Photovoltaic power optimizer and photovoltaic system
By separating the heat-generating components from the circuit board and using a combination of conductive busbars and cables with a heat sink, the temperature rise problem caused by heat concentration in the photovoltaic power optimizer is solved, achieving better heat dissipation performance and system stability.
Patent Information
- Application Number
- CN202520395855.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-07
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-03-07
AI Technical Summary
In traditional photovoltaic power optimizers, the heat from electronic components is concentrated on the circuit board, resulting in high temperature and poor heat dissipation performance, making it difficult to meet the heat dissipation requirements of high current.
The heat-generating components are separated from the circuit board and connected to the circuit board and cables via conductive busbars. Combined with a heat sink, heat is dissipated, avoiding direct heat transfer to the circuit board and increasing the heat dissipation path.
This reduces the temperature rise of the circuit board, improves the heat dissipation performance of the photovoltaic power optimizer, and ensures the stability and reliability of the system.
Smart Images
Figure CN223885164U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to photovoltaic power electronic equipment technical field especially relates to a photovoltaic power optimizer and photovoltaic system. BACKGROUND
[0002] The role of photovoltaic power optimizer is to solve the influence of weather, shadow shielding, inconsistent orientation etc. on the power generation of photovoltaic system, realize the stable output of photovoltaic module power and improve the power generation of photovoltaic system.
[0003] The traditional photovoltaic power optimizer adopts integrated circuit board, various electronic components are integrated on the circuit board, and the heat generated by the electronic components is conducted to the heat dissipation fin through the heat-conducting silica gel for heat dissipation. This structure makes the heat generated by the electronic components all concentrate on the circuit board, and as the current applicable to the photovoltaic power optimizer becomes larger and larger, the heat generated by the electronic components also becomes larger and larger, which makes the temperature rise of the circuit board higher and higher, and can affect the circuit board. In addition, only the heat dissipation plate is used for single-direction heat dissipation, and the heat dissipation performance is poor, which is difficult to meet the heat dissipation demand of the photovoltaic power optimizer.
[0004] Therefore, it is urgent to provide a photovoltaic power optimizer and photovoltaic system to solve the above technical problems. UTILITY MODEL CONTENT
[0005] According to one aspect of the utility model, the utility model provides a photovoltaic power optimizer, part of the heat generating components and the circuit board are arranged in a split mode, the temperature rise of the circuit board is reduced, and the heat dissipation mode is more, and the heat dissipation performance of the photovoltaic power optimizer is improved.
[0006] To achieve this purpose, the utility model adopts the following technical scheme:
[0007] The photovoltaic power optimizer comprises:
[0008] A shell is provided with a mounting cavity, and a first cable hole is arranged on the shell and communicates with the mounting cavity and the outside, and the first cable hole is used for the first cable to pass through;
[0009] A circuit board is arranged in the mounting cavity;
[0010] A heat generating component is arranged in the mounting cavity, the heat generating component comprises a heat generating component and a conductive row, the heat generating component is arranged at intervals with the circuit board and is connected with the conductive row, one end of the conductive row is electrically connected with the circuit board, and the other end is used for being connected with the first cable;
[0011] A heat dissipation plate is arranged at the opening of the mounting cavity.
[0012] Optionally, two conductive rows are arranged, the heating component is arranged between the two conductive rows, two pins of the heating component are connected with the two conductive rows respectively, and one first cable hole is arranged on each conductive row.
[0013] Optionally, a plurality of heating components are arranged, and the plurality of heating components are arranged in parallel and at intervals.
[0014] Optionally, an electric connection hole is arranged on the circuit board, one end of the conductive row is bent to form a plug-in part, the plug-in part is electrically connected to the electric connection hole, the other end of the conductive row is provided with a cable connection part, and the cable connection part is crimped on the end of the first cable.
[0015] Optionally, an extension part is arranged on the shell at one side of the opening of the mounting cavity, part of the heat dissipation plate cover is arranged on the extension part, and a plurality of heat dissipation holes are arranged on the extension part.
[0016] Optionally, a second cable hole is further arranged on the shell and communicates with the mounting cavity and the outside, the second cable hole is arranged on the same side of the shell as the first cable hole, the second cable hole is used for arranging a second cable, one end of the second cable is electrically connected with the circuit board, a MOS tube and an inductor are arranged on the circuit board, and the heating assembly, the MOS tube, the inductor and the second cable are arranged along the same edge of the circuit board.
[0017] Optionally, a plurality of high-power components are integrated on the circuit board, and the plurality of high-power components are arranged on one side of the circuit board close to the heat dissipation plate.
[0018] Optionally, buckles are arranged on opposite inner walls of the mounting cavity, and clamping edges corresponding to the buckles are arranged on opposite edges of the heat dissipation plate, the clamping edges are respectively clamped with the corresponding buckles, and sealing glue is arranged between the outer peripheral wall of the heat dissipation plate and the shell.
[0019] Optionally, a plurality of positioning holes are arranged on the circuit board in a circumferential direction, and positioning columns corresponding to the positioning holes are arranged on the shell, and the positioning columns are inserted into the corresponding positioning holes.
[0020] Optionally, the mounting cavity is filled with sealing glue.
[0021] According to another aspect of the utility model, the utility model also provides a photovoltaic system, including photovoltaic assembly and above -mentioned any technical scheme photovoltaic power optimizer, the circuit board of photovoltaic power optimizer is electrically connected with photovoltaic assembly.
[0022] The utility model has the advantages of:
[0023] The utility model provides a photovoltaic power optimizer, including casing, circuit board, heating component and heat dissipation plate. Heating component includes heating component and electrically conductive row, and heating component is arranged at interval with circuit board, so setting, can avoid heating component and transmit heat to circuit board, effectively reduce the temperature rise of circuit board, and then reduce the influence of heat to circuit board. And heating component is electrically connected with circuit board and first cable through electrically conductive row, so that the heat of heating component can be dissipated through heat dissipation plate, and can be dissipated through electrically conductive row and first cable, improve the heat dissipation performance of the photovoltaic power optimizer.
[0024] The utility model also provides a photovoltaic system, including photovoltaic module and above -mentioned photovoltaic power optimizer. The photovoltaic system because adopted above -mentioned photovoltaic power optimizer, failure rate is lower, can guarantee the stability and reliability of delivery power. ACCURACY OF DRAWINGS
[0025] In order to more clearly illustrate the technical scheme in the utility model embodiment, the following will be needed to use the drawing in the utility model embodiment description briefly introduced, obviously, the drawing in the following description only some embodiments of the utility model, for those skilled in the art, under the premise of not paying creative labor, can also obtain other drawings according to the content of the utility model embodiment and these drawings.
[0026] Figure 1 It is the exploded schematic view of photovoltaic power optimizer provided by the utility model embodiment;
[0027] Figure 2 It is the schematic view of photovoltaic power optimizer of the utility model embodiment after heat dissipation plate is hidden;
[0028] Figure 3 It is the schematic view of photovoltaic power optimizer of the utility model embodiment after base is hidden;
[0029] Figure 4 It is Figure 1 The enlarged view at A;
[0030] Figure 5 It is Figure 1 The enlarged view at B;
[0031] Figure 6 It is the structure schematic view of photovoltaic power optimizer provided by the utility model embodiment;
[0032] Figure 7 It is the side view of photovoltaic power optimizer provided by the utility model embodiment;
[0033] Figure 8 It is the structure schematic view of circuit board provided by the utility model embodiment.
[0034] In the drawings:
[0035] 10, first cable; 20, second cable;
[0036] 100, housing; 101, mounting cavity; 110, shell; 120, base; 130, first cable hole; 140, extension; 141, heat dissipation hole; 150, buckle; 160, positioning column; 170, second cable hole;
[0037] 200, circuit board; 210, electrical connection hole; 220, positioning hole; 230, MOS tube; 240, inductor;
[0038] 300, heat generating component; 310, heat generating component; 320, conductive row; 321, plug-in part; 322, cable connection part; 323, convex bump;
[0039] 400, heat dissipation plate; 410, heat dissipation fin; 420, clamping edge. DETAILED DESCRIPTION
[0040] The utility model will be further described in detail below in combination with the drawings and examples. It can be understood that the specific examples described herein are only used to explain the utility model, and not to limit the utility model. In addition, it should be noted that, in order to facilitate the description, only the part related to the utility model is shown in the drawings, not all structures.
[0041] In the description of the utility model, unless otherwise explicitly specified and limited, the terms "connected", "connected", "fixed" should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated, it can be mechanically connected, or it can be electrically connected, it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.
[0042] In the utility model, unless otherwise explicitly specified and limited, the first feature "on" or "below" the second feature can include that the first and second features are in direct contact, or the first and second features are not in direct contact but are in contact through another feature between them. Moreover, the first feature "on", "above" and "above" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature.
[0043] In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like, orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second" are only used to distinguish in the description, and have no special meaning.
[0044] The present embodiment provides a photovoltaic power optimizer, which separates part of the heat generating components from the circuit board, reduces the temperature rise of the circuit board, and has multiple heat dissipation modes, thereby improving the heat dissipation performance of the photovoltaic power optimizer.
[0045] Specifically, as shown in the accompanying drawings, Figures 1-7 The photovoltaic power optimizer includes a housing 100, a circuit board 200, a heat generating assembly 300, and a heat dissipation plate 400. The housing 100 is provided with a mounting cavity 101, and the housing 100 is provided with a first cable hole 130 communicating with the mounting cavity 101 and the outside, and the first cable hole 130 is used for the first cable 10 to pass through. The circuit board 200 and the heat generating assembly 300 are arranged in the mounting cavity 101, the heat generating assembly 300 includes a heat generating component 310 and a conductive row 320, the heat generating component 310 is arranged apart from the circuit board 200 and connected with the conductive row 320, one end of the conductive row 320 is electrically connected with the circuit board 200, and the other end is used for being connected with the first cable 10. The heat dissipation plate 400 is arranged at the opening of the mounting cavity 101.
[0046] The photovoltaic power optimizer provided in the present embodiment arranges the heat generating component 310 apart from the circuit board 200, compared with the prior art in which all heat generating components 310 are integrated on the circuit board 200, the heat of the heat generating component 310 will not be directly transmitted to the circuit board 200, thereby reducing the temperature rise of the circuit board 200, and further reducing the influence of heat on the circuit board 200. In addition, the heat generating component 310 is arranged to be electrically connected with the circuit board 200 and the first cable 10 through the conductive row 320, so that the heat of the heat generating component 310 can be dissipated through the heat dissipation plate 400 and the conductive row 320 and the first cable 10, thereby improving the heat dissipation performance of the photovoltaic power optimizer.
[0047] Optionally, the mounting cavity 101 can be filled with sealant. By filling the sealant in the mounting cavity 101, the sealing performance of the photovoltaic power optimizer can be improved, which is conducive to protecting the parts in the mounting cavity 101, and further improving the working reliability of the photovoltaic power optimizer.
[0048] Further, the sealing glue can be selected as a sealing glue with heat conduction performance. In this way, the heat in the mounting cavity 101 can be quickly transferred to the heat dissipation plate 400 through the heat conduction performance of the sealing glue, and the heat dissipation performance of the photovoltaic power optimizer is improved.
[0049] Further, continuing to refer to Figure 2 and Figure 3 , the conductive row 320 is provided with two, and it can be understood that the two conductive rows 320 correspond to the positive and negative poles of the heat generating component 310 respectively. Moreover, the heat generating component 310 is arranged between the two conductive rows 320, and the two pins of the heat generating component 310 are connected to the two conductive rows 320 respectively. In this way, the two pins of the heat generating component 310 can be directly connected to the two conductive rows 320 at the shortest distance, which facilitates the assembly of the heat generating component 310 and also makes the structure of the heat generating assembly 300 more compact, occupies less space, and improves the space utilization rate of the mounting cavity 101.
[0050] It is worth noting that one first cable hole 130 is arranged corresponding to each conductive row 320, that is, two first cable holes 130 are arranged on the shell 100, and the first cable 10 is also provided with two, and each first cable 10 is connected to one conductive row 320 through one first cable hole 130.
[0051] Optionally, the two conductive rows 320 can be arranged in parallel and at intervals.
[0052] Optionally, continuing to refer to Figures 1-4 In this embodiment, the heat generating component 310 is provided with multiple, and the multiple heat generating components 310 are arranged in parallel and at intervals.
[0053] Optionally, in a possible embodiment, the heat generating component 310 can be a diode. In another possible embodiment, the heat generating component 310 can also be a triode, and at this time, the two pins of the triode are connected to the corresponding conductive rows 320 respectively, and the other pin of the triode can be directly connected to the circuit board 200.
[0054] Further, continuing to refer to Figure 2 and Figure 4The circuit board 200 is provided with an electric connection hole 210, one end of the conductive strip 320 is bent to form a plug-in part 321, the plug-in part 321 is plugged and electrically connected to the electric connection hole 210, and the electric connection between the conductive strip 320 and the circuit board 200 is realized in a plug-in mode, which is simple in structure and convenient for assembly. In addition, the other end of the conductive strip 320 is provided with a cable connection part 322, and the cable connection part 322 is riveted to the end of the first cable 10. The connection between the conductive strip 320 and the first cable 10 is realized in a riveting mode, the connection strength is high, the risk that the first cable 10 is separated from the conductive strip 320 due to being pulled is reduced, and the reliability of the connection between the conductive strip 320 and the first cable 10 is ensured.
[0055] Optionally, continuing to refer to Figure 4 The heating component 310 can be connected to the conductive strip 320 in a welding mode. The welding process is simple, and the electric connection is reliable. Specifically, the conductive strip 320 is provided with a convex part 323, and the pin of the heating component 310 is welded to the convex part 323.
[0056] Further, continuing to refer to Figure 2 and Figure 6 On the shell 100, an extension part 140 is arranged on one side of the opening of the mounting cavity 101, part of the heat dissipation plate 400 covers the extension part 140, and a plurality of heat dissipation holes 141 are arranged on the extension part 140. By arranging the extension part 140 on the shell 100 and covering the extension part 140 with the heat dissipation plate 400, the heat dissipation area of the heat dissipation plate 400 can be increased, which is conducive to improving the heat dissipation effect of the photovoltaic power optimizer. In addition, by arranging a plurality of heat dissipation holes 141 on the extension part 140, the upper surface and the lower surface of the heat dissipation plate 400 covering the heat dissipation holes 141 are directly in contact with the air, the heat exchange area between the heat dissipation plate 400 and the air is increased, and the heat dissipation effect of the heat dissipation plate 400 is improved.
[0057] Optionally, continuing to refer to Figure 1 and Figure 3 The circuit board 200 is provided with a plurality of positioning holes 220 in the circumferential direction, the shell 100 is provided with positioning columns 160 corresponding to the positioning holes 220 one by one, and the positioning columns 160 are plugged into the corresponding positioning holes 220. The circuit board 200 is fixed by cooperation of the positioning columns 160 and the positioning holes 220, which is simple in structure and convenient for assembly of the circuit board 200 in the mounting cavity 101.
[0058] Optionally, in the embodiment, the positioning holes 220 are four, and the four positioning holes 220 are arranged at the four corners of the circuit board 200. Of course, in other embodiments, the number and arrangement mode of the positioning holes 220 can also be other, which can be arranged according to actual needs, and the application is not limited in this regard.
[0059] Further, continuing to refer to Figure 5 , the opposite two inner walls of the mounting cavity 101 are provided with buckles 150, the opposite two sides of the heat dissipation plate 400 are provided with buckling edges 420 corresponding to the buckles 150, the buckling edges 420 are respectively buckled with the corresponding buckles 150, and the outer peripheral wall of the heat dissipation plate 400 is provided with sealing glue between the shell 100. When assembling the heat dissipation plate 400, the sealing glue can be coated on the outer peripheral wall of the heat dissipation plate 400, and then the buckling edges 420 on the two sides of the heat dissipation plate 400 are buckled with the corresponding buckles 150 on the shell 100. The assembly of the heat dissipation plate 400 and the shell 100 is realized by buckling and bonding, and the connection strength is better.
[0060] Optionally, continuing to refer to Figure 5 , in the embodiment, the heat dissipation plate 400 is a metal plate, and a plurality of heat dissipation fins 410 are arranged on the side of the heat dissipation plate 400 away from the mounting cavity 101. The heat dissipation fins 410 can increase the area of the heat dissipation plate 400 and improve the heat dissipation effect of the heat dissipation plate 400. Of course, in other embodiments, the structure of the heat dissipation plate 400 can also be other structures, which can be set according to actual needs, and the present application does not make specific limitations.
[0061] Optionally, continuing to refer to Figure 1 , in the embodiment, the shell 100 includes a shell 110 and a base 120, and the shell 110 and the base 120 can be connected by welding. Optionally, ultrasonic welding can be used when welding.
[0062] Further, a plurality of high-power components are integrated on the circuit board 200, and the plurality of high-power components are arranged on the side of the circuit board 200 close to the heat dissipation plate 400. The high-power components have large heat generation, so that the high-power components are arranged close to the heat dissipation plate 400, which can shorten the heat transfer path and is beneficial to realize rapid heat dissipation. Optionally, the high-power components can be MOS tubes, inductors, etc.
[0063] Optionally, the plug-in components with low heat generation can be arranged on the side of the circuit board 200 away from the heat dissipation plate 400, which is convenient for assembly.
[0064] Further, as Figure 2 , Figure 3 , Figure 6 and Figure 8As shown, the shell 100 is further provided with a second cable hole 170 which is in communication with the installation cavity 101 and the outside, the second cable hole 170 is located at the same side of the shell 100 as the first cable hole 130, the second cable hole 170 is used for the second cable 20 to pass through, one end of the second cable 20 is electrically connected with the circuit board 200. The circuit board 200 is provided with a MOS tube 230 and an inductor 240, the heating component 300, the MOS tube 230, the inductor 240 and the second cable 20 are arranged along the same edge of the circuit board 200. In this way, the large current loop (indicated by the thick solid line) on the circuit board 200 is as small as possible, so as to reduce the internal resistance, thereby reducing the heat generation of the large current loop. Figure 8
[0065] Continuing to refer to Figure 8 In the embodiment, the second cable hole 170 is provided with two, one second cable 20 is arranged in each second cable hole 170, and the two second cables 20 are used for being connected with the input end and the output end of the photovoltaic module. The two first cables 10 are used for being connected with the load.
[0066] Optionally, continuing to refer to Figure 2 、 Figure 3 and Figure 8 The inductor 240 can be in the form of a plug-in type, and part of the inductor 240 can be arranged on one side of the circuit board 200, so as to reduce the heat conduction of the inductor 240 to the circuit board 200, and facilitate the reduction of the temperature rise of the circuit board 200.
[0067] Optionally, the MOS tube 230 can be in the form of a plug-in MOS tube, or can be in the form of a SMT MOS tube, and the selection can be made according to actual needs.
[0068] The embodiment further provides a photovoltaic system, which comprises a photovoltaic module and the above-mentioned photovoltaic power optimizer, and the circuit board 200 of the photovoltaic power optimizer is electrically connected with the photovoltaic module.
[0069] The photovoltaic system has a low failure rate due to the adoption of the above-mentioned photovoltaic power optimizer, and can ensure the stability and reliability of the delivered power.
[0070] Obviously, the above-mentioned embodiments of the utility model are only examples for clearly explaining the utility model, and are not the limitation of the embodiments of the utility model. For ordinary skilled in the art, various obvious changes, re-adjustment and replacement can be made without departing from the protection scope of the utility model. Here, it is not necessary and impossible to enumerate all the embodiments. Any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model claim.
Claims
1. A photovoltaic power optimizer, characterized in that, The application relates to a shell (100) provided with a mounting cavity (101), a first cable hole (130) for a first cable (10) to pass through, a circuit board (200) arranged in the mounting cavity (101), a heating component (300) arranged in the mounting cavity (101), the heating component (300) comprising a heating component (310) and a conductive row (320), the heating component (310) being arranged in a spaced manner with the circuit board (200) and connected with the conductive row (320), one end of the conductive row (320) being electrically connected with the circuit board (200), and the other end being used for being connected with the first cable (10), and a heat dissipation plate (400) arranged at the opening of the mounting cavity (101). The conductive row (320) is provided with two conductive rows (320), the heating component (310) is arranged between the two conductive rows (320), two pins of the heating component (310) are connected with the two conductive rows (320) respectively, and each conductive row (320) is provided with one first cable hole (130). The heating component (310) is provided with a plurality of heating components (310) arranged in a parallel and spaced manner. The circuit board (200) is provided with an electric connection hole (210), one end of the conductive row (320) is formed into a plug-in part (321) through bending, the plug-in part (321) is plugged and electrically connected to the electric connection hole (210), the other end of the conductive row (320) is provided with a cable connecting part (322), and the cable connecting part (322) is crimped to the end of the first cable (10). The shell (100) is provided with an extension part (140) on one side of the opening of the mounting cavity (101), part of the heat dissipation plate (400) is arranged on the extension part (140), and the extension part (140) is provided with a plurality of heat dissipation holes (141).
2. The photovoltaic power optimizer of claim 1, wherein, The shell (100) is further provided with a second cable hole (170) for a second cable (20) to pass through, the second cable hole (170) is located on the same side of the shell (100) as the first cable hole (130), one end of the second cable (20) is electrically connected with the circuit board (200), the circuit board (200) is provided with a MOS tube (230) and an inductor (240), and the heating component (300), the MOS tube (230), the inductor (240) and the second cable (20) are arranged along the same edge of the circuit board (200).
3. The photovoltaic power optimizer of claim 2, wherein, The circuit board (200) is integrated with a plurality of high-power components, and the plurality of high-power components are arranged on one side of the circuit board (200) close to the heat dissipation plate (400).
4. The photovoltaic power optimizer of claim 1, wherein, 5. The photovoltaic power optimizer of claim 1, wherein, 6. The photovoltaic power optimizer of claim 1, wherein, 7. The photovoltaic power optimizer of claim 1, wherein, 8. The photovoltaic power optimizer according to any of claims 1-7, characterized in that, The opposite two inner walls of the mounting cavity (101) are provided with buckles (150), the opposite two sides of the heat dissipation plate (400) are provided with buckles (420) corresponding to the buckles (150), the buckles (420) are respectively buckled with the corresponding buckles (150), and the outer peripheral wall of the heat dissipation plate (400) is provided with sealing glue between the heat dissipation plate (400) and the shell (100).
9. The photovoltaic power optimizer according to any of claims 1-7, characterized in that, The circuit board (200) is provided with a plurality of positioning holes (220) in the circumferential direction, and the shell (100) is provided with positioning columns (160) corresponding to the positioning holes (220), and the positioning columns (160) are inserted into the corresponding positioning holes (220).
10. The photovoltaic power optimizer according to any of claims 1-7, characterized in that, The mounting cavity (101) is filled with sealing glue.
11. A photovoltaic system characterized by, The photovoltaic power optimizer of any one of claims 1-10, wherein the circuit board (200) of the photovoltaic power optimizer is electrically connected to the photovoltaic assembly.