Light-emitting diode (LED) light source capable of reducing heat influence and high in luminous efficiency

Abstract

The utility model relates to the technical field of LED light sources, and discloses an LED light source capable of reducing heat influence and having high luminous efficiency, which comprises a substrate, the top of the substrate is provided with an annularly arranged white wall, the white wall is enclosed to form a luminous area, the top of the luminous area is provided with a top opening, and an LED chip is arranged in the luminous area; the top opening is covered with a fluorescent film layer made of fluorescent glue, and the fluorescent film layer abuts against the top of the white wall. According to the LED light source capable of reducing the heat influence and having the high luminous efficiency, the fluorescent film layer is covered on the top opening of the white wall in a sealing mode and is made of the fluorescent glue, so that the LED chips cannot be wrapped by the fluorescent glue, the LED chips are in an exposed state, in the light emitting process of the LED chips, the influence of heat of the LED chips on the fluorescent film layer is small, the heat influence of the LED light source is reduced, and the luminous efficiency of the LED light source is improved. And the fluorescent film layer does not have the phenomena of cracking, deformation and the like, so that the service life of the LED light source is greatly prolonged, and the lighting effect of the LED light source is improved.

Description

Technical Field

[0001] This utility model patent relates to the technical field of LED light sources, and more specifically, to LED light sources that reduce heat impact and have high luminous efficiency. Background Technology

[0002] LED light sources are widely used in daily life. They consist of a substrate on which LED chips are mounted. By covering the LED chips with a phosphor layer, the light emitted by the LED chips shines outward through the phosphor layer.

[0003] In existing technologies, the fluorescent adhesive layer directly covers the LED chip and wraps around its outer periphery. During the LED chip's emission, it emits heat outward, which can cause the fluorescent adhesive layer to crack and deform, greatly reducing the lifespan of the LED light source. LED light sources have a significant thermal impact. Utility Model Content

[0004] The purpose of this invention is to provide an LED light source with reduced heat impact and high luminous efficiency, aiming to solve the problem of significant heat impact in existing LED light sources.

[0005] This invention is achieved by providing a high-efficiency LED light source with reduced heat impact, comprising a substrate, a ring of white walls arranged on the top of the substrate, the white walls enclosing a light-emitting area, the top of the light-emitting area having a top opening, and an LED chip disposed in the light-emitting area; the top opening is covered with a fluorescent film layer made of fluorescent adhesive, the fluorescent film layer abutting against the top of the white walls.

[0006] Furthermore, the light-emitting area is arranged in a closed manner.

[0007] Furthermore, the top of the white wall has a top surface, and the outer periphery of the fluorescent film layer has an outer ring portion, which is attached to the top surface from top to bottom.

[0008] Furthermore, the bottom of the fluorescent film layer has a bottom side, and there is a light-transmitting gap between the bottom side and the LED chip.

[0009] Furthermore, a plurality of strip-shaped ribs are protruding on the bottom side of the membrane, and the ribs are arranged to protrude toward the light-emitting area.

[0010] Furthermore, the plurality of the aforementioned ribs are arranged in a crisscross pattern.

[0011] Furthermore, each end of the rib is formed as a fixed end, which is fixedly connected to the white wall.

[0012] Furthermore, the multiple ribs enclose multiple enclosing areas, and the bottom side of the membrane has an enclosing portion located in the enclosing area. The enclosing portion is concave and convex upward to form a convex surface.

[0013] Furthermore, the top of the fluorescent film layer has a top side surface, which is arranged in a flat plane.

[0014] Furthermore, the inner side of the white wall has an inward-facing side that faces the light-emitting area, and along the upward direction of the white wall, the inward-facing side is arranged at an angle away from the light-emitting area.

[0015] Compared with the prior art, the LED light source with reduced heat impact and high luminous efficiency provided by this utility model seals the top opening of the white wall with a fluorescent film layer made of fluorescent adhesive. In this way, the LED chip is not wrapped by the fluorescent adhesive and is in an exposed state. During the process of LED light emission, the heat of the LED chip has a smaller impact on the fluorescent film layer, reducing the heat impact of the LED light source. The fluorescent film layer will not crack or deform, greatly improving the service life of the LED light source.

[0016] In addition, the thickness of the fluorescent film layer varies little and can be regarded as a uniform thickness arrangement. In this way, the light emitted by the chip shines outward through the fluorescent film layer, resulting in a good light spot effect, reducing light loss, and improving the luminous efficiency of the LED light source. Attached Figure Description

[0017] Figure 1 This is a cross-sectional schematic diagram of the LED light source with reduced heat impact and high luminous efficiency provided by this utility model;

[0018] Figure 2 This is a cross-sectional schematic diagram of the fluorescent film layer provided by this utility model. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0020] The implementation of this utility model will be described in detail below with reference to specific embodiments.

[0021] In the accompanying drawings of this embodiment, the same or similar reference numerals correspond to the same or similar components. In the description of this utility model, it should be understood that if terms such as "upper," "lower," "left," and "right" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting this patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0022] Reference Figure 1-2 The image shown is a preferred embodiment of the present invention.

[0023] A high-efficiency LED light source with reduced heat impact includes a substrate 100. The top of the substrate 100 is provided with a ring-shaped white wall 300, which encloses and forms a light-emitting area 101. Of course, the white wall 300 can be integrally formed with the substrate 100, or it can be formed by subsequent dispensing.

[0024] The top of the light-emitting area 101 has a top opening, and an LED chip 200 is installed in the light-emitting area 101. The top opening is covered with a fluorescent film layer 400 made of fluorescent adhesive, and the fluorescent film layer 400 abuts against the top of the white wall 300. The light emitted by the LED chip 200 can pass through the fluorescent film layer 400 and shine outward to achieve the set illumination effect.

[0025] The aforementioned LED light source with reduced heat impact and high luminous efficiency achieves this by sealing a fluorescent film layer 400, made of fluorescent adhesive, through an opening at the top of the white wall 300. This prevents the LED chip 200 from being encased in the fluorescent adhesive, leaving it exposed. During the light-emitting process, the heat from the LED chip 200 has a smaller impact on the fluorescent film layer 400, thus reducing the heat impact of the LED light source. Furthermore, the fluorescent film layer 400 will not crack or deform, significantly improving the lifespan of the LED light source.

[0026] In addition, the thickness variation of the fluorescent film layer 400 is small, and it can be regarded as a uniform thickness arrangement. In this way, the light emitted by the LED chip 200 shines outward through the fluorescent film layer 400, resulting in a good light spot effect, reduced light loss, and improved luminous efficiency of the LED light source.

[0027] In this embodiment, the light-emitting area is arranged in a closed manner, so as to ensure that the light emitted by the LED chip 200 passes through the fluorescent film layer 400 before shining outward.

[0028] In this embodiment, the white wall 300 has a top surface, and the fluorescent film layer 400 has an outer peripheral ring 405 on its outer periphery, which is attached to the top surface from top to bottom.

[0029] In this embodiment, the bottom of the fluorescent film layer 400 has a bottom side 402, and there is a light-transmitting gap 102 between the bottom side 402 and the LED chip 200. This ensures that the bottom side 402 will not come into contact with the LED chip 200, further reducing the impact of the heat dissipated by the LED chip 200 on the fluorescent film layer 400.

[0030] In this embodiment, a plurality of strip-shaped ribs 403 are protruding from the bottom side 402 of the film, and the ribs 403 are arranged to protrude towards the light-emitting area. By arranging a plurality of ribs 403, the supporting strength of the fluorescent film layer 400 can be maintained, preventing it from collapsing towards the light-emitting area 101 when it is located at the top opening.

[0031] Multiple ribs 403 are arranged in a crisscross pattern, which further strengthens the support strength of the multiple ribs 403 for the fluorescent film layer 400 and facilitates the arrangement of the multiple ribs 403.

[0032] In this embodiment, the two ends of the rib 403 are respectively formed as fixed ends, which are fixedly connected to the white wall 300. In this way, by connecting the fixed ends of the rib 403 to the white wall 300, the stability of the fluorescent film layer 400 at the top opening can be enhanced, and the support strength of the fluorescent film layer 400 can be further strengthened.

[0033] In this embodiment, multiple ribs 403 enclose multiple enclosed areas, and the bottom side 402 of the film has an enclosing portion 404 located in the enclosed area. The enclosing portion 404 is concave and convex upward, forming a convex surface. In this way, when the light emitted by the LED chip 200 shines on the enclosing portion 404, it is focused by the enclosing portion 404 and then shines outward through the fluorescent film layer 400, which greatly improves the luminous efficacy of the LED light source.

[0034] In this embodiment, the top of the fluorescent film layer 400 has a top side surface 401, which is arranged in a flat plane. Of course, depending on actual needs, the top side surface 401 can also be set to a convex shape, etc.

[0035] In this embodiment, the inner side of the white wall 300 has an inner side 301 facing the light-emitting area 101. Along the upward direction of the white wall 300, the inner side 301 is inclined away from the light-emitting area 101. In this way, the light emitted by the LED chip 200 shines on the inner side 301 and is reflected upward to the fluorescent film layer 400, which greatly improves the luminous efficacy of the LED light source.

[0036] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An LED light source with reduced heat-affected zone and high luminous efficiency, characterized in that, The substrate includes a white wall arranged in a ring on the top of the substrate, which encloses a light-emitting area. The top of the light-emitting area has a top opening, and an LED chip is disposed in the light-emitting area. The top opening is covered with a fluorescent film layer made of fluorescent adhesive, which abuts against the top of the white wall.

2. The LED light source with reduced heat impact and high luminous efficiency as described in claim 1, characterized in that, The light-emitting area is arranged in a closed manner.

3. The LED light source with reduced heat impact and high luminous efficiency as described in claim 1, characterized in that, The white wall has a top surface, and the fluorescent film layer has an outer ring portion on its outer periphery, which is attached to the top surface from top to bottom.

4. The LED light source with reduced heat impact and high luminous efficiency as described in any one of claims 1 to 3, characterized in that, The bottom of the fluorescent film layer has a bottom side, and there is a light-transmitting gap between the bottom side and the LED chip.

5. The LED light source with reduced heat impact and high luminous efficiency as described in claim 4, characterized in that, The bottom side of the membrane is provided with a plurality of strip-shaped ribs protruding outwards towards the light-emitting area.

6. The LED light source with reduced heat impact and high luminous efficiency as described in claim 5, characterized in that, The multiple ribs are arranged in a crisscross pattern.

7. The LED light source with reduced heat impact and high luminous efficiency as described in claim 6, characterized in that, The two ends of the rib are respectively formed as fixed ends, which are fixedly connected to the white wall.

8. The LED light source with reduced heat impact and high luminous efficiency as described in claim 5, characterized in that, Multiple ribs enclose multiple enclosed areas, and the bottom side of the membrane has an enclosing portion located in the enclosed area. The enclosing portion is concave and convex upward to form a convex surface.

9. The LED light source with reduced heat impact and high luminous efficiency as described in any one of claims 1 to 3, characterized in that, The top of the fluorescent film layer has a top side surface, which is arranged in a flat plane.

10. The LED light source with reduced heat impact and high luminous efficiency as described in any one of claims 1 to 3, characterized in that, The white wall has an inner side facing the light-emitting area, and the inner side is arranged at an angle away from the light-emitting area along the white wall from bottom to top.

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