Four-side lead wire flat packaging shell with lead wires led out from front face and packaging device

Abstract

The utility model provides a four-side lead flat packaging shell with leads led out from the front surface and a packaging device, which belong to the technical field of integrated circuit packaging, and comprise a plastic shell and metal leads, and the front surface of the plastic shell is provided with a packaging cavity for packaging a chip; the metal leads are injection-molded on four edges of the plastic shell and horizontally extend out of the front surface of the plastic shell; the metal lead is provided with an inner cavity lead section and an outer lead section, and the inner cavity lead section downwards penetrates through the wall body of the plastic shell, is bent and extends into the packaging cavity and is attached to the bottom of the packaging cavity; and the external lead section horizontally extends outwards from the opening of the packaging cavity on the front surface of the plastic shell. The four-side lead flat packaging shell with the leads led out from the front face has the advantages of being easy to manufacture, low in operation requirement, low in manufacturing cost and good in heat resistance, moisture resistance, sealing performance and reliability.

Description

TECHNICAL FIELD

[0001] The utility model belongs to integrated circuit packaging technical field, concretely relates to a four -edge lead flat package shell and package device of lead is drawn from the front. BACKGROUND

[0002] Ceramic four -edge lead flat package (CQFP-quad fiat package with guard ring) shell, the four edges of ceramic shell have metal lead (see Figures 12 to 14 ), Metal lead is horizontally drawn from the back of ceramic shell. The main function of metal lead is to connect electronic components, and it can also transmit electrical signals and electrical energy. In circuit design and manufacturing, the selection and arrangement of metal lead are crucial to the performance and stability of the circuit.

[0003] Traditional integrated circuit shell has ceramic shell packaging and plastic encapsulation:

[0004] Ceramic shell is composed of alumina ceramic shell, metal lead, metal sealing ring and metal cover plate, alumina ceramic shell, metal lead, metal sealing ring three parts are welded together, and metal cover plate is sealed into airtight packaging shell. The process flow of ceramic shell packaging is:

[0005] (1) Alumina ceramic powder is mixed and cast into green ceramic sheet by casting process;

[0006] (2) The green ceramic sheet is printed with tungsten metallization paste by screen printing method;

[0007] (3) The green ceramic sheet is cut into single green ceramic piece

[0008] (4) Sintering in reducing atmosphere, green ceramic piece sintering into mature ceramic piece, sintering temperature is about 1600℃;

[0009] (5) Nickel plating of mature ceramic piece;

[0010] (6) The metal lead and sealing ring are welded on the metallized area of the mature ceramic piece, the welding temperature is about 800℃, and the solder is silver copper alloy;

[0011] (7) Whole nickel plating and gold plating;

[0012] (8) The cavity of ceramic shell is airtight cavity, the integrated circuit chip is welded or bonded on the bottom surface of cavity, the gold plated area of chip and the metallized area in the cavity are bonded with gold wire for circuit interconnection, and finally the metal cover plate is sealed to make complete integrated circuit device.

[0013] The process flow of plastic "encapsulation" is as follows:

[0014] (1) The lead frame is gold plated first;

[0015] (2) solder or bond the chip on the lead frame, and bond gold wires on the gold-plated area of the chip and the surface of the lead frame to make circuit interconnection;

[0016] (3) fill the chip and the lead frame with liquid epoxy resin by a filling machine, and heat to solidify the epoxy resin. All gaps are filled, and no cavity is allowed in the device. The epoxy resin is a thermosetting material, which is liquid at room temperature, and becomes solid by cross-linking polymerization between molecular chains when heated, and has no cavity inside.

[0017] The current ceramic packaging shell is manufactured by sintering in a reducing atmosphere and high-temperature welding, and has complex and high production process, high manufacturing cost, and high price. Although the plastic filling has low cost and simple process, the heat resistance, sealing property, moisture resistance, and reliability are poor. Content of the utility model

[0018] The utility model discloses a kind of four-side lead flat package shell and packaged device, which is made of positive lead of CQFP shell, with simple manufacturing, low operation requirement, low manufacturing cost, and good heat dissipation, solving the problems of complex ceramic packaging process, high cost and poor heat resistance, sealing property, moisture resistance and reliability of plastic filling shell.

[0019] In the first aspect, to achieve the above object, the utility model provides a kind of four-side lead flat package shell, which is made of positive lead, comprising:

[0020] A plastic shell is provided with a packaging cavity for packaging a chip on its front face; and

[0021] Metal leads are injection molded on the four sides of the plastic shell and horizontally extended from the front face of the plastic shell. The metal leads have inner cavity lead segments and outer lead segments. The inner cavity lead segments pass through the wall of the plastic shell downward and bend to extend into the packaging cavity, and are attached to the bottom of the packaging cavity. The outer lead segments horizontally extend outward from the opening of the packaging cavity on the front face of the plastic shell.

[0022] In an implementable manner, the inner cavity lead segment is a bending segment. The inner cavity lead segment has an inner cavity horizontal lead segment and an inner cavity vertical lead segment connected in sequence. The inner cavity horizontal lead segment is perpendicular to the inner cavity vertical lead segment. The inner cavity horizontal lead segment horizontally extends into the packaging cavity. The inner cavity vertical lead segment extends upward along the wall of the plastic shell to the opening of the packaging cavity, and is connected perpendicularly to the outer lead segment.

[0023] In an implementable manner, the inner cavity lead segment is provided with a glue locking hole for locking glue.

[0024] With reference to the first aspect, in an implementable mode, the inner cavity lead segment is provided with a locking groove for locking glue.

[0025] With reference to the first aspect, in an implementable mode, two sides of the inner cavity lead segment in the width direction are provided with locking notches for locking glue.

[0026] With reference to the first aspect, in an implementable mode, a step is arranged around the bottom of the packaging cavity, and the inner cavity lead segment is attached to the step.

[0027] With reference to the first aspect, in an implementable mode, a groove is arranged on the step, the inner cavity lead segment is attached to the groove, and the upper surface of the inner cavity lead segment is flush with the bottom surface of the packaging cavity.

[0028] With reference to the first aspect, in an implementable mode, guide grooves are arranged around the upper end surface of the wall of the plastic shell, the outer lead segment extends horizontally and outwardly from the guide grooves, and the upper surface of the outer lead segment is flush with the front surface of the plastic shell.

[0029] With reference to the first aspect, in an implementable mode, the material of the plastic shell is any one of LCP, LCP modified material, PPS, PS, and PBT high-temperature-resistant engineering plastic.

[0030] Secondly, the utility model embodiment further provides a packaging device, which comprises:

[0031] The lead wire is a four-side lead flat packaging shell with leads extending from the front surface;

[0032] A chip is arranged in the packaging cavity of the plastic shell, and the chip is directly connected to the metal lead wire extending into the packaging cavity through a bonding wire; and

[0033] A cap is arranged on the plastic shell to seal the chip in the packaging cavity.

[0034] The flat packaging shell and packaging device with four-sided leads extending from the front provided by this utility model have the following advantages compared with the prior art: Compared with traditional ceramic packaging shells, only appropriate injection molds are needed to integrally injection mold the metal leads and the plastic shell together, thus producing a flat packaging shell with the same size as traditional ceramic shells and better performance. The manufacturing process is simple, the operation requirements are low, the manufacturing cost is low, and the product price is reduced. Moreover, the plastic material has better impact resistance and flexibility. Compared with traditional plastic potting shells, the plastic shell has a packaging cavity, and the cavity around the chip is empty. After the cap is sealed, the packaging cavity is not filled, and the cavity around the chip inside the device remains empty. The structure of the plastic potting shell is different from that of the ceramic packaging shell. The shell of this application can achieve a completely consistent internal and external structure with the ceramic packaging shell. At the same time, compared with the plastic potting shell, it has better heat resistance, sealing performance, moisture resistance, and reliability.

[0035] The flat package with four-sided leads extending from the front provided by this utility model can maintain a high degree of consistency in internal and external dimensions and shape with the ceramic package. In practical applications, the lower-cost plastic flat package can be selected to replace the high-priced ceramic package, depending on the actual use environment and performance requirements of the product, thereby reducing production costs while ensuring the performance and reliability of electronic products. Attached Figure Description

[0036] Figure 1 A schematic diagram of the main structure of the flat package housing with four-sided leads extending from the front, provided by an embodiment of this utility model. Figure 1 ;

[0037] Figure 2 for Figure 1 A top view of the flat package housing with four-sided leads extending from the front.

[0038] Figure 3 This is a schematic diagram of the main structure of the metal lead wire provided in an embodiment of the present utility model;

[0039] Figure 4 for Figure 3 A top view of the metal leads shown.

[0040] Figure 5 A schematic diagram of the main structure of the flat package housing with four-sided leads extending from the front, provided by an embodiment of this utility model. Figure 2 ;

[0041] Figure 6 A schematic diagram of the main structure of the flat package housing with four-sided leads extending from the front, provided by an embodiment of this utility model. Figure 3 ;

[0042] Figure 7 A schematic diagram of the main structure of the flat package housing with four-sided leads extending from the front, provided by an embodiment of this utility model. Figure 4 ;

[0043] Figure 8 A schematic diagram of the main structure of the flat package housing with four-sided leads extending from the front, provided by an embodiment of this utility model. Figure 5 ;

[0044] Figure 9 A schematic diagram of the main structure of the flat package housing with four-sided leads extending from the front, provided by an embodiment of this utility model. Figure 6 ;

[0045] Figure 10 This is a schematic diagram of the main structure of the packaging device provided in an embodiment of the present utility model;

[0046] Figure 11 for Figure 10 A top view of the provided packaged device;

[0047] Figure 12 A front structural schematic diagram of the ceramic quad-lead flat package shell provided for an embodiment of this utility model;

[0048] Figure 13 for Figure 12 A schematic diagram of the back structure of the provided ceramic quad flat package;

[0049] Figure 14 for Figure 12 A schematic diagram of the main structure of the provided ceramic quad-lead flat package;

[0050] Explanation of reference numerals in the attached figures:

[0051] 1. Metal lead; 11. Inner cavity lead segment; 111. Locking groove; 112. Locking hole; 113. Locking notch; 12. Outer lead segment; 2. Plastic shell; 21. Encapsulation cavity; 22. Step; 3. Adhesive layer; 4. Cap; 5. Bonding wire; 6. Chip; 7. Ceramic quad flat package shell. Detailed Implementation

[0052] To make the technical problems, technical solutions, and beneficial effects of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0053] Please refer to the following: Figures 1 to 9The utility model provides a four edge lead flat package shell of lead wire is led out from the front, and the utility model provides the four edge lead flat package shell of lead wire is led out from the front, and the utility model discloses a four edge lead flat package shell of lead wire is led out from the front, which comprises a plastic shell 2 and a metal lead wire 1, and the plastic shell 2 is provided with a packaging cavity 21 for packaging a chip 6 on the front; the metal lead wire 1 is injection molded on the four edges of the plastic shell 2 and horizontally extends from the front of the plastic shell 2; the metal lead wire 1 has an inner cavity lead wire segment 11 and an external lead wire segment 12, the inner cavity lead wire segment 11 passes through the wall of the plastic shell 2 downward and is bent to extend into the packaging cavity 21, and is attached to the bottom of the packaging cavity 21; the external lead wire segment 12 horizontally extends outward from the opening of the packaging cavity 21 on the front of the plastic shell 2.

[0054] The four edge lead flat package shell of lead wire is led out from the front, and compared with the prior art, the beneficial effects are as follows: compared with the traditional ceramic package shell, only a corresponding injection mold is needed, the metal lead wire and the plastic shell can be integrally injection molded together, a flat package shell of a plastic product with consistent size and good performance of the traditional ceramic shell can be made, the production is simple, the operation requirement is low, the production cost is low, the price of the product is reduced, the impact resistance and flexibility of the plastic material are also good, compared with the traditional plastic pouring seal shell, the plastic shell has a packaging cavity, the periphery of the chip is a cavity, after the cap is sealed, the packaging cavity cannot be filled, the periphery of the chip in the device is still a cavity, the shell structure of the plastic pouring seal is different from the shell structure of the ceramic package, the shell of the application can be consistent with the internal and external structures of the ceramic package shell, and meanwhile, compared with the plastic pouring seal shell, the heat resistance, sealing property, moisture resistance and reliability are better.

[0055] The four edge lead flat package shell of lead wire is led out from the front, and the internal and external sizes and shapes of the shell are consistent with the ceramic package shell, in the actual application process, the flat package shell of the plastic material with low cost can be selected to replace the ceramic package shell with high price according to the actual use environment and performance requirements of the product, the production cost is reduced under the premise of ensuring the performance and reliability of the electronic product.

[0056] Meanwhile, since the shell of the plastic pouring seal is poured by using liquid epoxy resin, the liquid epoxy resin is in liquid state at room temperature, has hygroscopicity after solidification, and has poor moisture resistance, the shell is prone to cracking, cracking and explosion after being heated, has poor heat resistance, affects the sealing property, and has poor performance reliability; the packaging shell of the application uses the plastic material in solid state at room temperature, has good heat resistance, sealing property, moisture resistance and reliability, and the packaging shell with good cost performance can be selected according to the environmental conditions and performance requirements of the device in different occasions.

[0057] The four edge lead flat package shell of lead wire is led out from the front, and the manufacturing process of the four edge lead flat package shell of lead wire is as follows:

[0058] (1) the metal lead 1 is processed by machining, and the surface is subjected to chemical treatment to increase the bonding force with the plastic; (2) the metal lead 1 is loaded into an injection mold, and plastic is injected to form a plastic shell 2 wrapping the metal lead 1, or the metal lead 1 and the plastic shell 2 are integrally injection molded. This manufacturing method is simple and convenient, and the integral injection and the integral metal lead 1 not only increase the contact area of the metal lead 1 and the plastic shell 2, but also make the connection of the metal lead 1 and the plastic shell 2 more tight and firm, thereby avoiding the risk of poor contact or falling off of the metal lead 1 fixed at the bottom of the ceramic shell, and improving the stability of signal transmission.

[0059] The plastic shell 2 and the matched metal lead 1 provided by the utility model are corresponding to the structure of a ceramic quad flat package leadless (CQFP) shell. Figures 12 to 14 The ceramic quad flat package leadless (CQFP) shell has the characteristics of metal leads 1 on four sides, and the metal leads 1 horizontally extend from the back of the ceramic shell. In some cases, the shell can replace the ceramic package shell to reduce production cost.

[0060] It should be noted that the ceramic quad flat package leadless (CQFP) shell has leads extending from the back or horizontally extending from the front to adapt to different application occasions, and the plastic quad flat package leadless shell corresponding to the embodiment is adapted to the ceramic quad flat package leadless (CQFP) shell with leads extending from the front.

[0061] The plastic shell provided by the utility model is rectangular, and the middle sealing cavity is a cavity.

[0062] The plastic shell has a plurality of metal leads on four sides. The metal leads pass through the plastic shell from inside to outside, and the part of the metal leads passing through the plastic shell is flat. The metal leads are provided with round or rectangular notches, half-recessed grooves, through holes and other "glue locking" structures (such as glue locking holes, glue locking grooves and glue locking notches) to increase the bonding force of the metal and the plastic. The metal leads are bent to form two 90° angles and horizontally extend from the bottom surface of the plastic shell.

[0063] The quad flat package leadless shell provided by the utility model is applied to packaging integrated circuit chips, and the manufactured device is an integrated circuit component, including transistors, capacitors, resistors, microcontrollers MCU, microprocessors CPU, DSP, interface circuits, programmable logic devices FPGA, application specific integrated circuits ASIC, SOC, large capacity memories and the like, analog integrated circuits A / D, D / A converters, DDS, RFIC and the like, which are key components of various electronic circuits.

[0064] In some embodiments, as Figures 1 to 9As shown, the inner cavity lead segment 11 is a bent segment; the inner cavity lead segment 11 has an inner cavity horizontal lead segment and an inner cavity vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the inner cavity vertical lead segment; the inner cavity horizontal lead segment horizontally extends into the packaging cavity 21; the inner cavity vertical lead segment extends upward along the wall of the plastic shell 2 to the opening of the packaging cavity 21 and is connected perpendicularly with the external lead segment 12.

[0065] In some embodiments, as shown in Figures 1 to 9 As shown, the inner cavity lead segment 11 is provided with a glue locking hole 112 for locking glue. When the metal lead 1 is integrally injection molded with the plastic shell 2, the glue locking hole 112 can be filled with plastic liquid, increasing the bonding force between the metal lead 1 and the plastic shell 2 and improving the firmness of the connection between the metal lead 1 and the plastic shell 2.

[0066] Optionally, the shape of the glue locking hole 112 is circular, elliptical, or polygonal such as triangular, quadrangular, pentagonal, etc. The number of glue locking holes 112 can be one, two, or more, and the position of the glue locking holes 112 can be on the vertical part of the inner cavity lead segment 11 located in the vertical hole or on the horizontal part of the inner cavity lead segment 11 located in the horizontal hole.

[0067] In some embodiments, as shown in Figures 1 to 9 As shown, the inner cavity lead segment 11 is provided with a glue locking groove 111 for locking glue. Similarly, the glue locking groove 111 can be filled with plastic liquid, increasing the bonding force between the metal lead 1 and the plastic shell 2 and improving the firmness of the connection between the metal lead 1 and the plastic shell 2. Optionally, the shape of the glue locking groove 111 is circular, elliptical, or polygonal such as triangular, quadrangular, pentagonal, etc., with quadrangular being preferred. Similarly, the number and position of the glue locking grooves 111 are not limited.

[0068] In some embodiments, as shown in Figures 1 to 9 As shown, the two sides of the inner cavity lead segment 11 in the width direction are provided with glue locking notches 113 for locking glue. Similarly, the glue locking notches 113 can be filled with plastic liquid, increasing the bonding force between the metal lead 1 and the plastic shell 2 and improving the firmness of the connection between the metal lead 1 and the plastic shell 2.

[0069] Optionally, the shape of the glue locking notch 113 is semicircular, or rectangular, or elliptical, or trapezoidal, etc. The position of the glue locking notch 113 is also not limited.

[0070] It should be noted that the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113 do not affect the bonding of the bonding wire 5, or in other words, the positions of the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113 are away from the bonding position of the bonding wire 5.

[0071] Meanwhile, the metal lead 1 can be provided with any one of the glue locking hole 112, the glue locking groove 111, and the glue locking notch 113, or any two of them, or all of them.

[0072] The metal lead 1 is flat.

[0073] In some embodiments, as shown in Figure 1 , Figure 5 and Figure 6 , a step 22 is provided around the bottom of the package cavity 21, and the inner cavity lead segment 11 is attached to the step 22. The metal lead 1 on the step 22 can protrude from the surface of the step 22 (see Figure 6 ). Correspondingly, the upper surface of the outer lead segment 12 protrudes from the front surface of the plastic housing 2 (see Figure 1 ), or the outer lead segment 12 is embedded in a guide slot, and the upper surface of the outer lead segment 12 is flush with the front surface of the plastic housing 2 (i.e. the position of the sealing ring, as shown in Figure 5 and Figure 6 ).

[0074] In some embodiments, as shown in Figure 1 and Figure 5 , a groove is provided on the step 22, and the inner cavity lead segment 11 is attached to the groove, and the upper surface of the inner cavity lead segment 11 is flush with the bottom surface of the package cavity 21. Correspondingly, the upper surface of the outer lead segment 12 protrudes from the front surface of the plastic housing 2 (see Figure 1 ), or the outer lead segment 12 is embedded in a guide slot, and the upper surface of the outer lead segment 12 is flush with the front surface of the plastic housing 2 (as shown in Figure 5 and Figure 6 ).

[0075] In some embodiments, as shown in Figure 7 and Figure 8 , a sink 22 is provided around the bottom of the package cavity 21, and the inner cavity lead segment 11 is inserted into the sink, and the upper surface of the inner cavity lead segment 11 is flush with the bottom surface of the package cavity 21. Correspondingly, the upper surface of the outer lead segment 12 protrudes from the front surface of the plastic housing 2 (see Figure 7 ), or the outer lead segment 12 is embedded in a guide slot, and the upper surface of the outer lead segment 12 is flush with the front surface of the plastic housing 2 (see Figure 8 ).

[0076] Optionally, as shown in Figure 9 , the upper surface of the inner cavity lead segment 11 is higher than the bottom surface of the package cavity 21. Correspondingly, the bottom surface of the outer lead segment 12 protrudes from the back surface of the plastic housing 2, as shown in Figure 6 , or the outer lead segment 12 is embedded in a guide slot, and the bottom surface of the outer lead segment 12 is flush with the back surface of the plastic housing 2, as shown in Figure 7 .

[0077] In some embodiments, as shown in Figure 9As shown, the wall upper end surface of the plastic shell 2 is provided with a guide groove, and the external lead segment 12 horizontally extends out of the guide groove, and the upper surface of the external lead segment 12 is flush with the front surface of the plastic shell 2.

[0078] When the front surface of the plastic shell 2 is not provided with the guide groove, the upper surface of the external lead segment 12 is higher than the front surface of the plastic shell 2, as shown. Figure 7

[0079] It is illustrated that the locking glue hole, the locking glue groove and the locking glue notch on the inner cavity lead segment are matched with the position relationship that the inner cavity lead segment is flush or protrudes the bottom surface and the step surface of the packaging cavity, and are also matched with the position relationship that the external lead segment protrudes or is flush with the back surface of the plastic shell.

[0080] Further, the four-side lead flat packaging shell with the lead wire led out of the front surface includes the plastic shell 2, the metal lead wire 1, the metal ring (which can be selected or not selected) and the cap 4.

[0081] The plastic shell 2 and the cap 4 are both plastic materials, and the plastic is any one of high-temperature resistant engineering plastics such as LCP (LIQUID CRYSTAL POLYMER), LCP modified material, PPS (polyphenylene sulfide), PS (Polystyrene, abbreviated as PS) and PBT (Polybutylene terephthalate), and the plastic has more than 30% glass fiber as a filler.

[0082] The metal lead wire 1 and the metal ring are any one of materials such as Kovar alloy, copper and copper alloy, aluminum and aluminum alloy. The metal ring is located between the cap 4 and the plastic shell 2. When the metal ring is not selected, the cap 4 and the plastic shell 2 are glued together; when the metal ring is selected, the metal ring can be glued and fixed with the cap 4 and the plastic shell 2.

[0083] In the above embodiments, the description of each embodiment has its own emphasis, and the parts not described or recorded in a certain embodiment can be referred to the related description of other embodiments.

[0084] Based on the same inventive concept, the embodiments of the present application also provide a packaging device, as shown in Figure 10 and Figure 11 , which comprises: the four-side lead flat packaging shell with the lead wire led out of the front surface, the chip 6 and the cap 4; the chip 6 is arranged in the packaging cavity 21 of the plastic shell 2; the chip 6 is directly connected with the metal lead wire 1 extending into the packaging cavity 21 through the bonding wire 5; and the cap 4 is arranged on the plastic shell 2 to seal the chip 6 in the packaging cavity 21.

[0085] ​The packaging device provided by this utility model is simple to manufacture, has low operation requirements, low manufacturing cost, and good heat resistance, moisture resistance and sealing properties, thus meeting the usage requirements of the device.

[0086] The manufacturing process of packaged devices includes the following steps;

[0087] (1) Fabrication of metal lead 1:

[0088] Metal lead 1 is machined and its surface is chemically treated to increase its bonding strength with plastic;

[0089] (2) Fabrication of plastic shell 2:

[0090] Making injection molds;

[0091] The metal lead 1 is inserted into the injection mold, and plastic is injected to form a plastic shell 2 that encloses the metal lead 1. The metal lead 1 and the plastic shell 2 are then integrally injection molded.

[0092] After injection molding, the entire shell is plated with nickel and gold layers to produce the finished shell.

[0093] (3) Making the plastic cap 4:

[0094] Making injection molds;

[0095] 4. Plastic caps are manufactured using injection molding.

[0096] (4) Manufacturing of integrated circuit packaging devices:

[0097] (a) Chip 6 is mounted on the bottom surface inside the encapsulation cavity 21 by means of soldering or adhesive bonding.

[0098] (b) Connect the circuit from the electrode bonding wire of chip 6 to the surface of the gold-plated metal lead 1;

[0099] (c) Apply adhesive to the surface of the cap 4 and bond it to the top of the plastic housing 2. Figure 10 The middle adhesive layer 3) forms a sealed cavity with a sealing effect.

[0100] (d) After inspection and testing, a complete packaged device is manufactured. The above description is only a preferred embodiment of this utility model and is not intended to limit this utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this utility model should be included within the protection scope of this utility model.

Claims

1. A flat package housing with four-sided leads extending from the front, characterized in that, include: The plastic housing (2) has a packaging cavity (21) on its front side for packaging the chip (6); as well as Metal leads (1) are injection molded on the four sides of the plastic housing (2) and extend horizontally from the front of the plastic housing (2); the metal leads (1) have an inner cavity lead segment (11) and an outer lead segment (12), the inner cavity lead segment (11) passes downward through the wall of the plastic housing (2) and bends to extend into the encapsulation cavity (21), and is attached to the bottom of the encapsulation cavity (21); the outer lead segment (12) extends horizontally outward from the opening of the encapsulation cavity (21) on the front of the plastic housing (2).

2. The flat package housing with four-sided leads extending from the front side as described in claim 1, characterized in that, The inner cavity lead segment (11) is a bent segment; the inner cavity lead segment (11) has an inner cavity horizontal lead segment and an inner cavity vertical lead segment connected in sequence; the inner cavity horizontal lead segment is perpendicular to the inner cavity vertical lead segment; the inner cavity horizontal lead segment extends horizontally into the encapsulation cavity (21); the inner cavity vertical lead segment extends upward along the wall of the plastic shell (2) to the opening of the encapsulation cavity (21) and is vertically connected to the outer lead segment (12).

3. The flat package housing with four-sided leads extending from the front as described in claim 1, characterized in that, The inner cavity lead segment (11) is provided with a locking hole (112) for locking glue.

4. The flat package housing with four-sided leads extending from the front as described in claim 1, characterized in that, The inner cavity lead segment (11) is provided with a locking groove (111) for locking glue.

5. The flat package housing with four-sided leads extending from the front side as described in claim 1, characterized in that, The inner cavity lead segment (11) has adhesive-locking notches (113) on both sides in the width direction for locking adhesive.

6. The flat package housing with four-sided leads extending from the front as described in claim 1, characterized in that, The bottom of the encapsulation cavity (21) is provided with a step (22) around its perimeter, and the inner cavity lead segment (11) is attached to the step (22).

7. The flat package housing with four-sided leads extending from the front side as described in claim 6, characterized in that, A groove is provided on the step (22), the inner cavity lead segment (11) fits into the groove, and the upper surface of the inner cavity lead segment (11) is flush with the bottom surface of the encapsulation cavity (21).

8. The flat package housing with four-sided leads extending from the front as described in claim 1, characterized in that, The upper surface of the plastic housing is provided with guide grooves around the perimeter. The external lead segment (12) extends horizontally outward from the guide grooves, and the upper surface of the external lead segment (12) is flush with the front of the plastic housing (2).

9. The flat package housing with four-sided leads extending from the front side as described in claim 1, characterized in that, The plastic shell (2) is made of any one of LCP, LCP modified material, PPS, PS, or PBT high-temperature resistant engineering plastics.

10. A packaged device, characterized in that, include: The flat package housing with four-sided leads extending from the front side as described in any one of claims 1-9; The chip (6) is disposed in the encapsulation cavity (21) of the plastic housing (2); the chip (6) is directly connected to the metal lead (1) extending into the encapsulation cavity (21) by a bonding wire (5); as well as A cap (4) is placed on the plastic housing (2) to seal the chip (6) inside the encapsulation cavity (21).

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