Waterproof structure of PCB and display screen

Abstract

The utility model discloses a waterproof structure of a PCB, which comprises a PCB mainboard and sealant, the PCB is provided with an annular groove, the PCB comprises a working part located at the inner side of the annular groove and an excess material cutting part located at the outer side of the annular groove, and the sealant is arranged in the annular groove. According to the waterproof structure of the PCB, the annular groove is formed for accommodating the sealant, so that a sealing layer with enough thickness can be formed on the side surface of the working part after the excess material cutting part of the PCB main board is cut, a splicing gap between the PCB main boards has relatively high waterproof performance, and the phenomena of dead lights and caterpillar caused by the fact that a light-emitting chip of a Mini / Micro LED high-definition display product is affected with damp are avoided. The thickness of the sealing layer can be changed by adjusting the width of the annular groove.

Description

Technical Field

[0001] This utility model relates to the field of PCB board technology, and in particular to a waterproof structure for a PCB board and a display screen. Background Technology

[0002] Mini / Micro LED high-definition display products are made by integrating tens of thousands to hundreds of thousands of chips onto a PCB board. After the PCB board is integrated and packaged, it needs to be cut and spliced. However, after cutting, the waterproof performance of the sides of the PCB board is poor, and water can easily leak between the splicing seams of adjacent PCB boards. In existing Mini / Micro LED integrated packaged display products, the sides of the PCB board are generally coated with a waterproof coating. The thickness of the waterproof coating is difficult to control and is relatively thin. After splicing and compression, the waterproof effect will be greatly reduced, which can easily lead to moisture absorption of the light-emitting chips, resulting in dead LEDs and caterpillar-like defects. Utility Model Content

[0003] The technical problem to be solved by this utility model is to provide a waterproof structure for a PCB board and a display screen.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution: a waterproof structure for a PCB board, including a PCB motherboard and a sealant, wherein an annular groove is formed on the PCB board, the PCB board includes a working part located inside the annular groove and an excess material cutting part located outside the annular groove, and the sealant is disposed in the annular groove.

[0005] Furthermore, the number of the annular grooves is multiple.

[0006] Furthermore, the annular groove is rectangular.

[0007] Furthermore, the cross-section of the annular groove is rectangular.

[0008] Furthermore, the annular groove is formed by milling.

[0009] Furthermore, the width of the annular groove is 0.1-3.0 mm.

[0010] Furthermore, the depth of the annular groove is 0.1-1.8 mm.

[0011] Furthermore, the sealant is made of resin or rubber.

[0012] The second technical solution adopted in this utility model is: a display screen, including the waterproof structure of the PCB board mentioned above.

[0013] The beneficial effects of this invention are as follows: The waterproof structure of this PCB board, by creating annular grooves to accommodate sealant, allows for the formation of a sufficiently thick sealing layer on the side of the working section after the PCB motherboard cutting off excess material. This results in strong waterproof performance at the joints between PCB motherboards, preventing moisture damage to the light-emitting chips in Mini / Micro LED high-definition displays, which can lead to dead LEDs or "caterpillar" defects. The thickness of the sealing layer can be adjusted by changing the width of the annular grooves. Attached Figure Description

[0014] Figure 1 This is a top view of the waterproof structure of the PCB board according to Embodiment 1 of this utility model;

[0015] Figure 2 This is a cross-sectional view of the waterproof structure of the PCB board according to Embodiment 1 of this utility model;

[0016] Figure 3 for Figure 2 Enlarged detail of section A in the middle.

[0017] Label Explanation:

[0018] 1. PCB motherboard; 11. Circular groove; 12. Working section; 13. Excess material removal section;

[0019] 2. Sealant. Detailed Implementation

[0020] To explain in detail the technical content, objectives, and effects of this utility model, the following description is provided in conjunction with the embodiments and accompanying drawings.

[0021] Please refer to Figures 1 to 3 A waterproof structure for a PCB board includes a PCB motherboard 1 and a sealant 2. The PCB board has an annular groove 11. The PCB board includes a working part 12 located inside the annular groove 11 and a material removal part 13 located outside the annular groove 11. The sealant 2 is disposed in the annular groove 11.

[0022] As can be seen from the above description, the beneficial effects of this utility model are as follows: The waterproof structure of this PCB board, by opening an annular groove 11 to accommodate the sealant 2, allows a sufficiently thick sealing layer to be formed on the side of the working part 12 after the PCB motherboard 1 is cut to remove excess material 13. This results in strong waterproof performance at the splicing gaps between the PCB motherboards 1, preventing the light-emitting chips of Mini / Micro LED high-definition display products from becoming damp and developing dead LEDs or "caterpillar" phenomena. The thickness of the sealing layer can be changed by adjusting the width of the annular groove 11.

[0023] Furthermore, the number of annular grooves 11 is multiple.

[0024] As can be seen from the above description, multiple PCB unit boards for splicing can be cut from the same PCB motherboard 1.

[0025] Furthermore, the annular groove 11 is rectangular.

[0026] Furthermore, the cross-section of the annular groove 11 is rectangular.

[0027] Furthermore, the annular groove 11 is formed by milling.

[0028] Furthermore, the width of the annular groove 11 is 0.1-3.0 mm.

[0029] As can be seen from the above description, the thickness of the sealing layer on the side of the working part 12 of the PCB motherboard 1 can be changed by adjusting the width of the annular groove 11.

[0030] Furthermore, the depth of the annular groove 11 is 0.1-1.8 mm.

[0031] As can be seen from the above description, the width of the sealing layer on the side of the working part 12 of the PCB motherboard 1 can be changed by adjusting the depth of the annular groove 11.

[0032] Furthermore, the sealant 2 is made of resin or rubber.

[0033] As can be seen from the above description, the material of sealant 2 can be selected according to actual usage needs or production conditions.

[0034] The display screen includes the aforementioned waterproof structure of the PCB board.

[0035] As described above, the LED light-emitting board of the display screen has strong waterproof performance, which can effectively prevent the light-emitting chips from getting damp and causing dead lights or caterpillar-like phenomena.

[0036] Please refer to Figures 1 to 3 One embodiment of this utility model is as follows: The display screen includes a waterproof structure for a PCB board. The waterproof structure of the PCB board includes a PCB motherboard 1 and a sealant 2. An annular groove 11 is formed on the PCB board. The PCB board includes a working part 12 located inside the annular groove 11 and a material removal part 13 located outside the annular groove 11. The sealant 2 is disposed in the annular groove 11. Specifically, the sealant 2 is a liquid curing adhesive, which is injected into the annular groove 11 and allowed to cure statically, exhibiting elasticity after curing. Before splicing, the material removal part 13 is removed by milling the PCB motherboard 1, thus forming a sealing layer of sufficient thickness on the outer surface of the working part 12.

[0037] In this embodiment, there is one annular groove 11; the annular groove 11 is rectangular; the cross-section of the annular groove 11 is rectangular; the annular groove 11 is formed by milling. In other embodiments, the number of annular grooves 11 can be multiple, and the number of annular grooves 11 corresponds one-to-one with the number of working parts 12; the cross-section of the annular groove 11 can be arc-shaped or other polygonal.

[0038] In this embodiment, the width of the annular groove 11 is 0.1-3.0 mm. By adjusting the width of the annular groove 11, the thickness of the sealing layer on the side of the working part 12 of the PCB motherboard 1 can be changed. The depth of the annular groove 11 is 0.1-1.8 mm. By adjusting the depth of the annular groove 11, the width of the sealing layer on the side of the working part 12 of the PCB motherboard 1 can be changed.

[0039] Optionally, sealant 2 can be made of resin or rubber.

[0040] In summary, the waterproof structure of the PCB board provided by this utility model, by creating annular grooves to accommodate sealant, allows a sufficiently thick sealing layer to be formed on the side of the working part after the PCB motherboard cutting off excess material. This results in strong waterproof performance at the splicing gaps between PCB motherboards, preventing the light-emitting chips of Mini / Micro LED high-definition display products from becoming damp and developing issues such as dead LEDs or "caterpillar" defects. The thickness of the sealing layer can be changed by adjusting the width of the annular grooves.

[0041] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent modifications made based on the content of this utility model specification and drawings, or direct or indirect applications in related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A waterproof structure for a PCB board, characterized in that: The device includes a PCB motherboard and a sealant. The PCB motherboard has an annular groove. The PCB motherboard includes a working part located inside the annular groove and a material removal part located outside the annular groove. The sealant is disposed in the annular groove.

2. The waterproof structure of a PCB board according to claim 1, characterized in that: The number of annular grooves is multiple.

3. The waterproof structure of a PCB board according to claim 1, characterized in that: The annular groove is rectangular.

4. The waterproof structure of a PCB board according to claim 1, characterized in that: The cross-section of the annular groove is rectangular.

5. The waterproof structure of a PCB board according to claim 1, characterized in that: The annular groove is formed by milling.

6. A waterproof structure for a PCB board according to claim 1, characterized in that: The width of the annular groove is 0.1-3.0 mm.

7. The waterproof structure of a PCB board according to claim 1, characterized in that: The depth of the annular groove is 0.1-1.8 mm.

8. The waterproof structure of a PCB board according to claim 1, characterized in that: The sealant is made of resin or rubber.

9. A display screen, characterized in that: The waterproof structure of the PCB board as described in any one of claims 1-8.

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