Multiband laser chip integrated laser light source with reference light path

Abstract

The utility model provides a multiband laser chip integrated laser light source with a reference light path, which comprises a packaging shell, and the packaging shell comprises a packaging base and a packaging cap. The packaging shell is provided with laser chips, a beam combining unit and a reflecting unit, output light beams with different wavelengths emitted by the multiple laser chips all pass through the beam combining unit and the reflecting unit, and the output light beams are combined after passing through the beam combining unit. Reflected light generated when the output light beam passes through the reflection unit is used as a reference light beam; a reference gas chamber and a photoelectric detector are arranged in the packaging shell, and the reference light beam is detected by the photoelectric detector after passing through the reference gas chamber. According to the multi-band laser chip integrated laser light source with the reference light path, the packaging shell serves as a standardized general package, and the compact and efficient beam combining light path and the reference light path are integrated, so that the multi-band laser chip integrated laser light source with the reference light path is miniaturized and universalized from a device end.

Description

Technical Field

[0001] This utility model relates to a multi-band laser device structure, specifically, to a multi-band laser chip integrated laser source with a reference optical path. Background Technology

[0002] Tunable laser absorption spectroscopy (TDLAS) is a highly sensitive trace gas detection technology. By using a single-frequency tunable laser, it can identify different characteristic absorptions from the components of a gas mixture, avoiding spectral interference. It has high sensitivity and resolution. By combining it with modulation techniques and long optical path lengths, the detection sensitivity can reach the ppt level. It is widely used in molecular spectroscopy research, industrial process monitoring and control, combustion process diagnostics and analysis, engine efficiency and vehicle exhaust detection, explosion detection, and atmospheric trace pollutant gas monitoring.

[0003] Due to the high selectivity of TDLAS technology, a single laser source can only measure a single gas. Even with a wide tuning range, it can only measure a maximum of two or three gas components. Therefore, when detecting the concentration of multi-component gases, it is usually necessary to consider using multiple laser sources with different wavelengths. Compared to multiple separate laser sources, designing and developing a monolithic integrated multi-band laser chip laser will help promote the miniaturization and cost reduction of laser gas detection systems. However, when detecting target gases under varying ambient temperatures, the laser gas detection system may fail to detect the target gas accurately or generate false alarms because it cannot determine whether the center wavelength of the laser output has drifted. Generally, it is necessary to use an integrated reference photodetector and reference gas cell to achieve real-time tracking and calibration of the laser's center wavelength. However, in existing technologies, standardized universal packaging has not yet been achieved at the device level for multi-band laser chips with reference photodetectors and reference gas cells (i.e., those with reference optical paths). Standardized universal packaging refers to a series of standardized packaging forms used in semiconductor and optoelectronic device manufacturing, such as TO packaging or butterfly packaging for lasers, to ensure device interchangeability, reliability, and consistency, enabling miniaturization and cost reduction of lasers at the device level.

[0004] In existing technologies, such as the coaxial multi-wavelength self-stabilizing laser for real-time detection of multi-component gases disclosed in Chinese invention patent CN202210399288.9, multiple highly integrated TO-packaged lasers with different output wavelengths and multiple TO-packaged detectors with reference gas chambers are integrated into a single laser tube housing. Multiple filters are used to achieve coaxial output of multi-wavelength lasers and active feedback real-time calibration of the laser wavelength. However, from a device perspective, the laser structure disclosed in this document merely encapsulates multiple TO lasers and multiple TO detectors into a non-standardized laser tube housing to achieve its functionality. Each TO packaged unit corresponds to one TO detector, resulting in insufficient integration of the overall optical path. This leads to complex beam combining and reference optical path structures that occupy a significant amount of space. Furthermore, the laser tube housing itself becomes a large and complex irregular structure, requiring customization, resulting in high costs, large size, and inability to be used as a standardized, universal package.

[0005] In order to solve the above problems, people have been seeking an ideal technological solution. Utility Model Content

[0006] The purpose of this invention is to address the shortcomings of existing technologies and improve the problems of complex and space-consuming laser optical path and packaging structures. Starting from the device end, it provides an integrated laser source that uses a laser beam processing component to optimize the output beam of a multi-band laser chip, thereby increasing the integration of the overall optical path structure and making the packaging structure more miniaturized and versatile.

[0007] To achieve the above objectives, the technical solution adopted by this utility model is as follows: It includes a packaging shell, which comprises a packaging base and a packaging cap matching the packaging base; the packaging base is equipped with multiple laser chips, and the packaging shell is equipped with a laser beam processing assembly; the laser beam processing assembly includes a beam combining unit and a reflection unit, wherein output beams of different wavelengths emitted by the multiple laser chips pass through the beam combining unit and the reflection unit, the output beams are combined after passing through the beam combining unit, and the reflected light generated when the output beams pass through the reflection unit serves as a reference beam; the packaging shell contains a reference gas chamber and a photodetector, and the reference beam is detected by the photodetector after passing through the reference gas chamber.

[0008] Based on the above, the packaging shell adopts a butterfly-shaped package, and the laser chip adopts an edge-emitting laser chip.

[0009] Based on the above, the beam combining unit employs beam combining lenses and reflectors, and the beam combining lenses employ wavelength beam combining lenses and / or polarization beam combining lenses.

[0010] Based on the above, the reflection unit adopts a first lens or a beam splitter, and the output beam is combined by the beam combining unit and then passes through the reflection unit; a second lens for shaping the output beam is also provided after the beam splitter.

[0011] Based on the above, the packaging shell adopts T0 packaging, the laser chip adopts a surface-emitting laser chip or a side-emitting laser chip, and an optical path deflection structure is provided between the side-emitting laser chip and the beam combining unit.

[0012] Based on the above: the beam combining unit employs a third lens and a spatial beam combining element, the third lens converges the output beam, and the spatial beam combining element is located at the focal point where the output beam converges.

[0013] Based on the above, the reflection unit adopts the third lens or beam splitter of the beam combining unit, and the beam splitter is disposed between the third lens and the spatial beam combining element.

[0014] Based on the above, a fourth lens is also included. The fourth lens and the third lens form a focusing lens group. The fourth lens initially converges the output beam, and the third lens converges the output beam to a focal point.

[0015] Based on the above, the output beams emitted between the plurality of laser chips are configured to have a tilt angle that brings them closer to each other before passing through the third lens of the beam combining unit.

[0016] Based on the above, a fifth lens is also provided inside the packaging housing, and the reference beam is shaped by the fifth lens before passing through the reference gas chamber.

[0017] Based on the above, a sixth lens is also provided inside the packaging housing. The output beam is collimated by the sixth lens before passing through the beam combining unit. The sixth lens is a spherical lens or a cylindrical lens group.

[0018] Based on the above, an optical isolator is also provided inside the packaging housing, and the output beam passes through the optical isolator before passing through the beam combining unit.

[0019] Based on the above, a thermistor, a heat sink, and a temperature control module are also installed on the packaging base. The temperature control module uses a TEC cooler or a heater, and the heat sink is disposed between the temperature control module and the laser chip.

[0020] Based on the above, each laser chip corresponds to one thermistor, one heat sink, and one temperature control module.

[0021] Based on the above, a heat insulation block is provided between the heat sink and the temperature control module used for adjacent laser chips.

[0022] This invention represents a substantial advancement over existing technologies. Specifically, within the packaging housing, a laser beam processing component optimizes the output beam of the multi-band laser chip, increasing the overall integration of the optical path structure. Specifically, a beam combining unit combines the output beams, and a reflection unit reflects a portion of the output beams from multiple laser chips as a reference beam. This reference beam is detected by a reference gas chamber and a reference detector, eliminating the need for multiple optical instruments such as optical lenses and photodetectors. Thus, the beam combining, reflection, and reference beams in the optical path structure are compact, efficient, and highly coordinated, resulting in a high degree of integration and a small footprint for the overall laser optical path. Furthermore, based on this highly integrated optical path structure, the packaging housing uses a single packaging base and a matching packaging cap, providing a simple and compact packaging structure. This can serve as a standardized and universal packaging structure, enhancing the overall integration of the packaging structure and improving the applicability and versatility of the laser source. This allows the multi-band laser chip integrated laser source with a reference beam path of this invention to achieve miniaturization and universality from the device end.

[0023] Meanwhile, the use of standardized and universal packaging structures such as butterfly packaging or TO packaging as the packaging shell further enhances the versatility of the packaging shell; the use of the reflected light when the output beam passes through the lens or beam splitter as the reference optical path highly integrates the optical elements of the beam combining unit, reflection unit and reference optical path, which is conducive to improving the integration and compactness of the overall laser optical path structure; the integration of a temperature control module in the packaging shell enables real-time regulation of the laser chip temperature, ensuring the stability of the center wavelength of the laser beam. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the overall structure of the first embodiment of the present invention based on butterfly packaging;

[0025] Figure 2 This is a schematic diagram of the overall structure of the second embodiment of the present invention based on butterfly packaging;

[0026] Figure 3 This is a schematic diagram of the overall structure of the third embodiment of the present invention based on butterfly packaging;

[0027] Figure 4 This is a schematic diagram of the overall structure of the fourth embodiment of the present invention based on butterfly packaging;

[0028] Figure 5 This is a schematic diagram of the overall structure of the first embodiment of the present invention based on TO packaging;

[0029] Figure 6This is a schematic diagram of the overall structure of the second embodiment of the present invention based on TO packaging;

[0030] In the figure, the attached figures are labeled as follows:

[0031] Package housing 1, package base 11, package cap 12, pins 13;

[0032] 2. Laser chip, 21. Optical path bending structure, 22. Thermistor, 23. Heat sink, 24. Temperature control module, 25. Heat insulation block;

[0033] First lens 31, second lens 32, third lens 33, fourth lens 34, fifth lens 35, sixth lens 36;

[0034] Beam combiner 311, reflector 312, beam splitter 313, spatial beam combiner element 314;

[0035] Reference chamber 41, photodetector 42;

[0036] Optical isolator 5;

[0037] Output beam 201, reference beam 202. Detailed Implementation

[0038] The technical solution of this utility model will be further described in detail below through specific embodiments.

[0039] Example 1

[0040] like Figure 1 As shown, the multi-band laser chip integrated laser source with reference optical path in this embodiment is a butterfly-shaped packaged laser with multi-band, side-emitting laser chip integrated with reference optical path. It includes a package housing 1, a laser chip 2, a laser beam processing component and a reference optical path. The laser chip 2, the laser beam processing component and the reference optical path are all mounted on a single package housing 1.

[0041] The packaging housing 1 includes a single packaging base 11 and a packaging cap 12 that matches the packaging base 11. The packaging base 11 is also provided with pins 13. The single packaging base 11 is provided with a single packaging cap 12. The packaging base 11 and packaging cap 12, which have simple structure and shape, can be used as a standardized universal package, giving the packaging housing 1 the advantages of miniaturization, universality and low cost.

[0042] In this embodiment, the encapsulation housing 1 adopts a butterfly-shaped encapsulation structure.

[0043] Laser chip 2 is mounted on the packaging base 11 and connected to pin 13. Multiple laser chips 2 emit output beams 201 of different wavelengths. Each output beam 201 of a specific wavelength corresponds to the detection of a single target gas, which can be used to detect the concentration of multiple or multi-component gases. For example, for common gases that need to be detected, the laser absorption peak wavelength for methane is 1653.7 nm, for carbon monoxide it is 1567 nm, for hydrogen sulfide it is 1578 nm, and for oxygen it is 760 nm. In practical applications, after lasers of different wavelengths pass through their corresponding target gases, the absorption peaks change. The TDLAS-based laser detection system detects the changes in the absorption peaks, thus detecting the corresponding target gas and issuing an alarm.

[0044] Encapsulating multiple laser chips 2 that emit light of different wavelengths simultaneously within a single standardized universal package facilitates the miniaturization and universalization of the packaging structure for multi-gas detection laser sources from the device end. Of course, a single laser chip 2 can be used to detect not only one target gas component, but also to measure two or three target gas components under a wide tuning range.

[0045] In this embodiment, the laser chip 2 is an edge-emitting laser chip (EEL); preferably, the output beam 201 emitted by the laser chip 2 is directed toward the package side of the package housing 1 that does not have pins 13, and the output beams 201 emitted by multiple laser chips 2 are parallel.

[0046] The laser beam processing component includes a beam combining unit and a reflection unit. The reflection unit is located inside the package housing 1. The output beams 201 of different wavelengths emitted by multiple laser chips 2 all pass through the beam combining unit and the reflection unit. The multiple output beams 201 are combined after passing through the beam combining unit. The reflected light generated when the multiple output beams 201 pass through the reflection unit serves as a reference beam 202.

[0047] In this embodiment, the beam combining unit uses a beam combining lens 311 and a reflector 312. The beam combining lens 311 uses a wavelength beam combining lens and / or a polarization beam combining lens. The beam combining lens 311 and the reflector 312 combine the output beams 201 of different wavelengths emitted by multiple laser chips 2 into one beam. A portion of the reflected light from this output beam 201 after passing through the reflection unit is used as a reference beam 202.

[0048] In this embodiment, the reflection unit uses a first lens 31 as a shaping lens. After the beam combining unit combines the output beams 201 of different wavelengths emitted by multiple laser chips 2 into one beam, this output beam 201 is shaped by the first lens 31 and is directly output outside the packaging shell 1 or focused into the end of the optical fiber to be output outward through the optical fiber. At the same time, when the output beam 201 passes through the first lens 31, the naturally generated part of the reflected light serves as a reference beam 202.

[0049] It is worth mentioning that, in reality, reflection by a lens is unavoidable. However, the degree of reflection may vary depending on factors such as the lens's material, shape, and surface treatment. In this embodiment, the reference beam 202 is the unavoidable portion of the reflected light that is naturally reflected when the first lens 31 shapes and combines the output beam 201.

[0050] The reference optical path includes a reference gas chamber 41 and a photodetector 42. The reference gas chamber 41 is filled with a mixture of various target gases. The gas concentration of the mixture in the reference gas chamber 41 is fixed. Each specific target gas corresponds to a specific wavelength of light emitted by a single laser chip 2. The reference gas chamber 41 and the photodetector 42 together provide laser wavelength calibration and tracking for the laser gas detection system, and thus detect whether the center wavelength of multiple laser chips 2 has drifted, preventing false alarms in the TDLAS-based laser detection system. The reference gas chamber 41 and the photodetector 42 can be configured as photodetectors with their own reference gas chambers, which can be mounted on the packaging base 11 described below.

[0051] The reference optical path also includes a fifth lens 35, which is disposed inside the encapsulation housing 1. The reference beam 202 is shaped by the fifth lens 35 before passing through the reference gas chamber 41, which helps to improve the detection effect of the photodetector 42 on the reference beam 202.

[0052] In this embodiment, the fifth lens 35 is used to focus part of the reflected light naturally generated by the first lens 31 onto the photodetector 42, so that the photodetector 42 can detect the laser beam passing through the reference gas chamber 41.

[0053] The multi-band laser chip 2, beam combining unit, reflection unit, reference gas chamber 41, and photodetector 42 are simultaneously packaged in a single standardized universal package housing 1. The beam combining unit and reflection unit combine the multi-band laser beams into an output optical path and reflect the reference optical path. Through a compact and efficient optical path structure, the multi-band laser source with the reference optical path is miniaturized as a whole. The beam combining of multi-band laser beams and real-time tracking of the center wavelength of multi-band laser beams are realized in a single laser housing. The miniaturization and universalization of the packaging structure of the multi-gas detection laser source are achieved from the device end. The packaging housing 1, which can be used as a standardized universal package, has a simple and compact housing structure that also reduces the overall cost, giving the overall packaging structure the advantages of miniaturization, universality, and low cost.

[0054] In this embodiment, the packaging shell 1 adopts a butterfly-shaped package, the laser chip 2 adopts an edge-emitting laser chip, the beam combining unit adopts a beam combining lens 311 and a reflector 312, the reflection unit adopts a first lens 31, the first lens 31 shapes the output beam 201 that is beam combined, the reference beam 202 adopts the unavoidable part of the reflected light that is naturally reflected when the first lens 31 is shaped, and the fifth lens 35 focuses these reflected lights; in the optical path structure of this embodiment, the multiple laser beams emitted by multiple laser chips 2 (before beam combining) and the reference beam 202 (before and after passing through the reference gas chamber) can be arranged in parallel, and the optical path structure is compact and efficient.

[0055] The overall packaging structure of this embodiment is simple and compact. As a standardized and universal package, the butterfly package integrates a compact and efficient beam combining optical path and a reference optical path, enabling the multi-band laser chip with reference optical path in this embodiment to achieve miniaturization and universality of the laser source from the device end.

[0056] Example 2

[0057] like Figure 2 As shown, the multi-band laser chip integrated laser source with reference optical path in this embodiment is a butterfly-shaped packaged laser with multi-band, side-emitting laser chip integrated with reference optical path. It includes a package housing 1, a laser chip 2, a laser beam processing component and a reference optical path. The laser chip 2, the laser beam processing component and the reference optical path are all mounted on a single package housing 1.

[0058] The difference between this embodiment and embodiment 1 is that the reflection unit uses a beam splitter 313, and the output beam 201 passes through the second lens 32 after passing through the beam splitter 313.

[0059] As a plane mirror with a surface coating, beam splitter 313 utilizes the principle of light interference to achieve partial reflection and partial transmission of light. To cope with multi-band laser beams, beam splitter 313 can be a broadband beam splitter, a fixed-value multi-wavelength beam splitter, or a polarization beam splitter.

[0060] In this embodiment, after the beam combining unit combines the output beams 201 of different wavelengths emitted by multiple laser chips 2 into one beam, this output beam 201 passes through the beam splitter 313, with the transmitted part being output outward and the reflected part serving as the reference beam 202.

[0061] In this embodiment, the output beam 201 after beam combining passes through the beam splitter 313 at an incident angle of 45 degrees, which can achieve precise control of the beam splitting ratio (e.g., 50:50, 70:30, etc.), which is beneficial to improving the detection accuracy of the photodetector 42.

[0062] In this embodiment, the output beam 201 that is output to the outside of the packaging housing 1 will pass through the beam splitter 313 (i.e., the output beam 201 transmitted from the beam splitter 313) and then pass through the second lens 32. After being shaped by the second lens 32, it will be directly output to the outside or focused into the end of the optical fiber to be output to the outside through the optical fiber.

[0063] In this embodiment, the fifth lens 35 is used to shape the reflected light from the beam splitter 313, i.e., the reference beam 202, and then it is detected by the photodetector 42 after passing through the reference gas chamber 41.

[0064] It is worth mentioning that the above-mentioned "beam splitter 313 outputs the transmitted portion of the passed output beam 201 outward and uses the reflected portion as the reference beam 202" is a preferred solution, but it is not a limitation on the use of beam splitter 313 in this embodiment. Where the structure allows, beam splitter 313 can also output the reflected portion outward and use the transmitted portion as the reference beam 202.

[0065] In this embodiment, the packaging shell 1 adopts a butterfly-shaped package, the laser chip 2 adopts an edge-emitting laser chip, the beam combining unit adopts a beam combining lens 311 and a reflector 312, the reflection unit adopts a beam splitter 313, the beam splitter 313 outputs the transmitted part of the output beam 201 outward and the reflected part serves as the reference beam 202, the second lens 32 shapes the transmitted part, and the fifth lens 35 shapes the reference beam 202; in the optical path structure of this embodiment, the multiple laser beams emitted by the multiple laser chips 2 (before beam combining) and the reference beam 202 (before and after passing through the reference gas chamber) can be arranged in parallel, and the optical path structure is compact and efficient.

[0066] The overall packaging structure of this embodiment is simple and compact. As a standardized and universal package, the butterfly package integrates a compact and efficient beam combining optical path and a reference optical path, enabling the multi-band laser chip with reference optical path in this embodiment to achieve miniaturization and universality of the laser source from the device end.

[0067] Example 3

[0068] like Figure 3 As shown, the multi-band laser chip integrated laser source with reference optical path in this embodiment is a butterfly-shaped packaged laser with multi-band, side-emitting laser chip integrated with reference optical path. It includes a package housing 1, a laser chip 2, a laser beam processing component and a reference optical path. The laser chip 2, the laser beam processing component and the reference optical path are all mounted on a single package housing 1.

[0069] The difference between this embodiment and embodiment 1 is that the beam combining unit uses a third lens 33 and a spatial beam combining element 314, and the reflection unit uses the third lens 33 of the beam combining unit.

[0070] In this embodiment, the beam combining unit employs a third lens 33 and a spatial beam combining element 314. The third lens 33 is disposed inside the encapsulation housing 1, and the spatial beam combining element 314 is mounted on the outer wall or inner wall of the encapsulation housing 1 (e.g., Figure 3 Installed on the inner wall, Figure 4 (Installed on the outer wall); the third lens 33 converges the output beams 201 of multiple laser chips 2 into a focal spot. The spatial beam combiner 314 is located at the focal point where the output beams 201 converge. The spatial beam combiner 314 can be made of optical fiber, grating, or other components. It works with the third lens 33 to combine the multi-band output beams 201 at the focal spot and output them outside the packaging housing 1. For example, the focal spot enters the end of an optical fiber to be output outward through the optical fiber.

[0071] In this embodiment, the third lens 33, as a reflection unit, is similar to the first lens 31. The third lens 33 acts as a focusing lens to focus the multi-channel output beam 201. At the same time, the part of the reflected light naturally generated when the output beam 201 passes through the third lens 33 serves as the reference beam 202.

[0072] In this embodiment, the fifth lens 35 is used to focus part of the reflected light naturally generated by the third lens 33 onto the photodetector 42, so that the photodetector 42 can detect the laser beam passing through the reference gas chamber 41.

[0073] In this embodiment, the packaging shell 1 adopts a butterfly-shaped package, the laser chip 2 adopts a side-emitting laser chip, the beam unit adopts a third lens 33 and a spatial beam combining element 314, and the reflection unit adopts the third lens 33 of the beam combining unit. In the optical path structure of this embodiment, the multiple laser beams emitted by multiple laser chips 2 (before beam combining) and the reference beam 202 (before and after passing through the reference gas chamber) can be arranged in parallel or approximately in parallel, and the optical path structure is compact and efficient.

[0074] The overall packaging structure of this embodiment is simple and compact. As a standardized and universal package, the butterfly package integrates a compact and efficient beam combining optical path and a reference optical path, enabling the multi-band laser chip with reference optical path in this embodiment to achieve miniaturization and universality of the laser source from the device end.

[0075] Example 4

[0076] like Figure 4 As shown, the multi-band laser chip integrated laser source with reference optical path in this embodiment is a butterfly-shaped packaged laser with multi-band, side-emitting laser chip integrated with reference optical path. It includes a package housing 1, a laser chip 2, a laser beam processing component and a reference optical path. The laser chip 2, the laser beam processing component and the reference optical path are all mounted on a single package housing 1.

[0077] The difference between this embodiment and embodiment 3 is that the reflection unit uses a beam splitter 313.

[0078] In this embodiment, the reflection unit employs a beam splitter 313. To maintain the compactness of the overall optical path structure, the beam splitter 313 is positioned between the third lens 33 and the spatial beam combiner 314. To ensure the functionality of the beam splitter 313, it is positioned closer to the spatial beam combiner 314 to ensure that the output beams of multiple laser chips 2 are split. When the third lens 33 and the spatial beam combiner 314 combine the output beams 201 of multiple laser chips 2, the third lens 33 first focuses these multiple output beams 201. During the focusing process, the multiple output beams 201 pass through the beam splitter 313. The transmitted portion converges at the spatial beam combiner 314, and the reflected portion serves as the reference beam 202.

[0079] In this embodiment, the fifth lens 35 focuses the reflected light from the beam splitter 313 onto the photodetector 42, enabling the photodetector 42 to detect the laser beam passing through the reference gas chamber 41. Since the angle between the beam splitter and the incident laser beam is no longer 45 degrees, there will be differences in the reflectivity, transmittance, and reflection angle of the multi-channel output beam 201. Corresponding design adjustments are made to the beam splitter 313, the fifth lens 35, the reference gas chamber 41, and the photodetector 42 (e.g., changing the coating distribution of the beam splitter 313, adjusting the corresponding angles of the fifth lens 35 and the photodetector 42, and changing the target gas concentration ratio within the reference gas chamber). Ultimately, this enables the photodetector 42 to detect the multi-band output beam 201 of the multiple laser chips 2 and to effectively track and calibrate the emission wavelength of the laser chips 2.

[0080] In this embodiment, the packaging shell 1 adopts a butterfly-shaped package, the laser chip 2 adopts a side-emitting laser chip, the beam unit adopts a third lens 33 and a spatial beam combiner 314, and the reflection unit adopts a beam splitter 313, which is located between the third lens 33 and the spatial beam combiner 314. In the optical path structure of this embodiment, the multiple laser beams emitted by the multiple laser chips 2 (before beam combining) can be arranged in parallel or approximately in parallel, and the reference optical path also occupies less space, making the optical path structure compact and efficient.

[0081] The overall packaging structure of this embodiment is simple and compact. As a standardized and universal package, the butterfly package integrates a compact and efficient beam combining optical path and a reference optical path, enabling the multi-band laser chip with reference optical path in this embodiment to achieve miniaturization and universality of the laser source from the device end.

[0082] Example 5

[0083] like Figure 5 As shown, the multi-band laser chip integrated laser source with reference optical path in this embodiment is a TO packaged laser with multi-band, side-emitting laser chip integrated with reference optical path. It includes a package housing 1, a laser chip 2, a laser beam processing component and a reference optical path. The laser chip 2, the laser beam processing component and the reference optical path are all mounted on a single package housing 1.

[0084] The difference between this embodiment and embodiment 3 is that the packaging shell 1 is a TO package, and an optical path turning structure 21 is provided between the laser chip that emits light and the beam combining unit.

[0085] In this embodiment, the packaging structure is changed to TO packaging, and multiple laser chips 2 are mounted on the packaging base 11. Preferably, the output beam 201 emitted by the laser chip 2 is directed toward the top end face of the packaging cap 12. Of course, in order to make the output beam 201 emitted by the side-emitting laser chip 2 face away from the packaging base 11 and toward the packaging cap 12, a light path deflection structure 21 for reflecting the output beam 201 of the laser chip 2 is also installed.

[0086] In this embodiment, the encapsulation housing 1 adopts TO packaging, the laser chip 2 adopts a side-emitting laser chip, the beam combining unit adopts a third lens 33 and a spatial beam combining element 314, and the reflection unit adopts the third lens 33 of the beam combining unit. In the optical path structure of this embodiment, the multiple laser beams emitted by multiple laser chips 2 (before beam combining) and the reference beam 202 (before and after passing through the reference gas chamber) can be arranged in parallel or approximately in parallel, resulting in a compact and efficient optical path structure.

[0087] The overall packaging structure of this embodiment is simple and compact. The TO package, as a standardized and universal package, integrates a compact and efficient beam combining optical path and a reference optical path, enabling the multi-band laser chip with reference optical path in this embodiment to achieve miniaturization and universality of the laser source from the device end.

[0088] Example 6

[0089] like Figure 6 As shown, the multi-band laser chip integrated laser source with reference optical path in this embodiment is a TO packaged laser with multi-band, surface-emitting laser chip integrated with reference optical path. It includes a package housing 1, a laser chip 2, a laser beam processing component and a reference optical path. The laser chip 2, the laser beam processing component and the reference optical path are all mounted on a single package housing 1.

[0090] The difference between this embodiment and embodiment 5 is that the laser chip 2 is a surface-emitting laser chip and no longer has an optical path turning structure 21.

[0091] In this embodiment, the laser chip 2 is a surface-emitting laser chip (VCSEL). The laser chip 2 is mounted on the packaging base 11, and the output beam 201 emitted by the laser chip 2 is directed away from the packaging base 11 and toward the packaging cap 12.

[0092] In this embodiment, the encapsulation housing 1 adopts TO packaging, the laser chip 2 adopts a surface-emitting laser chip, the beam combining unit adopts a third lens 33 and a spatial beam combining element 314, and the reflection unit adopts the third lens 33 of the beam combining unit. In the optical path structure of this embodiment, the multiple laser beams emitted by multiple laser chips 2 (before beam combining) and the reference beam 202 (before and after passing through the reference gas chamber) can be arranged in parallel or approximately in parallel, resulting in a compact and efficient optical path structure.

[0093] The overall packaging structure of this embodiment is simple and compact. The TO package, as a standardized and universal package, integrates a compact and efficient beam combining optical path and a reference optical path, enabling the multi-band laser chip with reference optical path in this embodiment to achieve miniaturization and universality of the laser source from the device end.

[0094] Example 7

[0095] Based on Embodiments 3, 4, 5, and 6, this embodiment can be used in combination with Embodiment 8. In this embodiment, as a difference from Embodiments 1 and 2, such as... Figure 4As shown, the output beams 201 emitted between multiple laser chips 2 are configured to have a tilt angle that approaches each other before passing through the third lens 33 of the beam combining unit. This helps to reduce the focusing distance of the third lens 33 of the beam combining unit on the output beams 201, ensuring the compactness and efficiency of the optical path structure. To achieve the tilt, in the TO package, the upper surface of the heat sink 23 can be tilted so that the angle of the surface-emitting laser chip or the edge-emitting laser chip is tilted. The edge-emitting laser chip can also achieve this by adjusting the turning angle of the optical path turning structure 21.

[0096] Example 8

[0097] Based on Embodiments 3, 4, 5, and 6, this embodiment can be used in combination with Embodiment 7. In this embodiment, as a difference from Embodiments 1 and 2, such as... Figure 3 As shown, Figure 5 As shown, the output beam 201 emitted between multiple laser chips 2 can pass through a fourth lens 34 before passing through the third lens 33 of the beam combiner unit. The fourth lens 34 and the third lens 33 form a focusing lens group. The fourth lens 34 initially converges the output beam 201, and the third lens 33 converges the output beam 201 to a focal point. The fourth lens 34 helps to reduce the focusing distance of the third lens 33 of the beam combiner unit for the output beam 201, ensuring a compact and efficient optical path structure.

[0098] Example 9

[0099] Based on Embodiments 1, 2, 3, 4, 5, and 6, a sixth lens 36 is provided inside the encapsulation housing 1 to cooperate with the beam combining unit in combining the output beam 201. The output beam 201 is collimated by the sixth lens 36 before passing through the beam combining unit. The sixth lens 36 is either a spherical lens to collimate the laser beam, or a cylindrical lens group to collimate the fast and slow axes of the laser beam. The use of the sixth lens 36 ensures the beam combining effect.

[0100] Example 10

[0101] Based on Embodiments 1, 2, 3, 4, 5, and 6, a laser chip temperature control component is also installed inside the packaging housing.

[0102] The laser chip temperature control component includes a thermistor 22, a heat sink 23, and a temperature control module 24. Thermistor 22 is used to detect the temperature of the laser chip 2. Thermistor 22 can also be replaced by other temperature sensor elements such as a thermistor diode or thermocouple. Based on factors such as the working environment of the laser source, the temperature control module 24 uses a TEC cooler or heater (such as a resistance wire or ceramic heater). The heat sink 23 is located between the temperature control module 24 and the laser chip 2. The thermistor 22 and the laser chip 2 are mounted on the heat sink 23, which enables the transmission of thermal response between the laser chip and the temperature control module. Temperature is one of the main factors affecting the center wavelength of the laser chip 2. In the TDLAS-based laser detection system, the laser chip temperature control component provides real-time temperature control of the laser chip 2, ensuring the stability of the laser beam's center wavelength.

[0103] Preferably, each laser chip 2 is equipped with a thermistor 22, a heat sink 23 and a temperature control module 24 to adjust the center wavelength of multiple laser chips 2 in real time. Since the temperature requirements for the stable center wavelength of multi-band laser chips 2 may be different, a set of laser chip temperature control components is set for each laser chip 2 to ensure the accuracy when detecting the concentration of multiple or multi-component target gases.

[0104] Preferably, a heat insulation block 25 is provided between the heat sink 23 and the temperature control module 24 of the adjacent laser chips 2 to prevent the temperature of the adjacent laser chips 2 from affecting each other, thus ensuring the accuracy of detecting the concentration of multiple or multi-component target gases.

[0105] Example 11

[0106] Based on Embodiments 1, 2, 3, 4, 5, and 6, an optical path isolator 5 is also provided inside the packaging housing 1. The output beam 201 passes through the optical path isolator 5 before passing through the beam combining unit to prevent stray light from being transmitted to the laser chip end and causing damage to the laser chip 2.

[0107] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and not to limit it; although the utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications can still be made to the specific implementation of this utility model or equivalent substitutions can be made to some technical features without departing from the spirit of the technical solution of this utility model, and all such modifications and substitutions should be covered within the scope of the technical solution claimed by this utility model.

Claims

1. A multi-band laser chip integrated laser source with a reference optical path, characterized in that, The package includes a housing (1), which includes a base (11) and a cap (12) that matches the base (11). The base (11) is equipped with multiple laser chips (2), and the housing (1) is equipped with a laser beam processing assembly. The laser beam processing assembly includes a beam combining unit and a reflection unit. The output beams (201) of different wavelengths emitted by the multiple laser chips (2) pass through the beam combining unit and the reflection unit. The output beams (201) are combined after passing through the beam combining unit. The reflected light generated when the output beams (201) pass through the reflection unit serves as a reference beam (202). The housing (1) is provided with a reference gas chamber (41) and a photodetector (42). The reference beam (202) is detected by the photodetector (42) after passing through the reference gas chamber (41).

2. The multi-band laser chip integrated laser source with reference optical path according to claim 1, characterized in that, The encapsulation housing (1) adopts a butterfly-shaped encapsulation, and the laser chip (2) adopts a side-emitting laser chip.

3. The multi-band laser chip integrated laser source with reference optical path according to claim 1 or 2, characterized in that, The beam combining unit employs a beam combining lens (311) and a reflector (312), wherein the beam combining lens (311) is a wavelength beam combining lens and / or a polarization beam combining lens.

4. The multi-band laser chip integrated laser source with reference optical path according to claim 3, characterized in that, The reflecting unit employs a first lens (31) or a beam splitter (313). The output beam (201) is combined by the beam combining unit and then passes through the reflecting unit. A second lens (32) for shaping the output beam (201) is also provided after the beam splitter (313).

5. The multi-band laser chip integrated laser source with reference optical path according to claim 1, characterized in that, The encapsulation housing (1) adopts T0 encapsulation, the laser chip (2) adopts a surface-emitting laser chip or a side-emitting laser chip, and an optical path turning structure (21) is provided between the side-emitting laser chip and the beam combining unit.

6. The multi-band laser chip integrated laser source with reference optical path according to claim 1, 2, or 5, characterized in that: The beam combining unit employs a third lens (33) and a spatial beam combining element (314). The third lens (33) converges the output beam (201), and the spatial beam combining element (314) is located at the focal point where the output beam (201) converges.

7. The multi-band laser chip integrated laser source with reference optical path according to claim 6, characterized in that, The reflection unit adopts the third lens (33) or beam splitter (313) of the beam combining unit, and the beam splitter (313) is disposed between the third lens (33) and the spatial beam combining element (314).

8. The multi-band laser chip integrated laser source with reference optical path according to claim 7, characterized in that, It also includes a fourth lens (34), which and the third lens (33) form a focusing lens group. The fourth lens (34) initially converges the output beam (201), and the third lens (33) converges the output beam (201) to a focal point.

9. The multi-band laser chip integrated laser source with reference optical path according to claim 7, characterized in that, The output beams (201) emitted between the plurality of laser chips (2) are configured to have a tilt angle that approaches each other before passing through the third lens (33) of the beam combining unit.

10. The multi-band laser chip integrated laser source with reference optical path according to claim 1, 2, or 5, characterized in that, The encapsulation housing (1) is further provided with a fifth lens (35), which shapes the reference beam (202) before it passes through the reference gas chamber (41).

11. The multi-band laser chip integrated laser source with reference optical path according to claim 1, 2, or 5, characterized in that, The encapsulation housing (1) is also provided with a sixth lens (36), and the output beam (201) is collimated by the sixth lens (36) before passing through the beam combining unit. The sixth lens (36) is a spherical lens or a cylindrical lens group.

12. The multi-band laser chip integrated laser source with reference optical path according to claim 1, 2, or 5, characterized in that, The encapsulation housing (1) is also provided with an optical path isolator (5), and the output beam (201) passes through the optical path isolator (5) before passing through the beam combining unit.

13. The multi-band laser chip integrated laser source with reference optical path according to claim 1, 2, or 5, characterized in that, The packaging base (11) is also equipped with a thermistor (22), a heat sink (23) and a temperature control module (24). The temperature control module (24) uses a TEC cooler or a heater. The heat sink (23) is located between the temperature control module (24) and the laser chip (2).

14. The multi-band laser chip integrated laser source with reference optical path according to claim 13, characterized in that, Each laser chip (2) is equipped with a thermistor (22), a heat sink (23), and a temperature control module (24).

15. The multi-band laser chip integrated laser source with reference optical path according to claim 14, characterized in that, A heat insulation block (25) is provided between the heat sink (23) and the temperature control module (24) of the adjacent laser chip (2).

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