Buffering dustproof sticker for computer mainboard

Abstract

The utility model discloses a computer mainboard buffer dustproof sticker. The computer mainboard buffer dustproof sticker comprises a release film, an adhesive layer, a foam layer, an anti-static adhesive tape and an insulating film which are arranged from top to bottom, a pull lug part is arranged on the outer side of the release film and extends out of the whole buffering dustproof sticker; the insulating film is provided with avoiding holes used for avoiding electronic elements on the mainboard. The computer mainboard buffering dustproof sticker is a simple and effective protection tool, and can provide buffering, dustproof and anti-static protection for the mainboard under the condition that heat dissipation is not obviously influenced, so that the mainboard is prevented from being influenced by dust, impact, vibration and static accumulation.

Description

TECHNICAL FIELD

[0001] The utility model relates to dustproof paste technical field, especially relates to a computer mainboard buffering dustproof paste. BACKGROUND

[0002] With the continuous progress of science and technology, the precision degree of electronic equipment and mechanical parts is higher and higher, and the requirement for protective materials is increasingly strict. The computer mainboard is the core component of the computer system, and a large number of precise electronic components are installed on it, such as BIOS chip, I / O control chip, expansion slot, etc., and its performance and service life are affected by dust, static electricity, vibration and other factors. Dust accumulation may cause poor heat dissipation, short circuit or component damage, and vibration may affect the stability of the precise components on the mainboard. Therefore, it is particularly important to develop a protective material that can prevent dust and buffer vibration. The traditional dustproof and buffering design often has general buffering effect, insufficient dustproof effect, and easy to affect the heat dissipation effect, which cannot meet the efficient protection requirement.

[0003] Therefore, it is necessary to develop a buffering dustproof paste which can provide effective protection for the mainboard without significantly affecting heat dissipation and is simple to use. UTILITY MODEL CONTENT

[0004] In order to solve the above technical problems, the purpose of the utility model is to provide a computer mainboard buffering dustproof paste, which is a simple and effective protection tool, can provide buffering, dustproof and anti-static protection for the mainboard without significantly affecting heat dissipation, so that the mainboard is not affected by dust, impact, vibration and static accumulation.

[0005] In order to achieve the above technical purpose and effect, the utility model realizes the following technical scheme:

[0006] A computer mainboard buffering dustproof paste, comprising release film, adhesive layer, foam layer, anti-static tape and insulating film arranged from top to bottom; the outer side of the release film has a pull ear part which extends to the outside of the whole buffering dustproof paste; the insulating film is provided with a relief hole for avoiding the electronic components on the mainboard.

[0007] Further, the release film comprises a PET film and a release agent coating layer arranged on one side of the PET film.

[0008] Further, the release film is a three-piece structure, comprising a middle piece located at the middle part and a left side piece and a right side piece located at the left and right sides.

[0009] Further, the adhesive layer comprises a PET substrate and an acrylic adhesive layer arranged on both sides of the PET substrate.

[0010] Further, the foam layer comprises a plurality of foam blocks designed according to the distribution of electronic components on the computer motherboard.

[0011] Further, the foam block is a polyurethane foam block.

[0012] Further, the anti-static tape comprises a PET substrate and a glue layer arranged on one side of the PET substrate; the side of the anti-static tape with the glue layer is bonded to the insulating film, and the other side of the anti-static tape is bonded to the foam layer through a double-sided glue layer.

[0013] Further, the double-sided glue layer comprises a PET substrate and an acrylic glue layer arranged on both sides of the PET substrate.

[0014] Further, the insulating film is a polyester film.

[0015] Further, the thickness of the release film is 75±5 μm, the thickness of the adhesive layer is 50 μm, the thickness of the foam layer is 0.5-6.5 mm, the thickness of the anti-static tape is 50 μm, and the thickness of the insulating film is 75±5 μm.

[0016] The computer motherboard cushioning dustproof paste of the present application has the following advantages:

[0017] The computer motherboard cushioning dustproof paste of the present application has the following advantages:

[0018] The computer motherboard cushioning dustproof paste of the present application is a simple and effective protective tool, which is pasted on the computer motherboard during use, can provide cushioning, dustproof and anti-static protection for the motherboard without significantly affecting heat dissipation, and can prevent the motherboard from being affected by dust, impact, vibration and static accumulation. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 Fig. 1 is a schematic view of the computer motherboard cushioning dustproof paste of the present application.

[0020] In the figure, 1: release film, 11: middle piece, 12: left side piece, 13: right side piece, 14: pull ear part; 2: adhesive layer; 3: foam layer, 31: foam block; 4: antistatic tape; 5: insulating film, 51: avoiding hole; 6: double-sided adhesive layer. DETAILED DESCRIPTION

[0021] The advantages and features of the present application will be more apparent from the following detailed description of the preferred embodiments of the present application, taken in conjunction with the accompanying drawings, so as to make the scope of the protection of the present application more clearly and explicitly defined.

[0022] As Figure 1 shown in the computer mainboard buffering dustproof paste, including from top to bottom set release film 1, adhesive layer 2, foam layer 3, antistatic tape 4 and insulating film 5, the outer side of the release film 1 has a pull ear part 14, which extends to the outside of the whole buffering dustproof paste, the insulating film 5 is provided with avoiding hole 51 for avoiding the electronic components on the mainboard.

[0023] Among them, the release film 1 includes PET film and release agent coating arranged on one side of the PET film. The release film is a three-piece structure, including a middle piece 11 located at the middle part and a left side piece 12 and a right side piece 13 located at the left and right sides. When used, the middle piece 11 of the middle part is first pasted, and then the left side piece 12 and the right side piece 13 of the two side parts are pasted, which facilitates the assembly line operation and improves the accuracy of pasting.

[0024] Among them, the adhesive layer 2 includes PET substrate and acrylic adhesive layer arranged on both sides of the PET substrate.

[0025] The foam layer 3 includes a plurality of foam blocks designed according to the distribution of electronic components on the computer mainboard. The foam block 31 is a polyurethane foam block. The shape of each foam block 31 is designed according to the electronic components, such as square, L-shaped, etc.

[0026] The antistatic tape 4 is a single-sided tape, which includes a PET substrate and an adhesive layer arranged on one side of the PET substrate; the side of the antistatic tape 4 with the adhesive layer is bonded to the insulating film 5, and the other side of the antistatic tape 4 is bonded to the foam layer 3 through the double-sided adhesive layer 6.

[0027] The double-sided adhesive layer 6 includes a PET substrate and an acrylic adhesive layer arranged on both sides of the PET substrate.

[0028] Among them, the insulating film 5 is a polyester film.

[0029] The shapes of the adhesive layer 2 and the double-sided adhesive layer 6 are designed according to the shapes of the foam blocks 31.

[0030] Example 1

[0031] like Figure 1 The computer motherboard cushioning dustproof sticker shown includes, from top to bottom, a release film 1, an adhesive layer 2, a foam layer 3, an antistatic tape 4, and an insulating film 5; the release film 1 has a pull tab 14 on its outer side, which extends outward from the entire cushioning dustproof sticker; the insulating film 5 is provided with a clearance hole 51 for avoiding electronic components on the motherboard.

[0032] The release film 1 includes a PET film and a release agent coating disposed on one side of the PET film. The release film 1 has a three-piece structure, comprising a middle piece 11 in the center and left and right pieces 12 and 13 on the left and right sides, respectively. In use, the middle piece 11 is applied first, followed by the left and right pieces 12 and 13, facilitating assembly line operations and improving application accuracy. In this embodiment, the release film 1 uses SYB7515, is blue, has a thickness of 75±5μm, and a release force of 15±5g / inch.

[0033] In this embodiment, the adhesive layer 2 is made of TESA 61350, which includes a black PET substrate and an acrylic adhesive layer disposed on both sides of the PET substrate. The thickness is 50μm, the tensile strength is 20N / cm, and the 180-degree peel force is >8N / cm.

[0034] The foam layer 3 includes several foam blocks 31 designed according to the distribution of electronic components on the computer motherboard. The foam blocks 31 are polyurethane foam blocks. In this embodiment, the foam blocks 31 are 4701-60-25093-04, with dimensional stability tested under the following conditions: 22 hours @ 176℉ (80℃) in a forced convection oven, maximum change: ±5%, and a coefficient of thermal expansion of 2.3-3.1×10⁻⁶. -4 in / in / ℃, temperature resistance: 70℃*8H.

[0035] The antistatic tape 4 is a single-sided tape, comprising a PET substrate and an adhesive layer disposed on one side of the PET substrate. The adhesive side of the antistatic tape 4 is bonded to the insulating film 5, and the other side of the antistatic tape 4 is bonded to the foam layer 3 via a double-sided adhesive layer 6. In this embodiment, the antistatic tape 4 uses TESA 7950, has a thickness of 50 μm, a tensile strength of 36.7 N / cm, and a dielectric breakdown voltage of 4500 V. In this embodiment, the double-sided adhesive layer 6 comprises a PET substrate and acrylic adhesive layers disposed on both sides of the PET substrate. The double-sided adhesive layer 6 uses TESA 61350, has a thickness of 50 μm, a tensile strength of 20 N / cm, and a 180-degree peel force >8 N / cm.

[0036] The insulating film 5 is a polyester film, adopts FAD FBE-75, is a black PET (polyester film), the film surface is bright, the color is uniform, is not light-transmitting, is not color-fading, and has good adhesion for the coating of ink and silicone oil, has good dimensional stability at high temperature, and still can keep excellent flatness after heating; the thickness is 75±5 mu m, and the surface impedance is greater than or equal to 10 12 / ohm.

[0037] In use, the release film 1 of the buffer dustproof paste is torn off, and then the buffer dustproof paste is pasted on the computer mainboard through the adhesive layer 2; when pasting, the buffer dustproof paste is pasted according to the distribution of the electronic components on the computer mainboard, and the avoiding hole 51 on the insulating film 5 is matched with the electronic components protruding on the mainboard.

[0038] The buffer dustproof paste comprises a release film 1, an adhesive layer 2, a foam layer 3, an anti-static adhesive tape 4 and an insulating film 5; the release film 1 has a pull ear 14, and can be conveniently torn off; in addition, the release film 1 is a three-piece structure, comprising a left side piece 12, a middle piece 11 and a right side piece 13, and can facilitate assembly line operation and improve the accuracy of pasting; the foam layer 3 comprises a plurality of foam blocks 31 designed according to the distribution of the electronic components on the computer mainboard, can provide a buffering function, and can prevent the mainboard from being affected by impact, vibration and the like; and the foam layer 3 also has good temperature resistance and can be used for a long time. The anti-static adhesive tape 4 has an anti-static function, can prevent static electricity from accumulating, and can prevent damage to the mainboard and the electronic components on the mainboard. The insulating film 5 has an avoiding hole 51, and can avoid interference with the high electronic components protruding on the mainboard.

[0039] The buffer dustproof paste is a simple and effective protection tool, which is pasted on the computer mainboard in use, can provide buffering, dustproof and anti-static protection for the mainboard without significantly affecting heat dissipation, and can prevent the mainboard from being affected by dust, impact, vibration and static electricity accumulation.

[0040] It is apparent to those skilled in the art that the present application is not limited to the details of the foregoing exemplary embodiments, and that the present application can be implemented in other particular forms without departing from the spirit or essential characteristics of the present application. Therefore, the embodiments should be considered in all respects as illustrative and not restrictive, and the scope of the present application should be defined by the appended claims rather than the above description, and all changes coming within the meaning and equivalency range of the essential elements of the claims are intended to be embraced therein.

[0041] Furthermore, it should be understood that although the specification is described in terms of embodiments, not every embodiment includes every feature or implementation described herein. The specification can include implicit combinations of explicitly mentioned features and / or implicit combinations of implicitly mentioned features. Such combinations are also expressly included within the scope of the specification and an embodiment.

Claims

1. A dustproof computer mainboard buffer sticker, characterized in that, The dustproof and shockproof paste comprises, from top to bottom, a release film, a sticky glue layer, a foam layer, an anti-static adhesive tape and an insulating film; the release film has a pull ear portion on the outer side, which extends to the outside of the whole dustproof and shockproof paste; the insulating film is provided with an avoiding hole for avoiding electronic elements on a mainboard.

2. The dustproof computer mainboard buffer sticker according to claim 1, characterized in that, The release film comprises a PET film and a release agent coating layer arranged on one side of the PET film.

3. The dustproof computer mainboard buffer sticker according to claim 1, characterized in that, The release film has a three-piece structure, comprising a middle piece arranged at the middle position and left and right side pieces arranged at the left and right sides.

4. The dustproofing computer mainboard buffer sticker according to claim 1, characterized in that, The sticky glue layer comprises a PET base material and an acrylic glue layer arranged on both sides of the PET base material.

5. The dustproofing computer mainboard buffer sticker according to claim 1, characterized in that, The foam layer comprises a plurality of foam blocks designed according to the distribution of electronic elements on the computer mainboard.

6. The dustproofing computer mainboard buffer sticker according to claim 5, characterized in that, The foam blocks are polyurethane foam blocks.

7. The dustproofing computer mainboard buffer sticker according to claim 1, characterized in that, The anti-static adhesive tape comprises a PET base material and a glue layer arranged on one side of the PET base material; the side of the anti-static adhesive tape with the glue layer is bonded to the insulating film, and the other side of the anti-static adhesive tape is bonded to the foam layer through a double-sided glue layer.

8. The dustproof computer mainboard buffer sticker according to claim 7, characterized in that, The double-sided glue layer comprises a PET base material and an acrylic glue layer arranged on both sides of the PET base material.

9. The dustproofing computer mainboard buffer sticker according to claim 1, characterized in that, The insulating film is a polyester film.

10. The dustproofing computer mainboard buffer sticker according to claim 1, characterized in that, The thickness of the release film is 75±5 μm, the thickness of the sticky glue layer is 50 μm, the thickness of the foam layer is 0.5-6.5 mm, the thickness of the anti-static adhesive tape is 50 μm, and the thickness of the insulating film is 75±5 μm.

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