Circuit board and case with heat dissipation structure

Abstract

According to the circuit board and the case with the heat dissipation structure provided by the embodiment of the utility model, the heating element and the circuit board are arranged vertically or approximately vertically, so that the air flow is improved, the heat accumulation is reduced, and the heat dissipation effect is improved; meanwhile, the heating element is tightly attached to the vertical side plate through the pressing piece, heat generated by the heating element is conducted to the vertical side plate, and the heat dissipation effect is further improved through the cooling fins on the vertical side plate.

Description

TECHNICAL FIELD

[0001] The utility model relates to the heat dissipation technical field of electronic equipment, specifically relates to a circuit board and the case with heat dissipation structure. BACKGROUND

[0002] With electronic component structure size reduces unceasingly, power unceasingly improves and electronic equipment integration degree is higher and higher, lead to electronic component and device volume power density or area power density is bigger and bigger, and the motor board in the case is usually fixed in the inside of the case in the form of stacking. These all lead to the heat generated in the working process of the case not easy to dissipate, which will greatly affect the performance of the components. SUMMARY

[0003] The utility model discloses a circuit board and the case with heat dissipation structure, and aims at solving the problem of poor heat dissipation effect of the case in the prior art.

[0004] In the first aspect, the utility model provides a circuit board, the circuit board has heating element, the heating element has main heating surface, and the heating element is fixed in the edge position of the circuit board through element pin, and the main heating surface is perpendicular or approximately perpendicular to the circuit board.

[0005] In some possible embodiments, the heating element is multiple, and the main heating surface of multiple heating elements is in the same direction.

[0006] In the second aspect, the utility model provides a case with heat dissipation structure, and the case includes the circuit board as described above, and the case further includes vertical side plate, the side of the circuit board is connected with the vertical side plate, and the circuit board is perpendicular to the vertical side plate.

[0007] The main heating surface of the heating element is arranged towards the inner side wall of the vertical side plate, and the heating element is fixed on the inner side wall of the vertical side plate through the pressing sheet.

[0008] In some possible embodiments, a heat dissipation pad is further arranged between the heating element and the inner side wall of the vertical side plate.

[0009] In some possible embodiments, the pressing sheet is an arch bridge structure with the middle region arched up, and the pressing sheet includes an arched arch region and first and second pressing sheet regions at both ends of the arch region, and the arch region is arched up towards the side away from the vertical side plate.

[0010] In some possible embodiments, the first pressing sheet region is fixedly connected with the inner side wall of the vertical side plate, and the second pressing sheet region is pressed on the side of the heating element away from the vertical side plate.

[0011] In some possible embodiments, the case with the heat dissipation structure further comprises a heat shrink tube, the second pressing piece region is sleeved inside the heat shrink tube and is pressed on a side of the heat generating element away from the vertical side plate.

[0012] In some possible embodiments, the heat dissipation pad is a heat conductive silica gel pad, or a heat conductive silver glue layer, or an indium foil.

[0013] In some possible embodiments, the case further comprises a top plate and a bottom plate, the top plate and the bottom plate are oppositely arranged, the bottom plate and the top plate are movably connected with the vertical side plate through detachable connecting members respectively, the circuit board is arranged between the bottom plate and the top plate, and a plurality of heat dissipation holes are formed in the top plate and the bottom plate respectively.

[0014] In some possible embodiments, a plurality of heat dissipation fins are further arranged on the outer side wall of the vertical side plate, the plurality of heat dissipation fins are vertically arranged with the top plate and are arrayed on the outer side wall of the vertical side plate.

[0015] The embodiment of the utility model provides a kind of circuit board and the case with heat dissipation structure, by vertically or approximately vertically arranging heat generating element and circuit board, improve air flow, reduce heat accumulation, improve heat dissipation effect;Simultaneously, heat generating element is adhered to vertical side plate by pressing piece, heat generated by heat generating element is conducted to vertical side plate, and heat dissipation fin on vertical side plate is further used to improve heat dissipation effect. BRIEF DESCRIPTION OF DRAWINGS

[0016] The technical scheme of the utility model and other beneficial effects will be apparent by detailed description of the specific implementation manner of the utility model in combination with the drawings.

[0017] Figure 1 An embodiment structure schematic diagram of the case provided by the utility model is shown in the drawing.

[0018] Figure 2 An embodiment schematic diagram of pressing piece for pressing heat generating element provided by the embodiment of the utility model is shown in the drawing.

[0019] Figure 3 Another embodiment schematic diagram of pressing piece for pressing heat generating element provided by the embodiment of the utility model is shown in the drawing. DETAILED DESCRIPTION

[0020] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be particularly noted that the following embodiments are for illustrative purposes only and do not limit the scope of the present invention. Similarly, the following embodiments are only some, not all, embodiments of the present invention, and all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0021] In the following description of this utility model, "some embodiments" are used, which describe a subset of all possible embodiments. However, it is understood that "some embodiments" can be the same subset or different subsets of all possible embodiments, and can be combined with each other without conflict.

[0022] In the following description of this utility model, the terms "first, second, third" are used only to distinguish similar objects and do not represent a specific order of objects. It is understood that "first, second, third" can be interchanged in a specific order or sequence where permitted, so that the embodiments of this utility model described herein can be implemented in an order other than that illustrated or described herein.

[0023] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing embodiments of the invention only and is not intended to limit the invention.

[0024] The following detailed description, in conjunction with specific embodiments, should be noted. It should be understood that the sequence numbers of the embodiments are not intended to limit the preferred order of the embodiments. This utility model provides a circuit board and a chassis with a heat dissipation structure. The circuit board and chassis with a heat dissipation structure provided by this utility model will be described in detail below with reference to the accompanying drawings.

[0025] like Figure 1 The diagram shown is a structural schematic of one embodiment of the chassis provided by this utility model. Figure 1 In the illustrated embodiment, the chassis includes a top plate 10, a bottom plate 20, and vertical side plates 30. The top plate 10 and bottom plate 20 are positioned opposite each other and are movably connected to the vertical side plates 30 via multiple movable connectors. The chassis has an overall cuboid structure. The chassis also includes a circuit board (not shown), located inside the chassis and parallel to the top plate 10 and bottom plate 20. The sides of the circuit board are connected to the vertical side plates 30, and the circuit board is perpendicular to the vertical side plates 30. The circuit board also has a heating element 40, which is also located inside the chassis. The heating element 40 continuously generates heat during operation and typically requires heat dissipation to ensure the normal operation of the components.

[0026] Specifically, in the utility model, the heating element 40 can be fixed at the edge position of the circuit board through the element pin, and the heating element 40 has a main heating surface, and the heat generated by the heating element 40 is mainly released from the main heating surface. In the utility model, the main heating surface can be perpendicular or approximately perpendicular to the circuit board, that is, the heating element and the circuit board are perpendicular or approximately perpendicular, which can facilitate air flow, reduce heat accumulation and improve the heat dissipation effect. Among them, the main heating surface is approximately perpendicular to the circuit board, and the angle between the main heating surface and the circuit board is between 85°-90°. When the heating element 40 is multiple, the multiple heating elements 40 can be fixed at the edge position of the circuit board through the element pin, and the main heating surfaces of the multiple heating elements are in the same direction.

[0027] Since the circuit board is perpendicular to the vertical side plate 30, the heating element 40 is also perpendicular or approximately perpendicular to the circuit board, so the heating element 40 and the vertical side plate 30 can be arranged in parallel. Specifically, the main heating surface of the heating element 40 can be arranged towards the inner side wall of the vertical side plate 30, and the heating element 40 can be fixed on the inner side wall of the vertical side plate 30 through the pressing sheet 50. The utility model utilizes the pressing sheet 50 to fix the heating element 40 on the inner side wall of the vertical side plate 30, can guide the heat generated by the heating element 40 to the vertical side plate 30, and utilize the vertical side plate 30 for heat dissipation. And the utility model, the inner side wall between the heating element 40 and the vertical side plate 30 is also provided with the heat dissipation pad 60, the heat dissipation pad 60 can further guide the heat generated by the heating element 40 to the vertical side plate 30, to utilize the vertical side plate 30 for heat dissipation, and the heat dissipation pad can further fix the heating element 40, guarantee that the heating element 40 and the vertical side plate 30 are close. In some embodiments, the heat dissipation pad 60 can be a heat-conducting silica gel pad, or a heat-conducting silver glue layer, or an indium foil.

[0028] Figure 2 An embodiment example of the pressing sheet for pressing the heating element provided by the utility model embodiment is shown in the figure, Figure 3 Another embodiment example of the pressing sheet for pressing the heating element provided by the utility model embodiment is shown in the figure, Figure 2 In the embodiment shown in the figure, the pressing sheet 50 is in the overall arch bridge shape structure of the middle region arching, and the pressing sheet 50 includes the arched arch region 502 and the first pressing sheet region 501 and the second pressing sheet region 503 located at both ends of the arch region; the first pressing sheet region 501 and the second pressing sheet region 503 are respectively located at the left and right sides of the arch region 502, and the first pressing sheet region 501 is usually fixedly connected with the inner side wall of the vertical side plate 30 through the screw, and the second pressing sheet region 503 is pressed on the side of the heating element 40 away from the heat dissipation pad 60, and the main heating surface of the heating element 40 is the side close to the inner side wall of the vertical side plate 30.

[0029] In the utility model, the tablet 50 can be prepared by using high-hardness material such as stainless steel to press the second tablet area 503 on the heating element 40, and the heating element 40 is tightly attached to the vertical side plate. When the tablet 50 is not fixed to the vertical side plate 30 and not tightly attached to the heating element 40, the bottom of the first tablet area 501 and the bottom of the second tablet area 503 are usually in the same plane, so that more pressure can be applied to the heating element 40 when the second tablet area 503 is pressed tightly to ensure that the heating element 40 is tightly attached to the vertical side plate 30.

[0030] In the utility model, the case further comprises a heat shrink tube (not shown in the figure), which is a hollow structure, and the second tablet area 503 is sleeved inside the heat shrink tube and tightly attached to the heating element 40. Specifically, since the tablet 50 in the utility model is usually made of metal heat-conducting material to facilitate heat conduction, if the tablet 50 is directly pressed on the heating element 40, it may cause damage to the heating element 40, so an additional heat shrink tube can be provided, and the area of the tablet 50 that needs to be tightly attached to the heating element 40 is placed in the heat shrink tube to avoid direct contact between the tablet 50 and the heating element 40, thereby protecting the heating element 40. Therefore, the second tablet area 503 can be sleeved in the heat shrink tube, and the heat shrink tube can be heated to be tightly fixed outside the second tablet area 503 after shrinking; then the second tablet area 503 including the heat shrink tube is tightly attached to the side of the heating element, at this time the heat shrink tube directly contacts the heating element 40 to avoid damage to the heating element 40 by the tablet 50. In some embodiments, the second tablet area 503 can also include multiple tablet sub-areas, that is, part of the tablet in the second tablet area 503 can be divided into multiple sub-tablets, and the multiple sub-tablets are tightly attached to one heating element 40 at the same time; in this way, when a certain sub-tablet has a warping problem, other sub-tablets can also apply pressure to ensure that the second tablet area 503 can be tightly attached to the heating element 40. In the foregoing embodiment, when part of the tablet in the second tablet area 503 includes multiple sub-tablets, the heat shrink tube can also be multiple, and the multiple sub-tablets are respectively sleeved inside the multiple heat shrink tubes to protect the heating element 40.

[0031] In some embodiments, when the heating element 40 is multiple, the main heating surface of the multiple heating elements 40 can be arranged to face the vertical side plate 30. And the tablet 50 is also multiple, and the multiple tablets 50 press the multiple heating elements 40 on the inner side wall of the vertical side plate 30; at the same time, a heat dissipation pad is arranged between each heating element 40 and the inner side wall of the vertical side plate 30 to further dissipate heat.

[0032] The plurality of heat dissipation holes 70 can help air circulation to take away heat and achieve a heat dissipation effect.

[0033] The plurality of heat dissipation holes 70 can help air circulation to take away heat and achieve a heat dissipation effect.

[0034] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described in detail in a certain embodiment can be referred to the related description of other embodiments.

[0035] The above description is only a preferred embodiment of the present application, and is not intended to limit the present application. Any modification, equivalent replacement and improvement within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A circuit board having a heat generating element, characterized by, The heating element has a main heating surface, and the heating element is fixed at an edge position of the circuit board through an element pin, and the main heating surface is perpendicular or approximately perpendicular to the circuit board.

2. The circuit board of claim 1, wherein The heating element is multiple, and the multiple heating elements are fixed at the edge position of the circuit board through element pins, and the main heating surfaces of the multiple heating elements are in the same direction.

3. A cabinet having a heat dissipation structure, characterized by comprising: The case includes the circuit board as claimed in claim 1 or 2, and further includes a vertical side plate, a side edge of the circuit board is connected with the vertical side plate, and the circuit board is perpendicular to the vertical side plate; The main heating surface of the heating element is arranged towards an inner side wall of the vertical side plate, and the heating element is fixed on the inner side wall of the vertical side plate through a pressing sheet.

4. The case having a heat dissipation structure according to claim 3, characterized by, A heat dissipation pad is further arranged between the heating element and the inner side wall of the vertical side plate.

5. The case having a heat dissipation structure according to claim 3, wherein The pressing sheet is an arch bridge structure with an arching middle region, and the pressing sheet includes an arching arch region and first and second pressing sheet regions located at both ends of the arch region, and the arch region is arched towards a side away from the vertical side plate.

6. The case having a heat dissipation structure according to claim 5, wherein The first pressing sheet region is fixedly connected with the inner side wall of the vertical side plate, and the second pressing sheet region is pressed on a side of the heating element away from the vertical side plate.

7. The case having a heat dissipation structure according to claim 5, wherein The case with the heat dissipation structure further includes a heat shrink tube, and the second pressing sheet region is sleeved inside the heat shrink tube and is pressed on the side of the heating element away from the vertical side plate.

8. The case having a heat dissipation structure according to claim 4, wherein The heat dissipation pad is a heat-conducting silica gel pad, or a heat-conducting silver glue layer, or an indium foil.

9. The case having a heat dissipation structure according to claim 3, characterized by, The case further includes a top plate and a bottom plate, the top plate and the bottom plate are oppositely arranged, the bottom plate and the top plate are movably connected with the vertical side plate through detachable connecting members, the circuit board is arranged between the bottom plate and the top plate, and a plurality of heat dissipation holes are respectively formed in the top plate and the bottom plate.

10. The case having a heat dissipation structure according to claim 9, wherein, A plurality of heat dissipation fins are further arranged on an outer side wall of the vertical side plate, the plurality of heat dissipation fins are arranged in an array on the outer side wall of the vertical side plate and are arranged perpendicularly to the top plate.

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