Ridge waveguide constant temperature structure

Abstract

The utility model belongs to the technical field of ridge waveguide equipment, and provides a ridge waveguide constant temperature structure which comprises a ridge waveguide mounting shell and a base, the base is mounted at the bottom of the ridge waveguide mounting shell, and a heat dissipation cavity is formed in the middle of an inner cavity of the base; hollowed-out heat conduction fins are arranged at the top and the bottom of the heat dissipation cavity, a fan is arranged in the heat dissipation cavity, and the fan blows air from top to bottom; a plurality of refrigeration sheets are arranged around the heat dissipation cavity as the center; according to the scheme, the effect of keeping the working temperature of the ridge waveguide constant is achieved, and an efficient path is constructed for heat transfer through the arrangement of the heat dissipation cavity and the heat conduction fins. Heat is transmitted to the base from the ridge waveguide installation shell, then transmitted to the heat conduction fins through the refrigeration piece and finally blown out through the fan, the heat transmission links are closely connected, heat accumulation is reduced, and the influence of too high temperature on the ridge waveguide is effectively prevented.

Description

Technical Field

[0001] This utility model relates to the field of ridge waveguide equipment technology, specifically a ridge waveguide constant temperature structure. Background Technology

[0002] Ridge waveguides are a special type of waveguide structure widely used in the design and manufacture of components such as antennas, filters, and couplers. They offer better performance and smaller size, and are also used for high-frequency signal transmission and reception, providing high resolution and accurate measurement capabilities, making them suitable for military and civilian radar systems. However, ridge waveguides generate a large amount of heat when working. If this heat is not dissipated in time, the temperature will rise rapidly. The performance of ridge waveguides is quite sensitive to temperature changes; even small temperature fluctuations can affect their operating parameters. Sustained high temperatures can cause thermal stress in the internal materials of the ridge waveguide, and long-term accumulation may lead to material deformation and damage, affecting the lifespan of the equipment. Therefore, a ridge waveguide isothermal structure is proposed to solve this problem. Utility Model Content

[0003] The purpose of this invention is to provide a ridge waveguide isothermal structure to solve the problems mentioned in the background art.

[0004] To achieve the above objectives, this utility model provides the following technical solution: a ridge waveguide constant temperature structure, comprising a ridge waveguide mounting shell and a base, wherein the base is installed at the bottom of the ridge waveguide mounting shell, and a heat dissipation cavity is formed in the middle of the inner cavity of the base;

[0005] The top and bottom of the heat dissipation cavity are provided with hollowed-out heat-conducting fins, and a fan is installed inside the heat dissipation cavity, with the fan blowing air from top to bottom; several cooling plates are arranged around the heat dissipation cavity as the center.

[0006] Preferably, the cooling chip is used as the inner wall of the heat dissipation cavity; the bottom of the cooling chip is the high-temperature end, the top of the cooling chip is the low-temperature end, and the high-temperature end and the low-temperature end respectively abut against two heat-conducting fins.

[0007] Preferably, the base has an air inlet on its front side, and the air inlet is connected to the heat dissipation cavity.

[0008] Preferably, the heat-conducting fins are made of copper or aluminum alloy series metals with high thermal conductivity.

[0009] Preferably, an air filter is installed at the air inlet.

[0010] Compared with the prior art, the beneficial effects of this utility model are:

[0011] This design maintains a constant operating temperature for the ridge waveguide. The layout of the heat dissipation cavity and heat-conducting fins creates an efficient heat transfer path. Heat is transferred from the ridge waveguide mounting shell to the base, then through the cooling element to the heat-conducting fins, and finally blown out by the fan. This tightly integrated heat transfer process reduces heat buildup and effectively prevents excessive temperature from affecting the ridge waveguide. Attached Figure Description

[0012] Figure 1 This is the front view of the present utility model;

[0013] Figure 2 This is a bottom view of the base of this utility model;

[0014] Figure 3 This is a cross-sectional view of the base of this utility model;

[0015] Figure 4 This is a schematic diagram of the heat dissipation cavity and the cooling plate of this utility model.

[0016] In the diagram: 1. Ridge waveguide mounting housing, 2. Base, 3. Air inlet, 4. Foot pad, 5. Heat dissipation cavity, 6. Cooling chip, 7. Fan. Detailed Implementation

[0017] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0018] In the description of this utility model, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model. Example

[0019] Please see Figure 1-4 This utility model provides a ridge waveguide constant temperature structure technical solution: a ridge waveguide constant temperature structure, including a ridge waveguide mounting shell 1 and a base 2;

[0020] The base 2 is installed at the bottom of the ridge waveguide mounting shell 1. A heat dissipation cavity 5 is provided in the middle of the inner cavity of the base 2. The top and bottom of the heat dissipation cavity 5 are provided with hollow heat-conducting fins. A fan 7 is installed in the heat dissipation cavity 5. The fan 7 blows air from top to bottom. The working chamber fan 7 slowly blows air downwards, drawing the hot air in the base 2 into the heat dissipation cavity 5. Then, the cooling chip 6 in the heat dissipation cavity 5 does work to generate heat exchange. Temperature sensors are installed in the inner cavities of both the ridge waveguide mounting shell 1 and the base 2.

[0021] Several cooling plates 6 are arranged around the heat dissipation cavity 5. The cooling plates 6 serve as the inner wall of the heat dissipation cavity 5. The bottom of the cooling plate 6 is the high-temperature end, and the top of the cooling plate 6 is the low-temperature end. The high-temperature end and the low-temperature end respectively abut against two heat-conducting fins.

[0022] The hollow design of the heat-conducting fins not only increases the heat dissipation area, but also effectively reduces the overall weight and improves the heat dissipation efficiency; the number of cooling fins 6 is reasonably determined according to the heat dissipation requirements and the perimeter of the heat dissipation cavity 5 to ensure that the temperature of the heat dissipation cavity 5 is evenly distributed.

[0023] Through the coordinated work of the cooling chip, fan, and heat-conducting fins, the heat generated by the ridge waveguide can be dissipated quickly and effectively, ensuring that it operates within a stable temperature range; the heat-conducting fins are made of copper or aluminum alloy series metal materials with high thermal conductivity; an air inlet 3 is provided on the front side of the base 2, and the air inlet 3 is connected to the heat dissipation cavity 5; an air filter is installed at the air inlet 3.

[0024] Working principle:

[0025] A ridge waveguide is installed inside the ridge waveguide mounting housing 1. When the ridge waveguide generates heat during operation, the heat is transferred to the ridge waveguide mounting housing 1 and then conducted to the base 2 through the housing. The cooling chip 6 starts working, with its low-temperature end absorbing heat from the heat dissipation cavity 5 and its high-temperature end transferring heat to the heat-conducting fins in contact with it. At the same time, the fan 7 starts, blowing air from top to bottom, expelling the hot air from the heat dissipation cavity 5 through the heat-conducting fins at the bottom. External cold air enters the heat dissipation cavity 5 through the air inlet 3, forming a continuous air circulation that constantly removes heat, thereby maintaining a constant temperature environment for the ridge waveguide.

[0026] The cooling element 6 is typically composed of N-type and P-type semiconductors; in the N-type semiconductor, electrons (negatively charged) are the majority carriers, and in the P-type semiconductor, holes (which can be considered positively charged) are the majority carriers; these semiconductor materials are arranged alternately and connected by a metal conductor to form electrical couples; in this design, multiple such electrical couples constitute the cooling element 6, which is installed around the heat dissipation cavity 5;

[0027] When direct current flows through the thermoelectric cooler 6, the current flows from the N-type semiconductor to the P-type semiconductor at the node, and the motion state of electrons and holes changes; specifically, during the process of current flowing from the N-type semiconductor to the P-type semiconductor:

[0028] Heat absorption process: At the low-temperature end of the cooling chip 6, electrons flow from the N-type semiconductor to the P-type semiconductor. Due to the high hole concentration in the P-type semiconductor, electrons recombine with holes after entering the P-type semiconductor. During this process, electrons need to absorb heat to overcome the energy difference, thereby reducing the temperature near the node and achieving the heat absorption and cooling effect. This part of the heat is absorbed from the inside of the heat dissipation cavity 5.

[0029] Heat release process: When the current continues to flow and reaches the high temperature end, electrons flow from the P-type semiconductor to the N-type semiconductor; at this time, the electrons break free from the P-type semiconductor and need to release energy. This energy is released in the form of heat, which causes the temperature near the node to rise. The absorbed heat is transferred to the high temperature end, that is, to the heat-conducting fins in contact with it. Then the airflow blown out by the fan carries away the heat.

[0030] By reasonably controlling the magnitude and direction of the current, the cooling or heating effect of the thermoelectric cooler 6 can be precisely adjusted. In this ridge waveguide constant temperature structure scheme, the cooling characteristics of the thermoelectric cooler 6 are used to effectively control the temperature of the heat dissipation cavity 5, thereby ensuring that the ridge waveguide works in a suitable temperature environment.

[0031] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. It is obvious to those skilled in the art that this utility model is not limited to the details of the exemplary embodiments described above, and that it can be implemented in other specific forms without departing from the spirit or basic characteristics of this utility model. Therefore, the embodiments should be considered exemplary and non-limiting in all respects. The scope of this utility model is defined by the appended claims rather than the foregoing description. Therefore, it is intended that all variations falling within the meaning and scope of equivalents of the claims be included within this utility model, and no reference numerals in the claims should be considered as limiting the scope of the claims.

[0032] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A ridge waveguide thermostatic structure, comprising a ridge waveguide mounting shell (1) and a base (2), characterized in that: The base (2) is installed at the bottom of the ridge waveguide mounting shell (1), and a heat dissipation cavity (5) is provided in the middle of the inner cavity of the base (2). The top and bottom of the heat dissipation cavity (5) are provided with hollow heat-conducting fins, and a fan (7) is provided inside the heat dissipation cavity (5). The fan (7) blows air from top to bottom. Several cooling plates (6) are arranged around the heat dissipation cavity (5) as the center.

2. The ridge waveguide isothermal structure according to claim 1, characterized in that: The cooling chip (6) is used as the inner wall of the heat dissipation cavity (5); the bottom of the cooling chip (6) is the high temperature end, the top of the cooling chip (6) is the low temperature end, and the high temperature end and the low temperature end respectively abut against two heat-conducting fins.

3. The isothermal structure of a ridge waveguide according to claim 1, characterized in that: The base (2) has an air inlet (3) on its front side, and the air inlet (3) is connected to the heat dissipation cavity (5).

4. The ridge waveguide isothermal structure according to claim 1, characterized in that: The heat-conducting fins are made of copper or aluminum alloys, which are metals with high thermal conductivity.

5. The ridge waveguide isothermal structure according to claim 3, characterized in that: An air filter is installed at the air inlet (3).

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