Communication equipment and millimeter wave antenna

Abstract

The utility model relates to the technical field of millimeter wave antennas, and discloses a communication device and a millimeter wave antenna, comprising a substrate, the upper surface of the substrate is provided with a PCB, the upper surface of the PCB is provided with a radio frequency chip, the upper surface of the radio frequency chip is provided with a plurality of groups of first bonding alloy wires and a plurality of groups of second bonding alloy wires, two groups of antenna grounds are arranged at two ends of the upper surface of the PCB; one end of the first gold bonding wire can be conveniently moved through the adjusting part, so that the gap between the first gold bonding wire and the PCB is adjusted, the gap between the first gold bonding wire and the PCB is prevented from being too large, the consistency and reliability of signals in a vibration or impact environment are improved, the protection effect on the antenna is improved, and the service life of the antenna is prolonged. And the heat generated by the radio frequency chip is led out under the action of the heat conducting plate, so that the heat is dissipated through the plurality of groups of heat dissipation blades, thereby improving the heat dissipation effect on the communication equipment and prolonging the service life of the equipment.

Description

TECHNICAL FIELD

[0001] The utility model relates to millimeter wave antenna technical field, concretely is a kind of communication equipment and millimeter wave antenna. BACKGROUND

[0002] With the development of 5G millimeter wave communication, satellite, radar and other application scenarios, more and more scenarios need to develop different types of antennas, in some scene development, such as millimeter wave intelligent switch, intelligent furniture and other scenarios, we hope that millimeter wave antenna has low gain, so that its coverage area is wide;

[0003] In prior art, the Chinese utility model content with application number: CN202121201192.4, a kind of millimeter wave antenna module and communication equipment, including first bonding gold wire, PCB and impedance matching network;The impedance matching network is located at one side of the PCB;The side of the PCB is provided with the groove matched with the size of radio frequency chip, for placing radio frequency chip;One end of the first bonding gold wire is connected with the impedance matching network, the other end is used to be connected with the radio frequency chip, and there is interval between the first bonding gold wire and the PCB, gold wire bonding process is used, bonding gold wire is used as antenna, interval is set between bonding gold wire and PCB, and recess is provided on one side of PCB to place radio frequency chip, so that bonding gold wire can be in vacuum without PCB, therefore, PCB only needs to consider the wiring of low-frequency circuit, realizes the separation of antenna and low-frequency circuit, reduces the number of layers of PCB, thereby reduces the design complexity of antenna module, and further reduces the cost;

[0004] Millimeter wave antenna packaging in prior art is in shell, under high-frequency working condition, radio frequency chip and other electronic components can generate a large amount of heat, if heat dissipation is poor, it can cause device performance to decline or damage, overheated environment can affect the gain effect of antenna, reduce the service life of antenna, and the interval between PCB and bonding gold wire is large, impact can cause damage, therefore we need to propose a kind of communication equipment and millimeter wave antenna. UTILITY MODEL CONTENT

[0005] The utility model aims at providing a kind of communication equipment and millimeter wave antenna, improve the heat dissipation effect of radio frequency chip and antenna, reduce the influence of heat on antenna, guarantee the gain stability of antenna, to improve the use effect of antenna, simultaneously avoid the interval between bonding gold wire and PCB, reduce the influence of vibration and impact environment, improve the service life of antenna, to solve the problems proposed in the above background.

[0006] To achieve the above object, the utility model provides following technical scheme: a millimeter wave antenna, including the substrate, the upper surface of substrate is provided with PCB, the upper surface of PCB is installed with radio frequency chip, the upper surface of radio frequency chip is provided with a plurality of first bonding gold wire and a plurality of second bonding gold wire, the upper surface of PCB both ends is provided with two groups of antenna ground, the impedance matching network for first bonding gold wire connection is provided on both groups of antenna ground, the adjusting part is provided on the impedance matching network.

[0007] Preferably, the adjusting part includes a connecting rod, the upper end of the connecting rod is fixedly connected with a sealing plate, the upper surface of the sealing plate is provided with a knob in the middle, the lower end of the connecting rod is fixedly connected with a connecting block, one end of the connecting block is fixedly connected with the first bonding gold wire.

[0008] Preferably, the PCB includes a dielectric layer, a low-frequency circuit area and a metal layer, the antenna ground and the low-frequency circuit area are arranged on the same plane, and there is a gap between the antenna ground and the low-frequency circuit area.

[0009] A communication device includes a millimeter wave antenna described above, and further includes a plurality of heat dissipation components arranged on the substrate, the plurality of heat dissipation components are arranged equidistantly, the upper surface of the substrate is clamped with a packaging shell along the edge, and the upper surface of the packaging shell is provided with a sliding groove for slidingly arranging the connecting rod.

[0010] Preferably, the heat dissipation component includes a heat conduction plate and a plurality of heat dissipation blades, the plurality of heat dissipation blades are fixedly connected to the lower surface of the heat conduction plate, the upper surface of the substrate is provided with a mounting groove for mounting the heat conduction plate, and the lower ends of the plurality of heat dissipation blades penetrate into the lower part of the substrate.

[0011] Preferably, the upper surface of the heat conduction plate abuts against the lower surface of the PCB, heat-conducting paste is arranged between the substrate and the PCB, the cross section of the PCB is smaller than that of the substrate, and the inner cavity of the packaging shell is provided with an inner groove at the lower end, which is matched with the substrate.

[0012] Preferably, a plurality of clamping grooves are arranged on both sides of the inner cavity of the packaging shell, a plurality of protrusions matched with the clamping grooves are fixedly connected to both sides of the substrate, and a plurality of supporting frames are arranged on the lower surface of the substrate.

[0013] Compared with the prior art, the utility model has the beneficial effects that:

[0014] 1.The utility model mainly through the cooperation between PCB, adjusting spare, first keying gold wire and second keying gold wire realizes the separation of antenna and low frequency circuit, makes the layer number of PCB reduce, reduces the design complexity of antenna module, adjusts the clearance between first keying gold wire and PCB through the convenient movement of one end of first keying gold wire through adjusting spare, thereby avoids the clearance between first keying gold wire and PCB too big, improves the consistency and reliability of signal under the vibration or impact environment.

[0015] 2.The utility model discloses through the cooperation between base plate, heat dissipation component and package shell, can improve the stability of adjusting spare through package shell, improves the protection effect to antenna, and under the action of heat conduction plate exports the heat generated by radio frequency chip, makes heat dissipate through multiple sets of heat dissipation blades, thereby improves the heat dissipation effect to communication equipment, improves the service life of equipment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Fig. 1 It is the whole structure schematic diagram of the utility model;

[0017] Fig. 2 It is the PCB structure schematic diagram of the utility model;

[0018] Fig. 3 It is the package shell structure schematic diagram of the utility model.

[0019] In the drawing: 1, base plate;2, PCB;3, package shell;31, inner groove;32, clamping groove;33, sliding slot;4, adjusting spare;41, connecting rod;42, connecting block;43, sealing plate;44, tab;5, support frame;6, radio frequency chip;7, first keying gold wire;8, second keying gold wire;9, antenna ground;10, impedance matching network;11, mounting groove;12, heat dissipation component;121, heat conduction plate;122, heat dissipation blade;13, lug. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the utility model will be apparently and completely described below in conjunction with the drawings in the embodiments of the utility model, and obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by the ordinary skill in the art without creative labor belong to the range of protection of the utility model.

[0021] Please refer to Figs. 1-3The utility model provides a technical scheme: a kind of millimeter wave antenna, including substrate 1, the upper surface of substrate 1 is provided with PCB 2, the upper surface of PCB 2 is installed with radio frequency chip 6, the upper surface of radio frequency chip 6 is provided with multiple groups of first bonding gold wire 7 and multiple groups of second bonding gold wire 8, the upper surface of PCB 2 both ends is provided with two groups of antenna ground 9, two groups of antenna ground 9 are all provided with the impedance matching network 10 for the first bonding gold wire 7 connection, the impedance matching network 10 is all provided with adjusting part 4.

[0022] Adjusting part 4 includes connecting rod 41, the upper end of connecting rod 41 is fixedly connected with sealing plate 43, the upper surface of sealing plate 43 is provided with the middle part of tab 44, the lower end of connecting rod 41 is fixedly connected with connecting block 42, one end of connecting block 42 is fixedly connected with the first bonding gold wire 7, the position adjustment of first bonding gold wire 7 is facilitated by the position adjustment of connecting rod 41, thereby, the stability of first bonding gold wire 7 is improved.

[0023] PCB 2 includes dielectric layer, low-frequency circuit area and metal layer, antenna ground 9 is arranged in the same plane with low-frequency circuit area, there is interval between antenna ground 9 and low-frequency circuit area, first bonding gold wire 7 is four, corresponding with impedance matching network 10, the impedance matching of antenna is realized, the resonant frequency of antenna reaches target working frequency, maximum output power is obtained, and the performance of antenna is improved.

[0024] A kind of communication equipment, including the above-mentioned millimeter wave antenna, still include multiple groups of heat dissipation components 12 arranged on substrate 1, multiple groups of heat dissipation components 12 are equidistantly arranged, the upper surface of substrate 1 is clamped with encapsulation shell 3 along edge, the upper surface of encapsulation shell 3 is provided with the sliding slot 33 for the sliding arrangement of connecting rod 41, overall structure is simple, and production cost is reduced.

[0025] Heat dissipation component 12 includes heat conduction plate 121 and multiple groups of heat dissipation blades 122, multiple groups of heat dissipation blades 122 are all fixedly connected on the lower surface of heat conduction plate 121, the upper surface of substrate 1 is provided with the installation groove 11 for the installation of heat conduction plate 121, the lower end of multiple groups of heat dissipation blades 122 all penetrates to the lower of substrate 1, and the heat dissipation effect of radio frequency chip 6 is improved by multiple groups of heat dissipation blades 122.

[0026] The upper surface of heat conduction plate 121 is in contact with the lower surface of PCB 2, heat-conducting paste is arranged between substrate 1 and PCB 2, the cross section of PCB 2 is less than the cross section of substrate 1, the inner cavity lower end of encapsulation shell 3 is provided with inner groove 31 that is combined with substrate 1, the stable combination of encapsulation shell 3 and substrate 1 is facilitated by using inner groove 31, so as to improve the encapsulation effect of PCB 2.

[0027] A plurality of clamping grooves 32 are formed on both sides of the inner cavity of the packaging shell 3, a plurality of protrusions 13 are fixedly connected to both sides of the substrate 1 and matched with the clamping grooves 32, a plurality of supporting frames 5 are arranged on the lower surface of the substrate 1, the protrusions 13 and the clamping grooves are used to facilitate the installation of the packaging shell 3, improve the packaging efficiency, and the packaging shell 3 is made of ceramic material and has little influence on signal transmission.

[0028] In use, the position of the connecting rod 41 is adjusted by pushing the push piece 44 on the sealing plate 43, the connecting block 42 on the connecting rod 41 is adjusted in shape to facilitate the first bonding gold wire 7, the first bonding gold wire 7 is straightened, the first bonding gold wire 7 is prevented from being damaged due to shaking in a vibrating or impacting environment, the stability of the signal is improved, the heat generated by the operation of the radio frequency chip 6 is absorbed by the heat-conducting plate 121 of the heat dissipation assembly 12, is discharged from the packaging shell 3 through a plurality of heat dissipation blades 122, the overall heat dissipation effect of the communication equipment is improved, and the service life of the communication equipment is improved.

[0029] Although the embodiments of the present application have been shown and described, it should be understood that various changes, modifications, substitutions and variations can be made to these embodiments without departing from the principles and spirit of the present application, the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A millimeter wave antenna comprising a substrate (1), characterized in that: The upper surface of the substrate (1) is provided with a PCB (2), the upper surface of the PCB (2) is provided with a radio frequency chip (6), the upper surface of the radio frequency chip (6) is provided with a plurality of first bonding gold wires (7) and a plurality of second bonding gold wires (8), and the upper surface of the PCB (2) is provided with two groups of antenna grounds (9) at both ends, and the two groups of antenna grounds (9) are provided with impedance matching networks (10) connected by the first bonding gold wires (7), and the impedance matching networks (10) are provided with adjusting members (4).

2. The millimeter wave antenna of claim 1, wherein: The adjusting member (4) comprises a connecting rod (41), the upper end of the connecting rod (41) is fixedly connected with an enclosing plate (43), the upper surface of the enclosing plate (43) is provided with a knob (44) in the middle, and the lower end of the connecting rod (41) is fixedly connected with a connecting block (42), one end of the connecting block (42) is fixedly connected with the first bonding gold wire (7).

3. The millimeter wave antenna of claim 2, wherein: The PCB (2) comprises a dielectric layer, a low-frequency circuit area and a metal layer, the antenna ground (9) and the low-frequency circuit area are arranged on the same plane, and there is a gap between the antenna ground (9) and the low-frequency circuit area.

4. A communication device comprising a millimeter wave antenna according to any one of claims 1-3, characterized in that: A plurality of heat dissipation assemblies (12) are arranged on the substrate (1), the plurality of heat dissipation assemblies (12) are arranged at equal intervals, the upper surface of the substrate (1) is clamped with a packaging shell (3) along the edge, and the upper surface of the packaging shell (3) is provided with a sliding groove (33) for slidingly arranging the connecting rod (41).

5. A communications device according to claim 4, characterised in that: The heat dissipation assembly (12) comprises a heat conduction plate (121) and a plurality of heat dissipation blades (122), the plurality of heat dissipation blades (122) are fixedly connected to the lower surface of the heat conduction plate (121), the upper surface of the substrate (1) is provided with a mounting groove (11) for mounting the heat conduction plate (121), and the lower ends of the plurality of heat dissipation blades (122) penetrate to the lower side of the substrate (1).

6. A communications device according to claim 5, characterised in that: The upper surface of the heat conduction plate (121) abuts against the lower surface of the PCB (2), heat-conducting paste is arranged between the substrate (1) and the PCB (2), the cross section of the PCB (2) is smaller than that of the substrate (1), and the inner cavity of the packaging shell (3) is provided with an inner groove (31) matched with the substrate (1) at the lower end.

7. A communications device according to claim 6, characterised in that: A plurality of clamping grooves (32) are arranged on both sides of the inner cavity of the packaging shell (3), a plurality of protrusions (13) matched with the clamping grooves (32) are fixedly connected to both sides of the substrate (1), and a plurality of supporting frames (5) are arranged on the lower surface of the substrate (1).

Images