Aging test socket adaptive to chips of different specifications

Abstract

The utility model discloses an aging test socket adaptive to chips of different specifications, which comprises a socket body and a bearing plate arranged on the socket body and used for bearing the chips, a group of test pinholes are arranged on the bearing plate, and test probes matched with pins on the chips are arranged in the test pinholes in a floating manner; the socket body is further quickly connected with a positioning plate, the positioning plate is provided with a pressing plate, and the pressing plate can be driven by a driving assembly to move up and down or / and rotate relative to the positioning plate so as to apply downward acting force to the chip all the time. The beneficial effects of the utility model are mainly embodied in that the design is exquisite, the layout is reasonable, and the position of the pressing plate on the positioning plate can be adjusted in real time according to the thickness of the chip so as to ensure that the acting force applied to the chip is always constant, and the accuracy of the detection precision is ensured. In addition, the structure is compact, the layout is reasonable, disassembly, replacement and maintenance are convenient, the working efficiency is greatly improved, and enterprise development is facilitated.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip testing equipment technical field, specifically, especially, a kind of self-adapting different specification chip's aging test socket. BACKGROUND

[0002] It is known that encapsulated chip refers to chip that has been wrapped, which can effectively avoid chip from being damaged by external environment, after chip encapsulation, aging test socket is often used to carry out aging test on chip for sampling inspection, to predict and evaluate the service life of the whole batch of chip products, to ensure the quality of products, which has been widely used in the field of encapsulated chip.

[0003] The existing aging test socket is directly inserted into the test socket when using, and then the aging test socket is connected to carry out aging detection on the chip.

[0004] As disclosed in the authorized announcement No.CN219609002U, a socket for aging test of encapsulated chip can press and fix the chip while inserting the chip, to improve the stability of chip insertion and the accuracy of test, comprising a base, a chip seat, four sets of pressure rods and four sets of clamping jaws, the top end of the base is provided with a square groove, the chip seat is slidably connected with the square groove, the front end, the left end, the rear end and the right end of the square groove are provided with swing grooves, the middle parts of the four sets of pressure rods are hingedly connected with the middle parts of the four sets of swing grooves, and the four sets of clamping jaws are respectively installed on the top end outer sides of the four sets of pressure rods. However, although the socket improves the stability of chip insertion, when positioning the chip with different thickness, the chip is easily damaged due to excessive pressure, or the test result is inaccurate due to poor pressing, which seriously affects the yield, and has great limitations. UTILITY MODEL CONTENTS

[0005] The utility model aims at overcoming the deficiencies in the prior art, and provides an aging test socket self-adapting to different specification chips.

[0006] The utility model achieves the above-mentioned purpose by the following technical solutions.

[0007] An aging test socket self-adapting to different specification chips, comprising a socket body and a bearing plate provided thereon for bearing a chip, a group of test pin holes are formed on the bearing plate, and a test probe matched with the pins on the chip is floatingly arranged in the test pin hole; a positioning plate is quickly connected to the socket body, a pressing plate is arranged on the positioning plate, and the pressing plate can move up and down or / and rotate relative to the positioning plate under the driving of a driving assembly, to always apply downward force to the chip.

[0008] Preferably, the driving assembly comprises a receiving hole formed in the positioning plate, and a pressing spring, a guide plate and the pressing plate are sequentially arranged in the receiving hole.

[0009] Preferably, the driving assembly further comprises a limiting groove formed in the receiving hole, and a limiting block matched with the limiting groove is arranged on the outer circumferential surface of the guide plate; a threaded sleeve is fixedly arranged on the lower surface of the guide plate, and a threaded rod matched with the threaded sleeve is arranged on the pressing plate.

[0010] Preferably, a buffer pad made of silica gel is further fixedly arranged on the bottom of the pressing plate, and protruding particles are arranged on the lower surface of the buffer pad.

[0011] Preferably, the test needle hole is provided with a limiting plate fixedly arranged on the bearing plate, a baffle movably arranged above the limiting plate, a jacking spring arranged between the limiting plate and the baffle, and the test probe is fixedly arranged on the baffle.

[0012] Preferably, two insertion grooves are formed on the upper surface of the socket body, and an insertion plate matched with the insertion grooves is arranged in the insertion grooves, and the insertion plate is fixedly arranged on the positioning plate.

[0013] Preferably, a mounting hole is formed in the positioning plate, a pressing spring is fixedly arranged in the mounting hole, the other end of the pressing spring is fixedly connected with a positioning block, and a positioning groove is formed on the outer surface of the socket body, and the positioning groove is matched with the positioning block.

[0014] Preferably, two sliding grooves are formed on the two sides of the mounting hole, and two sliding blocks matched with the sliding grooves are arranged on the two sides of the positioning block.

[0015] Preferably, a group of heat dissipation grooves are formed on the outer surface of the socket body.

[0016] The beneficial effects of the utility model mainly reflect in:

[0017] 1. The design is exquisite, the layout is reasonable, the pressing plate can adjust the position on the positioning plate according to the thickness of the chip, so as to ensure that the acting force applied to the chip is always constant, guarantee the accuracy of detection precision. In addition, the structure is compact, the layout is reasonable, and it is also convenient to disassemble, replace and overhaul, which greatly improves the work efficiency and is beneficial to the development of enterprises.

[0018] 2. The test probe can move up and down under the action of the jacking spring, which can effectively avoid the situation that the socket cannot be tested due to the too long or too short pin, improve the precision of measurement, and also greatly increase the applicability of measurement.

[0019] 3. The setting of the buffer pad can play the role of shock absorption and buffering, avoiding the situation that the chip is damaged by the pressing plate, and ensuring the yield of the chip.

[0020] 4. The assembly and disassembly of the socket body and positioning plate are simple, convenient, stable and reliable, greatly improving work efficiency. Attached Figure Description

[0021] The technical solution of this utility model will be further described below with reference to the accompanying drawings:

[0022] Figure 1 : A three-dimensional structural diagram of a preferred embodiment of this utility model;

[0023] Figure 2 : A schematic diagram of the orthographic section of a preferred embodiment of this utility model;

[0024] Figure 3 : A first-view schematic diagram of the preferred embodiment of this utility model after the positioning plate and the socket body are separated;

[0025] Figure 4 : A second-view schematic diagram of the preferred embodiment of this utility model after the positioning plate and the socket body are separated;

[0026] Figure 5 This is a three-dimensional structural diagram of the positioning plate in a preferred embodiment of the present invention;

[0027] Figure 6 An exploded view of the driving component in a preferred embodiment of this utility model is provided;

[0028] Figure 7 An exploded view of the connection structure between the socket body and the positioning plate in a preferred embodiment of this utility model is provided. Detailed Implementation

[0029] The present invention will now be described in detail with reference to the specific embodiments shown in the accompanying drawings. However, these embodiments are not limited to the present invention, and any structural, methodological, or functional modifications made by those skilled in the art based on these embodiments are included within the protection scope of the present invention.

[0030] In the description of this utility model, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model based on the specific circumstances.

[0031] The present invention will now be described in detail with reference to the accompanying drawings and embodiments.

[0032] As Figures 1 to 7 The utility model discloses a kind of aging test sockets of self-adapting different specification chips, including socket body 1 and the bearing plate for bearing chip being arranged on it, a group of test pinholes 7 are opened on the bearing plate, test probe 8 that is adapted to the pin on the chip is floatingly arranged in the test pinhole 7.Specifically, limit plate 10 is built-in in the test pinhole 7, limit plate 10 is movably arranged above, baffle 9 is movably arranged above, lift spring 11 is arranged between baffle 9 and limit plate 10, test probe 8 is fixedly arranged on baffle 9.

[0033] When the pin on the chip is inserted into the test pinhole 7, the lift spring 11 pushes the baffle 9 to move upwards, the baffle 9 drives the test probe 8 to move upwards, and the test probe 8 is tightly attached to the pin on the chip. When the length of the pin on the chip is relatively large, the test probe 8 and the baffle 9 can move downwards under the action of the pin. The above design can effectively avoid the situation that the socket cannot be tested due to the pin being too long or too short, greatly improving the applicability.

[0034] The socket body 1 is also quickly connected with a positioning plate 12, the positioning plate 12 is provided with a pressing plate 146, the pressing plate 146 can move up and down or / and rotate relative to the positioning plate 12 under the driving of a driving assembly 14 to always apply a downward force to the chip. The above design is ingenious, the layout is reasonable, the pressing plate 146 can adjust its position on the positioning plate in real time according to the thickness of the chip to ensure that the force applied to the chip is always constant, ensuring the accuracy of detection precision. In addition, the structure is compact, the layout is reasonable, and it is also convenient to disassemble, replace and maintain, greatly improving the work efficiency and being beneficial to the development of enterprises.

[0035] In the preferred embodiment, the driving assembly 14 at least includes a receiving hole 13 opened in the positioning plate 12, a force spring 143, a guide plate 141 and the pressing plate 146 are sequentially arranged in the receiving hole 13. The force spring 143 can apply a force to the pressing plate 146 through the guide plate 141 to drive the pressing plate 146 to move downward.

[0036] The driving assembly 14 also includes a limiting groove opened in the receiving hole 13, and a limiting block 142 adapted to the limiting groove is arranged on the outer circumferential surface of the guide plate 141; a threaded sleeve 144 is fixedly arranged on the lower surface of the guide plate 141, and a threaded rod 145 screwed with the threaded sleeve 144 is arranged on the pressing plate 146. The threaded rod 145 and the threaded sleeve 144 are matched to adjust the pressing plate by a small distance according to the thickness of the chip, to ensure that the pressing plate 146 applies a constant force to the chip.

[0037] Further, the bottom of the pressing plate 146 is further fixed with a buffer pad 147 made of silica gel material, and the lower surface of the buffer pad 147 is provided with protruding particles. The buffer pad 147 can play a role of shock absorption and buffering, avoiding the situation that the chip is damaged by the pressing plate, and ensuring the yield of the chip.

[0038] In the preferred embodiment, when testing the chip, the chip to be tested is placed on the carrier plate, and the pins of the chip are inserted into the test pin holes 7. After the above process is completed, the positioning plate 12 is installed on the top of the socket body 1. At the same time, the force spring 143 exerts force on the pressing plate 146 through the guide plate 141 until the buffer pad 147 is tightly attached to the upper surface of the chip.

[0039] During installation, if the thickness of the chip is too large, the chip exerts force on the buffer pad 147, and the pressing plate 146 and the guide plate 141 move upward, and the force spring 143 is in a compressed state.

[0040] If the thickness of the chip is small, the force spring 143 exerts force on the pressing plate 146 through the guide plate 141 until the buffer pad 147 is tightly attached to the upper surface of the chip, so as to achieve the purpose of adaptive extrusion fixation, and can be suitable for positioning of chips of various thickness specifications.

[0041] If the thickness of the chip is too small and the fixation is not firm, the pressing plate 146 is counterclockwise rotated, the threaded rod 145 moves downward relative to the threaded sleeve 144, and the buffer pad 147 is driven to move downward until the buffer pad 147 is tightly pressed on the chip.

[0042] The upper surface of the socket body 1 is further provided with a slot 4, the slot 4 is built-in with a plug plate 151 matched therewith, and the plug plate 151 is fixedly arranged on the positioning plate 12. The positioning plate 12 is provided with a mounting hole 152, the mounting hole 152 is fixedly arranged with a pressing spring 154, the other end of the pressing spring 154 is fixedly connected with a positioning block 155, the outer surface of the socket body 1 is provided with a positioning groove 5 matched with the positioning block 155. The two sides of the mounting hole 152 are provided with a sliding groove 153, and the two sides of the positioning block 155 are provided with a sliding block 156 matched with the sliding groove 153.

[0043] When installing and positioning the positioning plate 12, the positioning block 155 is pressed inwards until it retracts into the mounting hole 152. Then, the two insert plates 151 are inserted into the slot 4. When the positioning block 155 moves to the position of the positioning groove 5, the spring 154 is pressed to push the positioning block 155 back into place and pop it out of the positioning groove 5, thus fixing the positioning plate 12. To disassemble, the positioning block 155 is pressed inwards until it is fully retracted into the mounting hole 152. Then, the positioning plate 12 is pulled upwards to disassemble it. This connection method is simple and convenient, facilitating disassembly, replacement, and maintenance, and greatly improving work efficiency.

[0044] Furthermore, a set of heat dissipation grooves 3 are provided on the outer surface of the socket body 1. The heat dissipation grooves 3 can quickly dissipate heat during the testing process and improve safety.

[0045] It should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This way of describing the specification is only for clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

[0046] The detailed descriptions listed above are merely specific descriptions of feasible implementations of this utility model, and are not intended to limit the scope of protection of this utility model. All equivalent implementations or modifications made without departing from the spirit of this utility model should be included within the scope of protection of this utility model.

Claims

1. An aging test socket for adaptive chips of different specifications, comprising a socket body (1) and a carrier plate disposed thereon for supporting the chip, characterized in that: A set of test pin holes (7) are provided on the carrier plate. Test probes (8) that are adapted to the pins on the chip are floating in the test pin holes (7). A positioning plate (12) is also connected to the socket body (1). A pressure plate (146) is provided on the positioning plate (12). The pressure plate (146) can move up and down or rotate relative to the positioning plate (12) under the drive of the drive component (14) so ​​as to always apply a downward force to the chip.

2. The aging test socket for adaptive chips of different specifications according to claim 1, characterized in that: The drive assembly (14) includes at least a storage hole (13) opened on the positioning plate (12), and a force-applying spring (143), a guide plate (141) and a pressure plate (146) are sequentially arranged in the storage hole (13).

3. The aging test socket for adaptive chips of different specifications according to claim 2, characterized in that: The drive assembly (14) also includes a limiting groove opened in the receiving hole (13), and a limiting block (142) adapted to the limiting groove is provided on the outer circumferential surface of the guide plate (141); a threaded sleeve (144) is fixedly provided on the lower surface of the guide plate (141), and a threaded rod (145) screwed to the threaded sleeve (144) is provided on the pressure plate (146).

4. The aging test socket for adaptive chips of different specifications according to claim 1 or 2, characterized in that: The bottom of the pressure plate (146) is also fixed with a buffer pad (147), which is made of silicone material and has raised particles on the lower surface of the buffer pad (147).

5. The aging test socket for adaptive chips of different specifications according to claim 1, characterized in that: The test pinhole (7) has a limiting plate (10) fixed on the bearing plate. A baffle (9) is movably provided above the limiting plate (10). A lifting spring (11) is provided between the baffle (9) and the limiting plate (10). The test probe (8) is fixed on the baffle (9).

6. The aging test socket for adaptive chips of different specifications according to claim 1, characterized in that: The socket body (1) has slots (4) on both sides of its upper surface. The slots (4) have insert plates (151) that are compatible with them. The insert plates (151) are fixed on the positioning plate (12).

7. The aging test socket for adaptive chips of different specifications according to claim 6, characterized in that: The positioning plate (12) has an installation hole (152), and a pressing spring (154) is fixedly installed in the installation hole (152). The other end of the pressing spring (154) is fixedly connected to the positioning block (155). The outer surface of the socket body (1) has a positioning groove (5), which is adapted to the positioning block (155).

8. The aging test socket for adaptive chips of different specifications according to claim 7, characterized in that: The mounting hole (152) has grooves (153) on both sides, and the positioning block (155) has sliders (156) on both sides that are adapted to the grooves (153).

9. The aging test socket for adaptive chips of different specifications according to claim 1, characterized in that: A set of heat dissipation grooves (3) are provided on the outer surface of the socket body (1).

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