Infrared detector module and thermal infrared imager

Abstract

The utility model relates to the field of infrared detection, and discloses an infrared detector module and an infrared thermal imager, and the infrared detector module comprises a substrate, a housing, an infrared detector, and a light-transmitting member. The shell comprises a main body and enclosure parts, a window is formed in the top surface of the main body, and the enclosure parts are connected with the top surface of the main body and are at least located on the two sides of the window; the light-transmitting part is positioned in the window and is lower than the enclosure part; the bottom surface of the main body is fixedly connected with the front surface of the substrate, and the shell, the light-transmitting part and the substrate form a cavity; the infrared detector is located in the cavity, and the base plate enables pins of the infrared detector to be connected to the back face of the base plate in a rotating mode. The shell, the substrate and the light-transmitting piece form a layer of protective barrier for the infrared detector, so that adverse effects of the external environment on the infrared detector are avoided. The enclosure part of the shell is higher than the light-transmitting piece, the enclosure part can protect the light-transmitting piece, damage to the light-transmitting piece is avoided, and the service life of the light-transmitting piece is prolonged.

Description

Technical Field

[0001] This application relates to the field of infrared detection, and in particular to an infrared detector module and an infrared thermal imager. Background Technology

[0002] An infrared detector is a device that detects objects based on their infrared radiation characteristics. It absorbs infrared radiation and converts it into electrical signals, thus enabling the detection and measurement of objects. Infrared detectors are susceptible to environmental influences, which can affect their performance.

[0003] Therefore, how to solve the above-mentioned technical problems should be a key focus for those skilled in the art. Utility Model Content

[0004] The purpose of this application is to provide an infrared detector module and an infrared thermal imager to reduce the impact of the environment on the infrared detector and extend the life of the light-transmitting component.

[0005] To address the aforementioned technical problems, this application provides an infrared detector module, comprising:

[0006] Substrate, housing, infrared detector, and light-transmitting component;

[0007] The housing includes a main body and a enclosure. The top surface of the main body is provided with a window. The enclosure is connected to the top surface of the main body and is located at least on both sides of the window. The light-transmitting element is located at the window and is lower than the enclosure.

[0008] The bottom surface of the main body is fixedly connected to the front surface of the substrate, and the housing, the light-transmitting element and the substrate form a cavity; the infrared detector is located in the cavity, and the substrate transfers the pins of the infrared detector to the back surface of the substrate.

[0009] As one possible implementation, the main body and the enclosure are an integral structure.

[0010] As one possible implementation, the enclosure is detachably connected to the main body.

[0011] As one possible implementation, the connection method between the enclosure and the main body includes any of the following:

[0012] Clip-on connection, pin connection, magnetic connection.

[0013] In one possible implementation, the enclosure surrounds the perimeter of the window.

[0014] As one possible implementation, it also includes:

[0015] An infrared antireflective film and / or metasurface structure located on the target surface of the light-transmitting element; the target surface includes the outer surface and / or inner surface of the light-transmitting element, the outer surface of the light-transmitting element being the surface of the light-transmitting element away from the infrared detector, and the inner surface of the light-transmitting element being the surface of the light-transmitting element closer to the infrared detector.

[0016] As one possible implementation, it also includes:

[0017] A through hole is located in the main body, and the through hole communicates with the cavity to release heat from the cavity.

[0018] In one possible implementation, the bottom surface of the main body is bonded to the front surface of the substrate.

[0019] This application also provides an infrared thermal imager, including any of the infrared detector modules described above.

[0020] This application provides an infrared detector module, comprising: a substrate, a housing, an infrared detector, and a light-transmitting element; the housing includes a main body and a surrounding portion, the top surface of the main body is provided with a window, the surrounding portion is connected to the top surface of the main body and is located at least on both sides of the window; the light-transmitting element is located at the window and is lower than the surrounding portion; the bottom surface of the main body is fixedly connected to the front surface of the substrate, and the housing, the light-transmitting element, and the substrate form a cavity; the infrared detector is located in the cavity, and the substrate transfers the pins of the infrared detector to the back surface of the substrate.

[0021] As can be seen, the infrared detector module in this application includes a substrate, a housing, an infrared detector, and a light-transmitting element. The housing has a window, and the light-transmitting element is located within the window. The housing, substrate, and light-transmitting element form a cavity, in which the infrared detector is housed. The substrate connects the pins of the infrared detector to the outside of the infrared detector module. Therefore, the housing, substrate, and light-transmitting element form a protective barrier for the infrared detector, preventing adverse effects from the external environment. The enclosure of the housing is higher than the light-transmitting element, which protects the light-transmitting element, preventing damage and extending its service life.

[0022] In addition, this application also provides an infrared thermal imager with the above-mentioned advantages. Attached Figure Description

[0023] To more clearly illustrate the technical solutions of the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] Figure 1 This is a cross-sectional schematic diagram of an infrared detector module provided in an embodiment of this application;

[0025] In the figure, 1 is the substrate, 2 is the housing, 3 is the infrared detector, 4 is the light-transmitting component, 5 is the conductive wire, 6 is the cavity, 7 is the through hole, 21 is the main body, 22 is the enclosure, 31 is the infrared detector chip, and 32 is the light window. Detailed Implementation

[0026] To enable those skilled in the art to better understand the present application, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0028] As described in the background section, infrared detectors are easily affected by the environment during use, which in turn affects their performance.

[0029] In view of this, this application provides an infrared detector module, please refer to... Figure 1 It can include:

[0030] 1. Substrate; 2. Housing; 3. Infrared detector; 4. Light-transmitting component;

[0031] The housing 2 includes a main body 21 and a enclosure 22. The top surface of the main body 21 is provided with a window. The enclosure 22 is connected to the top surface of the main body 21 and is located at least on both sides of the window. The light-transmitting element 4 is located at the window and is lower than the enclosure 22.

[0032] The bottom surface of the main body 21 is fixedly connected to the front surface of the substrate 1, and the housing 2, the light-transmitting element 4 and the substrate 1 form a cavity 6; the infrared detector 3 is located in the cavity 6, and the substrate 1 transfers the pins of the infrared detector 3 to the back surface of the substrate 1.

[0033] The bottom surface of the main body 21 is opposite to the top surface of the main body 21.

[0034] The infrared detector 3 and the substrate 1 can be electrically connected via conductive wire 5. The substrate 1 transfers the pins of the infrared detector 3 to the back side of the substrate 1, that is, the substrate 1 is a substrate 1 with a transfer function. The back side of the substrate 1 is the surface away from the infrared detector 3, and the infrared detector 3 can be located on the front side of the substrate 1. The front and back sides of the substrate 1 are opposite to each other.

[0035] The infrared detector 3 includes an infrared detector chip 31 and a light window 32.

[0036] The infrared detector 3 can be packaged in metal, ceramic, wafer-level, or pixel-level packages. The specific package type can be set as needed and is not specifically limited here.

[0037] The light-transmitting element 4 is located in the incident light path of the infrared detector 3. The light-transmitting element 4 is used to transmit infrared light. After passing through the light-transmitting element 4, the infrared light shines onto the infrared detector 3, thereby realizing infrared detection.

[0038] To improve the transmittance of infrared light on the light-transmitting element 4, the material of the light-transmitting element 4 can be any one of germanium, silicon, or sulfur selenide glass.

[0039] Both the outer and inner surfaces of the light-transmitting element 4 are flat surfaces. The inner surface of the light-transmitting element 4 is the surface closer to the infrared detector 3, and the outer surface of the light-transmitting element 4 is the surface farther away from the infrared detector 3.

[0040] The light-transmitting element 4 is lower than the enclosure portion 22, meaning that the outer surface of the light-transmitting element 4 is lower than the surface of the enclosure portion 22 on the side away from the main body 21. This allows the enclosure portion 22 to protect the light-transmitting element 4. The enclosure portion 22 can also block foreign objects coming from the outer surface of the light-transmitting element 4, protecting the light-transmitting element 4 and preventing it from being damaged.

[0041] The shape of the window includes, but is not limited to, any one of the following: circle, rectangle, square, hexagon, octagon, or irregular shape.

[0042] The light-transmitting element 4 is matched with the window to ensure that the housing 2 and the light-transmitting element 4 can fit tightly together to form the cavity 6.

[0043] It should be noted that this application does not limit the connection method between the main body 21 and the enclosure 22 in the housing 2. Two alternative methods are provided below.

[0044] In the first method, the main body 21 and the enclosure 22 are integrally formed, that is, the shell 2 is integrally formed. The shell 2 is integrally formed during manufacturing, which simplifies the manufacturing process of the shell 2 and is very convenient.

[0045] In the second method, the enclosure part 22 is detachably connected to the main body 21. That is, the enclosure part 22 and the main body 21 are movably connected, and the enclosure part 22 and the main body 21 can be separated from each other or combined together.

[0046] In this embodiment, the enclosure part 22 is detachably connected to the main body 21. On the one hand, when the enclosure part 22 is damaged, the enclosure part 22 can be replaced separately, and the main body 21 does not need to be replaced, saving the cost of the shell 2. On the other hand, when different heights of enclosure parts 22 are required, enclosure parts 22 of different heights can be replaced without replacing the entire shell 2, which is very convenient and can reduce costs.

[0047] It should be noted that when the main body 21 and the enclosure part 22 are detachably connected, this application does not limit the connection method between the main body 21 and the enclosure part 22, and can set it by itself.

[0048] As one possible implementation, the connection method between the enclosure portion 22 and the main body 21 includes, but is not limited to, any of the following:

[0049] Clip-on connection, pin connection, magnetic connection.

[0050] For example, when using a snap-fit ​​connection, an annular groove can be provided on the surface of the main body 21 opposite to the enclosure 22, and a protruding connector can be provided on the surface of the enclosure 22 opposite to the main body 21. When the main body 21 and the enclosure 22 are connected, the protruding connector on the enclosure 22 can be inserted into the groove of the main body 21. When separation is needed, the enclosure 22 can be pulled out, which is very simple and convenient. Of course, a protruding connector can also be provided on the main body 21, and an annular groove can be provided on the enclosure 22, both of which are within the protection scope of this application.

[0051] For example, when using pin connection, protrusions with pin holes are provided on the side wall of the main body 21 and the side wall of the enclosure 22. The pins are inserted into the two pin holes for fixation, thereby connecting the main body 21 and the enclosure 22.

[0052] For example, when a magnetic connection is used, a magnetic element (e.g., a magnet) is provided on the surface of the main body 21 opposite to the enclosure 22, and a magnetic element is provided on the surface of the enclosure 22 opposite to the main body 21. The N poles and S poles of the two magnetic elements on the main body 21 and the enclosure 22 are opposite to each other. When the main body 21 and the enclosure 22 are close together, an attraction is generated between the two magnetic elements, thereby achieving a connection.

[0053] To enhance the stability and reliability of the connection between the main body 21 and the enclosure 22, multiple magnetic elements can be provided on the enclosure 22 and the main body 21 respectively to form a more uniform adsorption force.

[0054] It should be noted that this application does not limit the arrangement of the enclosure 22 around the window.

[0055] For example, the barrier 22 can be set on opposite sides of the window. Taking a rectangular window as an example, the barrier 22 can be set on one side of the two long sides of the window, or on one side of the two short sides, so as to block damaged objects from the two sides of the window and the side of the window away from the infrared detector 3, thereby protecting the light-transmitting component 4.

[0056] However, this application does not specifically limit this. In other embodiments of this application, the barrier 22 may also surround the perimeter of the window. For example, if the window is rectangular, the barrier 22 surrounds the four sides of the rectangle; or, if the window is circular, the barrier 22 is arranged around the circular window. In this embodiment, the barrier 22 can block damaged objects from any side of the window and from the side of the window away from the infrared detector 3, providing more comprehensive protection for the light-transmitting element 4 and preventing damage to it.

[0057] In one possible implementation, the bottom surface of the main body 21 is bonded to the front surface of the substrate 1, i.e., bonded by applying an adhesive between the bottom surface of the main body 21 and the front surface of the substrate 1. Bonding the main body 21 and the substrate 1 is very convenient and can improve the manufacturing efficiency of the infrared detector module. However, this application does not limit the connection method between the main body 21 and the substrate 1; other connection methods can also be used, as long as the main body 21 and the substrate 1 are connected.

[0058] In this embodiment, the infrared detector module includes a substrate 1, a housing 2, an infrared detector 3, and a light-transmitting element 4. The housing 2 has a window, and the light-transmitting element 4 is located within the window. The housing 2, substrate 1, and light-transmitting element 4 form a cavity 6. The infrared detector 3 is disposed within the cavity 6. The substrate 1 connects the pins of the infrared detector 3 to the outside of the infrared detector module. Therefore, the housing 2, substrate 1, and light-transmitting element 4 form a protective barrier for the infrared detector 3, preventing adverse effects from the external environment. The enclosure portion 22 of the housing 2 is higher than the light-transmitting element 4, which protects the light-transmitting element 4, preventing damage and extending its service life.

[0059] Based on the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0060] An infrared antireflective film and / or metasurface structure located on the target surface of the light-transmitting element 4; the target surface includes the outer surface and / or inner surface of the light-transmitting element 4, the outer surface of the light-transmitting element 4 being the surface of the light-transmitting element 4 away from the infrared detector 3, and the inner surface of the light-transmitting element 4 being the surface of the light-transmitting element 4 close to the infrared detector 3.

[0061] The target surface of the light-transmitting element 4 includes three cases: first, the target surface is the outer surface of the light-transmitting element 4; second, the target surface is the inner surface of the light-transmitting element 4; and third, the target surface is both the outer surface and the inner surface of the light-transmitting element 4.

[0062] There are three possible configurations for the target surface of the light-transmitting element 4: first, the target surface of the light-transmitting element 4 is only provided with an infrared anti-reflection film; second, the target surface of the light-transmitting element 4 is only provided with a metasurface structure; and third, the target surface of the light-transmitting element 4 is provided with both an infrared anti-reflection film and a metasurface structure.

[0063] The metasurface structure consists of multiple cylinders arranged in a honeycomb pattern.

[0064] The material of the infrared antireflective coating can be selected according to the infrared band that needs to be transmitted, such as magnesium fluoride (MgF2) and zinc sulfide (ZnS).

[0065] As one possible implementation, the infrared antireflection film comprises alternating layers of germanium and zinc sulfide to give the infrared antireflection film high-temperature resistance, thereby enabling the infrared detector module to have high-temperature resistance.

[0066] In this embodiment, by setting an infrared anti-reflection film, the transmittance of infrared light on the light-transmitting component 4 can be improved, the absorption and reflection of infrared light can be reduced, thereby improving the performance and detection sensitivity of the infrared detector module.

[0067] In this embodiment, by setting a metasurface structure, the transmittance of infrared light on the light-transmitting component 4 can be improved, the absorption and reflection of infrared light can be reduced, thereby improving the performance and detection sensitivity of the infrared detector module.

[0068] like Figure 1 As shown, based on any of the above embodiments, in one embodiment of this application, the infrared detector module may further include:

[0069] The through hole 7 is located in the main body 21 and is connected to the cavity 6 to release heat in the cavity 6.

[0070] In this embodiment, the position of the through hole 7 on the housing 2 is not limited and can be set arbitrarily. For example, it can be set on the top surface of the main body 21 or on the side wall of the main body 21.

[0071] The number of through holes 7 is not limited in this embodiment and depends on the situation. The number of through holes 7 can be one, two, three, four, etc.

[0072] Heat may be generated during the encapsulation of the housing 2 and the substrate 1. If the heat is not discharged from the cavity 6, the main body 21 will expand, and it will also affect the bonding strength between the main body 21 and the substrate 1. In this embodiment, by providing a through hole 7 on the main body 21, the heat in the cavity 6 can be discharged in time, avoiding the heat from having an adverse effect on the main body 21, improving the bonding strength between the main body 21 and the substrate 1, and at the same time avoiding the heat from having an adverse effect on the imaging of the infrared detector 3.

[0073] This application also provides an infrared thermal imager, which includes the infrared detector module described in any of the above embodiments.

[0074] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0075] The infrared detector module and infrared thermal imager provided in this application have been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the solution and core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of this application.

Claims

1. An infrared detector module, characterized in that, include: Substrate (1), housing (2), infrared detector (3) and light-transmitting component (4); The housing (2) includes a main body (21) and a enclosure (22). The top surface of the main body (21) is provided with a window. The enclosure (22) is connected to the top surface of the main body (21) and is located at least on both sides of the window. The light-transmitting element (4) is located at the window and is lower than the enclosure (22). The bottom surface of the main body (21) is fixedly connected to the front surface of the substrate (1), and the housing (2), the light-transmitting element (4) and the substrate (1) form a cavity (6); the infrared detector (3) is located in the cavity (6), and the substrate (1) transfers the pins of the infrared detector (3) to the back surface of the substrate (1).

2. The infrared detector module as described in claim 1, characterized in that, The main body (21) and the enclosure (22) are an integral structure.

3. The infrared detector module as described in claim 1, characterized in that, The enclosure (22) is detachably connected to the main body (21).

4. The infrared detector module as described in claim 3, characterized in that, The connection method between the enclosure part (22) and the main body (21) includes any of the following: Clip-on connection, pin connection, magnetic connection.

5. The infrared detector module as described in claim 1, characterized in that, The enclosure (22) surrounds the window.

6. The infrared detector module as described in claim 1, characterized in that, Also includes: An infrared antireflective film and / or metasurface structure located on the target surface of the light-transmitting element (4); the target surface includes the outer surface and / or inner surface of the light-transmitting element (4), the outer surface of the light-transmitting element (4) being the surface of the light-transmitting element (4) away from the infrared detector (3), and the inner surface of the light-transmitting element (4) being the surface of the light-transmitting element (4) close to the infrared detector (3).

7. The infrared detector module as described in claim 6, characterized in that, Also includes: A through hole (7) is located in the main body (21), the through hole (7) is connected to the cavity (6), and is used to release heat in the cavity (6).

8. The infrared detector module according to any one of claims 1 to 7, characterized in that, The bottom surface of the main body (21) is bonded to the front surface of the substrate (1).

9. An infrared thermal imager, characterized in that, Including the infrared detector module as described in any one of claims 1 to 8.

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