Focusing type semiconductor laser protection shell
By designing a protective housing for an adjustable-focus semiconductor laser, the heat dissipation and lens module protection issues of high-power lasers are solved, enabling precise adjustment and stable fixation of the lens module, and ensuring the long-term reliability and efficient heat dissipation of the laser.
Patent Information
- Application Number
- CN202520352737.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-03
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-03-03
AI Technical Summary
Existing semiconductor lasers suffer from severe heat dissipation problems in high-power applications. The installation and adjustment of lens modules are not flexible enough, and there is a lack of effective protection mechanisms, which affects the focusing effect and output quality of the laser beam.
An adjustable-focus semiconductor laser protective housing was designed, comprising an adjustable-focus lens module, a cooling module, and a dustproof lens. The lens module is precisely adjusted via bolt connections and is equipped with a cooling chip, a heat sink, and a cooling fan for effective heat dissipation. A silicone pad is added to protect the lens, and a temperature sensor monitors the temperature in real time and activates the cooling system.
It achieves precise adjustment and stable fixation of the lens module, effectively preventing dust accumulation and external impacts, ensuring stable operation and long-term reliability of the laser, improving heat dissipation efficiency, and preventing overheating damage.
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Figure CN223898802U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to the field of semiconductor laser, especially to a focus adjustable semiconductor laser protection shell. BACKGROUND
[0002] Semiconductor laser, also known as laser diode, is a device that produces stimulated emission with semiconductor material as working substance; since the 1960s, semiconductor laser has been proposed, and its technology has developed rapidly, and has become an indispensable part of laser technology; semiconductor laser is small in size, long in life, can be pumped by simple injection current, and is compatible with integrated circuits in working voltage and current, and is easy to monolithic integration; these advantages make semiconductor laser widely used in laser communication, optical storage, optical gyroscope, laser printing, ranging and radar fields;
[0003] With the development of technology, the performance of semiconductor laser is continuously improved, the output power and conversion efficiency are significantly improved, and the application field is continuously expanded; for example, small power semiconductor laser used in information technology field develops rapidly, especially in the fields of optical fiber communication, optical switching system and optical disc information processing technology, the single frequency narrow linewidth, high speed, tunable, short wavelength and optoelectronic monolithic integration of semiconductor laser are more and more obvious;
[0004] Although semiconductor laser technology has made remarkable progress, there are still some technical problems in practical application; especially in the application of high power semiconductor laser, the heat dissipation problem is particularly important; high power laser diode will generate a lot of heat when working, if it cannot be effectively dissipated in time, it will cause the temperature of the laser to rise, and then affect its performance and stability, and even may cause damage; in addition, the traditional semiconductor laser protection shell design often lacks precise adjustment and protection mechanism for lens module; as a key optical element of semiconductor laser, the position and state of lens module directly affect the focusing effect and output quality of laser beam; however, in the prior art, the installation and adjustment of lens module are often not flexible enough, and lack effective protection for external environment. UTILITY MODEL CONTENTS
[0005] In order to solve the problems of traditional semiconductor laser in heat dissipation and lens module protection in the prior art, the utility model provides a focus adjustable semiconductor laser protection shell;
[0006] The utility model provides a focus adjustable semiconductor laser protection shell adopts the following technical scheme:
[0007] The utility model provides a kind of focus type semiconductor laser protective shell, including laser mount, laser shell;The laser shell laser mount is connected by bolt, and installation space is formed inside;The inside of the laser shell is mounted with the lens module of adjustable focal length;The front end of the lens module is fixedly installed with baffle ring;The front end of the baffle ring is installed with dustproof lens by thread;The dustproof lens is separated from lens module by baffle ring;The inside wall of the laser mount is installed with laser diode, and the relatively thick laser beam generated by the laser diode is refracted to form uniform linear light spot by lens module;The outside wall of the laser mount is installed with refrigeration module;The bottom of the laser mount is also installed with gran head;
[0008] Further, the laser shell includes a square connection portion for connecting with the laser mount, and a cylindrical mounting portion for mounting the lens module; the baffle ring is fixedly connected with the cylindrical mounting portion by bolts
[0009] Further, the lens module includes a lens cover plate, a microlens array, a lens mounting cylinder, a glued lens, and a lens nut; the inside of the cylindrical mounting portion of the laser shell is slidably provided with the lens mounting cylinder; the end of the lens mounting cylinder close to the laser mount is provided with the glued lens, and the lens mounting cylinder is fixed in the inside of the lens mounting cylinder by the lens nut; the other end of the lens mounting cylinder is provided with the microlens array; the surface of the microlens array is fixed with the lens mounting cylinder by bolts through the lens cover plate; the outside wall of the cylindrical mounting portion of the laser shell is sleeved with an adjusting assembly for controlling the sliding of the lens module in the inside thereof;
[0010] Further, the adjusting assembly includes an outer sleeve, a guide sleeve, and a guide shaft; the outside wall of the lens mounting cylinder is provided with the guide shaft by bolts; the outside wall of the cylindrical mounting portion of the laser shell is provided with a circular key groove, and the guide shaft can linearly slide in the circular key groove; the outside wall of the cylindrical mounting portion of the laser shell is sleeved with the guide sleeve; the inside of the guide sleeve is provided with a helical guide groove; the guide shaft can linearly move through the guide groove; the outside wall of the guide sleeve is sleeved with the outer sleeve, and the guide sleeve is fixed with the guide sleeve by bolts; the lens mounting cylinder can be moved forward and backward by the guide sleeve by rotating the outer sleeve, so as to adjust the front and back positions of the glued lens and improve the focusing effect of the lens;
[0011] Further, a silica gel gasket is arranged between the microlens array and the lens mounting cylinder; for buffering external impact force, protecting the microlens array from damage;
[0012] Further, the refrigeration module comprises a semiconductor refrigerating sheet, a heat dissipation plate and a heat dissipation fan, which are used for solving the heat dissipation problem of the high-power laser diode during operation; the semiconductor refrigerating sheet is attached to the outer side wall of the laser mounting seat; the heat dissipation plate is mounted on the outer side wall of the laser mounting seat through bolts, and the semiconductor refrigerating sheet is clamped between the heat dissipation plate and the laser mounting seat; the heat dissipation plate is provided with the heat dissipation fan through bolts;
[0013] Further, T-shaped nylon washers are used for bolt mounting between the heat dissipation fan and the heat dissipation plate, so that the sealing property and stability are improved, and the influence of vibration of the heat dissipation fan on performance is reduced;
[0014] Further, the temperature sensor is mounted on the outer side wall of the laser mounting seat, so that the working temperature can be monitored in real time, and the refrigeration module is started to reduce the temperature when the temperature exceeds a preset value;
[0015] Further, the outer side wall of the laser shell is processed with a circular arc surface, and the screw holes are reserved on the upper and lower surfaces of the laser mounting seat, so that the laser mounting seat can be mounted through a circular clamp or a planar fixing mode.
[0016] In summary, the beneficial effects of the utility model are as follows:
[0017] The utility model discloses a laser shell, the structure design of laser mounting seat, realize the accurate adjustment and stable fixation of lens module, increase dustproof lens and silica gel gasket and other protection measures simultaneously, effectively prevent the damage of dust accumulation and external impact to lens module, in addition, the protective shell still integrates refrigeration module, through the synergies of semiconductor refrigerating sheet, heat dissipation plate and heat dissipation fan, timely and effectively dissipate the heat generated by laser, ensure the stable work and long-term reliability of laser. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 It is overall structure schematic diagram of the utility model;
[0019] Figure 2 It is overall internal structure schematic diagram of the utility model;
[0020] Figure 3 It is guiding assembly structure schematic diagram of the utility model;
[0021] Figure 4 It is overall structure explosion schematic diagram of the utility model;
[0022] As shown in the figure: 1 - dustproof lens; 2 - baffle; 3 - outer sleeve; 4 - guide sleeve; 5 - lens cover plate; 6 - microlens array; 7 - silica gel gasket; 8 - lens mounting cylinder; 9 - guide shaft; 10 - cemented lens; 11 - lens nut; 12 - laser housing; 13 - laser diode; 14 - gran head; 15 - laser mounting base; 16 - semiconductor refrigeration sheet; 17 - heat sink; 18 - cooling fan; 19 - T-shaped nylon washer; 20 - temperature sensor. DETAILED DESCRIPTION
[0023] The following will be described in detail with reference to the accompanying drawings Figures 1-4 The utility model makes further detailed description:
[0024] The utility model discloses a kind of focus-adjustable semiconductor laser protective shell, as shown in the figure: Figure 1 、 4 A focus-adjustable semiconductor laser protective shell, including laser mounting base 15, laser housing 12;Laser housing 12 laser mounting base 15 between through bolt connection, inside form installation space;The inside of laser housing 12 is installed with lens module of adjustable focal length;The front end of lens module is fixedly installed with baffle 2;The front end of baffle 2 is installed with dustproof lens 1 by screw thread;Dustproof lens 1 is separated by a distance with lens module by baffle 2;The inner side wall of laser mounting base 15 is installed with laser diode 13, and the relatively thick laser beam generated by laser diode 13 is refracted to form uniform linear light spot by lens module;The outer side wall of laser mounting base 15 is installed with refrigeration module;The bottom of laser mounting base 15 is also installed with gran head 14;In the embodiment, laser housing 12 and laser mounting base 15 are connected by bolt, form a closed installation space, and install lens module, laser diode 13 and other elements inside;Dustproof lens 1 is increased at a position at a distance from lens module, can effectively prevent dust accumulation on lens module, and lens position is away from laser focus point, and dispersed laser line cannot cause burning influence to lens surface;It is suitable for high-power semiconductor laser diode 13, and generates a lot of heat, for this, refrigeration module for convenient installation is added, and laser can be cooled by refrigeration module in higher temperature use environment;
[0025] As shown in the figure: Figure 1 Laser housing 12 includes square connection part for connecting with laser mounting base 15, and cylindrical mounting part for lens module installation;Baffle 2 is fixedly connected with the cylindrical mounting part by bolt;
[0026] As shown in the figure: Figure 2 、 3As shown, the lens module includes a lens cover plate 5, a microlens array 6, a lens mounting cylinder 8, a cemented lens 10, and a lens nut 11. The lens mounting cylinder 8 is slidably disposed inside the cylindrical mounting portion of the laser housing 12. A cemented lens 10 is disposed inside one end of the lens mounting cylinder 8 near the laser mounting base 15 and fixed inside the lens mounting cylinder 8 by the lens nut 11. The microlens array 6 is disposed at the other end of the lens mounting cylinder 8. The surface of the microlens array 6 is fixed to the lens mounting cylinder 8 by bolts through the lens cover plate 5. An adjustment assembly for controlling the sliding of the lens module within the cylindrical mounting portion of the laser housing 12 is fitted onto the outer wall of the cylindrical mounting portion. A guide shaft 9 is bolted to the outer wall of the lens module. A circular keyway is formed on the outer wall of the cylindrical mounting portion of the laser housing 12. The guide shaft 9 can slide linearly within the circular keyway; a guide sleeve 4 is fitted on the outer wall of the cylindrical mounting portion of the laser housing 12; a spiral guide groove is formed inside the guide sleeve 4; the guide shaft 9 can move linearly through the guide groove; an outer sleeve 3 is fitted on the outer wall of the guide sleeve 4 and is fixed to the guide sleeve 4 by bolts; by rotating the outer sleeve 3, the lens mounting cylinder 8 can be moved back and forth through the guide sleeve 4, thereby adjusting the front and rear position of the cemented lens 10 and improving the focusing effect of the lens; in this embodiment, the guide shaft 9 slides linearly within the circular keyway of the laser housing 12, while the guide sleeve 4 guides the movement of the guide shaft 9 through its internal spiral guide groove; when the outer sleeve 3 is rotated, the guide sleeve 4 drives the lens mounting cylinder 8 to move back and forth, thereby adjusting the position of the cemented lens 10;
[0027] like Figure 4 As shown, a silicone pad 7 is provided between the microlens array 6 and the lens mounting cylinder 8; it is used to buffer external impact force and protect the microlens array 6 from damage; in this embodiment, when the laser is subjected to external impact, the silicone pad 7 can absorb and disperse the impact force, thereby protecting the microlens array 6 from damage; it improves the durability and reliability of the laser and ensures the long-term stability of the optical components.
[0028] like Figure 2 , 4As shown, the cooling module includes a thermoelectric cooler 16, a heat sink 17, and a cooling fan 18, used to solve the heat dissipation problem of the high-power laser diode 13 during operation. The thermoelectric cooler 16 is attached to the outer wall of the laser mounting base 15. The heat sink 17 is bolted to the outer wall of the laser mounting base 15, clamping the thermoelectric cooler 16 between it and the laser mounting base 15. The cooling fan 18 is bolted to the outer wall of the heat sink 17. In this embodiment, the thermoelectric cooler 16 is attached to the outer wall of the laser mounting base 15, clamped and dissipated by the heat sink 17. The cooling fan 18 is bolted to the outer wall of the heat sink 17 to accelerate heat dissipation. This design effectively solves the heat dissipation problem of the high-power laser diode 13 during operation, ensuring the long-term stability and reliability of the laser.
[0029] like Figure 2 , 4 As shown, a T-shaped nylon washer 19 is used for bolt installation between the cooling fan 18 and the heat sink 17 to improve sealing and stability and reduce the impact of cooling fan 18 vibration on performance. In this embodiment, when installing the cooling fan 18, the T-shaped nylon washer 19 is placed between the bolt and the heat sink 17 to ensure a tight connection and reduce vibration. This design improves the efficiency and stability of the heat dissipation system and reduces the adverse effects of vibration on laser performance.
[0030] like Figure 2 , 4 As shown, a temperature sensor 20 is installed on the outer wall of the laser mounting base 15 to monitor the operating temperature in real time. When the temperature exceeds the preset value, the cooling module is activated to cool down the laser. In this embodiment, this process is automatic and requires no manual intervention, ensuring that the laser operates within a safe operating range and preventing damage or performance degradation caused by overheating.
[0031] like Figure 1 As shown, the outer wall of the laser housing 12 is machined with an arc surface, and threaded holes are reserved on the upper and lower surfaces of the laser mounting base 15 to support installation by means of circular clamps or flat fixing. In this embodiment, the user can choose to install the laser by means of circular clamps or flat fixing as needed. This design provides a variety of installation options to adapt to different application scenarios and installation requirements. It improves the flexibility and applicability of the laser, enabling it to be widely used in various fields and industries.
[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. The various components mentioned in this utility model are common technologies in the existing field. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A protective housing for an adjustable-focus semiconductor laser, characterized in that: The system includes a laser mounting base (15) and a laser housing (12). The laser housing (12) and the laser mounting base (15) are connected by bolts, forming an internal installation space. An adjustable lens module is installed inside the laser housing (12). A retaining ring (2) is fixedly installed at the front end of the lens module. A dustproof lens (1) is installed at the front end of the retaining ring (2) by a thread. The dustproof lens (1) is separated from the lens module by the retaining ring (2). A laser diode (13) is installed on the inner side wall of the laser mounting base (15). The relatively thick laser beam generated by the laser diode (13) is refracted by the lens module to form a uniform line spot. A cooling module is installed on the outer side wall of the laser mounting base (15). A granite head (14) is also installed at the bottom of the laser mounting base (15).
2. The adjustable-focus high-performance semiconductor laser protective housing according to claim 1, characterized in that, The laser housing (12) includes a square connecting part for connecting with the laser mounting base (15) and a cylindrical mounting part for mounting the lens module; the retaining ring (2) is fixedly connected to the cylindrical mounting part by bolts.
3. The adjustable-focus semiconductor laser protective housing according to claim 2, characterized in that, The lens module includes a lens cover plate (5), a microlens array (6), a lens mounting cylinder (8), a cemented lens (10), and a lens nut (11); the lens mounting cylinder (8) is slidably disposed inside the cylindrical mounting part of the laser housing (12); a cemented lens (10) is disposed inside one end of the lens mounting cylinder (8) near the laser mounting base (15) and is fixed inside the lens mounting cylinder (8) by the lens nut (11); the other end of the lens mounting cylinder (8) is disposed with a microlens array (6); the surface of the microlens array (6) is fixed to the lens mounting cylinder (8) by bolts through the lens cover plate (5); an adjustment component for controlling the sliding of the lens module inside is fitted on the outer wall of the cylindrical mounting part of the laser housing (12).
4. The adjustable-focus semiconductor laser protective housing according to claim 3, characterized in that, The adjustment assembly includes an outer sleeve (3), a guide sleeve (4), and a guide shaft (9); the outer wall of the lens mounting cylinder (8) is bolted with the guide shaft (9); the outer wall of the cylindrical mounting part of the laser housing (12) is provided with a circular keyway, and the guide shaft (9) can slide linearly in the circular keyway; the outer wall of the cylindrical mounting part of the laser housing (12) is fitted with the guide sleeve (4); the inside of the guide sleeve (4) is provided with a spiral guide groove; the guide shaft (9) can move linearly through the guide groove; the outer wall of the guide sleeve (4) is fitted with the outer sleeve (3) and fixed to the guide sleeve (4) with bolts; by rotating the outer sleeve (3), the lens mounting cylinder (8) can be moved back and forth through the guide sleeve (4), thereby adjusting the front and rear position of the cemented lens (10) and improving the focusing effect of the lens.
5. The adjustable-focus semiconductor laser protective housing according to claim 3, characterized in that, A silicone gasket (7) is provided between the microlens array (6) and the lens mounting cylinder (8) to buffer external impact forces and protect the microlens array (6) from damage.
6. The adjustable-focus semiconductor laser protective housing according to claim 1, characterized in that, The cooling module includes a semiconductor cooling chip (16), a heat sink (17), and a cooling fan (18) to solve the heat dissipation problem when the high-power laser diode (13) is working. The semiconductor cooling chip (16) is attached to the outer wall of the laser mounting base (15). The heat sink (17) is bolted to the outer wall of the laser mounting base (15), and the semiconductor cooling chip (16) is clamped between it and the laser mounting base (15). The cooling fan (18) is bolted to the outer wall of the heat sink (17).
7. The adjustable-focus semiconductor laser protective housing according to claim 6, characterized in that, The bolt installation between the cooling fan (18) and the heat sink (17) uses a T-type nylon washer (19) to improve sealing and stability and reduce the impact of cooling fan (18) vibration on performance.
8. A protective housing for a focusable semiconductor laser according to claim 6, characterized in that, A temperature sensor (20) is installed on the outer wall of the laser mounting base (15) to monitor the working temperature in real time. When the temperature exceeds the preset value, the cooling module is activated to cool down the laser.
9. A protective housing for a focusable semiconductor laser according to claim 1, characterized in that, The outer wall of the laser housing (12) is machined with an arc surface, and threaded holes are reserved on the upper and lower surfaces of the laser mounting base (15) to support installation by means of circular clamps or flat fixing.