Circuit board solder resist printing device
By introducing a circuit board solder resist printing device with a material ejection assembly and a buffer structure, the problem of the lower half of the circuit board sinking into the placement frame was solved, achieving automated positioning and uniform coating, improving production efficiency and reducing operational difficulty.
Patent Information
- Application Number
- CN202423277165.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-30
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2034-12-30
AI Technical Summary
When using a placement frame or placement cavity, the lower half of the circuit board is sunk into the existing circuit board solder resist printing machine, which complicates the material handling operation and increases the difficulty and time cost.
A circuit board solder resist printing device was designed, comprising a material ejection assembly, an electric slide rail, an electric slider, a frame, a screw, a guide rod, a motor, and an ink feeder. Through automatic material ejection and a buffer structure, the device achieves automated positioning of the circuit board and uniform coating of solder resist ink.
It simplifies the material handling process for circuit boards, improves production efficiency, reduces the workload of operators, and reduces the risk of the wire mesh frame scratching the copper surface of the circuit board.
Smart Images
Figure CN223899418U_ABST
Abstract
Description
Technical Field
[0001] This utility model belongs to the field of screen printing technology, and in particular relates to a circuit board solder resist printing device. Background Technology
[0002] A printed circuit board (PCB) is a substrate used to connect and support electronic components, typically composed of insulating and conductive materials. The conductive paths on a PCB are formed through processes such as etching, drilling, and plating, connecting various electronic components to enable them to function properly. Solder resist printing refers to the process of coating the PCB surface with a layer of solder resist ink. Solder resist ink is a special coating material, usually green, blue, red, or black, with good insulation and heat resistance. The main purpose of solder resist printing is to protect the PCB surface and conductive paths, preventing unnecessary short circuits or poor soldering during the soldering process.
[0003] Conventional circuit board solder resist printing machines are relatively simple in design and function, mainly used to complete the solder resist ink coating process. However, when circuit boards are fixed and positioned on the printing table using a placement frame or cavity, this design causes the lower half of the circuit board to sink into the placement frame or cavity, making the board unloading operation more complex and difficult, increasing the operational difficulty and time cost.
[0004] Therefore, there is a particular need for a circuit board solder resist printing device to solve the above problems. Utility Model Content
[0005] To overcome the drawbacks of conventional circuit board solder resist printing machines, where the lower half of the circuit board is sunk into the placement frame or cavity, complicating the material handling process and increasing the difficulty and time cost, this utility model provides a circuit board solder resist printing device.
[0006] This utility model is achieved through the following technical approach: A circuit board solder resist printing device includes a base, a mounting frame, a placement frame, an electric slide rail, an electric slider, a mesh frame, a screw, a guide rod, a motor, and an ink feeder. The mounting frame is located at the bottom layer, serving as the supporting foundation for the entire device. The base is fixedly connected to the lower front side of the mounting frame. The placement frame is fixedly connected to the top of the base by multiple support pillars. The electric slide rail is installed on the upper part of the mounting frame. The electric slider is slidably connected to the electric slide rail. The mesh frame is installed in front of the electric slider. The screw is rotatably connected to the upper part of the mesh frame at a position slightly forward of the middle. The guide rod is fixedly connected to the upper part of the mesh frame. The motor is located slightly behind the screw and positioned on the upper right side of the mesh frame, slightly forward of the center. Its output shaft passes through the mesh frame to the left and is fixedly connected to the right end of the screw. The ink feeder is located between the screw and the guide rod. The front part of the ink feeder is threaded to the screw, and the upper rear part is slidably connected to the guide rod through a groove. The guide rod and the screw have the same length. The bottom end of the ink feeder contacts the mesh surface of the mesh frame, and the width of the ink feeder is equal to the width of the mesh surface of the mesh frame. It also includes a material ejection assembly for ejecting the circuit board, which is located between the base, the placement frame, and the mesh frame.
[0007] In one embodiment, the ejector assembly includes support columns, an ejector plate, a first rack, a gear, a torsion spring, a second rack, and abutment blocks. Two support columns are distributed left and right, fixed to the upper left and right sides of the base. The ejector plate is slidably placed inside the placement frame. Two first racks are symmetrically distributed, fixed to the lower left and right sides of the ejector plate, and pass through the placement frame, extending to the outside of the placement frame. The gear is rotatably connected to the end of the support column near the base, and the first rack is located in front of the corresponding gear and meshes with it. The torsion spring is sleeved on the other end of the support column away from the base, and its two ends are fixedly connected to the gear and the support column, respectively. Two second racks are symmetrically distributed, slidably connected to the left and right sides outside the placement frame, and are located in front of the corresponding gear and mesh with it. The upper end of the second rack is designed as a hollow rectangular block, which is slidably connected to the convex plate on the side of the placement frame. Two abutment blocks are distributed left and right, fixed to the lower left and right sides of the mesh frame at a position slightly forward, and the abutment blocks face the upper part of the corresponding second rack.
[0008] In one embodiment, the system further includes a base cylinder, a sliding rod, and springs. Multiple base cylinders are arranged in a U-shape and fixed to the upper left and right sides of the base. Multiple sliding rods are arranged in a U-shape and fixed to the lower left and right sides of the mesh frame. The lower ends of the sliding rods are inserted into the corresponding base cylinders and slidably connected to them. Every two springs are located inside the corresponding base cylinders, and their two ends are fixedly connected to the corresponding sliding rods and the corresponding base cylinders, respectively.
[0009] In one embodiment, a sealing strip is also included. The rectangular sealing strip is fixed to the bottom edge of the mesh frame, and a groove adapted to the sealing strip is formed at the top edge of the placement frame, with the sealing strip directly above the groove.
[0010] In one embodiment, the device also includes limiting rods, which are distributed in a rectangular pattern and fixed to multiple corners at the top of the placement frame. The left limiting rod has its edge near the ejector plate aligned vertically with the left inner edge of the placement frame, and the right limiting rod has its edge near the ejector plate aligned vertically with the right inner edge of the placement frame.
[0011] In one embodiment, the first rack and the second rack have the same thickness.
[0012] In one embodiment, the bottom area of the ejector plate is equal to the bottom area of the placement frame, and the left and right sides of the ejector plate are designed with chamfered angles.
[0013] In one embodiment, two ink inlet tubes are provided at the upper right front side of the ink feeder, and there are threaded grooves at the inner diameter of the upper end of the ink inlet tubes.
[0014] Beneficial effects:
[0015] By introducing a material ejection assembly, operators only need to place the circuit board on the ejection plate, and the subsequent ejection process is completed automatically by the device, reducing manual intervention, improving production efficiency, and reducing the workload of operators.
[0016] By incorporating a base cylinder, sliding rod, and spring design, effective cushioning is provided to reduce the impact of the mesh on the copper surface of the circuit board when the mesh frame moves downward, thus preventing the mesh from scratching the copper surface of the circuit board. Attached Figure Description
[0017] Figure 1 This is a three-dimensional structural diagram of the present invention.
[0018] Figure 2 This is a three-dimensional structural diagram of the electric slide rail, electric slider, and wire frame components of this utility model.
[0019] Figure 3 This is a three-dimensional structural diagram of the guide rod, motor, and ink feeder components of this utility model.
[0020] Figure 4 This is a cross-sectional view of the bottom cylinder component of this utility model.
[0021] Figure 5 This is a cross-sectional view of the placement frame component of this utility model.
[0022] The markings in the diagram are as follows: 1. Base, 101. Mounting bracket, 2. Placement frame, 3. Electric slide rail, 4. Electric slider, 5. Mesh frame, 6. Sealing strip, 7. Groove, 8. Screw, 9. Guide rod, 10. Motor, 11. Ink feeder, 12. Bottom cylinder, 13. Slide rod, 14. Spring, 15. Support column, 16. Unloading plate, 17. First rack, 18. Gear, 19. Torsion spring, 20. Second rack, 21. Abutment block, 22. Limiting rod. Detailed Implementation
[0023] The present invention will be further described below with reference to the embodiments shown in the accompanying drawings.
[0024] Example: A circuit board solder mask printing apparatus, such as Figures 1-5As shown, the device includes a base 1, a mounting frame 101, a placement frame 2, an electric slide rail 3, an electric slider 4, a mesh frame 5, a sealing strip 6, a screw 8, a guide rod 9, a motor 10, and an ink feeder 11. The mounting frame 101 is located at the bottom and serves as the supporting foundation for the entire device. The base 1 is welded to the lower front side of the mounting frame 101. The placement frame 2 is welded to the top of the base 1. The electric slide rail 3 is bolted to the upper part of the mounting frame 101. The electric slider 4 is slidably connected to the electric slide rail 3. The mesh frame 5 is bolted to the electric slide rail 101. On the front side of slider 4, a rectangular sealing strip 6 is bonded to the bottom edge of mesh frame 5. A groove 7, which matches the sealing strip 6, is located at the top edge of placement frame 2, with the sealing strip 6 directly above the groove 7. This ensures that the two are perfectly aligned vertically, preventing the sealing strip 6 from shifting or tilting during insertion and guaranteeing that it can be smoothly inserted into the groove 7 and fit tightly. Screw 8 is rotatably connected to the upper part of mesh frame 5, slightly forward of the center. Guide rod 9 is welded to the upper part of mesh frame 5, slightly rearward of the center, and located behind screw 8. Motor 10 is bolted to the upper right side of the mesh frame 5, slightly forward. Its output shaft passes through the mesh frame 5 to the left and is fixedly connected to the right end of the screw 8. The ink feeder 11 is located between the screw 8 and the guide rod 9. The front part of the ink feeder 11 is threaded to the screw 8, and the upper rear part is slidably connected to the guide rod 9 through a groove. The guide rod 9 and the screw 8 are of the same length, so that the ink feeder 11 can achieve precise linear movement while maintaining stability. The bottom end of the ink feeder 11 contacts the mesh surface of the mesh frame 5, so that the ink feeder 11 can... Simultaneously, the solder resist ink is scraped, and the width of the ink feeder 11 is equal to the width of the mesh surface of the mesh frame 5, ensuring that the ink feeder 11 can be fully coated with solder resist ink. At the upper right front side of the ink feeder 11, there are two ink inlet pipes, which can continuously add ink to the ink feeder 11. There is a threaded groove at the inner diameter of the upper end of the ink inlet pipe, which can be connected to a feed pipe with a threaded protrusion at the outer diameter. When the motor 10 runs, the screw 8 rotates clockwise to drive the ink feeder 11 to move to the left. It also includes a material ejection component, which is used to eject the circuit board and is set between the base 1, the placement frame 2 and the mesh frame 5.
[0025] like Figure 1 and Figure 5As shown, the ejector assembly includes support columns 15, ejector plate 16, first rack 17, gear 18, torsion spring 19, second rack 20, and abutment block 21. Two support columns 15 are distributed left and right, connected to the upper left and right sides of the base 1 by welding. The ejector plate 16 is slidably placed inside the placement frame 2. The bottom area of the ejector plate 16 is equal to the bottom area inside the placement frame 2, ensuring that the ejector plate 16 can move smoothly and stably along the inner wall of the placement frame 2. Furthermore, the left and right sides of the ejector plate 16 are designed with chamfered angles to effectively reduce contact with... The contact area between the placement frames 2 is designed to prevent jamming. Two first racks 17 are symmetrically distributed and welded to the left and right sides of the bottom of the ejector plate 16, passing through the placement frames 2 and extending to the outside of the placement frames 2. A gear 18 is rotatably connected to the end of the support column 15 near the base 1, with the first rack 17 located in front of the corresponding gear 18 and meshing with it. A torsion spring 19 is sleeved on the other end of the support column 15 away from the base 1, with its two ends fixedly connected to the gear 18 and the support column 15, respectively. Two second racks 20 are symmetrically distributed and slide... Connected to the left and right sides of the outer side of the placement frame 2 and positioned in front of the corresponding gear 18 to mesh with it, the upper end of the second rack 20 is designed as a hollow rectangular block. This rectangular block is slidably connected to the convex plate on the side of the placement frame 2 in a closed manner, which can prevent the second rack 20 from disengaging from the placement frame 2 during movement. The first rack 17 and the second rack 20 have the same thickness, ensuring that the first rack 17 and the second rack 20 can withstand the same mechanical load during transmission with the gear 18, avoiding stress concentration or unevenness caused by thickness differences. The force is evenly distributed, with two abutment blocks 21 distributed on the left and right sides and connected by welding to the lower left and right sides of the mesh frame 5, slightly forward. The abutment blocks 21 are directly above the corresponding second rack 20, ensuring that the corresponding second rack 20 can be accurately squeezed by the abutment blocks 21. When the mesh frame 5 moves the abutment blocks 21 downward to squeeze the corresponding second rack 20, the corresponding second rack 20 meshes with the gear 18 in the forward direction, causing the gear 18 to rotate clockwise and mesh with the corresponding first rack 17 in the forward direction, causing the corresponding first rack 17 to move the ejector plate 16 downward.
[0026] like Figure 1 and Figure 4 As shown, it also includes a base cylinder 12, a sliding rod 13, and a spring 14. The four base cylinders 12 are arranged in a U-shape and are connected to the upper left and right sides of the base 1 by welding. The four sliding rods 13 are arranged in a U-shape and are connected to the lower left and right sides of the mesh frame 5 by welding. The lower end of the sliding rod 13 passes into the corresponding base cylinder 12 and slides therewith. Every two springs 14 are set inside the corresponding base cylinder 12, and their two ends are fixedly connected to the corresponding sliding rod 13 and the corresponding base cylinder 12, respectively. When the mesh frame 5 moves the sliding rod 13 downward, the sliding rod 13 moves downward along the corresponding base cylinder 12 and compresses the corresponding spring 14.
[0027] like Figure 5As shown, it also includes limiting rods 22. The four limiting rods 22 are distributed in a rectangular pattern and are connected to the four corners of the top of the placement frame 2 by welding. The edge of the left limiting rod 22 near the ejector plate 16 is vertically aligned with the inner left edge of the placement frame 2, and the edge of the right limiting rod 22 near the ejector plate 16 is vertically aligned with the inner right edge of the placement frame 2. This allows the multiple limiting rods 22 to accurately contact the side of the circuit board and effectively limit the circuit board from the left and right directions, ensuring its stability and accurate positioning inside the placement frame 2.
[0028] Initially, the ejector plate 16 is in the ejected state. First, the operator connects the feed pipe to the ink inlet pipe on the ink feeder 11, adding solder resist ink into the ink feeder 11. Then, the circuit board to be printed is placed on the ejector plate 16 (copper side of the circuit board facing up). The limiting rod 22 acts as a limit, assisting the operator in accurately placing the circuit board, ensuring that the left and right inner edges of the circuit board are vertically aligned with the left and right inner edges of the placement frame 2. After the circuit board is placed, the front and rear positions of the circuit board are adjusted to ensure that the front and rear inner edges of the circuit board are vertically aligned with the front and rear inner edges of the placement frame 2. Then, the electric slide rail 3 is activated, controlling the electric slider 4 to move the screen frame 5 downwards until the screen surface of the screen frame 5 is in contact with the copper surface of the circuit board. During this process, the screen frame 5 moves downwards. As the sliding rod 13 moves downward, the spring 14 is compressed, acting as a buffer to slow down the downward movement of the mesh frame 5 and prevent the mesh surface of the mesh frame 5 from forcefully impacting the copper surface of the circuit board and causing scratches. Simultaneously, the mesh frame 5 drives the abutment block 21 downward, contacting and pressing the second rack 20 downward, engaging with the gear 18 in a forward direction. During engagement, the gear 18 rotates clockwise, and the torsion spring 19 deforms to store energy. As the gear 18 rotates clockwise, it engages with the first rack 17 in a forward direction. During engagement, the first rack 17 drives the ejector plate 16 downward, and the circuit board moves downward along with the ejector plate 16, falling into the placement frame 2 for positioning. Simultaneously, the mesh frame 5 drives the sealing strip 6 downward, precisely embedding it into the groove 7, achieving a precise fit between the mesh frame 5 and the edge of the placement frame 2. After sealing the gap, the motor 10 and ink feeder 11 are started. When the motor 10 is running, its output shaft drives the screw 8 to rotate clockwise, driving the ink feeder 11 to move to the left. When the ink feeder 11 moves to the left, it evenly coats the solder resist ink on the screen surface of the screen frame 5. At the same time, the bottom end of the ink feeder 11 scrapes the solder resist ink on the screen surface, allowing the solder resist ink to pass through the screen surface and be printed onto the copper surface of the circuit board. During the printing process, the sealing strip 6 plays a sealing role to ensure that the solder resist ink does not leak from between the placement frame 2 and the screen frame 5. When the ink feeder 11 moves to the left limit position and the printing on the copper surface of the circuit board is completed, the motor 10 and ink feeder 11 are turned off, and the solder resist ink on the copper surface of the circuit board is allowed to form a film. After the solder resist ink forms a film, the electric slider 4 is controlled to drive the screen frame 5 to move upward and reset. The screen of frame 5 is detached from the copper surface of the circuit board. During this process, frame 5 moves slide bar 13 upward, spring 14 returns to its original shape, and frame 5 moves abutment block 21 upward, disengaging from and no longer pressing second rack 20. This relieves the second rack 20 of the force of meshing with gear 18, torsion spring 19 returns to its original shape, causing gear 18 to rotate counterclockwise and mesh with first rack 17 in the opposite direction. During meshing, first rack 17 moves ejector plate 16 upward, pushing the printed circuit board out of placement frame 2, thus realizing automatic ejection of the circuit board. Frame 5 also moves sealing strip 6 upward, disengaging it from groove 7. Finally, the ejected circuit board is removed from ejector plate 16, thus completing the entire solder resist printing process of the circuit board.
[0029] The above description is merely an embodiment of this utility model and is not intended to limit the scope of this utility model. All equivalent substitutions made within the principles of this utility model should be included within the protection scope of this utility model. Contents not described in detail in this utility model are existing technologies known to those skilled in the art.
Claims
1. A circuit board solder resist printing device, comprising a base (1), a mounting frame (101), a placement frame (2), an electric slide rail (3), an electric slider (4), a mesh frame (5), a screw (8), a guide rod (9), a motor (10), and an ink feeder (11). The mounting frame (101) is located at the bottom and serves as the supporting foundation for the entire device. The base (1) is fixed to the lower front side of the mounting frame (101). The placement frame (2) is fixed to the top of the base (1) by multiple support columns. The electric slide rail (3) is installed on the upper part of the mounting frame (101). The electric slider (4) is slidably connected to the electric slide rail (3). The mesh frame (5) is installed in front of the electric slider (4). The screw (8) is rotatably connected to the upper part of the mesh frame (5) at a position slightly forward of the middle. The guide rod (9) is fixed to the upper part of the mesh frame (5) at a position slightly backward of the middle and located behind the screw (8). The motor (10) is installed at the upper right side of the mesh frame (5) at a position slightly forward of the middle. Its output shaft passes through the mesh frame (5) to the left and is fixedly connected to the right end of the screw (8). The ink feeder (11) is set between the screw (8) and the guide rod (9). The front part of the ink feeder (11) is threaded to the screw (8) through a thread, and the rear upper part is slidably connected to the guide rod (9) through a groove. The guide rod (9) and the screw (8) have the same length. The bottom end of the ink feeder (11) is in contact with the mesh surface of the mesh frame (5), and the width of the ink feeder (11) is equal to the width of the mesh surface of the mesh frame (5). The feature is that it also includes a material ejection component for ejecting the circuit board, which is set between the base (1), the placement frame (2) and the mesh frame (5).
2. The circuit board solder resist printing device as described in claim 1, characterized in that: The ejector assembly includes a support column (15), an ejector plate (16), a first rack (17), a gear (18), a torsion spring (19), a second rack (20), and an abutment block (21). The two support columns (15) are distributed on the left and right sides and fixed to the upper left and right sides of the base (1). The ejector plate (16) is slidably placed inside the placement frame (2). The two first racks (17) are symmetrically distributed and fixed to the lower left and right sides of the ejector plate (16), and pass through the placement frame (2) to extend to the outside of the placement frame (2). The gear (18) is rotatably connected to the end of the support column (15) near the base (1). The first rack (17) is located in front of the corresponding gear (18). The torsion spring (19) is sleeved on the other end of the support column (15) away from the base (1), and its two ends are fixedly connected to the gear (18) and the support column (15) respectively. Two second racks (20) are symmetrically distributed and slidably connected to the left and right sides of the outside of the placement frame (2), and are located in front of the corresponding gear (18) and mesh with it. The upper end of the second rack (20) is designed as a hollow rectangular block. The rectangular block is slidably connected to the convex plate on the side of the placement frame (2). Two abutting blocks (21) are distributed on the left and right, and are fixed to the lower left and right sides of the mesh frame (5) at a position slightly in front. The abutting blocks (21) are directly above the corresponding second rack (20).
3. The circuit board solder resist printing device as described in claim 2, characterized in that: It also includes a base cylinder (12), a sliding rod (13) and a spring (14). Multiple base cylinders (12) are arranged in a U-shape and fixed to the upper left and right sides of the base (1). Multiple sliding rods (13) are arranged in a U-shape and fixed to the lower left and right sides of the mesh frame (5). The lower end of the sliding rod (13) is inserted into the corresponding base cylinder (12) and slidably connected to it. Every two springs (14) are set inside the corresponding base cylinder (12), and their two ends are fixedly connected to the corresponding sliding rod (13) and the corresponding base cylinder (12) respectively.
4. The circuit board solder resist printing device as described in claim 3, characterized in that: It also includes a sealing strip (6), a rectangular sealing strip (6) fixed to the bottom edge of the mesh frame (5), and a groove (7) adapted to the sealing strip (6) opened at the top edge of the placement frame (2), with the sealing strip (6) directly above the groove (7).
5. The circuit board solder resist printing apparatus as described in claim 4, characterized in that: It also includes limit rods (22), multiple limit rods (22) are distributed in a rectangular direction and fixed to multiple corners at the top of the placement frame (2). Among them, the side edge of the left limit rod (22) near the ejector plate (16) is vertically aligned with the left inner edge of the placement frame (2), and the side edge of the right limit rod (22) near the ejector plate (16) is vertically aligned with the right inner edge of the placement frame (2).
6. The circuit board solder resist printing apparatus as described in claim 5, characterized in that: The first rack (17) and the second rack (20) have the same thickness.
7. The circuit board solder resist printing apparatus as described in claim 6, characterized in that: The bottom area of the ejector plate (16) is equal to the bottom area of the placement frame (2), and the left and right sides of the ejector plate (16) are designed with chamfered angles.
8. The circuit board solder resist printing apparatus as described in claim 7, characterized in that: Two ink inlet pipes are provided on the upper right front side of the ink feeder (11), and there is a threaded groove at the inner diameter of the upper end of the ink inlet pipe.