Ball grid array (BGA) outgoing line structure capable of avoiding back drilling and crosstalk of high-speed line
By using laser-drilled holes and through-hole connections on printed circuit boards, high-speed back-drilling is avoided, stub and signal crosstalk issues are resolved, production costs are reduced, and signal quality and routing flexibility are improved.
Patent Information
- Application Number
- CN202520158135.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-02-06
- Estimated Expiration
- 2035-01-21
AI Technical Summary
In existing technologies, BGA line-out designs require back-drilling of high-speed line vias, which leads to high production difficulty and high costs.
Laser-drilled holes are used to connect the first high-speed signal output line from the top layer of the printed circuit board to the second layer, and through-holes are used to connect the second high-speed signal output line, thereby avoiding stubs and signal crosstalk and reducing the use of back-drilling processes.
It effectively avoids stub problems, reduces production costs, improves signal quality and wiring flexibility, and achieves a more reliable and higher-performance circuit system.
Smart Images
Figure CN223885373U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to circuit board technical field, specifically relates to a kind of BGA line structure of avoiding high-speed line back drilling and crosstalk. BACKGROUND
[0002] Printed Circuit Board (PCB) plays a vital role in modern electronic equipment, it is not only the physical support structure of electronic components, is the key carrier to realize the efficient and orderly transmission of electronic signals between components. As the core component of electronic products, the design and manufacturing quality of PCB directly affects the performance and stability of the whole system.
[0003] In some PCB designs, BGA is set in the TOP layer, and 2 signal layers are needed to process high-speed line in a single direction. In order to realize the above line requirements, the traditional design method is to connect high-speed lines to different signal layers through vias, and these vias will leave stubs (i.e. unused hole segments), which will cause signal reflection and attenuation, affecting signal quality. In order to reduce the impact of stubs on signal quality, back drilling is needed for high-speed line vias. However, back drilling is a complex and costly process, which increases the difficulty and cost of production.
[0004] The above shortcomings need to be improved. UTILITY MODEL CONTENT
[0005] In order to overcome the problem of back drilling high-speed line vias in the prior art BGA line design method, resulting in high production difficulty and cost, the utility model provides a BGA line structure for avoiding high-speed line back drilling and crosstalk.
[0006] The technical scheme of the utility model is as follows:
[0007] A BGA line structure for avoiding high-speed line back drilling and crosstalk, comprising a printed circuit board, the top layer of the printed circuit board is provided with a BGA area, the second layer and the second to last layer of the printed circuit board are signal layers, the second layer of the printed circuit board is provided with a first high-speed signal line, the first high-speed signal line is connected to the BGA area through a laser hole, the second to last layer of the printed circuit board is provided with a second high-speed signal line, and the second high-speed signal line is connected to the BGA area through a via.
[0008] As a preferred scheme of the utility model, the laser hole is communicated from the top layer of the printed circuit board to the second layer of the printed circuit board.
[0009] As one preferred scheme of the present utility model, the second layer of the printed circuit board is provided with a plurality of rows of the first high-speed signal outgoing line outside the first outgoing line direction, and the penultimate layer of the printed circuit board is provided with a plurality of rows of the second high-speed signal outgoing line inside the first outgoing line direction.
[0010] As one preferred scheme of the present utility model, the second layer of the printed circuit board is provided with a plurality of rows of the first high-speed signal outgoing line outside the first outgoing line direction, and the penultimate layer of the printed circuit board is provided with a plurality of rows of the second high-speed signal outgoing line inside the first outgoing line direction.
[0011] As one preferred scheme of the present utility model, the second layer of the printed circuit board is provided with a plurality of rows of the first high-speed signal outgoing line outside the first outgoing line direction, and the penultimate layer of the printed circuit board is provided with a plurality of rows of the second high-speed signal outgoing line inside the first outgoing line direction.
[0012] As one preferred scheme of the present utility model, the second layer of the printed circuit board is provided with a plurality of rows of the first high-speed signal outgoing line outside the first outgoing line direction, and the penultimate layer of the printed circuit board is provided with a plurality of rows of the second high-speed signal outgoing line inside the first outgoing line direction.
[0013] As one preferred scheme of the present utility model, the thickness of the penultimate layer to the bottom layer of the printed circuit board is less than or equal to the aperture of the laser hole.
[0014] As one preferred scheme of the present utility model, the printed circuit board is at least six layers.
[0015] As one preferred scheme of the present utility model, the second layer of the printed circuit board is a signal outgoing line layer, and the penultimate layer of the printed circuit board is a signal receiving line layer.
[0016] As one preferred scheme of the present utility model, the second layer of the printed circuit board is a signal receiving line layer, and the penultimate layer of the printed circuit board is a signal outgoing line layer.
[0017] Compared with the prior art, the present utility model has the beneficial effects that:
[0018] The BGA wire-out structure provided by the utility model has the advantages that the first high-speed signal wire-out line is arranged on the second layer of the printed circuit board, and the laser hole is arranged from the top layer to the second layer, so that the first high-speed signal wire-out line has no stub problem, and the laser hole does not increase the number of pressing during the production of the board factory, and has little influence on the cost; the second high-speed signal wire-out line is arranged on the second-to-last layer of the printed circuit board, and the through hole is connected, and the thickness from the second-to-last layer to the bottom layer is relatively small (less than 4 mil), so that the requirement of the maximum stub of the high-speed signal wire-out line (for example, 6 mil) is completely met, so that the wire-out line of the layer can not be back-drilled; meanwhile, the laser hole used by the first high-speed signal wire-out line arranged on the second layer only connects the top layer and the second layer, so that the signal crosstalk of the second high-speed signal wire-out line of the second-to-last layer and the first high-speed signal wire-out line of the second layer in the Z-axis direction is avoided. BRIEF DESCRIPTION OF DRAWINGS
[0019] In order to more clearly illustrate the technical scheme in the embodiments of the utility model, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description, obviously, the drawings in the following description are only some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creating labor.
[0020] Figure 1 It is a local schematic view of the BGA wire-out structure in the embodiment of the utility model for avoiding high-speed wire back drilling and crosstalk in the first wire-out direction;
[0021] Figure 2 It is a local wire-out schematic view of the second layer of the printed circuit board in the first wire-out direction in the embodiment of the utility model;
[0022] Figure 3 It is a local wire-out schematic view of the second layer of the printed circuit board in the first wire-out direction in the embodiment of the utility model;
[0023] Figure 4 It is a local wire-out schematic view of the second layer of the printed circuit board in the second wire-out direction in the embodiment of the utility model;
[0024] Figure 5 It is a local wire-out schematic view of the second layer of the printed circuit board in the second wire-out direction in the embodiment of the utility model.
[0025] In the drawings,
[0026] 1, printed circuit board;2, BGA area;3, first high-speed signal wire-out line;4, laser hole;5, second high-speed signal wire-out line;6, through hole. DETAILED DESCRIPTION
[0027] In order to make the technical problems, technical schemes and beneficial effects of the utility model clearer and more apparent, the utility model will be further described in detail below in combination with the drawings and embodiments. It should be noted that similar reference numerals and letters represent similar items in the following drawings, and therefore, once an item is defined in one drawing, it need not be further defined and explained in subsequent drawings. It is hereby declared that the following described embodiments are only used to explain the utility model and do not limit the utility model.
[0028] It should be noted that the terms "arranged", "connected" and the like should be interpreted broadly, for example, can be fixedly connected, or can be detachably connected, or integrated; can be mechanically connected, or electrically connected; can be directly connected, or indirectly connected through an intermediate medium; can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise explicitly limited. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, or the orientation or positional relationship commonly placed when the product of the application is used, or the orientation or positional relationship commonly understood by those skilled in the art, or the orientation or positional relationship commonly placed when the product of the application is used, which is only for the convenience of describing the application and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a particular orientation, structure and operation, and therefore cannot be understood as limiting the application. The terms "first", "second" are only used for the purpose of convenience, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features.
[0029] Please refer to Figures 1 to 5 The embodiment provides a BGA wire-out structure capable of avoiding high-speed wire back drilling and crosstalk, comprising a printed circuit board 1, the printed circuit board 1 is a multilayer board (generally more than 6 layers), a BGA area 2 is arranged on a top layer of the printed circuit board 1, the BGA area 2 is used for connecting a BGA chip, and the size of the BGA area 2 is consistent with the size of the BGA chip. A second layer and a penultimate layer of the printed circuit board 1 are signal layers, one layer is a sending signal wire-out layer, and the other layer is a receiving signal wire-out layer. A first high-speed signal wire-out 3 is arranged on the second layer of the printed circuit board 1, the first high-speed signal wire-out 3 is connected with the BGA area 2 through a laser hole 4, and the laser hole 4 only communicates from the top layer of the printed circuit board 1 to the second layer of the printed circuit board 1. A second high-speed signal wire-out 5 is arranged on the penultimate layer of the printed circuit board 1, and the second high-speed signal wire-out 5 is connected with the BGA area 2 through a through hole 6.
[0030] In the BGA out-line structure of the embodiment, the first high-speed signal out-line 3 is on the second layer of the printed circuit board 1 and passes through the laser hole 4 from the top layer to the second layer, so that the first high-speed signal out-line 3 is completely free of stub and the use of the laser hole 4 does not increase the number of pressing during the production of the board factory, which has little effect on the cost; the second high-speed signal out-line 5 is on the second-to-last layer of the printed circuit board 1 and is connected by the through hole 6, and the thickness from the second-to-last layer to the bottom layer is relatively small (less than 4 mil), which completely meets the requirement of the maximum stub (for example, 6 mil) of the high-speed signal out-line, so that the wiring on the layer does not need to be back-drilled; at the same time, since the first high-speed signal out-line 3 on the second layer only uses the laser hole 4 to connect the top layer and the second layer, the signal crosstalk in the Z-axis direction between the second high-speed signal out-line 5 on the second-to-last layer and the first high-speed signal out-line 3 on the second layer is completely avoided.
[0031] It should be noted that laser drilling is a non-contact processing method, which uses the high-intensity heat source of the laser beam to heat the material, so that the material is melted or vaporized and then evaporated, thereby forming a hole. The laser hole 4 ensures that the depth of the hole only reaches the required signal layer by precisely controlling the burning time and power of the laser beam, without penetrating to the next layer or leaving an excessively long stub. This way allows the signal to be successfully transmitted from one layer to another without being affected by the stub.
[0032] Please refer to Figure 2 , Figure 3 In one embodiment, the second layer of the printed circuit board 1 is provided with a plurality of rows of first high-speed signal out-lines 3 outside the first out-line direction, and the second-to-last layer of the printed circuit board 1 is provided with a plurality of rows of second high-speed signal out-lines 5 inside the first out-line direction. The above out-line layout and the use of laser holes 4 and through holes 6 effectively solve the stub and crosstalk problems in high-speed signal transmission, not only improve the signal quality, but also increase the wiring flexibility, which helps to realize more reliable and higher performance circuit systems.
[0033] In some specific embodiments, the second layer of the printed circuit board 1 is provided with two rows of first high-speed signal out-lines 3 outside the first out-line direction, and the second-to-last layer of the printed circuit board 1 is provided with two rows of second high-speed signal out-lines 5 inside the first out-line direction.
[0034] Please refer to Figure 4 , Figure 5In one embodiment, the second layer of the printed circuit board 1 is provided with a plurality of rows of first high-speed signal lines 3 on the outer side in a second line-out direction, and the second-to-last layer of the printed circuit board 1 is provided with a plurality of rows of second high-speed signal lines 5 on the inner side in the second line-out direction, the second line-out direction being opposite to the first line-out direction, such as the left side direction and the right side direction. The above line-out layout and the use of the laser hole 4 and the via hole 6 effectively solve the stub and crosstalk problems in high-speed signal transmission, not only improve the signal quality, but also increase the wiring flexibility, which is helpful to realize a more reliable and higher performance circuit system.
[0035] In some specific embodiments, the second layer of the printed circuit board 1 is provided with two rows of first high-speed signal lines 3 on the outer side in a second line-out direction, and the second-to-last layer of the printed circuit board 1 is provided with two rows of second high-speed signal lines 5 on the inner side in the second line-out direction.
[0036] In one embodiment, the thickness of the second-to-last layer to the bottom layer of the printed circuit board 1 varies according to the aperture of the actually used laser hole 4, and the principle is that the thickness of the second-to-last layer to the bottom layer of the printed circuit board 1 is less than or equal to the aperture of the laser hole 4. That is, if a laser hole 4 with a large aperture is used, the thickness can be appropriately increased, but based on the requirement for high-speed line stub, the thickness needs to be as small as possible.
[0037] In one embodiment, the second layer of the printed circuit board 1 is a transmitting signal line layer, and the second-to-last layer of the printed circuit board 1 is a receiving signal line layer. Of course, in another embodiment, the second layer of the printed circuit board 1 can also be a receiving signal line layer, and the second-to-last layer of the printed circuit board 1 can also be a transmitting signal line layer, which is not limited by the present application.
[0038] It should be understood that those skilled in the art can make improvements or changes according to the above description, and all these improvements and changes shall fall within the protection scope of the appended claims of the present application.
[0039] The above has described the present application by way of example in connection with the drawings. Obviously, the implementation of the present application is not limited by the above manner, and various improvements or changes are made by using the method concept and technical solution of the present application, or the concept and technical solution of the present application is directly applied to other occasions without improvement, which all fall within the protection scope of the present application.
Claims
1. A BGA out-line structure for avoiding high-speed line back-drilling and crosstalk, characterized in that, The printed circuit board comprises a top layer provided with a BGA area, a second layer and a penultimate layer which are signal layers, the second layer is provided with a first high-speed signal line, the first high-speed signal line is connected to the BGA area through a laser hole, the penultimate layer is provided with a second high-speed signal line, and the second high-speed signal line is connected to the BGA area through a via hole.
2. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 1, wherein, The laser hole is communicated from the top layer to the second layer of the printed circuit board.
3. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 1, wherein, The second layer of the printed circuit board is provided with a plurality of rows of the first high-speed signal lines outside in a first line direction, and the penultimate layer of the printed circuit board is provided with a plurality of rows of the second high-speed signal lines inside in the first line direction.
4. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 3, wherein, The second layer of the printed circuit board is provided with a plurality of rows of the first high-speed signal lines outside in a second line direction, and the penultimate layer of the printed circuit board is provided with a plurality of rows of the second high-speed signal lines inside in the second line direction, the second line direction being opposite to the first line direction.
5. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 4, wherein, The second layer of the printed circuit board is provided with two rows of the first high-speed signal lines outside in the first line direction, and the penultimate layer of the printed circuit board is provided with two rows of the second high-speed signal lines inside in the first line direction.
6. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 5, wherein, The second layer of the printed circuit board is provided with two rows of the first high-speed signal lines outside in the second line direction, and the penultimate layer of the printed circuit board is provided with two rows of the second high-speed signal lines inside in the second line direction.
7. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 1, wherein, The thickness of the penultimate layer to the bottom layer of the printed circuit board is less than or equal to the aperture of the laser hole.
8. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 1, wherein, The printed circuit board is at least a six-layer board.
9. The BGA out-lead structure for avoiding high-speed line-back-drilling and cross-talk according to claim 1, wherein, The second layer of the printed circuit board is a transmitting signal line layer, and the penultimate layer of the printed circuit board is a receiving signal line layer.
10. The BGA out-lead structure to avoid high speed line-back-drilling and cross-talk of claim 1, wherein, The second layer of the printed circuit board is a receiving signal line layer, and the penultimate layer of the printed circuit board is a transmitting signal line layer.