0025] Also, as described above, the sensor layer can include a plurality of first-1 electrodes and a plurality of first-2 electrodes extending in different directions from each other according to areas, and a plurality of first lines commonly connected to the plurality of first-1 electrodes and the plurality of first-2 electrodes, respectively, wherein the sensor driving part can transmit the same sensing signal to a corresponding pair of electrodes among the plurality of first-1 electrodes and the plurality of first-2 electrodes through the plurality of first lines, and can calculate coordinate information based on the received reception signal. Through the configuration of transmitting the same sensing signal, the number of channels for transmitting the sensing signal can be reduced to half, and one sensing driving part can drive the sensor layer. Accordingly, an electronic device having a reduced area of an ineffective area can be provided. BRIEF DESCRIPTION OF DRAWINGS

[0026] Figure 1 is a perspective view of an electronic device according to an embodiment of the present application.

[0027] Figure 2 is an exploded perspective view of an electronic device according to an embodiment of the present application.

[0028] Figure 3 is a schematic cross-sectional view of a display module according to an embodiment of the present application.

[0029] Figure 4 is a cross-sectional view of an electronic device according to an embodiment of the present application.

[0030] Figure 5 is a block diagram illustrating a portion of an electronic device according to an embodiment of the present application.

[0031] Figure 6 is a block diagram illustrating a portion of an electronic device according to an embodiment of the present application. is a block diagram illustrating a portion of an electronic device according to an embodiment of the present application.

[0032] Figure 7 is a plan view showing a region of the sensor according to an embodiment of the present application, enlarged. Figure 6

[0033] Figure 8 is a sectional view of the sensor layer taken along I-I' of the sensor according to an embodiment of the present application. Figure 7

[0034] Figure 9 is a plan view showing a region of the sensor according to an embodiment of the present application, enlarged. Figure 6

[0035] Figure 10 is a sectional view taken along II-II' of the sensor according to an embodiment of the present application. Figure 9

[0036] Figure 11 is a plan view showing a region of the sensor according to an embodiment of the present application, enlarged. Figure 6 BRIEF DESCRIPTION OF DRAWINGS

[0037]

[0038] DETAILED DESCRIPTION In the present specification, when it is mentioned that a certain constituent element (or region, layer, portion, etc.) is "on" another constituent element, is "connected" to another constituent element, or is "combined" with another constituent element, it means that it can be directly disposed on or connected / combined with the other constituent element, or a third constituent element can be disposed therebetween.

[0039] The same reference numerals refer to the same constituent elements. Also, in the drawings, the thickness, ratio, and size of the constituent elements are exaggerated for effective explanation of the technical content. "And / or" includes all combinations of one or more of the relevant constituent elements.

[0040] The terms "first", "second", and the like can be used to describe various constituent elements, but the constituent elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one constituent element from another constituent element. For example, a first constituent element can be named a second constituent element, and similarly, a second constituent element can be named a first constituent element, without departing from the scope of the present application. The singular expression includes the plural expression unless it is explicitly stated otherwise in the context.

[0041]

[0042] ​​​​​Furthermore, terms such as "below," "lower side," "above," and "upper side" are used to describe the relationships between the constituent elements shown in the accompanying drawings. These terms are relative concepts and are explained based on the directions indicated in the accompanying drawings.

[0043] Terms such as “including” or “having” should be understood as being intended to specify the presence of features, figures, steps, operations, constituent elements, components or combinations thereof described in the specification, rather than precluding the presence or possibility of one or more other features or figures, steps, operations, constituent elements, components or combinations thereof.

[0044] Unless otherwise defined, all terms used in this specification (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. Furthermore, terms such as those defined in commonly used dictionaries shall be interpreted as having the same meaning as they have in the context of the relevant art, and shall not be interpreted as having an overly ideal or excessively formal meaning unless expressly defined herein.

[0045] The embodiments of the present invention will now be described with reference to the accompanying drawings.

[0046] Figure 1 This is a perspective view of an electronic device according to an embodiment of the present invention. Figure 2 This is an exploded perspective view of an electronic device according to an embodiment of the present invention.

[0047] Reference Figure 1 and Figure 2 The electronic device 1000 can be a device activated by an electrical signal. The electronic device 1000 according to this invention can be a large electronic device such as a television or monitor, or a small to medium-sized electronic device such as a portable telephone, tablet computer, laptop computer, vehicle navigation system, vehicle dashboard, or game console. These are merely examples, and other forms of electronic devices can certainly be included as long as they do not depart from the concept of this invention. The electronic device 1000 can have a rectangular shape with a long side in a first direction DR1 and a short side in a second direction DR2 intersecting the first direction DR1. However, the shape of the electronic device 1000 is not limited to this, and various shapes of electronic devices 1000 can be provided. The electronic device 1000 can display an image IM facing a third direction DR3 in a display surface IS parallel to each of the first direction DR1 and the second direction DR2. The third direction DR3 can intersect the first direction DR1 and the second direction DR2. The display surface IS displaying the image IM can correspond to the front surface of the electronic device 1000.

[0048] In the present embodiment, a front surface (or an upper surface) and a back surface (or a lower surface) of each component can be defined with reference to a direction in which the image IM is displayed. The front surface and the back surface can be opposing each other in the third direction DR3, and a normal direction of each of the front surface and the back surface can be parallel to the third direction DR3.

[0049] A distance between the front surface and the back surface in the third direction DR3 can correspond to a thickness of the electronic device 1000 in the third direction DR3. In addition, the directions indicated by the first direction DR1, the second direction DR2, and the third direction DR3 are relative concepts, and can be converted into other directions.

[0050] The electronic device 1000 can detect an external input applied from the outside. The external input can include various forms of input provided from the outside of the electronic device 1000. The electronic device 1000 according to an embodiment of the present disclosure can detect an external input of a user applied from the outside. The external input of the user can be one or a combination of various forms of external inputs of a part of the user's body, light, heat, a line of sight, pressure, and the like. Also, the electronic device 1000 can detect an external input of a user applied to a side surface or a back surface of the electronic device 1000 according to the structure of the electronic device 1000, and is not limited to a certain embodiment. As an example of the present disclosure, the external input can also include input through an input device (e.g., a stylus, an active pen, a touch pen, an electronic pen, or the like), and the like.

[0051] The display face IS of the electronic device 1000 can be divided into a display area DA and a non-display area NDA. The display area DA can be an area in which the image IM is displayed. The user can see the image IM through the display area DA. In the present embodiment, the display area DA is shown in a quadrangular shape with rounded corners. However, this is shown by way of example, and the display area DA can have various shapes and is not limited to a certain embodiment.

[0052] The non-display area NDA can be adjacent to the display area DA. The non-display area NDA can have a predetermined color. The non-display area NDA can surround the display area DA. Accordingly, the shape of the display area DA can be substantially defined by the non-display area NDA. However, this is shown by way of example only, and the non-display area NDA can be arranged adjacent to only one side of the display area DA, or can be omitted. The electronic device 1000 according to an embodiment of the present disclosure can include various embodiments and is not limited to a certain embodiment.

[0053] The electronic device 1000 can include a display module DM, a main circuit board MCB, a flexible circuit film D-FCB, a plurality of data driving circuits DIC, and a window WM.

[0054] The display module DM can include the display layer 100 and the sensor layer 200.

[0055] The display layer 100 according to an embodiment of the present disclosure can be a light emitting type display panel. As one example thereof, the display layer 100 can be an organic light emitting display layer, an inorganic light emitting display layer, or a quantum dot light emitting display layer. The light emitting layer of the organic light emitting display layer can include an organic light emitting substance. The light emitting layer of the inorganic light emitting display layer can include an inorganic light emitting substance. For example, the light emitting layer of the inorganic light emitting display layer can include a micro-LED or a nano-LED. The light emitting layer of the quantum dot light emitting display layer can include quantum dots and quantum rods, etc. Hereinafter, the display layer 100 will be described as an organic light emitting display panel in the present embodiment.

[0056] The display layer 100 can output an image IM, and the output image IM can be displayed through a display surface IS.

[0057] The sensor layer 200 can detect an input from the outside. The sensor layer 200 can be disposed on the display layer 100. For example, the sensor layer 200 can be directly disposed on the display layer 100.

[0058] The window WM can be configured with a transparent substance capable of emitting an image IM. For example, the window WM can be configured with glass, sapphire, plastic, etc. Although the window WM is shown as a single layer, it is not limited thereto, and can include a plurality of layers.

[0059] In an embodiment, the window WM can include a light blocking pattern for defining the non-display area NDA. The light blocking pattern, as a colored organic film, can be formed, for example, by a coating method.

[0060] The window WM can be bonded to the display module DM through an adhesive film. As one example of the present disclosure, the adhesive film can include an optically clear adhesive film (OCA). However, the adhesive film is not limited thereto, and can include a general adhesive or a bonding agent. For example, the adhesive film can include an optically clear adhesive resin (OCR) or a pressure sensitive adhesive film (PSA).

[0061] The display module DM can display an image IM according to an electrical signal. The display module DM can be defined as an active area AA and a non-active area NAA. The active area AA can be defined as an area in which an image IM provided from the display module DM is emitted.

[0062] The non-active area NAA is adjacent to the active area AA. For example, the non-active area NAA can surround the active area AA. However, this is an exemplary illustration, and the non-active area NAA can be defined in various shapes and is not limited to one embodiment. According to an embodiment, the active area AA of the display module DM can correspond to at least a portion of the display area DA.

[0063] The main circuit board MCB can be connected to the flexible circuit film D-FCB to be electrically connected to the display module DM. The flexible circuit film D-FCB can be connected to the display module DM to electrically connect the display module DM and the main circuit board MCB.

[0064] The main circuit board MCB can include a sensor driving part TIC and a timing controller TCON. The sensor driving part TIC can include a circuit for driving the display module DM. A plurality of data driving circuits DIC can be mounted on the flexible circuit film D-FCB.

[0065] As an example of the present application, the flexible circuit film D-FCB can include a first flexible circuit film D-FCB1, a second flexible circuit film D-FCB2, and a third flexible circuit film D-FCB3. The plurality of data driving circuits DIC can include a first data driving circuit DIC1, a second data driving circuit DIC2, and a third data driving circuit DIC3. The first flexible circuit film D-FCB1, the second flexible circuit film D-FCB2, and the third flexible circuit film D-FCB3 can be arranged apart in the first direction DR1 and can be connected to the display module DM to electrically connect the display module DM and the main circuit board MCB. The first data driving circuit DIC1 can be mounted on the first flexible circuit film D-FCB1. The second data driving circuit DIC2 can be mounted on the second flexible circuit film D-FCB2. The third data driving circuit DIC3 can be mounted on the third flexible circuit film D-FCB3. However, embodiments of the present application are not limited thereto. For example, the display module DM can be electrically connected to the main circuit board MCB through one flexible circuit film, and only one driving chip can be mounted on one flexible circuit film. Also, the display module DM can be electrically connected to the main circuit board MCB through four or more flexible circuit films, and driving chips can be mounted on the flexible circuit films, respectively.

[0066] In Figure 2In the embodiment, the first data driving circuit DIC1, the second data driving circuit DIC2, and the third data driving circuit DIC3 are mounted on the first flexible circuit film D-FCB1, the second flexible circuit film D-FCB2, and the third flexible circuit film D-FCB3, respectively, but the present application is not limited thereto. For example, the first data driving circuit DIC1, the second data driving circuit DIC2, and the third data driving circuit DIC3 can be directly mounted on the display module DM. In this case, the portion of the display module DM on which the first data driving circuit DIC1, the second data driving circuit DIC2, and the third data driving circuit DIC3 are mounted can be bent to be disposed on the rear surface of the display module DM. Also, the first data driving circuit DIC1, the second data driving circuit DIC2, and the third data driving circuit DIC3 can be directly mounted on the main circuit board MCB.

[0067] The electronic device 1000 can further include a housing EDC in which the display module DM is received. The housing EDC can define the appearance of the electronic device 1000 in combination with the window WM. The housing EDC can absorb an impact applied from the outside and prevent foreign substances / moisture, etc. from penetrating toward the display module DM to protect the components received in the housing EDC. In addition, as an example of the present application, the housing EDC can be provided in a form in which a plurality of receiving parts are combined.

[0068] The electronic device 1000 according to an embodiment can further include an electronic module including various functional modules for operating the display module DM, a power supply module (e.g., a battery) supplying power required for overall operation of the electronic device 1000, a bracket, etc. that divides the internal space of the electronic device 1000 in combination with the display module DM and / or the housing EDC.

[0069] Figure 3 FIG. 1 is a schematic cross-sectional view of a display module according to an embodiment of the present application.

[0070] Referring to Figure 3 , the display module DM can include a display layer 100 and a sensor layer 200.

[0071] The display layer 100 can be a configuration that substantially generates an image. The display layer 100 can be a light emitting type display layer, for example, the display layer 100 can be an organic light emitting display layer, an inorganic light emitting display layer, an organic-inorganic light emitting display layer, a quantum dot display layer, a micro LED display layer, or a nano LED display layer. The display layer 100 can include a base layer 110, a circuit layer 120, a light emitting element layer 130, and an encapsulation layer 140.

[0072] The base layer 110 can be a component that provides a base surface on which the circuit layer 120 is disposed. The base layer 110 can have a multi-layer structure or a single layer structure. The base layer 110 can be a glass substrate, a metal substrate, a silicon substrate, a polymer substrate, or the like, but is not particularly limited thereto.

[0073] The circuit layer 120 can be disposed on the base layer 110. The circuit layer 120 can include an insulating layer, a semiconductor pattern, a conductive pattern, and a signal line. The insulating layer, the semiconductor layer, and the conductive layer can be formed on the base layer 110 by coating, deposition, or the like, and can be selectively patterned by a plurality of photolithography processes.

[0074] The light emitting element layer 130 can be disposed on the circuit layer 120. The light emitting element layer 130 can include a light emitting element. For example, the light emitting element layer 130 can include an organic light emitting substance, an inorganic light emitting substance, an organic-inorganic light emitting substance, a quantum dot, a quantum rod, a micro-LED, or a nano-LED.

[0075] The encapsulation layer 140 can be disposed on the light emitting element layer 130. The encapsulation layer 140 can protect the light emitting element layer 130 from foreign substances such as moisture, oxygen, and dust particles.

[0076] The sensor layer 200 can be disposed on the display layer 100. The sensor layer 200 can sense an external input applied from the outside. The sensor layer 200 can be an integral sensor continuously formed in a manufacturing process of the display layer 100, or the sensor layer 200 can be an external sensor attached to the display layer 100. The sensor layer 200 can be referred to as a sensor, an input sensing layer, an input sensing panel, or an input coordinate sensing electronic device, or the like.

[0077] According to an embodiment of the present disclosure, the sensor layer 200 can sense all inputs with respect to a passive type input unit such as a user's body and an input device that generates a magnetic field of a predetermined resonance frequency. The input device can be referred to as a pen, an input pen, a magnetic pen, a stylus, or an electromagnetic resonance pen.

[0078] Figure 4 is a cross-sectional view of an electronic device according to an embodiment of the present disclosure.

[0079] Referring to Figure 4 At least one inorganic layer is formed on an upper surface of the base layer 110. The inorganic layer can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. The inorganic layer can be formed in multiple layers. The inorganic layer in multiple layers can constitute a barrier layer and / or a buffer layer. In the present embodiment, the display layer 100 is shown to include a buffer layer BFL.

[0080] The buffer layer BFL can improve the adhesion between the base layer 110 and the semiconductor pattern. The buffer layer BFL may include at least one of silicon oxide, silicon nitride, and silicon oxynitride. For example, the buffer layer BFL may include a structure consisting of alternating stacks of silicon oxide layers and silicon nitride layers.

[0081] Semiconductor patterns can be arranged on the buffer layer BFL. The semiconductor patterns can include polycrystalline silicon. However, they are not limited to this; the semiconductor patterns can also include amorphous silicon, low-temperature polycrystalline silicon, or oxide semiconductors.

[0082] Figure 4 Only a portion of the semiconductor pattern is shown; semiconductor patterns may also be arranged in other areas. The semiconductor pattern can span multiple pixels and be arranged according to a specific rule. The semiconductor pattern has different electrical properties depending on whether it is doped or not. The semiconductor pattern may include a first region with high conductivity and a second region with low conductivity. The first region may be doped with N-type or P-type dopant. A P-type transistor may include a doped region doped with P-type dopant, and an N-type transistor may include a doped region doped with N-type dopant. The second region may be an undoped region, or it may be a region doped at a lower concentration than the first region.

[0083] The conductivity of the first region can be greater than that of the second region, and it can essentially function as an electrode or signal wiring. The second region can essentially be equivalent to the active region (or channel region) of a transistor. In other words, a portion of the semiconductor pattern can be the active region of a transistor, another portion can be the source or drain region of a transistor, and yet another portion can be a connecting electrode or a connecting signal wiring.

[0084] Each pixel can have an equivalent circuit including seven transistors, one capacitor, and a light-emitting element, and the equivalent circuit diagram of a pixel can be deformed in various forms. Figure 4 The image exemplarily illustrates a transistor 100PC and a light-emitting element 100PE included in a pixel.

[0085] The source region SC, active region AL, and drain region DR of transistor 100PC can be formed by semiconductor patterning. The source region SC and drain region DR can extend from the active region AL in opposite directions in the cross section. Figure 4 A portion of the connection signal wiring SCL formed by a semiconductor pattern is shown. Although not shown separately, the connection signal wiring SCL can be connected to the drain region DR of transistor 100PC on a plane.

[0086] The first insulating layer 10 can be disposed on the buffer layer BFL. The first insulating layer 10 can collectively overlap the plurality of pixels, and can cover the semiconductor pattern. The first insulating layer 10 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The first insulating layer 10 can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide. In the present embodiment, the first insulating layer 10 can be a single layer of silicon oxide. Not only the first insulating layer 10, but also the insulating layer of the circuit layer 120 to be described later can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The inorganic layer can include at least one of the above-described substances, but is not limited thereto.

[0087] The gate electrode GT of the transistor 100PC is disposed on the first insulating layer 10. The gate electrode GT can be a part of a metal pattern. The gate electrode GT overlaps the active layer AL. In a process of doping the semiconductor pattern, the gate electrode GT can function as a mask.

[0088] The second insulating layer 20 can be disposed on the first insulating layer 10, and can cover the gate electrode GT. The second insulating layer 20 can collectively overlap the plurality of pixels. The second insulating layer 20 can be an inorganic layer and / or an organic layer, and can have a single layer or a multi-layer structure. The second insulating layer 20 can include at least one of silicon oxide, silicon nitride, and silicon oxynitride. In the present embodiment, the second insulating layer 20 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0089] The third insulating layer 30 can be disposed on the second insulating layer 20. The third insulating layer 30 can have a single layer or a multi-layer structure. For example, the third insulating layer 30 can have a multi-layer structure including a silicon oxide layer and a silicon nitride layer.

[0090] The first connection electrode CNE1 can be disposed on the third insulating layer 30. The first connection electrode CNE1 can be connected to the connection signal wiring SCL through a contact hole CNT-1 that penetrates the first insulating layer 10, the second insulating layer 20, and the third insulating layer 30.

[0091] The fourth insulating layer 40 can be disposed on the third insulating layer 30. The fourth insulating layer 40 can be a single layer of silicon oxide. The fifth insulating layer 50 can be disposed on the fourth insulating layer 40. The fifth insulating layer 50 can be an organic layer.

[0092] The second connection electrode CNE2 can be disposed on the fifth insulating layer 50. The second connection electrode CNE2 can be connected to the first connection electrode CNE1 through a contact hole CNT-2 that penetrates the fourth insulating layer 40 and the fifth insulating layer 50.

[0093] The sixth insulating layer 60 can be disposed on the fifth insulating layer 50, and can cover the second connection electrode CNE2. The sixth insulating layer 60 can be an organic layer.

[0094] The light emitting element layer 130 can be disposed on the circuit layer 120. The light emitting element layer 130 can include the light emitting element 100PE. For example, the light emitting element layer 130 can include an organic light emitting substance, an inorganic light emitting substance, an organic-inorganic light emitting substance, a quantum dot, a quantum rod, a micro-LED, or a nano-LED. Hereinafter, the light emitting element 100PE is exemplified as an organic light emitting element, but is not particularly limited thereto.

[0095] The light emitting element 100PE can include a first electrode AE, a light emitting layer EL, and a second electrode CE.

[0096] The first electrode AE can be disposed on the sixth insulating layer 60. The first electrode AE can be connected with the second connection electrode CNE2 through a contact hole CNT-3 penetrating the sixth insulating layer 60.

[0097] The pixel definition film 70 can be disposed on the sixth insulating layer 60, and can cover a portion of the first electrode AE. An opening portion 70-OP is defined in the pixel definition film 70. The opening portion 70-OP of the pixel definition film 70 can expose at least a portion of the first electrode AE.

[0098] The display area DA can include a light emitting area PXA and a non-light emitting area NPXA adjacent to the light emitting area PXA. The non-light emitting area NPXA can surround the light emitting area PXA. In the present embodiment, the light emitting area PXA is defined as a region corresponding to a portion of the first electrode AE exposed by the opening portion 70-OP.

[0099] The light emitting layer EL can be disposed on the first electrode AE. The light emitting layer EL can be disposed in a region corresponding to the opening portion 70-OP. That is, the light emitting layer EL can be formed separately for each pixel. In the case where the light emitting layer EL is formed separately for each pixel, each light emitting layer EL can emit light of at least one color among blue, red, and green. However, it is not limited thereto, and the light emitting layer EL can also be commonly provided in connection with a plurality of pixels. In this case, the light emitting layer EL can provide blue light, or can also provide white light.

[0100] The second electrode CE can be disposed on the light emitting layer EL. The second electrode CE can have an integrated shape, and can be commonly disposed for a plurality of pixels.

[0101] Although not shown, a hole control layer can be disposed between the first electrode AE and the light-emitting layer EL. The hole control layer can be commonly disposed in the light-emitting region PXA and the non-light-emitting region NPXA. The hole control layer can include a hole transport layer, and can further include a hole injection layer. An electron control layer can be disposed between the light-emitting layer EL and the second electrode CE. The electron control layer includes an electron transport layer, and can further include an electron injection layer. The hole control layer and the electron control layer can be commonly formed in the plurality of pixels using an opening mask.

[0102] The encapsulation layer 140 can be disposed on the light-emitting element layer 130. The encapsulation layer 140 can include inorganic layers, organic layers, and inorganic layers stacked in this order, but the layers constituting the encapsulation layer 140 are not limited thereto. The inorganic layers can protect the light-emitting element layer 130 from moisture and oxygen, and the organic layers can protect the light-emitting element layer 130 from foreign matter such as dust particles. The inorganic layers can include a silicon nitride layer, a silicon oxynitride layer, a silicon oxide layer, a titanium oxide layer, or an aluminum oxide layer, etc. The organic layers can include an acrylic series organic layer, but are not limited thereto.

[0103] The sensor layer 200 can include a base layer 201, a first conductive layer 202, a detection insulating layer 203, a second conductive layer 204, and a cover insulating layer 205.

[0104] The base layer 201 can be an inorganic layer including at least one of silicon nitride, silicon oxynitride, and silicon oxide. Alternatively, the base layer 201 can be an organic layer including an epoxy series resin, an acrylic series resin, or an imide series resin. The base layer 201 can have a single layer structure, or can have a multi-layer structure stacked in the third direction DR3.

[0105] Each of the first conductive layer 202 and the second conductive layer 204 can have a single layer structure, or can have a multi-layer structure stacked in the third direction DR3.

[0106] The conductive layer of the single layer structure can include a metal layer or a transparent conductive layer. The metal layer can include molybdenum, silver, titanium, copper, aluminum, or an alloy thereof. The transparent conductive layer can include a transparent conductive oxide such as indium tin oxide (ITO), indium zinc oxide (IZO), zinc oxide (ZnO), or indium zinc tin oxide (IZTO). In addition thereto, the transparent conductive layer can include a conductive polymer such as PEDOT, a metal nanowire, graphene, etc.

[0107] The conductive layer of the multi-layer structure can include a metal layer. The metal layer can have a three-layer structure of titanium / aluminum / titanium, for example. The conductive layer of the multi-layer structure can include at least one metal layer and at least one transparent conductive layer.

[0108] The at least one of the detection insulating layer 203 and the cover insulating layer 205 can include an inorganic film. The inorganic film can include at least one of aluminum oxide, titanium oxide, silicon oxide, silicon nitride, silicon oxynitride, zirconium oxide, and hafnium oxide.

[0109] The at least one of the detection insulating layer 203 and the cover insulating layer 205 can include an organic film. The organic film can include at least one of an acrylic resin, a methacrylic resin, a polyisoprene resin, a vinyl resin, an epoxy resin, a urethane resin, a cellulose resin, a siloxane resin, a polyimide resin, a polyamide resin, and a perylene resin.

[0110] Figure 5 is a block diagram illustrating a portion of an electronic device according to an embodiment of the present disclosure.

[0111] Referring to Figure 5 , the electronic device 1000 can include a display layer 100, a timing controller TCON, and a data driving circuit DIC. Figure 5 The data driving circuit DIC can be Figure 2 one of the data driving circuits DIC (see Figure 2 ) illustrated in FIG. 1.

[0112] The timing controller TCON can receive input data RGB and a control signal D-CS from a processor. The external control section can include a graphic processing section. The control signal D-CS can include various signals. For example, the control signal D-CS can include an input vertical synchronization signal, an input horizontal synchronization signal, a main clock, and a data enable signal.

[0113] The timing controller TCON can generate image data DS that converts a data format of the input data RGB to conform to an interface specification between the data driving circuit DIC.

[0114] The timing controller TCON can generate a scan control signal SCS and a data control signal DCS based on the control signal D-CS.

[0115] The data driving circuit DIC can output grayscale voltages for driving the plurality of data lines DL1-DLm in response to a data control signal DCS and image data DS from the timing controller TCON. The data driving circuit DIC can be implemented as an integrated circuit and directly mounted on a predetermined area of the display layer 100 or mounted on a separate printed circuit board in a chip on film manner to be electrically connected with the display layer 100, but is not particularly limited thereto. For example, the data driving circuit DIC can also be formed using the same process as the circuit layer in the display layer 100.

[0116] The display layer 100 can define a display area AA-1 and a non-display area NAA-1. The plurality of pixels PX can be arranged in the display area AA-1, and the scan driving circuit SDC can be arranged in the non-display area NAA-1. The display area AA-1 can overlap with an active area AA (refer to FIG. 1) of the electronic device 1000, and the non-display area NAA-1 can overlap with a non-active area NAA (refer to FIG. 1) of the electronic device 1000. Figure 2 Figure 2

[0117] The display layer 100 can include a plurality of scan lines SL1-SLn, a plurality of data lines DL1-DLm, a plurality of pixels PX, and a scan driving circuit SDC. Each of the plurality of pixels PX can be connected with a corresponding data line of the plurality of data lines DL1-DLm and can be connected with a corresponding scan line of the plurality of scan lines SL1-SLn. In an embodiment of the present disclosure, the display layer 100 can further include a light emitting control line, and the electronic device 1000 can further include a light emitting driving circuit that provides a control signal to the light emitting control line. The configuration of the display layer 100 is not particularly limited.

[0118] Each of the plurality of scan lines SL1-SLn can extend in parallel with the first direction DR1. The plurality of scan lines SL1-SLn can be arranged apart from each other in the second direction DR2. Each of the plurality of data lines DL1-DLm can extend in parallel with the second direction DR2 from the data driving circuit DIC. The plurality of data lines DL1-DLm can be arranged apart from each other in the first direction DR1.

[0119] The plurality of pixels PX can be electrically connected with the plurality of scan lines SL1-SLn and the plurality of data lines DL1-DLm, respectively. For example, the pixels of the first row can be connected to the scan line SL1, and the pixels of the first column can be connected to the data line DL1.

[0120] ​​The scan driving circuit SDC can drive the plurality of scan wirings SL1-SLn in response to a scan control signal SCS. In an embodiment of the present application, the scan driving circuit SDC can be formed using the same process as the circuit layer in the display layer 100, but is not limited thereto. For example, the scan driving circuit SDC can also be implemented as an integrated circuit (IC) and directly mounted on a predetermined area of the display layer 100 or mounted on a separate printed circuit board in a chip on film (COF) manner, thereby being electrically connected to the display layer 100.

[0121] Figure 6 is a block diagram illustrating a portion of an electronic device according to an embodiment of the present application.

[0122] Referring to Figure 6 , the electronic device 1000 can include a sensor layer 200 and a sensor driving part TIC.

[0123] A sensing area AA-2 can be defined in the sensor layer 200. The sensing area AA-2 can be an area activated according to an electrical signal. The sensing area AA-2 can be an area detecting an input. The sensing area AA-2 can overlap an active area AA (refer to Figure 2 ) of the electronic device 1000, and can overlap a display area AA-1 (refer to Figure 5 ) of the display layer 100 (refer to Figure 5 ).

[0124] The sensing area AA-2 can include a first area AA1, a second area AA2, and a boundary area BA. The second area AA2 can be spaced apart from the first area AA1 in the first direction DR1. The boundary area BA can be disposed between the first area AA1 and the second area AA2. The first area AA1 and the second area AA2 can have the same area.

[0125] The sensor layer 200 can include a plurality of electrodes 210, 220, a plurality of first lines 230, a plurality of second lines 240, a protection electrode 251, and a protection line 252. The plurality of electrodes 210, 220 and the protection electrode 251 can be disposed in the sensing area AA-2.

[0126] The plurality of electrodes 210, 220 can include a plurality of first electrodes 210 and a plurality of second electrodes 220. The sensor layer 200 can obtain information for an external input through a change in capacitance between the plurality of first electrodes 210 and the plurality of second electrodes 220.

[0127] The plurality of first electrodes 210 can include a plurality of 1-1 electrodes 210-1 and a plurality of 1-2 electrodes 210-2.

[0128] A plurality of first-1 electrodes 210-1 can be arranged in a first region AA1. Each of the plurality of first-1 electrodes 210-1 can extend along a first direction DR1. The plurality of first-1 electrodes 210-1 can be arranged along a second direction DR2.

[0129] A plurality of first-second electrodes 210-2 may be arranged in the second region AA2. Each of the plurality of first-second electrodes 210-2 may extend along the second direction DR2. The plurality of first-second electrodes 210-2 may be arranged along the first direction DR1.

[0130] The dimensions of each of the plurality of first-1 electrodes 210-1 may differ from the dimensions of each of the plurality of first-2 electrodes 210-2. For example, the maximum width of each of the plurality of first-1 electrodes 210-1 in the second direction DR2 may be less than the maximum width of each of the plurality of first-2 electrodes 210-2 in the first direction DR1. Furthermore, the width of each of the plurality of first-1 electrodes 210-1 in the first direction DR1 may be greater than the width of each of the plurality of first-2 electrodes 210-2 in the second direction DR2.

[0131] The number of multiple first-1 electrodes 210-1 can be the same as the number of multiple first-2 electrodes 210-2. That is, the number of channels of the multiple first-1 electrodes 210-1 can be the same as the number of channels of the multiple first-2 electrodes 210-2. Figure 6 The illustration exemplarily shows seven first-1 electrodes 210-1 and seven first-2 electrodes 210-2, but the number of each of the plurality of first-1 electrodes 210-1 and the plurality of first-2 electrodes 210-2 according to an embodiment of the present invention is not limited thereto. For example, the number of each of the plurality of first-1 electrodes 210-1 and the plurality of first-2 electrodes 210-2 may be 35.

[0132] The plurality of second electrodes 220 may include a plurality of second-1 electrodes 220-1 and a plurality of second-2 electrodes 220-2.

[0133] A plurality of second-first electrodes 220-1 may be arranged in the first region AA1. The plurality of second-first electrodes 220-1 may insulate against and intersect with a plurality of first-first electrodes 210-1. Each of the plurality of second-first electrodes 220-1 may extend along a second direction DR2. The plurality of second-first electrodes 220-1 may be arranged along a first direction DR1.

[0134] The plurality of second-2 electrodes 220-2 can be disposed in the second area AA2. The plurality of second-2 electrodes 220-2 can cross the plurality of first-2 electrodes 210-2 insulatively. Each of the plurality of second-2 electrodes 220-2 can extend in the first direction DR1. The plurality of second-2 electrodes 220-2 can be arranged in the second direction DR2.

[0135] The size of each of the plurality of second-1 electrodes 220-1 can be different from the size of each of the plurality of second-2 electrodes 220-2.

[0136] The number of the plurality of second-1 electrodes 220-1 can be different from the number of the plurality of second-2 electrodes 220-2. For example, the number of the plurality of second-1 electrodes 220-1 can be greater than the number of the plurality of second-2 electrodes 220-2. In Figure 6 Eight second-1 electrodes 220-1 and seven second-2 electrodes 220-2 are exemplarily illustrated in FIG. 1, but the number of the plurality of second-1 electrodes 220-1 and the number of the plurality of second-2 electrodes 220-2 according to an embodiment of the present disclosure are not limited thereto. For example, the number of the plurality of second-1 electrodes 220-1 can be 40, and the number of the plurality of second-2 electrodes 220-2 can be 35.

[0137] In Figure 6 Eight second-1 electrodes 220-1 and seven second-2 electrodes 220-2 are exemplarily illustrated in FIG. 1, but the number of the plurality of second-1 electrodes 220-1 and the number of the plurality of second-2 electrodes 220-2 according to an embodiment of the present disclosure are not limited thereto. For example, the number of the plurality of second-1 electrodes 220-1 can be 40, and the number of the plurality of second-2 electrodes 220-2 can be 35.

[0138] The plurality of first lines 230 can be electrically connected with the sensor driving part TIC. When viewed from a planar surface, the plurality of first lines 230 can overlap the non-active area NAA (refer to FIG. 2). Figure 2

[0139] Each of the plurality of first lines 230 can be connected with a corresponding one of the plurality of first-1 electrodes 210-1 and with a corresponding one of the plurality of first-2 electrodes 210-2. For example, a first one of the plurality of first lines 230 can be connected with a first one of the plurality of first-1 electrodes 210-1 and with a first one of the plurality of first-2 electrodes 210-2, and a second one of the plurality of first lines 230 can be connected with a second one of the plurality of first-1 electrodes 210-1 and with a second one of the plurality of first-2 electrodes 210-2.

[0140] ​Multiple first-1 electrodes 210-1 and multiple first-2 electrodes 210-2 can be electrically connected via multiple first lines 230, respectively. For example, the first first-1 electrode 210-1 and the first first-2 electrode 210-2 can be electrically connected to each other, and the second first-1 electrode 210-1 and the second first-2 electrode 210-2 can be electrically connected to each other.

[0141] Multiple second lines 240 can be electrically connected to the sensor driver unit (TIC). Multiple second lines 240 can each be electrically connected to multiple second electrodes 220. When viewed from a planar surface, the multiple second lines 240 can be connected to the non-active region NAA (refer to...). Figure 2 (overlap). Multiple second lines 240 may include multiple second-1 lines 241 and multiple second-2 lines 242.

[0142] Multiple second-1 lines 241 can be electrically connected to multiple second-1 electrodes 220-1 respectively.

[0143] Multiple second-2 lines 242 can be electrically connected to multiple second-2 electrodes 220-2 respectively.

[0144] The protection electrode 251 can be arranged in the boundary region BA. The protection electrode 251 can be spaced apart from the plurality of first electrodes 210 and the plurality of second electrodes 220. The protection line 252 can be connected to the protection electrode 251. The protection line 252 can be electrically connected to the sensor drive unit TIC.

[0145] The sensor driving unit TIC can sequentially output sensing signals Tx to multiple first lines 230. The sensor driving unit TIC can provide the same sensing signal Tx to the first first electrode of the multiple first-1 electrodes 210-1 and the first first-2 electrode of the multiple first-2 electrodes 210-2. For example, the same sensing signal Tx can be provided to the first first-1 electrode 210-1 and the first first-2 electrode 210-2, and the same sensing signal Tx can be provided to the second first-1 electrode 210-1 and the second first-2 electrode 210-2.

[0146] That is, the same sensing signal Tx can be provided to one of the multiple first electrodes 210-1 and one of the multiple first electrodes 210-2 through multiple first lines 230.

[0147] The sensor driver unit (TIC) can calculate the input coordinate information based on the received signals Rx1 and Rx2 received from each of the multiple second lines 240.

[0148] The received signals Rx1 and Rx2 may include a first received signal Rx1 and a second received signal Rx2.

[0149] The first reception signal Rx1 can be output from the plurality of second 1-1 electrodes 220-1. The first reception signal Rx1 can be generated based on the sensing signal Tx provided by the plurality of first 1-1 electrodes 210-1. The sensor driving part TIC can calculate the coordinate information of the first area AA1 based on the first reception signal Rx1.

[0150] The second reception signal Rx2 can be output from the plurality of second 2-2 electrodes 220-2. The second reception signal Rx2 can be generated based on the sensing signal Tx provided by the plurality of first 2-2 electrodes 210-2. The sensor driving part TIC can calculate the coordinate information of the second area AA2 based on the second reception signal Rx2.

[0151] Unlike the present application, for the electronic device 1000 constituting the vehicle instrument panel, it can have a relatively large effective area AA (refer to Figure 2 ). In this case, since the number of electrodes of the sensor layer 200 increases, it can be difficult to drive by one sensing driving part. However, according to the present application, the sensor layer 200 can include the plurality of first 1-1 electrodes 210-1 and the plurality of first 2-2 electrodes 210-2 extending in different directions from each other and the plurality of first lines 230 commonly connected to the plurality of first 1-1 electrodes 210-1 and the plurality of first 2-2 electrodes 210-2 according to the areas AA1 and AA2, the sensor driving part TIC can transmit the same sensing signal Tx to a corresponding pair of electrodes among the plurality of first 1-1 electrodes 210-1 and the plurality of first 2-2 electrodes 210-2 through the plurality of first lines 230, and can calculate the coordinate information based on the received reception signals Rx1 and Rx2. In the sensing area AA-2, the number of sensing signals Tx required for detecting an external input can be relatively reduced. By the configuration of transmitting the same sensing signal Tx, the number of channels for transmitting the sensing signal Tx can be reduced to half, and the sensor layer 200 can be driven by one sensor driving part TIC. Therefore, it is possible to provide the electronic device 1000 having a reduced area of the non-effective area NAA (refer to Figure 2 ).

[0152] Also, according to the present application, electrodes disposed in the first area AA1 and the second area AA2 can be electrically insulated by the protection electrode 251. A ghost touch phenomenon that can occur in a case where the sensing area AA-2 is not electrically insulated and separated can be removed or prevented. The sensor driving part TIC can transmit the same sensing signal Tx to the plurality of first-1 electrodes 210-1 of the first area AA1 and the plurality of first-2 electrodes 210-2 of the second area AA2, respectively, so that the first receiving signal Rx1 for the first area AA1 and the second receiving signal Rx2 for the second area AA2 can be received separately. Accordingly, an electronic device 1000 having improved touch reliability can be provided.

[0153] Figure 7 is a plan view showing a region of Figure 6 according to an embodiment of the present application. In the description Figure 7 , the same reference numerals are used to describe the same constituent elements as those described with reference to Figure 6 , and a description thereof will be omitted.

[0154] Referring to Figure 7 , the cross region SU can be a region in which the bridge pattern 222-1 is disposed.

[0155] Each of the plurality of first-1 electrodes 210-1 can include a first portion 211-1 and a second portion 212-1. The first portion 211-1 and the second portion 212-1 can have an integrated shape.

[0156] Each of the plurality of second-1 electrodes 220-1 can include a detection pattern 221-1 and a bridge pattern 222-1. Two detection patterns 221-1 adjacent to each other can be electrically connected to each other by two bridge patterns 222-1, but are not particularly limited thereto. The detection pattern 221-1 can have a mesh structure. An opening OP-M can be defined in the detection pattern 221-1. One opening OP-M can overlap with an opening part 70-OP defined by the pixel defining film 70 (refer to Figure 4 ). However, this is merely an example, and one opening OP-M can overlap with a plurality of opening parts 70-OP. The bridge pattern 222-1, the first portion 211-1, and the second portion 212-1 can also have a mesh structure similar to that of the detection pattern 221-1, respectively.

[0157] Two bridge patterns 222-1 can connect two detection patterns 221-1. A first connection region CNT-A1, a second connection region CNT-A2, a third connection region CNT-A3, and a fourth connection region CNT-A4 can be provided between the two bridge patterns 222-1 and the two detection patterns 221-1. Four contact holes CNT-I can be formed in each of the first connection region CNT-A1 to the fourth connection region CNT-A4. However, this is merely an example, and the two detection patterns 221-1 can also be electrically connected by one bridge pattern. Also, in another embodiment of the present application, the two detection patterns 221-1 can also be electrically connected by more than three bridge patterns.

[0158] In Figure 7 , a plurality of first-1 electrodes 210-1 and a plurality of second-1 electrodes 220-1 are exemplarily described as a reference, but a plurality of first-2 electrodes 210-2 and a plurality of second-2 electrodes 220-2 can also have similar structures, respectively.

[0159] Figure 8 is a cross-sectional view of a sensor layer cut along I-I' of the sensor according to an embodiment of the present application. Figure 7 In the description Figure 8 , the same reference numerals are used for the constituent elements described through Figure 4 and Figure 7 , and the description thereof is omitted.

[0160] Referring to Figure 8 , the sensor layer 200 can have a bottom bridge structure. For example, a bridge pattern 222-1 can be included in the first conductive layer 202 (referring to Figure 4 ), and a first portion 211-1 (referring to Figure 7 ), a second portion 212-1, and a detection pattern 221-1 can be included in the second conductive layer 204 (referring to Figure 4 ).

[0161] The bridge pattern 222-1 can be disposed on the base layer 201.

[0162] A detection insulating layer 203 can be disposed on the bridge pattern 222-1. The detection insulating layer 203 can cover the bridge pattern 222-1.

[0163] The first portion 211-1 (referring to Figure 7 ), the second portion 212-1, and the detection pattern 221-1 can be disposed on the detection insulating layer 203. The first portion 211-1 (referring to Figure 7 ), the second portion 212-1, and the detection pattern 221-1 can be provided in the same layer.

[0164] The detection pattern 221-1 can be connected with the bridge pattern 222-1 through a contact hole CNT-I penetrating the detection insulating layer 203.

[0165] The cover insulating layer 205 can be arranged on the first portion 211-1 (refer to Figure 7 ), the second portion 212-1, and the detection pattern 221-1. The cover insulating layer 205 can cover the first portion 211-1 (refer to Figure 7 ), the second portion 212-1, and the detection pattern 221-1.

[0166] Figure 9 is a plan view that enlargedly shows a region of the detection electrode 200 according to an embodiment of the present disclosure, Figure 6 is a sectional view taken along II-II' of the detection electrode 200 according to an embodiment of the present disclosure. In the description Figure 10 , the same reference numerals are used to describe the same components as those described through Figure 9 , and the description thereof is omitted. Figure 9 Figure 6 With reference to and

[0167] , the intermediate region EA can be a region in which the guard electrode 251 is arranged. Figure 9 Figure 10 The guard electrode 251 can be arranged in the boundary region BA (refer to ). The guard electrode 251 can extend in the second direction DR2. The guard electrode 251 can have a mesh structure.

[0168] Figure 6 The guard electrode 251 can be arranged between the plurality of 1-1 electrodes 210-1 and the plurality of 2-2 electrodes 220-2. The guard electrode 251 can be arranged between the plurality of 2-1 electrodes 220-1 and the plurality of 1-2 electrodes 210-2.

[0169] The ground voltage or the guard voltage can be supplied to the guard electrode 251 through the guard line 252, or the guard electrode 251 can be in a floating state. The ground voltage can have a voltage level different from the guard voltage. The guard electrode 251 can electrically insulate the first region AA1 and the second region AA2.

[0170] The guard electrode 251 can be arranged on the detection insulating layer 203. The guard electrode 251 can be arranged in the same layer as the 1-1 electrode 210-1. The guard electrode 251 can be arranged in the same layer as at least a portion of the 2-2 electrode 220-2.

[0171] The guard electrode 251 can be arranged on the detection insulating layer 203. The guard electrode 251 can be arranged in the same layer as the 1-1 electrode 210-1. The guard electrode 251 can be arranged in the same layer as at least a portion of the 2-2 electrode 220-2.

[0172] ​According to the present application, the sensor driving part TIC can transmit the same sensing signal Tx to the plurality of first electrodes 210-1 of the first area AA1 and the plurality of second electrodes 210-2 of the second area AA2, respectively, so that the first receiving signal Rx1 for the first area AA1 and the second receiving signal Rx2 for the second area AA2 can be received separately. The ghost touch phenomenon that can occur in the case where the sensing area AA-2 is not electrically insulated and separated can be removed or prevented. Therefore, the electronic device 1000 having improved touch reliability can be provided.

[0173] Figure 11 is a plan view showing a region corresponding to a region of Figure 6 the electronic device 1000 according to an embodiment of the present application. In the description Figure 11 of the electronic device 1000, the same reference numerals are assigned to the constituent elements Figure 9 illustrated in the drawings and a description thereof will be omitted.

[0174] Referring to Figure 11 , the intermediate area EAa can be an area in which the guard electrode 251-1 is disposed.

[0175] The guard electrode 251-1 can be disposed in the boundary area BA (see FIG. 2). The guard electrode 251-1 can be disposed between the plurality of first electrodes 210-1 and the plurality of second electrodes 220-2. The guard electrode 251 can be disposed between the plurality of second electrodes 220-1 and the plurality of first electrodes 210-2. Figure 9 The guard electrode 251-1 can include a first sub-guard electrode 251a, a second sub-guard electrode 251b, and a third sub-guard electrode 251c arranged in the first direction DR1. Each of the first sub-guard electrode 251a, the second sub-guard electrode 251b, and the third sub-guard electrode 251c can extend in the second direction DR2.

[0176] The second sub-guard electrode 251b can be disposed between the first sub-guard electrode 251a and the third sub-guard electrode 251c. A voltage supplied to the first sub-guard electrode 251a and the third sub-guard electrode 251c can be different from a voltage supplied to the second sub-guard electrode 251b. That is, voltage levels of the first sub-guard electrode 251a and the second sub-guard electrode 251b can be different from each other, and voltage levels of the first sub-guard electrode 251a and the third sub-guard electrode 251c can be the same as each other.

[0177]

[0178] ​For example, a ground voltage can be supplied to the second sub protection electrode 251b, and a protection voltage having a voltage level different from the ground voltage can be supplied to the first sub protection electrode 251a and the third sub protection electrode 251c. Alternatively, a protection voltage can be supplied to the second sub protection electrode 251b, and a ground voltage can be supplied to the first sub protection electrode 251a and the third sub protection electrode 251c. However, this is exemplary, and the voltage supplied to each of the first sub protection electrode 251a, the second sub protection electrode 251b, and the third sub protection electrode 251c according to an embodiment of the present application is not limited thereto, and can be variously supplied.

[0179] Although the above has been described with reference to the preferred embodiments of the present application, it is understood by those skilled in the art or a person with ordinary knowledge in the art that various modifications and changes can be made to the present application without departing from the spirit and technical scope of the present application as recited in the claims. Therefore, the technical scope of the present application should not be limited to the contents described in the detailed description of the present application, but should be determined by the claims.

Claims

1. An electronic device, characterized by comprising: Comprising: a display layer; a sensor layer arranged on the display layer, defining a sensing region including a first region and a second region separated from the first region; and a sensor drive section driving the sensor layer, wherein the sensor layer includes: a 1-1 electrode arranged in the first region, extending in a first direction; a 2-1 electrode arranged in the first region, extending in a second direction crossing the first direction, insulated from the 1-1 electrode; a 1-2 electrode arranged in the second region, extending in the second direction; a 2-2 electrode arranged in the second region, extending in the first direction, insulated from the 1-2 electrode; a first line connected to the 1-1 electrode and the 1-2 electrode; a 2-1 line connected to the 2-1 electrode; and a 2-2 line connected to the 2-2 electrode. 2.The electronic device of claim 1, wherein: the sensing region further includes a boundary region arranged between the first region and the second region, and wherein the sensor layer further includes a guard electrode arranged in the boundary region. 3.The electronic device of claim 2, wherein: the guard electrode is provided with a ground voltage. 4.The electronic device of claim 2, wherein: the guard electrode is in a floating state. 5.The electronic device of claim 2, wherein: the guard electrode and the 1-1 electrode are arranged in the same layer. 6.The electronic device of claim 2, wherein: the guard electrode includes a first sub-guard electrode and a second sub-guard electrode arranged in the first direction, and wherein each of the first sub-guard electrode and the second sub-guard electrode extends in the second direction. 7.The electronic device of claim 6, wherein: voltage levels of the first sub-guard electrode and the second sub-guard electrode are different from each other. 8.The electronic device of claim 6, wherein: the guard electrode further includes a third sub-guard electrode separated from the first sub-guard electrode in the first direction across the second sub-guard electrode. 9.The electronic device of claim 8, wherein: a voltage provided to the first sub-guard electrode and the third sub-guard electrode is different from a voltage provided to the second sub-guard electrode. 10.The electronic device of claim 1, wherein: the first line, the 2-1 line, and the 2-2 line are electrically connected to the sensor drive section. ​ ​ ​ ​ ​ ​ ​ ​ ​ ​ ​

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