Filter circuit, controller, driving system and vehicle

Abstract

The utility model discloses a filter circuit, a controller, a driving system and a vehicle, and relates to the technical field of filtering. The filter circuit comprises filter capacitors, at least one filter capacitor is arranged corresponding to at least one bridge arm of the bridge type power module, one end of each filter capacitor is suitable for being connected with a high-voltage wire of the power module, the other end of each filter capacitor is suitable for being connected with a ground wire of a controller, and the controller comprises the power module. The filter circuit is low in cost and has a good filtering effect on DC bus noise.

Description

Technical Field

[0001] This utility model relates to the field of filtering technology, and in particular to a filtering circuit, controller, drive system and vehicle. Background Technology

[0002] In power electronic systems, the DC bus is a critical component connecting the power supply, load, and power modules. Electromagnetic interference noise is generated on the DC bus due to the switching operations of the power modules, which can affect system performance and stability. Therefore, filtering circuits are needed to filter the DC bus to reduce or avoid the impact of noise.

[0003] In related technologies, filter circuits are typically placed between the DC bus power supply inlet and the power module to filter out noise transmitted from the power module to the DC bus. However, this technology suffers from large noise loops and unstable filtering performance. Utility Model Content

[0004] This invention aims to at least partially solve one of the technical problems in related technologies. Therefore, the purpose of this invention is to provide a filter circuit, controller, drive system, and vehicle to improve the stability of the filtering effect.

[0005] In a first aspect, this utility model proposes a filtering circuit, comprising: a filtering capacitor, one end of which is adapted to be connected to the high-voltage wiring of a power module, and the other end of which is adapted to be connected to the ground wiring of a controller, wherein the controller includes the power module.

[0006] For example, one end of the filter capacitor is adapted to be connected to the high-voltage trace of the power module on the substrate of the controller, and the other end of the filter capacitor is adapted to be connected to the ground trace on the substrate.

[0007] For example, the power module is a bridge power module, which includes N bridge arms, where N is a positive integer; wherein, the number of filter capacitors is 2*N, and every two filter capacitors are set for one bridge arm of the bridge power module, one end of one filter capacitor is adapted to be connected to the positive high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line, and one end of the other filter capacitor is adapted to be connected to the negative high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line.

[0008] For example, the power module is a bridge power module, which includes N bridge arms, where N is a positive integer; wherein, the number of filter capacitors is 3*N, and every two filter capacitors are set for one bridge arm of the bridge power module, one end of one filter capacitor is adapted to be connected to the positive high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line, one end of one filter capacitor is adapted to be connected to the negative high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line, and one end of another filter capacitor is adapted to be connected to the load line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line.

[0009] For example, the filter capacitor may be a single surface-mount capacitor or a combination of surface-mount capacitors.

[0010] For example, the single surface-mount capacitor may include a surface-mount safety capacitor or a surface-mount ceramic capacitor.

[0011] For example, the surface-mount safety capacitor is a Y1 type safety capacitor or a Y2 type safety capacitor.

[0012] For example, the surface mount capacitor assembly includes multiple surface mount capacitors connected in series and / or in parallel, and / or, surface mount capacitors connected in series with a balanced bipolar capacitor.

[0013] For example, the substrate below the filter capacitor is hollowed out.

[0014] For example, the surface of the filter capacitor is coated with conformal coating.

[0015] For example, one end of the ground trace of the filter capacitor is connected to the ground pad on the substrate. The ground pad is adapted to be fixed to the housing by metal fasteners and connected to the ground on the housing. The housing is used to assemble the substrate, the power module and the filter circuit.

[0016] Secondly, this utility model proposes a controller, including: a ground line, a power module, and the filtering circuit described in the first aspect above.

[0017] For example, the controller further includes a substrate on which the ground trace and the high-voltage trace of the power module are disposed.

[0018] For example, the power module is a bridge power module, which is provided with copper busbars, and at least three copper busbars are provided for each arm of the bridge power module. One copper busbar is used to connect to the corresponding phase line of the load, one copper busbar is used to connect to the positive DC bus, and another copper busbar is used to connect to the negative DC bus.

[0019] For example, the bridge power module is provided with at least one of a high-voltage line pin, a drive signal pin, and a temperature signal pin.

[0020] For example, the controller further includes a housing and a heat sink, the housing being used to mount the substrate, the power module and the filter circuit, and the heat sink being disposed on the housing.

[0021] Thirdly, this utility model proposes a drive system, including: a load, and the controller described in the second aspect above, or the filter circuit described in the first aspect above.

[0022] Fourthly, this utility model proposes a vehicle, comprising: the drive system described in the third aspect above, or the controller described in the second aspect above, or the filter circuit described in the first aspect above.

[0023] The filtering circuit of this invention reduces noise loops and improves the stability of filtering effect by connecting one end of the filter capacitor to the high-voltage line of the power module in the controller and the other end to the ground line of the controller. Attached Figure Description

[0024] Figure 1 This is a schematic diagram of the filter circuit of the first embodiment of this utility model;

[0025] Figure 2 This is a schematic diagram of the filter circuit of the second embodiment of this utility model;

[0026] Figure 3(a) is a schematic diagram of a filter circuit according to a specific embodiment of the present invention;

[0027] Figure 3(b) is a schematic diagram of the filter circuit of another specific embodiment of the present invention;

[0028] Figure 4(a) is a schematic diagram of a surface-mount capacitor assembly according to an example of the present invention;

[0029] Figure 4(b) is a schematic diagram of another example of the chip capacitor assembly of this utility model;

[0030] Figure 5 This is a graph showing the S12-F relationship of various surface mount capacitors according to one embodiment of this utility model;

[0031] Figure 6 This is a schematic diagram of the assembly of a filter capacitor according to an embodiment of the present invention;

[0032] Figure 7 This is a structural block diagram of the controller according to an embodiment of the present invention;

[0033] Figure 8This is a schematic diagram of the appearance of a bridge power module according to an embodiment of the present invention;

[0034] Figure 9 This is a schematic diagram of the appearance of a controller according to one embodiment of the present invention;

[0035] Figure 10 This is a structural block diagram of a motor drive system according to an embodiment of the present invention;

[0036] Figure 11 This is a structural block diagram of a vehicle according to one embodiment of the present invention. Detailed Implementation

[0037] In related technologies, the filter circuit is typically made into an independent module and placed between the DC bus power supply inlet and the power devices (such as insulated-gate bipolar transistors (IGBTs)) to filter out noise transmitted from the power devices to the DC bus. In this technology, the filter circuit is relatively far from the noise source, resulting in a large noise loop and unstable filtering performance.

[0038] To address this issue, this invention proposes a filter circuit to improve the stability of the filtering effect when filtering noise on a DC bus. Corresponding to this filter circuit, this invention also proposes a controller, a control system, and a vehicle.

[0039] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0040] The following is a reference appendix. Figure 1-11 This invention describes a filter circuit, a controller, a motor drive system, and a vehicle according to embodiments of the present invention.

[0041] In embodiments of this utility model, such as Figure 1 As shown, the filter circuit 10 includes a filter capacitor C. One end of the filter capacitor C is adapted to be connected to the high voltage line l1 of the power module 20, and the other end of the filter capacitor C is adapted to be connected to the ground line l2 of the controller 700. The controller 700 includes the power module 20.

[0042] Among them, the high-voltage wiring l1 refers to the wiring of the power module 20 that connects to the positive DC bus P (used to connect to the positive terminal of the DC power supply) and / or the negative DC bus N (used to connect to the negative terminal of the DC power supply).

[0043] By connecting one end of the filter capacitor C (which can be a common-mode capacitor) to the high-voltage line l1 of the power module 20 in the controller 700 and the other end to the ground line l2 of the controller 700, the filter capacitor C can filter out the noise (such as electromagnetic interference noise, ripple noise, etc.) transmitted from the power module 20 to the DC bus "nearby", thereby reducing the noise loop and improving the stability of the filtering effect.

[0044] In some embodiments of this utility model, such as Figure 2 As shown, one end of the filter capacitor C is adapted to be connected to the high voltage trace l1 on the substrate 30 of the controller 700 of the power module 20, and the other end of the filter capacitor C is adapted to be connected to the ground trace l2 on the substrate 30.

[0045] The substrate 30 is used to carry electronic components in the controller 700 (which may include filter capacitor C, components in power module 20, etc.) and to provide electrical connections between electronic components. It can be in the form of a printed circuit board (PCB). Taking the controller 700 as a motor controller as an example, the substrate 30 can be a circuit board used for the drive board of the drive motor M.

[0046] By placing the high-voltage line l1 and the ground line l2 on the substrate 30, it is convenient to connect the filter capacitor C to the power module 20 "nearby", so as to "nearby" guide the noise generated by the power module 20 to the ground terminal and reduce the noise flowing into the DC bus.

[0047] In this embodiment, the power module 20 can be a bridge power module, such as an H-bridge power module, a three-phase full-bridge power module, or a double H-bridge power module, which can be mounted on the substrate 30. Taking a three-phase full-bridge power module as an example, as shown in Figures 3(a) and 3(b), in the design of the power assembly, the positive terminal of the DC bus in some electronic control units (i.e., the positive DC bus P) is connected to the collector (C) of each phase of the upper bridge of the IGBT (or Si, SiC, etc.) power device in the three-phase full-bridge power module, and the negative terminal of the DC bus (i.e., the negative DC bus N) is connected to the emitter (E) of each phase of the lower bridge of the power device. The emitter of the upper bridge and the collector of the lower bridge are short-circuited and connected to the U-phase, V-phase, or W-phase. The three-phase full-bridge power module being mounted on the substrate 30 can mean that the pins of the three-phase full-bridge power module are fixed on the substrate 30 (or the three-phase full-bridge power module and the substrate 30 are stacked together to form a whole). The pins of the three-phase full-bridge power module may include at least one of the following: high-voltage line pins, drive signal pins, and temperature signal pins.

[0048] When the power module 20 is a bridge power module, the filter capacitor C can be set according to the bridge arm of the bridge power module 10. For example, at least one bridge arm (see the bridge arms corresponding to U / V / W in Figures 3(a) and 3(b)) is provided with at least one filter capacitor C. The filter capacitor C is set on the substrate 30 and connected between the trace of the corresponding bridge arm on the substrate 30 that connects to the positive DC bus P or the negative DC bus N and the ground trace l2 on the substrate 30. The ground trace l2 is used to connect to the ground of the housing (such as the metal inner wall of the housing). The housing is used to assemble the substrate 30, the power module 20 and the filter circuit 10.

[0049] Specifically, the noise flowing into the DC bus mainly includes noise from the devices on the substrate 30, noise generated by the power devices in the power module 20, noise generated by the load (such as the motor M), and noise transmitted to the DC bus from the internal circuit boards of the battery pack. By setting at least one filter capacitor C for at least one bridge arm of the bridge power module 20, and placing the filter capacitor C on the substrate 30, and connecting it between the trace on the substrate 30 corresponding to the bridge arm connecting to the positive or negative DC bus and the ground trace l2 on the substrate 30, the filter capacitor C can be connected to the ground trace l2 on the substrate 30 through a very thick and short trace. Therefore, on the one hand, noise transmitted to the DC bus from the devices (including the bridge power module) on the substrate 30 can be filtered at close range; on the other hand, the ESL of the filter capacitor C is very small, and its impact on the insertion loss of the filter capacitor C is minimal, thus ensuring the stability of the filtering effect.

[0050] In some examples of this utility model, as shown in Figure 3(a), two filter capacitors are provided for each bridge arm of the bridge power module (two filter capacitors are provided for each bridge arm of the three-phase full-bridge power module in Figure 3(a), denoted as filter capacitors CY1, CY2, CY3, CY4, CY5, and CY6 respectively). One filter capacitor is connected between the trace connecting the positive DC bus P of the corresponding bridge arm and the ground GND trace on the substrate 30, and the other filter capacitor is connected between the trace connecting the negative DC bus N of the corresponding bridge arm and the ground GND trace on the substrate 30 (see [reference]). Figure 2 Filter capacitors CY1 and CY4 are configured for the U-phase bridge arm and are connected between the two ends of the U-phase bridge arm and ground (GND), respectively; filter capacitors CY2 and CY5 are configured for the V-phase bridge arm and are connected between the two ends of the V-phase bridge arm and ground (GND), respectively; filter capacitors CY3 and CY6 are configured for the W-phase bridge arm and are connected between the two ends of the W-phase bridge arm and ground (GND), respectively.

[0051] Referring to Figure 3(a), two filter capacitors are provided for each bridge arm of the bridge power module, and these capacitors are mounted on the substrate 30. The two filter capacitors are connected between the traces connecting the positive DC bus P and the negative DC bus N of the corresponding bridge arm, and the ground (GND) trace on the substrate 30, respectively. This allows for close-range filtering of noise transmitted from the devices on the substrate 30 to the DC bus, as well as noise generated by the power devices and transmitted to the DC bus. Simultaneously, it minimizes the ESL of the filter capacitors, reducing their impact on insertion loss. Furthermore, compared to solutions where only one filter capacitor is provided for each bridge arm or for individual bridge arms, the filtering effect is significantly better.

[0052] In some other examples of this utility model, as shown in Figure 3(b), three filter capacitors are provided for each bridge arm of the bridge power module (in Figure 3(b), three filter capacitors are provided for each bridge arm of the three-phase full-bridge power module, respectively denoted as filter capacitors CY1, CY2, CY3, CY4, CY5, CY6, CY7, CY8, and CY9). One filter capacitor is connected between the trace connecting the positive DC bus P of the corresponding bridge arm and the ground GND trace on the substrate 30, and the other filter capacitor is connected between the trace connecting the negative DC bus P of the corresponding bridge arm and the ground GND trace on the substrate 30. Between the DC bus N trace and the ground GND trace on the substrate 30, another filter capacitor is connected between the trace of the load connected to the corresponding bridge arm (Figure 3(a) and Figure 3(b) are shown as examples of the load being a motor M) and the ground GND trace on the substrate 30 (see Figure 3(b), which adds filter capacitors CY7, CY8, and CY9 to Figure 3(a). The filter capacitors CY7, CY8, and CY9 are respectively set for the U-phase, V-phase, and W-phase bridge arms and are respectively connected between the power terminal of the corresponding phase bridge arm and the ground GND).

[0053] Referring to Figure 3(b), a filter capacitor is added to each phase bridge arm. Compared to the scheme in Figure 3(a), this can also filter out the noise generated by the motor M, resulting in a smaller noise loop. In addition, regardless of which bridge in the bridge power module is conducting, some noise from the DC bus will still flow into the three-phase lines UVW. By using filter capacitors (such as filter capacitors CY1, CY2, and CY3 in Figure 3(b)) on the three-phase lines UVW, some noise can be diverted to the ground of the casing, reducing the filtering pressure on the DC bus and thus reducing the common-mode noise flowing out of the DC bus.

[0054] It should be noted that the number, composition, and connection positions of the filter capacitors C in the bridge arms of the bridge power module (i.e., between the traces connecting the positive DC bus P to the corresponding bridge arm and the ground GND trace on the substrate 30, between the traces connecting the positive DC bus P or the negative DC bus N to the corresponding bridge arm and the ground GND trace on the substrate 30, and between the traces connecting the load to the corresponding bridge arm and the ground GND trace on the substrate 30) can be selected according to actual needs. Furthermore, all filter capacitors C and their traces must maintain sufficient safety clearance from other electrical attribute pins, pads, studs, traces, and test points (such as withstand voltage test points, overcurrent test points, etc.).

[0055] For example, the filter capacitor C can be a single surface-mount capacitor or a combination of surface-mount capacitors. Using surface-mount capacitors on the substrate 30 results in significantly lower ESL compared to safety capacitors with long ground leads. The frequency band for achieving a certain insertion loss is more than 10 times wider than that of through-hole capacitors, offering better stability, smaller deviations, and no influence from human factors.

[0056] Individual surface-mount capacitors may include surface-mount safety capacitors or surface-mount ceramic capacitors. Surface-mount capacitor combinations include multiple surface-mount capacitors connected in series and / or in parallel, and / or, surface-mount capacitors connected in series with balanced dual-line (BDL) capacitors. Surface-mount safety capacitors can be either Y1 or Y2 type. The main difference between Y1 and Y2 type safety capacitors is the withstand voltage test requirement. When the battery pack voltage is relatively low, such as below DC 400V without a boost design, Y2 type safety capacitors are sufficient. When the voltage is relatively high, Y1 type safety capacitors can be considered. Surface-mount ceramic capacitors have a withstand voltage greater than 1KV, and balanced dual-line capacitors have a withstand voltage greater than 1KV.

[0057] If space is limited, surface-mount ceramic capacitors with high withstand voltage, such as those above 2KV, can be considered. These devices are small in size. If a single surface-mount capacitor cannot withstand the withstand voltage test, a combination of surface-mount capacitors can be used. The type and number of capacitors in the combination can be adjusted. For example, four surface-mount ceramic capacitors with a nominal withstand voltage of 1KV or higher can be used to replace one surface-mount ceramic capacitor with a nominal withstand voltage of 2KV, as shown in Figure 4(a). The four surface-mount ceramic capacitors are arranged in a two-row, two-column configuration on the substrate 30 (two capacitors in the same column are connected in series, and then the two columns are connected in parallel). Another example is to use a surface-mount ceramic capacitor with a nominal withstand voltage of 2KV and a BDL capacitor with a nominal withstand voltage of 1KV in series to replace one surface-mount ceramic capacitor with a nominal withstand voltage of 2KV, as shown in Figure 4(b). The surface-mount ceramic capacitors and the balanced bipolar converter are arranged in a two-row, one-column configuration on the substrate 30. By connecting the BDL capacitor in series, the filtering effect can be improved.

[0058] Specifically, Figure 5The relationship between insertion loss S12 and bandwidth F of various surface mount capacitors is shown. Figure 5 The numbers 222, 473, 1103, 1222, 1332, and 1472 in the model designation indicate surface mount capacitors. See also... Figure 5 When surface mount capacitors (such as surface mount safety capacitors and high voltage surface mount ceramic capacitors) reach a relatively high insertion loss value, the corresponding bandwidth is very large. For example, when the insertion loss S12 of a surface mount capacitor reaches 30dB, the bandwidth F is generally above 30M, which far exceeds that of existing through-hole safety capacitors and other devices, indicating that the filtering effect is good.

[0059] For example, the substrate 30 below the filter capacitor C is hollowed out, and

[0060] Specifically, such as Figure 6 As shown, by hollowing out the area below the filter capacitor C and physically cutting out a channel 1 from top to bottom on the substrate 30, the withstand voltage can be increased, thus facilitating the withstand voltage test.

[0061] For example, the surface of the filter capacitor C is coated with conformal coating.

[0062] Specifically, after placing the required components, including filter capacitor C and power module 20, on the substrate 30, a conformal coating can be sprayed to protect the substrate 30 and its supporting components from environmental corrosion, thereby improving and extending their service life and ensuring safety and reliability. Under real-world conditions, such as chemical environments (fuels, coolants, etc.), vibration, high dust, salt spray, humidity, and high temperatures, the substrate may experience corrosion, softening, deformation, and mold growth, leading to circuit malfunctions. The conformal coating applied to the surface of the substrate 30 forms a light and flexible film with a thickness of approximately 25-50 micrometers, which can protect the circuit from damage under the aforementioned harsh conditions.

[0063] For example, such as Figure 6 As shown, one end of the ground trace of the filter capacitor C is connected to the ground pad 4 on the substrate 30. The ground pad 4 is adapted to be fixed to the housing by metal fasteners 6 and connected to the ground on the housing.

[0064] Specifically, see Figure 6 One end of the filter capacitor C can be connected to the high voltage pin 2 of the corresponding bridge arm through a very thick and short trace 3. The other end of the filter capacitor C can be directly connected to the grounding pad 4 of the ground GND trace on the substrate 30 through a very thick and short trace 3. The grounding pad 4 can be fixed to the housing through metal fasteners 5 (such as metal screws, metal studs, etc.) to connect to the ground of the housing for subsequent testing, assembly, etc.

[0065] The filtering circuit of this embodiment improves the stability of DC bus filtering by placing the filter capacitor between the high-voltage trace of the power module and the ground trace of the controller. Compared with the magnetic ring filtering technology, the space and cost are significantly reduced. Furthermore, the ESL is very small, achieving high insertion loss over a wide bandwidth, meaning it can handle a relatively wide range of noise, typically exceeding 30MHz. Even with the influence of trace length on the substrate and the deviation of the filter capacitor itself (potentially 10%-20%), the impact on insertion loss is far less than that of grounding the capacitor leads or connecting them to high-voltage lines. Additionally, if there are other frequency bands of noise on the DC bus, capacitors targeting those frequency bands can be added without significant space requirements, allowing for a slightly larger substrate. In contrast, using related technologies requires adding more capacitors between the DC bus inlet and the power module, increasing space constraints and cost, and may even necessitate the addition of new magnetic rings for multi-stage filtering, further increasing the complexity.

[0066] Figure 7 This is a structural block diagram of the controller according to an embodiment of the present invention.

[0067] like Figure 7 As shown, the controller 700 includes: a ground line 12, a power module 20, and a filter circuit 10 as described in the above embodiment, wherein the bridge power module 20 and the filter circuit 10 are both mounted on the substrate 30.

[0068] See some examples of this utility model. Figure 7 The controller 700 also includes a substrate 30, and ground lines l2 and high-voltage lines l1 of the power module 20 can be disposed on the substrate 30.

[0069] In some examples of this utility model, such as Figure 8 As shown, power module 20 is a three-bridge full-bridge power module, which is equipped with copper busbars, and each phase of the three-bridge full-bridge power module is equipped with at least three copper busbars (e.g., Figure 8 The copper busbars 61, 62, and 63 are used to connect the corresponding phase line of the load (such as motor M), the copper busbar 62 is used to connect the positive DC busbar P, and the copper busbar 63 is used to connect the negative DC busbar N.

[0070] For example, see Figure 8 The power module 20 may also be provided with at least one of the following: high voltage line pin 71, drive signal pin 72, and temperature signal pin 73.

[0071] Specifically, the copper busbars (i.e., high-voltage lines) of the three-phase full-bridge power module mainly connect the positive and negative terminals of the high-voltage DC bus, as well as the three-phase lines U, V, and W of the motor M. Due to the internal design limitations of the three-phase full-bridge power module, additional pins are also provided to connect to the high-voltage signals and lead to the outside. In other words, in addition to the copper busbars, the high-voltage positive terminal, high-voltage negative terminal, and U, V, and W phases all have additional pins. These pins can be fixed on the substrate 30, allowing the power module 20 to be stacked with the substrate 30. Figure 9 As shown. Among them, drive signal pin 72 is used to transmit drive signals, temperature signal pin 73 is used to connect to the temperature sensor, and high voltage line pin 71 is directly connected to the high voltage line.

[0072] For example, the power module 20 also includes a heat sink and a housing, the heat sink being disposed on the housing, and the housing being used to mount the substrate 30, the filter circuit 10 and the power module 20.

[0073] Specifically, the heat sink of the power module 20 can be made of metal, and it can be connected to the ground line l2 on the substrate 30 and locked to the ground of the housing. The location of the heat sink can be... Figure 8 The position number is at least one of the following: 81, 82, 83, 84, 85, 86, 87, 88.

[0074] Figure 10 This is a structural block diagram of a drive system according to an embodiment of the present invention.

[0075] like Figure 10 As shown, the drive system 1000 includes: a load 40 (such as a motor M) and a controller 600 as described in the above embodiment.

[0076] In some embodiments of this utility model, the drive system 1000 includes: a load 40 (such as a motor M) and a filter circuit 10 as described in the above embodiments.

[0077] Figure 11 This is a structural block diagram of a vehicle according to one embodiment of the present invention.

[0078] like Figure 11 As shown, the vehicle 1100 includes the drive system 1000 of the above embodiment.

[0079] In some embodiments of this utility model, the vehicle 1000 includes the controller 700 of the above embodiments, or the filter circuit 10 of the above embodiments.

[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0081] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0082] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0083] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0084] In this utility model, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0085] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A filter circuit, characterized in that, include: A filter capacitor, one end of which is adapted to be connected to the high-voltage wiring of the power module, and the other end of which is adapted to be connected to the ground wiring of the controller, the controller including the power module.

2. The filter circuit according to claim 1, characterized in that, One end of the filter capacitor is adapted to be connected to the high-voltage trace of the power module on the substrate of the controller, and the other end of the filter capacitor is adapted to be connected to the ground trace on the substrate.

3. The filter circuit according to claim 1 or 2, characterized in that, The power module is a bridge power module, which includes N bridge arms, where N is a positive integer; The number of filter capacitors is 2*N, and each pair of filter capacitors corresponds to one arm of the bridge power module. One end of one filter capacitor is adapted to be connected to the positive high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line. One end of the other filter capacitor is adapted to be connected to the negative high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line.

4. The filter circuit according to claim 1 or 2, characterized in that, The power module is a bridge power module, which includes N bridge arms, where N is a positive integer; The number of filter capacitors is 3*N. Each pair of filter capacitors corresponds to one arm of the bridge power module. One end of one filter capacitor is adapted to be connected to the positive high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line. One end of one filter capacitor is adapted to be connected to the negative high voltage line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line. One end of the other filter capacitor is adapted to be connected to the load line of the corresponding bridge arm, and the other end is adapted to be connected to the ground line.

5. The filter circuit according to claim 1 or 2, characterized in that, The filter capacitor can be a single surface-mount capacitor or a combination of surface-mount capacitors.

6. The filter circuit according to claim 5, characterized in that, The individual surface-mount capacitor includes surface-mount safety capacitors or surface-mount ceramic capacitors.

7. The filter circuit according to claim 6, characterized in that, The surface-mount safety capacitor is a Y1 type safety capacitor or a Y2 type safety capacitor.

8. The filter circuit according to claim 5, characterized in that, The surface mount capacitor assembly includes multiple surface mount capacitors connected in series and / or in parallel, and / or, surface mount capacitors connected in series with a balanced bipolar capacitor.

9. The filter circuit according to claim 2, characterized in that, The substrate below the filter capacitor has a cutout design.

10. The filter circuit according to claim 1 or 2, characterized in that, The surface of the filter capacitor is coated with conformal coating.

11. The filter circuit according to claim 2, characterized in that, One end of the grounding trace of the filter capacitor is connected to the grounding pad on the substrate. The grounding pad is adapted to be fixed to the housing by metal fasteners and connected to the ground on the housing. The housing is used to assemble the substrate, the power module and the filter circuit.

12. A controller, characterized in that, include: Grounding traces, power modules, and filter circuits according to any one of claims 1-11.

13. The controller according to claim 12, characterized in that, The controller further includes a substrate, on which the ground trace and the high-voltage trace of the power module are disposed.

14. The controller according to claim 12, characterized in that, The power module is a bridge power module, which is equipped with copper busbars. At least three copper busbars are provided for each arm of the bridge power module. One copper busbar is used to connect to the corresponding phase line of the load, one copper busbar is used to connect to the positive DC bus, and another copper busbar is used to connect to the negative DC bus.

15. The controller according to claim 14, characterized in that, The bridge power module is provided with at least one of the following: a high-voltage line pin, a drive signal pin, and a temperature signal pin.

16. The controller according to claim 13, characterized in that, The controller also includes a housing and a heat sink. The housing is used to mount the substrate, the power module and the filter circuit, and the heat sink is disposed on the housing.

17. A drive system, characterized in that, include: The load, and the controller according to any one of claims 12-16, or the filter circuit according to any one of claims 1-11.

18. A vehicle, characterized in that, include: The drive system according to claim 17, or the controller according to any one of claims 12-16, or the filter circuit according to any one of claims 1-11.

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