Cooling fin mounting device for high-power power panel

Abstract

The utility model relates to the technical field of cooling fin installation, and discloses a cooling fin installation device for a high-power power panel, which comprises a positioning piece and a clamping piece, and the positioning piece and the clamping piece are both arranged on a mainboard; a plurality of clamping units are arranged on the clamping piece; one end of the radiating fin is in contact with the positioning piece; the side wall of the other end of the cooling fin is provided with a clamping groove matched with the clamping unit in an inserted mode. According to the invention, the effect of improving the convenience of dismounting and mounting the cooling fins on the mainboard is achieved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of fin mounting, in particular to a fin mounting device for a high-power power supply board. BACKGROUND

[0002] The high-power power supply board is a printed circuit board capable of processing high current and resisting high temperature for a long time, and is commonly used in GPU graphics cards or storage servers. When the high-power power supply board works, a large amount of heat is generated due to the heat effect caused by current passing through resistance, power conversion efficiency problems, poor environmental temperature and heat dissipation conditions and load factors. In order to control the heat of the high-power power supply board, a fin and a cooling fan are generally arranged on the mainboard of the high-power power supply board, and the fin and the cooling fan are used to dissipate heat from the mainboard of the high-power power supply board, so as to control the heat of the mainboard.

[0003] At present, the mainboard is generally placed in a box, and a connecting cylinder is arranged on the inner wall of the box. Holes are arranged on the mainboard and the heat dissipation piece for the screws to pass through. When the fin is installed, the fin is placed at the heat dissipation surface of the mainboard, and the screws pass through the fin and the mainboard in sequence and are threadedly connected with the connecting cylinder, so that the fin is fixedly installed at the heat dissipation surface of the mainboard.

[0004] However, in order to improve the stability of the fin installation, a plurality of screws are generally required to press the fin tightly on the mainboard, and there is a defect that disassembly and assembly are relatively complicated. CONTENT OF THE INVENTION

[0005] In order to improve the convenience of disassembling and assembling the fin on the mainboard, the application provides a fin mounting device for a high-power power supply board.

[0006] The fin mounting device for the high-power power supply board provided by the application adopts the following technical scheme:

[0007] A fin mounting device for a high-power power supply board, which is used for mounting a fin on a mainboard, and comprises a positioning piece and a clamping piece, wherein:

[0008] The positioning piece and the clamping piece are arranged on the mainboard;

[0009] A plurality of clamping units are arranged on the clamping piece;

[0010] One end of the fin is in contact with the positioning piece;

[0011] The other end of the fin is provided with a clamping groove matched with the clamping unit.

[0012] Optionally, the positioning piece comprises a positioning hemisphere.

[0013] The fin side wall is provided with a first placing groove for inserting the positioning hemisphere.

[0014] Optionally, the positioning member comprises a positioning column.

[0015] The fin side wall is provided with a second placing groove for placing the positioning column.

[0016] Optionally, the clamping member comprises a pair of clamping plates.

[0017] The clamping unit is arranged on the side of the clamping plates close to each other.

[0018] Optionally, the top of the clamping plate is provided with a fastening groove.

[0019] The side wall of the fastening groove is provided with a movable groove penetrating the side wall of the clamping plate.

[0020] The clamping unit is movably arranged in the movable groove.

[0021] The fastening groove is internally provided with a pushing unit for pushing the clamping unit to move.

[0022] Optionally, the pushing unit comprises a pushing plate and a first elastic pad, wherein:

[0023] The pushing plate is in plug-in cooperation with the fastening groove.

[0024] The bottom of the pushing plate is provided with a guide inclined surface.

[0025] The first elastic pad is arranged on the pushing plate and used for contacting the clamping unit.

[0026] When the clamping unit is arranged in the clamping groove, the first elastic pad is in a compressed state.

[0027] Optionally, the clamping unit is in a columnar shape.

[0028] Optionally, the clamping member comprises a second elastic pad.

[0029] The second elastic pad is in contact with the bottom of the fin.

[0030] When the clamping unit is arranged in the clamping groove, the second elastic pad is in a compressed state.

[0031] In summary, the present application has at least one of the following beneficial technical effects:

[0032] 1. Through the combined design of the first mounting plate, the positioning column and the positioning hemisphere in the positioning member, the heat dissipation fin can be accurately positioned. The positioning column and the positioning hemisphere cooperate with the placement groove at the end of the heat dissipation fin to ensure the accurate position of the heat dissipation fin during installation, and the arc design of the positioning hemisphere reduces the resistance when the heat dissipation fin rotates, improving the stability and smoothness of the installation process;

[0033] 2. The clamping unit in the clamping member can be firmly clamped into the clamping groove of the heat dissipation fin through the action of the pushing unit, realizing the limiting of the heat dissipation fin in the X-axis and Y-axis directions. The columnar design of the clamping unit increases the contact area with the inner wall of the clamping groove, improving the stability and reliability of clamping. At the same time, the elastic force of the second elastic pad further enhances the pressing force between the clamping unit and the clamping groove, ensuring that the heat dissipation fin will not loosen during use;

[0034] 3. The installation and disassembly of the heat dissipation fin can be completed through simple rotation and pushing actions, which is convenient for users to maintain and replace. In addition, the device has strong universality and can adapt to heat dissipation fins of different sizes and specifications, having wide applicability. BRIEF DESCRIPTION OF DRAWINGS

[0035] Figure 1 is a schematic diagram of the heat dissipation fin installed on the mainboard in the embodiment of the present application.

[0036] Figure 2 is a schematic diagram of the relative positions of the heat dissipation fin, the positioning member and the clamping member in the embodiment of the present application.

[0037] Figure 3 is a schematic diagram of the structure of the heat dissipation fin in the embodiment of the present application.

[0038] Figure 4 is a schematic diagram of the structure of the positioning member in the embodiment of the present application.

[0039] Figure 5 is a schematic diagram of the structure of the clamping member in the embodiment of the present application.

[0040] BRIEF DESCRIPTION OF DRAWINGS

[0041] 1, heat dissipation fin; 11, clamping groove; 12, first placement groove; 13, second placement groove; 2, mainboard; 3, positioning member; 31, first mounting plate; 32, positioning column; 33, positioning hemisphere; 4, clamping member; 41, clamping plate; 411, fastening groove; 412, movable groove; 42, second elastic pad; 43, second mounting plate; 5, clamping unit; 6, pushing unit; 61, pushing plate; 62, first elastic pad; 63, guide inclined surface; 64, handle. DETAILED DESCRIPTION

[0042] The following will be described in detail in combination with the accompanying Figures 1-5The application is further described in detail.

[0043] The application discloses a heat dissipation fin mounting device for a high-power power supply board.

[0044] The heat dissipation fin mounting device is mainly used for mounting a heat dissipation fin 1 on a mainboard 2. The heat dissipation fin mounting device for the high-power power supply board comprises a positioning member 3 and a clamping member 4. The positioning member 3 and the clamping member 4 are both mounted on the mainboard 2, and a placing area is formed between the two members. The clamping member 4 is provided with a clamping unit 5, and one end of the heat dissipation fin 1 is provided with a clamping groove 11.

[0045] When the heat dissipation fin 1 is mounted on the mainboard 2, the heat dissipation fin 1 is placed in the placing area, the heat absorbing surface of the heat dissipation fin 1 is contacted with the heat dissipation surface of the mainboard 2, one end of the heat dissipation fin 1 is contacted with the positioning member 3, and the other end of the heat dissipation fin 1 is located close to the clamping member 4. Then, the clamping unit 5 is clamped into the clamping groove 11 of the heat dissipation fin 1, the clamping unit 5 limits the heat dissipation fin 1 through the clamping groove 11, and the mounting of the heat dissipation fin 1 is completed. When the heat dissipation fin 1 needs to be replaced, the limitation of the clamping unit 5 on the heat dissipation fin 1 is released.

[0046] The positioning member 3 comprises a first mounting plate 31, a positioning column 32 and a positioning hemisphere 33. The first mounting plate 31 is pre-installed on the mainboard 2, the positioning column 32 is provided with a plurality of positioning columns 32 along the length direction of the first mounting plate 31, in the embodiment of the application, the positioning column 32 is provided with two positioning columns 32, the two positioning columns 32 are respectively located at two ends of the first mounting plate 31 and are fixed on the first mounting plate 31, and the axis of the positioning column 32 is perpendicular to the first mounting plate 31. The positioning hemisphere 33 is provided with two positioning hemispheres 33, the two positioning hemispheres 33 are respectively installed at two ends of the positioning column 32, and the diameter of the positioning hemisphere 33 gradually decreases along the direction from the positioning column 32 to the position far away from the positioning column 32.

[0047] The end of the heat dissipation fin 1 is provided with a first placing groove 12 and a second placing groove 13, the first placing groove 12 is used for placing the positioning hemisphere 33, the internal shape of the first placing groove 12 is adapted to the positioning hemisphere 33, and the first placing groove 12 is provided in a hemispherical shape. The second placing groove 13 is used for placing the positioning column 32, the internal shape of the second placing groove 13 is adapted to the shape of the positioning column 32, and the inner wall of the second placing groove 13 is provided in an arc shape.

[0048] When the heat dissipation sheet 1 is positioned, the positioning column 32 is placed inside the second placing groove 13, and the positioning hemisphere 33 is placed in the first placing groove 12, so as to complete the positioning of the heat dissipation sheet 1. The bottom of the heat dissipation sheet 1 is provided with a curved surface. When the heat dissipation sheet 1 is placed in the placing area, the positioning hemisphere 33 is first placed in the first placing groove 12, and then the heat dissipation sheet 1 is rotated around the positioning hemisphere 33, so that the heat absorption surface of the heat dissipation sheet 1 is in contact with the heat dissipation surface of the mainboard 2, thereby completing the positioning of the heat dissipation sheet 1. When the heat dissipation sheet 1 is rotated and positioned, the curved surface of the positioning hemisphere 33 and the curved surface of the bottom of the heat dissipation sheet 1 reduce the rotation resistance of the heat dissipation sheet 1 and improve the stability of the rotation process of the heat dissipation sheet 1.

[0049] The clamping piece 4 comprises a pair of clamping plates 41 and a second elastic pad 42. The bottom of the pair of clamping plates 41 is provided with a second mounting plate 43, and the clamping plate 41 and the second mounting plate 43 are integrally arranged in a U shape. The second mounting plate 43 is mounted on the mainboard 2. The top of the clamping plate 41 is provided with a fastening groove 411 facing the second mounting plate 43. The inner wall of the fastening groove 411 is provided with a movable groove 412 close to the other clamping plate 41. The movable groove 412 penetrates through the clamping plate 41 and is provided with a plurality of movable grooves 412 along the vertical direction of the clamping plate 41. The clamping unit 5 is located at the movable groove 412 and can move in the movable groove 412. The fastening groove 411 is provided with a pushing unit 6.

[0050] After the heat absorption surface of the heat dissipation sheet 1 is in contact with the heat dissipation surface of the mainboard 2, the end of the heat dissipation sheet 1 away from the positioning hemisphere 33 is located between the pair of clamping plates 41. The clamping groove 11 on the side wall of the end of the heat dissipation sheet 1 is adapted to the shape and number of the clamping unit 5.

[0051] After the heat dissipation sheet 1 is placed between the pair of clamping plates 41, the clamping unit 5 is moved in the movable groove 412 by the pushing unit 6, and the clamping unit 5 is partially clamped in the clamping groove 11. Since the movable groove 412 is partially located in the clamping groove 11, the heat dissipation sheet 1 is limited in the Y-axis direction by the clamping unit 5. Since the clamping unit 5 is tightly clamped in the clamping groove 11, the clamping unit 5 on the pair of clamping plates 41 cooperates to clamp the heat dissipation sheet 1, thereby limiting the heat dissipation sheet 1 in the X-axis direction.

[0052] In order to facilitate the movement of the clamping unit 5 in the movable groove 412 and to facilitate the increase of the contact surface between the clamping unit 5 and the inner wall of the clamping groove 11, and to improve the stability of the clamping unit 5 limiting the heat dissipation sheet 1, the clamping unit 5 is in a columnar shape.

[0053] The pushing unit 6 comprises a pushing plate 61 and a first elastic pad 62. The pushing plate 61 and the fastening groove 411 are insertedly matched. In order to facilitate the movement of the pushing plate 61, a handle 64 is arranged on the top of the pushing plate 61, and the operator moves the pushing plate 61 through the handle 64. A guide inclined surface 63 is arranged on the bottom of the pushing plate 61. During the process of inserting the pushing plate 61 into the inside of the fastening groove 411, the guide inclined surface 63 pushes the clamping unit 5 to move. At this time, since the clamping unit 5 is arranged in a columnar shape, the guide inclined surface 63 and the clamping unit 5 are rollingly matched, thereby reducing the difficulty of moving the clamping unit 5 in the movable groove 412.

[0054] Meanwhile, when the heat dissipation fin 1 needs to be taken out, after taking out the pushing plate 61, the arc on the clamping groove 11 suitable for the columnar clamping unit 5 facilitates the guidance of the clamping unit 5. When lifting the heat dissipation fin 1, the clamping unit 5 is pushed into the movable groove 412 inside the clamping groove 11, thereby improving the convenience of taking out the heat dissipation fin 1.

[0055] The first elastic pad 62 is installed on the pushing plate 61. When the first elastic pad 62 contacts the clamping unit 5, the first elastic pad 62 is in a compressed state when the clamping unit 5 is placed in the clamping groove 11. The first elastic pad 62 in the compressed state facilitates the clamping unit 5 to be tightly clamped in the clamping groove 11, thereby improving the stability of clamping the heat dissipation fin 1.

[0056] The second elastic pad 42 is installed on the second mounting plate 43. When the heat absorption surface of the heat dissipation fin 1 contacts the heat dissipation surface of the main plate 2, the second elastic pad 42 contacts the bottom of the heat dissipation fin 1 and is in a compressed state. The elastic force of the second elastic pad 42 further tightly clamps the clamping unit 5 and the clamping groove 11, thereby improving the limiting reliability of the heat dissipation fin 1 in the X-axis direction and the Y-axis direction.

[0057] In order to improve the heat dissipation efficiency and convenience of the high-power power board, the main plate 2 of the high-power power board is provided with a heat transfer plate. The heat generated by the components on the high-power power board is gathered on the heat transfer plate. The heat dissipation fin 1 is placed on the heat transfer plate and dissipates heat from the heat transfer plate. The heat transfer plate has a certain thickness. The first mounting plate 31 and the second mounting plate 43 are respectively located at both ends of the heat transfer plate, and the first mounting plate 31 and the second mounting plate 43 are flush with the top of the heat transfer plate. The first mounting plate 31 and the second mounting plate 43 adjust the height position of the heat dissipation fin 1, so as to reduce the possibility of damaging the heat transfer plate or even damaging the main plate 2 during the installation process of the heat dissipation fin 1.

[0058] The implementation principle of the heat dissipation fin mounting device for a high-power power supply board is as follows: during installation, first, the positioning column 32 is placed in the second placing groove 13, and the positioning hemisphere 33 is placed in the first placing groove 12, so that preliminary positioning is completed; then, the heat dissipation fin 1 is rotated around the positioning hemisphere 33 until the heat absorption surface is in contact with the heat dissipation surface of the main board 2, so that accurate positioning is completed. After the heat absorption surface of the heat dissipation fin 1 is in contact with the heat dissipation surface of the main board 2, the clamping unit 5 is pushed to move in the movable groove 412 by the pushing unit 6, so that the clamping unit 5 is partially abutted in the clamping groove 11, and the heat dissipation fin 1 is limited in the X-axis and Y-axis directions. When the heat absorption surface of the heat dissipation fin 1 is in contact with the heat dissipation surface of the main board 2, the second elastic pad 42 is in contact with and compressed by the bottom of the heat dissipation fin 1, the elastic force makes the clamping unit 5 abut against the clamping groove 11, and the limiting reliability is enhanced.

[0059] The above are preferred embodiments of the present application, and do not limit the protection scope of the present application. Therefore, equivalent changes made on the basis of the structure, shape and principle of the present application should be covered within the protection scope of the present application.

Claims

1. A heat sink mounting device for high power power boards, said heat sink (1) mounting device for mounting a heat sink (1) on a main board (2), characterized in that: The fin mounting device comprises a positioning member (3) and a clamping member (4), wherein: The positioning member (3) and the clamping member (4) are both arranged on the main plate (2); A plurality of clamping units (5) are arranged on the clamping member (4); One end of the fin (1) is in contact with the positioning member (3); A clamping groove (11) is arranged on the side wall of the other end of the fin (1) and is in plug-in cooperation with the clamping unit (5).

2. The fin mounting device for a high-power power supply plate according to claim 1, characterized in that: The positioning member (3) comprises a positioning hemisphere (33); A first placement groove (12) is arranged on the side wall of the fin (1) and is used for inserting the positioning hemisphere (33).

3. The fin mounting device for a high-power power supply plate according to claim 1, characterized in that: The positioning member (3) comprises a positioning column (32); A second placement groove (13) is arranged on the side wall of the fin (1) and is used for placing the positioning column (32).

4. The fin mounting device for a high-power power supply plate according to claim 1, characterized in that: The clamping member (4) comprises a pair of clamping plates (41); The clamping units (5) are arranged on the side of the clamping plates (41) close to each other.

5. The fin mounting device for a high-power power supply plate according to claim 4, characterized in that: A fastening groove (411) is arranged on the top of the clamping plate (41); A movable groove (412) is arranged on the side wall of the fastening groove (411) and penetrates the side wall of the clamping plate (41); The clamping unit (5) is movably arranged at the movable groove (412); A pushing unit (6) is arranged in the fastening groove (411) and is used for moving the clamping unit (5).

6. The fin mounting device for a high-power power supply plate according to claim 5, characterized in that: The pushing unit (6) comprises a pushing plate (61) and a first elastic pad (62), wherein: The pushing plate (61) is in plug-in cooperation with the fastening groove (411); A guide inclined surface (63) is arranged on the bottom of the pushing plate (61); The first elastic pad (62) is arranged on the pushing plate (61) and is used for contacting the clamping unit (5); When the clamping unit (5) is arranged in the clamping groove (11), the first elastic pad (62) is in a compressed state.

7. The fin mounting device for a high-power power supply plate according to claim 1, characterized in that: The clamping unit (5) is in a columnar shape.

8. The fin mounting device for a high-power power supply plate according to claim 1, characterized in that: The clamping member (4) comprises a second elastic pad (42); The second elastic pad (42) is in contact with the bottom of the fin (1); When the clamping unit (5) is arranged in the clamping groove (11), the second elastic pad (42) is in a compressed state.

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