Semiconductor process equipment and cooling device thereof
By employing a cooling device with a housing and guide plate structure in semiconductor process equipment, the problems of space occupation and safety hazards of cooling pipes are solved, achieving more efficient cooling effect and safety performance.
Patent Information
- Application Number
- CN202520145015.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-01-21
- Publication Date
- 2026-02-10
- Estimated Expiration
- 2035-01-21
AI Technical Summary
Existing semiconductor process equipment has poor cooling performance, and cooling tubes occupy a large cavity space, resulting in low cooling efficiency and safety hazards.
The structure employs a shell and a guide plate to form a flow channel. The cooling medium flows within the flow channel and exchanges heat with the process liquid in the chamber to be cooled. This avoids the cooling pipes occupying space inside the chamber, increases the amount of process liquid that can be accommodated, and improves cooling efficiency and safety.
It improves cooling efficiency, increases the space utilization rate for containing process solutions, reduces the risk of mixing between cooling medium and process solutions, and enhances safety performance.
Smart Images
Figure CN223899628U_ABST
Abstract
Description
Technical Field
[0001] This application belongs to the field of semiconductor technology, specifically relating to a semiconductor process equipment and its cooling device. Background Technology
[0002] In the semiconductor industry, semiconductor process equipment needs to use process solutions to remove photoresist and silicon nitride mask layers from the wafer surface. After cleaning, the process solutions need to be cooled before they can be discharged into the plant system.
[0003] In related technologies, a cooling device is used to cool the cleaned process solution. The cooling device has a cavity with a cooling pipe inside for introducing coolant, and the process solution can flow into the cooling cavity. In this way, the process solution entering the cavity comes into direct contact with the cooling pipe, and heat exchange occurs between the coolant and the process solution, thereby cooling the process solution.
[0004] However, the cooling pipes are located inside the cavity, occupying space that would otherwise be used to hold the process chemicals. This results in a smaller volume of process chemicals that can be held in the cavity, leading to lower cooling efficiency and poorer cooling effect. Furthermore, the cooling pipes pose a risk of rupture, which could easily cause the coolant and process chemicals to mix, creating a significant safety hazard. Utility Model Content
[0005] The purpose of this application is to provide a semiconductor process equipment and its cooling device, which can solve the problem of poor cooling effect of the cooling device of semiconductor process equipment in related technologies.
[0006] In a first aspect, embodiments of this application provide a cooling device for semiconductor process equipment, including a housing for accommodating a chamber to be cooled. The housing is provided with a cooling inlet for introducing a cooling medium and a cooling outlet for allowing the cooling medium to flow out. A guide plate is provided on the inner side of the housing, forming a flow channel, which is connected to the cooling inlet and the cooling outlet respectively.
[0007] Secondly, embodiments of this application also provide a semiconductor process apparatus, including a chamber to be cooled and the aforementioned cooling device, wherein the chamber to be cooled is disposed within the housing.
[0008] In this embodiment, when the cooling device of the semiconductor process equipment accommodates the chamber to be cooled, a cooling cavity is formed between the housing and the chamber, and a flow channel is formed through a guide plate. The cooling medium can flow within the flow channel to exchange heat with the process liquid in the chamber, thereby cooling the process liquid. Thus, there is no need to install cooling pipes or other components inside the chamber to be cooled, and the cooling medium and cooling components do not occupy the internal space of the chamber, increasing the amount of process liquid that the chamber can hold and improving the space utilization of the chamber, which is beneficial for improving cooling efficiency and cooling effect. Furthermore, it avoids the risk of mixing of the cooling medium and process liquid due to cooling pipe rupture, which is beneficial for improving safety performance.
[0009] Furthermore, the embodiment of this application adds a guide plate to guide the cooling medium in the guide channel, which helps to extend the flow path of the cooling medium in the guide channel and extend the residence time of the cooling medium, thereby further improving the cooling effect. Attached Figure Description
[0010] Figure 1 This is a schematic diagram of the cooling device disclosed in the embodiments of this application;
[0011] Figure 2 This is a partial structural schematic diagram of the cooling device disclosed in the embodiments of this application (with part of the housing removed);
[0012] Figure 3 This is a second partial structural schematic diagram of the cooling device disclosed in the embodiments of this application (with the cover and part of the housing removed).
[0013] Figure 4 This is the third partial structural schematic diagram of the cooling device disclosed in the embodiments of this application (with the cover removed).
[0014] Figure 5 This is a schematic diagram showing the assembly of the guide plate, the chamber to be cooled, the first flange, and the drain pipe disclosed in the embodiments of this application;
[0015] Figure 6 This is the fourth partial structural schematic diagram of the cooling device disclosed in the embodiments of this application (with the cover and shell removed).
[0016] Figure 7 yes Figure 6 A schematic diagram of the structure shown from another perspective;
[0017] Figure 8 yes Figure 6 A bottom view of the structure shown;
[0018] Figure 9 yes Figure 6 The front view of the structure shown.
[0019] Explanation of reference numerals in the attached figures:
[0020] 100 - Cooling chamber, 100a - Cavity, 110 - Chamber body, 110a - First outer side wall, 110b - Second outer side wall, 111 - Drain port, 120 - Cover, 120a - Liquid inlet, 120b - Exhaust port, 121 - Connector
[0021] 200 - Casing, 210 - Cooling inlet, 220 - Cooling outlet
[0022] 200a-cooling chamber
[0023] 300-Blower Plate
[0024] 310-First guide vane, 310a-First guide channel, 311-Top guide vane,
[0025] 320 - Second guide plate, 320a - Second guide channel, 321 - First guide section, 321a - First gap, 322 - Second guide section, 322a - Second gap
[0026] A - First direction, B - Second direction
[0027] 400 - Drain pipe, 410 - T-connector
[0028] 510 - First temperature sensing element, 520 - Second temperature sensing element
[0029] 600-Liquid Level Detection Element
[0030] 700 - Liquid level observation line, 710 - Liquid level limiting element
[0031] 800-Seals
[0032] 910 - First flange, 920 - Second flange, 930 - Third flange, 940 - Fourth flange. Detailed Implementation
[0033] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.
[0034] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.
[0035] The semiconductor process equipment and cooling device provided in this application will be described in detail below with reference to the accompanying drawings, through specific embodiments and application scenarios.
[0036] Please refer to Figures 1-9 The cooling device disclosed in this application is applied to semiconductor process equipment, such as a tank cleaning machine, for performing cleaning or wet etching processes on wafers. The cooling device includes a housing 200 for accommodating a chamber 100 to be cooled, which is used to contain a process solution. The chamber 100 can be placed inside the housing 200. When the housing 200 accommodates the chamber 100, there is a gap between the outer wall surface of the chamber 100 and the inner wall surface of the housing 200. The housing 200 and the chamber 100 cooperate to form a cooling cavity 200a that contains the cooling medium. When the semiconductor process equipment is a tank cleaning machine, the process solution is the cleaning solution. The cleaning solution can be, for example, SC1 (Standard Clean 1), SC2 (Standard Clean 2), BOE (Buffered Oxide Etch), SPM (Sulfuric Acid / Hydrogen Peroxide Mixture), PRM (Phosphoric Acid and Hydrogen Peroxide Mixture), etc. The high-temperature concentrated sulfuric acid waste liquid and high-temperature concentrated phosphoric acid waste liquid generated by these solutions, especially SPM and PRM solutions, need to be cooled before they can be discharged into the plant system.
[0037] The cooling chamber 100 is provided with a cavity 100a for introducing the process liquid. The cooling chamber 100 can be a square structure, a cylindrical structure, etc., and the structure and shape of the cooling chamber 100 are not limited in this embodiment. The cooling chamber 100 is a heat-conducting structure so that the cooling medium in the cooling chamber 200a exchanges heat with the process liquid in the cavity 100a. Optionally, the cooling chamber 100 can be made of metal, and more preferably, the material of the cooling chamber 100 is stainless steel, so that the cooling medium in the cooling chamber 200a exchanges heat with the process liquid through the cooling chamber 100 to achieve cooling of the process liquid. Of course, the cooling chamber 100 can also be made of other materials, as long as they can achieve the effect of heat conduction.
[0038] The housing 200 can be a heat-insulating structure to prevent the loss of cooling medium in the cooling chamber 200a. Of course, the housing 200 can also be made of metal. This application embodiment does not limit the material of the housing 200.
[0039] In this embodiment, the housing 200 of the cooling device can accommodate the chamber 100 to be cooled. When the housing 200 accommodates the chamber 100, a cooling chamber 200a is formed between the chamber 100 and the housing 200. The cooling medium can flow within the cooling chamber 200a to exchange heat with the process liquid within the chamber 100a, thereby cooling the process liquid. Thus, there is no need to install cooling pipes or other components inside the chamber 100 to be cooled. The cooling medium and cooling components do not occupy the internal space of the chamber 100, increasing the amount of process liquid that the chamber 100 can hold and improving the space utilization rate of the chamber 100, which is beneficial for improving cooling efficiency and cooling effect. Furthermore, it avoids the risk of mixing of the cooling medium and process liquid due to cooling pipe rupture, which is beneficial for improving safety performance.
[0040] Optionally, the process solution can be concentrated acid such as concentrated phosphoric acid or concentrated sulfuric acid, or other types of solutions. The embodiments of this application do not limit the type of process solution.
[0041] In an optional embodiment, the housing 200 is provided with a cooling inlet 210 for introducing cooling medium and a cooling outlet 220 for allowing cooling medium to flow out. A guide plate 300 is provided on the inner side of the housing 200, meaning the guide plate 300 is located inside the cooling chamber 200a and is connected to the inner wall of the housing 200. Optionally, the guide plate 300 is connected to the inner wall of the housing 200 by welding or other means. When the chamber 100 to be cooled is located inside the housing 200, the guide plate 300 can be connected to the outer wall of the chamber 100 to be cooled by welding or other means. The guide plate 300 can be a metal structure; optionally, it can be made of stainless steel, but it can also be a non-metallic structure.
[0042] The guide plate 300 forms a flow channel, which is connected to the cooling inlet 210 and the cooling outlet 220 respectively. In this way, the cooling medium entering through the cooling inlet 210 flows through the flow channel and finally flows out through the cooling outlet 220.
[0043] In this embodiment, a guide plate 300 is added to the cooling device. The guide plate 300 guides the cooling medium in the cooling chamber 200a, which helps to extend the flow path of the cooling medium in the cooling chamber 200a and extend the residence time of the cooling medium, thereby improving the cooling effect.
[0044] Optionally, refer to Figure 4 As shown, a second flange 920 is provided at the cooling inlet 210, and the liquid inlet pipe (not shown in the figure) is connected to the second flange 920 so that the liquid inlet pipe is connected to the cooling inlet 210; similarly, a third flange 930 is provided at the cooling outlet 220, and the liquid outlet pipe (not shown in the figure) is connected to the third flange 930 so that the liquid outlet pipe is connected to the cooling outlet 220.
[0045] In the solution of this application, the cooling cavity 200a includes a first cooling cavity and a second cooling cavity. The first cooling cavity is connected to the second cooling cavity. The first cooling cavity is formed between the inner sidewall of the housing 200 and the outer sidewall of the chamber to be cooled 100. The second cooling cavity is formed between the inner bottom wall of the housing 200 and the outer bottom wall of the chamber to be cooled 100.
[0046] In this embodiment, not only is a cooling cavity 200a formed between the inner wall of the shell 200 and the outer wall of the chamber to be cooled 100, but a cooling cavity 200a is also formed between the inner bottom wall of the shell 200 and the outer bottom wall of the chamber to be cooled 100. The volume of the cooling cavity 200a is increased, and the heat exchange area between the cooling medium and the process liquid in the cooling cavity 200a is increased, which is beneficial to improving the heat exchange efficiency and cooling efficiency, and thus improving the cooling effect.
[0047] In an optional embodiment, refer to Figure 2 and Figure 3 As shown, the guide plate 300 includes a first guide plate 310, which faces the inner wall of the housing 200 and is located within the first cooling chamber. The guide channel includes a first guide channel 310a, which is formed by the first guide plate 310, the inner wall of the housing 200, and the outer wall of the chamber 100 to be cooled. Optionally, the first guide plate 310 and the inner wall of the housing 200 can be fixedly connected by welding or other means, and the cooling inlet 210 is connected to the cooling outlet 220 through the first guide channel 310a. Thus, the cooling medium entering the first cooling chamber from the cooling inlet 210 flows along the first guide channel 310a and exits through the cooling outlet 220.
[0048] Optionally, the first flow channel 310a may be formed by the first guide plate 310, a part of the inner wall of the housing 200 and the outer wall of the chamber to be cooled 100, or the first flow channel 310a may be formed by the first guide plate 310, the entire inner wall of the housing 200 and the outer wall of the chamber to be cooled 100.
[0049] In this embodiment, the first guide plate 310 forms a first guide channel 310a to guide the cooling medium in the first cooling chamber, which helps to extend the flow path of the cooling medium in the first cooling chamber, extend the residence time of the cooling medium, and improve the cooling effect.
[0050] In a further embodiment, reference is made to... Figure 1 and Figure 4 As shown, the bottom of the housing 200 is provided with a cooling inlet 210, and the top of the housing 200 is provided with a cooling outlet 220. That is to say, the height of the cooling outlet 220 is greater than the height of the cooling inlet 210, and the cooling medium flows upward in the cooling chamber 200a. Thus, the cooling medium flows relatively slowly in the cooling chamber 200a, and the residence time of the cooling medium is longer, which is more conducive to the cooling medium fully cooling the process liquid and further improving the cooling effect.
[0051] refer to Figures 5-7 as well as Figure 9 As shown, the first guide plate 310 has a spiral structure and is arranged around the chamber 100 to be cooled, and the first guide channel 310a is a spiral channel. Optionally, the inner sidewall of the shell 200 includes multiple sidewall surfaces, and the first guide plate 310 includes multiple guide parts connected end to end. The guide parts can be metal sheets, and each sidewall surface is connected to at least one guide part by welding or other means. Moreover, the angle between each guide part and the horizontal direction can be 2°-3°, or other angles. Further optionally, each sidewall surface is connected to multiple guide parts by welding or other means, and the multiple guide parts connected to each sidewall surface are spaced apart in the height direction of the shell 200, and two adjacent guide parts are parallel. In this embodiment, both the chamber 100 to be cooled and the shell 200 are cubic structures, and the outer sidewall of the chamber 100 to be cooled includes four sidewall surfaces, which are connected to multiple guide parts respectively.
[0052] In this embodiment, the first guide plate 310 is configured as a spiral structure, making the first guide channel 310a a spiral channel. After the cooling medium enters the cooling chamber 200a, the cooling medium can spiral upward along the spiral direction of the first guide channel 310a, avoiding dead angles in flow, effectively extending the flow path of the cooling medium in the first cooling chamber, extending the residence time of the cooling medium, and further improving cooling efficiency.
[0053] Optionally, refer to Figure 6As shown, the first guide plate 310 extends in a spiral direction, and the top of the first guide plate 310 is the top guide plate 311. The top guide plate 311 is connected to the top of the housing 200 by welding, bonding or other means.
[0054] Of course, in other embodiments, the first guide plate 310 may also adopt other shapes besides a spiral structure. Optionally, the first guide plate 310 may be a bent structure and the first guide channel 310a may be a bent channel.
[0055] In an optional embodiment, refer to Figure 2 and Figure 3 As shown, the guide plate 300 includes a second guide plate 320, which is opposite to the inner bottom wall of the housing 200. The second guide plate 320 is located inside the second cooling chamber. The guide channel includes a second guide channel 320a, which is formed by the second guide plate 320, the inner bottom wall of the housing, and the outer bottom wall of the chamber to be cooled 100. Optionally, the second guide plate 320 and the inner bottom wall of the housing 200 can be fixedly connected by welding or other means. The cooling inlet 210 is connected to the cooling outlet 220 through the second guide channel 320a. In this way, the cooling medium entering the second cooling chamber from the cooling inlet 210 flows along the second guide channel 320a and can flow out from the cooling outlet 220.
[0056] Optionally, the second guide plate 320, a part of the inner bottom wall of the shell, and the outer bottom wall of the chamber to be cooled 100 may form the second guide channel 320a, or the second guide plate 320, the entire inner bottom wall of the shell, and the outer bottom wall of the chamber to be cooled 100 may form the second guide channel 320a.
[0057] In this embodiment, the second guide plate 320 forms a second guide channel 320a to guide the cooling medium in the second cooling chamber, which helps to extend the flow path of the cooling medium in the second cooling chamber, extend the residence time of the cooling medium, and improve the cooling effect.
[0058] In a further embodiment, reference is made to... Figure 8 and Figure 9 As shown, the second guide plate 320 includes a first guide portion 321 and a second guide portion 322. Both the first guide portion 321 and the second guide portion 322 extend along a first direction A, and are alternately distributed along a second direction B. The first direction A and the second direction B intersect. Optionally, the first direction A and the second direction B can be perpendicular. Further, the shell 200 has a cubic structure, where the first direction A can be the width direction of the shell 200, and the second direction B can be the length direction of the shell 200; or, the first direction A can be the length direction of the shell 200, and the second direction B can be the width direction of the shell 200. Of course, the first direction A and the second direction B can also intersect but not be perpendicular.
[0059] For details, please refer to the following: Figure 8 A second flow channel 320a is formed between adjacent first flow guide portions 321 and second flow guide portions 322. In the first direction A, the first end of the first flow guide portion 321 protrudes relative to the first end of the second flow guide portion 322, and the second end of the second flow guide portion 322 protrudes relative to the second end of the first flow guide portion 321, so that the first flow guide portion 321 and the second flow guide portion 322 are staggered. Moreover, a first gap 321a is provided between the second end of the first flow guide portion 321 and the housing 200, and a second gap 322a is provided between the first end of the second flow guide portion 322 and the housing 200. The first gap 321a communicates with the second gap 322a through the second flow channel 320a.
[0060] Specifically, the cooling chamber 100 has a first outer side wall 110a and a second outer side wall 110b facing away from each other along the first direction A. When the cooling chamber 100 is located inside the housing 200, the first end of the first flow guide 321 extends to the first outer side wall 110a, and the first gap 321a is located between the second end of the first flow guide 321 and the second outer side wall 110b. That is, the length of the first flow guide 321 is less than the distance between the first outer side wall 110a and the second outer side wall 110b. The first end of the second flow guide 322 extends to the second outer side wall 110b, and the second gap 322a is located between the second end of the second flow guide 322 and the first outer side wall 110a. That is, the length of the second flow guide 322 is less than the distance between the first outer side wall 110a and the second outer side wall 110b.
[0061] Thus, the cooling medium enters the second guide channel 320a through the first gap 321a, and further enters the next second guide channel 320a through the second gap 322a, causing the cooling medium to flow back and forth along the first direction A until it fills the entire second cooling chamber, after which the cooling medium flows further upward into the first cooling chamber.
[0062] In this embodiment, the second guide plate 320 is divided into two parts: a first guide section 321 and a second guide section 322. The first guide section 321 and the second guide section 322 form a second guide channel 320a to guide the cooling medium, so that the cooling medium flows back and forth along the first direction A, effectively extending the flow path of the cooling medium in the second cooling chamber and extending the residence time of the cooling medium, which is more conducive to improving the cooling efficiency.
[0063] Of course, in other embodiments, the second guide plate 320 may also be other structures capable of guiding flow.
[0064] Optionally, the deflector 300 may include only the first deflector 310 or only the second deflector 320. In an embodiment, the deflector 300 includes both the first deflector 310 and the second deflector 320. The bottom of the first deflector 310 is connected to the second deflector 320. Optionally, the bottom of the first deflector 310 and the second deflector 320 can be connected by welding, bonding, or other methods. Of course, the first deflector 310 and the second deflector 320 can also be an integral structure.
[0065] With this configuration, including the first guide plate 310 and the second guide plate 320, the cooling medium at various locations within the cooling chamber 200a can be guided, thus significantly extending the flow path of the cooling medium and further increasing its residence time, which is beneficial for improving cooling efficiency.
[0066] Based on the cooling device disclosed in this application, this application also discloses a semiconductor process apparatus, which includes a cooling chamber 100 and the cooling device in the above embodiments, wherein the cooling chamber 100 is disposed within the housing 200.
[0067] The housing 200 is located outside the cooling chamber 100. The guide plates 300 are connected to the inner wall of the housing 200 and the outer wall of the cooling chamber 100 respectively. Optionally, the cooling chamber 100 can be directly placed inside the housing 200. The first guide plate 310 contacts the outer wall of the cooling chamber 100, and a first cooling chamber is formed between the inner wall of the housing 200 and the outer wall of the cooling chamber 100. The first guide plate 310, the inner wall of the housing 200, and the outer wall of the cooling chamber 100 form a first flow channel 310a. The second guide plate 320 contacts the outer bottom wall of the cooling chamber 100, and a second cooling chamber is formed between the inner bottom wall of the housing 200 and the outer bottom wall of the cooling chamber 100. The second guide plate 320, the inner bottom wall of the housing 200, and the outer bottom wall of the cooling chamber 100 form a second flow channel 320a.
[0068] In this embodiment, when the cooling device of the semiconductor process equipment accommodates the chamber to be cooled 100, a cooling chamber 200a for the flow of cooling medium is formed between the chamber to be cooled 100 and the housing 200. There is no need to install cooling pipes or other components inside the chamber to be cooled 100. The cooling medium and cooling components do not occupy the internal space of the chamber to be cooled 100, which increases the amount of process liquid that the chamber to be cooled 100 can hold, which is beneficial to improving cooling efficiency, improving cooling effect, and thus improving process effect.
[0069] In an optional embodiment, the cooling chamber 100 is used to contain the process reagent solution, see reference. Figure 4As shown, the bottom of the cooling chamber 100 is provided with a drain port 111 for discharging the process liquid. Optionally, after the process liquid has cooled, the process liquid in the cooling chamber 100 can be directly discharged from the drain port 111; or, the drain port 111 can be connected to a pipeline outside the cooling device, and the process liquid in the cooling chamber 100 can be discharged through the pipeline.
[0070] In this embodiment, the bottom of the cooling chamber 100 is provided with a drain port 111. The process liquid in the cooling chamber 100 is directly discharged from the drain port 111 under its own gravity, without the need for other extra drainage operations or auxiliary drainage components such as pumps, making the drainage process simpler and easier to implement.
[0071] Of course, in other embodiments, a drain port 111 may be provided at the top or middle position of the cooling chamber 100, and a pump body or other auxiliary process liquid discharge component is provided in the cooling chamber 100, with the outlet end of the pump body connected to the drain port 111.
[0072] In an optional embodiment, refer to Figure 1 and Figure 2 As shown, the cooling device also includes a first temperature sensing element 510. The first temperature sensing element 510 can be, but is not limited to, a temperature sensor. The temperature sensing end of the first temperature sensing element 510 extends into the interior of the chamber 100 to be cooled to detect the temperature of the process liquid. Optionally, the first temperature sensing element 510 is disposed at the top of the chamber 100 to be cooled. Of course, the first temperature sensing element 510 can also be disposed at other locations in the chamber 100 to be cooled.
[0073] With this configuration, the temperature of the process liquid in the cooling chamber 100 can be accurately detected by the first temperature detection element 510, avoiding the discharge of the process liquid when the temperature is too high and ensuring that the temperature of the process liquid is within a suitable range when it is discharged.
[0074] In an optional embodiment, refer to Figure 5 and Figure 6 As shown, the cooling device also includes a drain pipe 400, one end of which penetrates the housing 200 and communicates with the drain port 111; that is, one end of the drain pipe 400 is connected to the drain port 111, and the other end of the drain pipe 400 extends outside the housing 200; Reference Figure 1 and Figure 2 As shown, the cooling device also includes a second temperature detection element 520, which may be, but is not limited to, a temperature sensor, and is disposed in the drain pipe 400.
[0075] Optionally, refer to Figure 1 and Figure 4As shown, the end of the drain pipe 400 is provided with a fourth flange 940. The cooling device also includes a tee connector 410. One of the joints of the tee connector 410 is connected to the housing 200 through the fourth flange 940, and this joint is connected to the drain pipe 400. The second temperature sensing element 520 can be connected to the tee connector 410, and the temperature sensing end of the second temperature sensing element 520 extends into the tee connector 410. With this configuration, when the drain pipe 400 discharges the process liquid, the process liquid flows within the tee connector 410, and the second temperature sensing element 520 can accurately detect the temperature of the process liquid flowing within the tee connector 410.
[0076] In this embodiment, the temperature of the process solution discharged from the drain port 111 can be accurately detected by the second temperature detection element 520.
[0077] In this embodiment, the cooling device is equipped with both a first temperature detection element 510 and a second temperature detection element 520. This arrangement combines the first and second temperature detection elements 510 and 520, allowing them to detect the temperature of the process liquid at different locations. This ensures that the temperature of the process liquid discharged from the drain port 111 is within a suitable range, avoiding the situation where only the first temperature detection element 510 is used, which could fail to detect the temperature of the process liquid at the bottom of the cooling chamber 100, leading to inaccurate detection and abnormal discharge of the process liquid.
[0078] In one alternative embodiment, reference is made to... Figure 1 and Figure 2 As shown, the cooling device also includes a liquid level detection element 600, which is disposed in the chamber 100 to be cooled. The liquid level detection element 600 is provided with a liquid level detection end, which detects the liquid level of the process liquid.
[0079] In another embodiment, the liquid level detection element 600 is provided with a plurality of liquid level detection ends, each of which extends into the cavity 100a and is spaced apart, so as to detect the liquid level of the process liquid through each liquid level detection end.
[0080] Optionally, the liquid level detection element 600 can be, but is not limited to, a liquid level sensor. The liquid level sensor can use nitrogen to detect the liquid level, that is, nitrogen is introduced into the chamber 100 to be cooled, and the nitrogen increases the pressure of the chamber 100 to be cooled. The liquid level detection end is a detection tube. Under different pressure conditions, the amount of process liquid entering the detection tube is different. Therefore, the liquid level of the process liquid in the chamber 100 to be cooled is fed back based on the amount of process liquid entering the detection tube.
[0081] In this embodiment, the liquid level detection element 600 is changed from single-point detection to multi-point detection. Each liquid level detection end can detect the liquid level at different positions of the process liquid, which helps to improve the detection accuracy and avoid the inaccuracy caused by the floating of the liquid surface in single-point detection.
[0082] In the scheme of this application, reference is made to Figure 1 and Figure 2 As shown, the cooling device also includes a liquid level observation pipe 700, which is located outside the housing 200. The first end of the liquid level observation pipe 700 is connected to the top of the chamber 100 to be cooled, and the bottom of the chamber 100 to be cooled is provided with a drain port 111 for discharging the process liquid. The second end of the liquid level observation pipe 700 is connected to the drain port 111.
[0083] Optionally, the liquid level observation pipe 700 is transparent to facilitate observation of the liquid level inside. The first end of the liquid level observation pipe 700 can be connected to the top of the chamber to be cooled 100 by welding, bonding, or other methods. A tee connector 410 is provided at the drain port 111. The second end of the liquid level observation pipe 700 and the other end of the tee connector 410 can be connected by welding, bonding, or other methods. The tee connector 410 is connected to the liquid level observation pipe 700, thus connecting the drain port 111 to the liquid level observation pipe 700. Therefore, the liquid level of the process liquid inside the chamber to be cooled 100 is equal to the liquid level of the process liquid in the liquid level observation pipe 700.
[0084] In this embodiment, the cooling device is equipped with a liquid level observation pipe 700, which facilitates the observation of the liquid level of the process liquid in the cooling chamber 100 from the outside of the shell 200, and allows for timely awareness of changes in the liquid level of the process liquid.
[0085] In one optional embodiment, the cooling device further includes a liquid level limiting element 710, which is disposed within the cooling chamber 100. This configuration allows the liquid level limiting element 710 to trigger an alarm when the liquid level of the process liquid is too high, preventing the liquid level from becoming excessively high and ensuring that the liquid level of the process liquid within the cooling chamber 100 remains within a suitable range.
[0086] In another embodiment, the liquid level limiting element 710 is located outside the housing 200 and is disposed in the liquid level observation pipe 700. Optionally, the liquid level limiting element 710 can be a capacitive sensor; of course, the liquid level limiting element 710 can also be other limiting elements that prevent the liquid level from being too high.
[0087] In this embodiment, the liquid level limiting element 710 is located outside the cooling chamber 100, avoiding direct contact with the process liquid inside the cooling chamber 100. The liquid level limiting element 710 is not affected by changes in the liquid level of the process liquid inside the cooling chamber 100, thus avoiding pressure fluctuations caused by rapid changes in the liquid level of the process liquid inside the cooling chamber 100, which could lead to false alarms of the liquid level limiting element 710 and improve stability.
[0088] Optionally, the cooling device is typically connected to the machine tool of the semiconductor process equipment. The machine tool is equipped with an alarm device, and the liquid level limiting element 710 is communicatively connected to the alarm device. When the liquid level limiting element 710 detects that the liquid level of the process solution is too high, the alarm device will sound an alarm.
[0089] In an optional embodiment, both the inner wall of the cooling chamber 100 and the outer wall of the shell 200 are provided with an anti-corrosion coating. Optionally, the anti-corrosion coating can be made of soluble polytetrafluoroethylene, or other materials that can provide anti-corrosion effects; the thickness of the anti-corrosion coating is 300um-500um, or other thicknesses are also possible.
[0090] By using this embodiment, the anti-corrosion coating is provided to prevent the cooling chamber 100 and the shell 200 from being corroded by direct contact with the process liquid, which helps to extend the service life of the cooling chamber 100 and the shell 200.
[0091] Of course, in other embodiments, the cooling chamber 100 and the shell 200 can be directly corrosion-resistant structures, and the inner wall of the cooling chamber 100 and the outer wall of the shell 200 can be without anti-corrosion coating, and the inner wall of the cooling chamber 100 and the outer wall of the shell 200 can be in direct contact with the process liquid.
[0092] In the scheme of this application, reference is made to Figure 1 and Figure 2 As shown, the cooling chamber 100 includes a chamber body 110 and a cover 120. The top of the chamber body 110 has an opening, and the cover 120 covers the opening. The chamber body 110 and the cover 120 together form a cavity 100a. The cover 120 and the chamber body 110 can be fixedly connected by welding, bonding, or other methods. Optionally, the first temperature detection element 510 and the liquid level detection element 600 are both disposed on the cover 120. The first end of the liquid level observation pipe 700 is connected to the cover 120. The cover 120 also has an inlet 120a for introducing process liquid.
[0093] A sealing element 800 is provided between the chamber body 110 and the cover 120 to seal the gap between the chamber body 110 and the cover 120. The sealing element 800 can be a sealing gasket, and the material of the sealing gasket can be polytetrafluoroethylene. Of course, other materials that can achieve a sealing effect can also be used. The sealing element 800 can also be a sealing strip or a sealing ring. The specific structure of the sealing element 800 is not limited in the embodiments of this application.
[0094] Optionally, refer to Figure 3 and Figure 4 As shown, a first flange 910 is provided at the opening of the chamber body 110. The first flange 910 can be fixedly connected to the chamber body 110 by welding, bonding or other means. The sealing element 800 is located between the first flange 910 and the cover 120, and the first flange 910 and the cover 120 are connected by multiple connecting parts 121 (such as bolts, screws and other fasteners), so as to achieve relative fixation of the chamber body 110, the first flange 910, the sealing element 800 and the cover 120.
[0095] In this embodiment, a sealing element 800 is added between the chamber body 110 and the cover 120. The sealing element 800 seals the gap between the chamber body 110 and the cover 120, which helps to improve the sealing performance of the chamber 100 to be cooled.
[0096] Optionally, refer to Figure 1 and Figure 2 As shown, the cooling chamber 100 is also provided with an exhaust port 120b, which is used to connect to the plant system to discharge the gas in the cooling chamber 100 and to balance the pressure generated by the process liquid during the inlet and outlet processes. Optionally, the exhaust port 120b is located on the cover 120.
[0097] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.
Claims
1. A cooling device for semiconductor process equipment, characterized in that, The device includes a housing (200) for accommodating a chamber (100) to be cooled. The housing (200) is provided with a cooling inlet (210) for introducing a cooling medium and a cooling outlet (220) for allowing the cooling medium to flow out. A guide plate (300) is provided on the inner side of the housing (200), forming a flow channel. The flow channel is connected to the cooling inlet (210) and the cooling outlet (220) respectively.
2. The cooling device according to claim 1, characterized in that, The deflector (300) includes: A first guide plate (310) is opposite to the inner wall of the housing (200). The guide channel includes a first guide channel (310a), which is formed by the first guide plate (310), the inner wall of the housing (200), and the outer wall of the chamber to be cooled (100); and / or, The second guide plate (320) is opposite to the inner bottom wall of the housing (200). The guide channel includes a second guide channel (320a). The second guide plate (320), the inner bottom wall of the housing (200) and the outer bottom wall of the chamber to be cooled (100) form the second guide channel (320a).
3. The cooling device according to claim 2, characterized in that, The cooling inlet (210) is located at the bottom of the housing (200), and the cooling outlet (220) is located at the top of the housing (200). The first guide plate (310) has a spiral structure and is arranged around the chamber to be cooled (100), and the first guide channel (310a) is a spiral channel.
4. The cooling device according to claim 2, characterized in that, The second guide plate (320) includes a first guide portion (321) and a second guide portion (322). The first guide portion (321) and the second guide portion (322) both extend along a first direction (A) and are alternately distributed in a second direction (B). The first direction (A) intersects with the second direction (B), and a second guide channel (320a) is formed between adjacent first guide portions (321) and second guide portions (322). The first end of the first flow guide (321) protrudes from the first end of the second flow guide (322), and the second end of the second flow guide (322) protrudes from the second end of the first flow guide (321). A first gap (321a) is provided between the second end of the first flow guide (321) and the housing (200), and a second gap (322a) is provided between the first end of the second flow guide (322) and the housing (200). The first gap (321a) is connected to the second gap (322a) through the second flow guide channel (320a).
5. A semiconductor process apparatus, characterized in that, It includes a cooling chamber (100) and a cooling device according to any one of claims 1-4, wherein the cooling chamber (100) is disposed within the housing (200).
6. The semiconductor process equipment according to claim 5, characterized in that, The cooling chamber (100) is used to contain the process liquid, and the bottom of the cooling chamber (100) is provided with a drain port (111) for the process liquid to be discharged.
7. The semiconductor process equipment according to claim 6, characterized in that, The semiconductor process equipment also includes a first temperature detection element (510), the temperature detection end of which extends into the interior of the chamber to be cooled (100) to detect the temperature of the process solution; The semiconductor process equipment also includes a drain pipe (400) and a second temperature sensing element (520). One end of the drain pipe (400) passes through the housing (200) and is connected to the drain port (111). The second temperature sensing element (520) is disposed on the drain pipe (400).
8. The semiconductor process equipment according to claim 6, characterized in that, The semiconductor process equipment also includes a liquid level detection element (600), which is disposed in the cooling chamber (100). The liquid level detection element (600) is provided with a plurality of liquid level detection ends, each of which extends into the cooling chamber (100) and is spaced apart, so as to detect the liquid level of the process solution through each of the liquid level detection ends.
9. The semiconductor process equipment according to claim 6, characterized in that, The semiconductor process equipment also includes a liquid level observation pipe (700) and a liquid level limiting element (710). The liquid level observation pipe (700) is located outside the housing (200). The first end of the liquid level observation pipe (700) is connected to the top of the chamber to be cooled (100), and the second end of the liquid level observation pipe (700) is connected to the drain port (111). The liquid level limiting element (710) is disposed on the liquid level observation pipe (700).
10. The semiconductor process equipment according to claim 5, characterized in that, The cooling chamber (100) includes a chamber body (110) and a cover (120). The top of the chamber body (110) has an opening, and the cover (120) covers the opening. A sealing element (800) is provided between the chamber body (110) and the cover (120) to seal the gap between them; or, The inner wall of the cooling chamber (100) and the outer wall of the shell (200) are both provided with anti-corrosion coatings.