Tail gas cyclone hybrid spraying treatment equipment for semiconductor chip welding

Abstract

The utility model discloses tail gas cyclone hybrid spraying treatment equipment for semiconductor chip welding, which is characterized by comprising a rack, a front filter vat and a rear filter vat are respectively arranged on two sides of the rack, an air inlet is arranged on the left side of the front filter vat, an air outlet is arranged on the top of the rear filter vat, and a gas outlet is arranged on the right side of the rear filter vat. Rotational flow plates are arranged in the front filtering barrel and the rear filtering barrel; comprising a cleaning water pipe, and the two sides of the cleaning water pipe are provided with a first-stage water distribution pipe corresponding to the front filtering barrel and a second-stage water distribution pipe corresponding to the rear filtering barrel respectively. The cleaning device is simple in structure, multiple cleaning areas are arranged, gas makes contact with water twice from bottom to top, multiple spraying cleaning operation is achieved, and the cleaning effect is good.

Description

TECHNICAL FIELD

[0001] The utility model relates to the field of semiconductor processing tail gas treatment, concretely relates to a tail gas cyclone mixed motion spraying treatment equipment for semiconductor chip welding. BACKGROUND

[0002] Semiconductor refers to the material that the conductivity performance is between conductor and insulator at room temperature, and common semiconductor materials are silicon, germanium, gallium arsenide etc. Semiconductors can be divided into two categories of element semiconductors and compound semiconductors according to chemical composition. According to the impurity, it can be divided into N-type semiconductor and P-type semiconductor. The properties of semiconductor include optical properties and transport properties. Semiconductors are applied in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, illumination, high-power power conversion and other fields, and diodes are made of semiconductor devices.

[0003] The semiconductor needs to pass multiple welding operations in the processing process, and waste gas is generated in the welding operation process. Therefore, the waste gas cannot be directly discharged, and thus an equipment is needed to process. At present, the process pipeline of the waste gas processing equipment is relatively complex, and the operation difficulty is great, which is not conducive to use. UTILITY MODEL CONTENT

[0004] The utility model solves the technical problem to provide a tail gas cyclone mixed motion spraying treatment equipment for semiconductor chip welding, simple structure, multiple cleaning area setting, gas contacts water from bottom to top twice to realize multiple spraying cleaning operation, and the cleaning effect is good.

[0005] In order to solve the above technical problem, the utility model provides a tail gas cyclone mixed motion spraying treatment equipment for semiconductor chip welding, including the frame, the frame both sides are provided with front filter bucket and rear filter bucket, the front filter bucket left side is provided with air inlet, the rear filter bucket top is provided with air outlet, the front filter bucket and rear filter bucket inside all are provided with cyclone plate, including cleaning water pipe, the cleaning water pipe both sides are provided with corresponding the first stage water pipe of front filter bucket, corresponding the second stage water pipe of rear filter bucket.

[0006] Further, the first stage water pipe and second stage water pipe bottom are provided with the spray head that evenly interval.

[0007] Further, including mounting seat, the mounting seat is provided with the water pump of control cleaning water pipe.

[0008] Further, the rear filter bucket inside is provided with two layers of water removal curtain near the air outlet position.

[0009] Further, the front filter bucket and rear filter bucket bottom all are provided with water tank bottom plate, the water tank bottom plate bottom is provided with water tank, the water tank is provided with filter screen in.

[0010] Further, the water tank side is provided with an overflow pipe and a drain pipe.

[0011] Further, the rack is provided with an access door plate at a top position close to the front filter barrel.

[0012] The device has the advantages that: when the device is used, the tail gas generated by chip welding is introduced into the air inlet on the left side of the front filter barrel, at this time, external clean water is introduced through the cleaning water pipe, and the front filter barrel and the rear filter barrel are respectively subjected to spray treatment through the first water distribution pipe and the second water distribution pipe on the two sides, the tail gas is sequentially discharged through the air inlet, the front filter barrel, the rear filter barrel and the air outlet, at this time, the tail gas is subjected to twice from bottom to top route and spray operation, water washing and purification are realized, the cyclone plate in the front filter barrel and the rear filter barrel is used for guiding the flow direction of the gas, the structure is simple, the multiple cleaning zones are arranged, the gas is contacted with water twice from bottom to top to realize multiple spray cleaning operation, and the cleaning effect is good. BRIEF DESCRIPTION OF DRAWINGS

[0013] Fig. 1 is the overall structure schematic diagram of the utility model.

[0014] Fig. 2 is the partial structure schematic diagram of the utility model.

[0015] The figure label explanation: 1, rack; 2, front filter barrel; 3, rear filter barrel; 4, air inlet; 5, air outlet; 6, cyclone plate; 7, cleaning water pipe; 8, first water distribution pipe; 9, second water distribution pipe; 10, spray head; 11, mounting seat; 12, water pump; 13, water removal curtain; 14, water tank bottom plate; 15, water tank; 16, filter screen; 17, overflow pipe; 18, drain pipe; 19, access door plate. DETAILED DESCRIPTION

[0016] The utility model will be further described below in combination with the drawings and specific embodiments, so that the person skilled in the art can better understand the utility model and can be implemented, but the embodiment is not as the limitation of the utility model.

[0017] In the description of the utility model, it is understood that the orientation or positional relationship indicated by the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as limiting the device or element indicated to have a particular orientation, to be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the utility model.

[0018] In addition, the terms "first", "second", etc. are used only for descriptive purposes and should not be construed as indicating or implying relative importance or an indicated number of technical features. Thus, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is at least two, such as two, three, etc., unless otherwise specifically limited.

[0019] In the present application, unless otherwise specifically defined and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be broadly understood, for example, it can be fixedly connected, or it can be detachably connected, or it can be integrated; it can be mechanically connected, or it can be electrically connected; it can be directly connected, or it can be indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction relationship of two elements, unless otherwise specifically limited. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0020] In the present application, unless otherwise specifically defined and limited, the first feature is "on" or "under" the second feature. The first and second features can be in direct contact, or the first and second features can be indirectly contacted through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0021] It should be noted that when an element is referred to as "fixed to" or "provided on" another element, it can be directly on another element or there can be a middle element. When an element is considered to be "connected" to another element, it can be directly connected to another element or there can be a middle element. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for illustrative purposes and do not represent the only embodiment.

[0022] Reference Figs. 1-2As shown, the utility model discloses a kind of tail gas cyclone mixed spray processing equipment for semiconductor chip welding, including rack 1, the rack 1 two sides are separately provided with front filter barrel 2 and rear filter barrel 3, the left side of the front filter barrel 2 is provided with air inlet 4, the top of the rear filter barrel 3 is provided with air outlet 5, the inside of the front filter barrel 2 and rear filter barrel 3 is provided with cyclone plate 6;Including cleaning water pipe 7, the two sides of the cleaning water pipe 7 are separately provided with corresponding the first stage water pipe 8 of the front filter barrel 2, the second stage water pipe 9 corresponding to the rear filter barrel 3.

[0023] When using, the tail gas generated by chip welding is introduced into the air inlet 4 on the left side of the front filter barrel 2, at this time, the external clean water source is introduced by the cleaning water pipe 7, and then the front filter barrel 2 and the rear filter barrel 3 are sprayed by the first stage water pipe 8 and the second stage water pipe 9 on the two sides respectively, and the tail gas is discharged in turn through the air inlet 4, the front filter barrel 2, the rear filter barrel 3 and the air outlet 5, at this time, the tail gas will pass through twice from bottom to top and spraying operation, realizing water washing purification, and the cyclone plate 6 in the front filter barrel 2 and the rear filter barrel 3 is used for guiding the flow direction of the gas.

[0024] The first stage water pipe 8 and the second stage water pipe 9 are provided with uniformly spaced spray heads 10 at the bottom, to ensure that the spraying range is wide enough to cover all positions of the front filter barrel 2 and the rear filter barrel 3.

[0025] Including mounting seat 11, the mounting seat 11 is provided with water pump 12 for controlling the cleaning water pipe 7, to facilitate installation and removal.

[0026] The position close to the air outlet 5 in the rear filter barrel 3 is provided with two layers of water removal curtains 13, which are easy to bring up water mist when the gas rises, which is used to remove the water mist in the gas.

[0027] The bottom of the front filter barrel 2 and the rear filter barrel 3 is provided with a water tank bottom plate 14, the bottom of the water tank bottom plate 14 is provided with a water tank 15, the water tank 15 is provided with a filter screen 16, after spraying starts and ends, the sprayed water will fall into the water tank 15 through the bottom water tank bottom plate 14, and the filter screen 16 is used for preliminary filtering of the filtered water for subsequent recycling, and the water tank 15 is provided with overflow pipe 17 and drain pipe 18 on the side.

[0028] The top position close to the front filter barrel 2 of the rack 1 is provided with an access door plate 19, to facilitate opening and repairing the whole device.

[0029] The above-mentioned embodiments are only preferred embodiments for fully illustrating the utility model, and the protection scope of the utility model is not limited to this. The equivalent substitution or transformation made by the person skilled in the art on the basis of the utility model is within the protection scope of the utility model. The protection scope of the utility model is subject to the claims.

Claims

1. A semiconductor chip soldering exhaust gas cyclone mixing and spraying treatment apparatus, characterized by comprising: a semiconductor chip soldering exhaust gas cyclone mixing and spraying treatment device; and a semiconductor chip soldering exhaust gas cyclone mixing and spraying treatment device. The utility model relates to a filter device, including frame (1), frame (1) both sides are provided with front filter barrel (2) and rear filter barrel (3) respectively, front filter barrel (2) left side is provided with air inlet (4), and rear filter barrel (3) top is provided with air outlet (5), and front filter barrel (2) and rear filter barrel (3) inside are provided with cyclone plate (6); Including cleaning water pipe (7), cleaning water pipe (7) both sides are provided with the first water pipe (8) of corresponding front filter barrel (2) respectively, the second water pipe (9) of corresponding rear filter barrel (3).

2. The semiconductor chip soldering tail gas cyclone mixing and spraying treatment equipment according to claim 1, characterized in that, The first water pipe (8) and second water pipe (9) bottom are provided with evenly spaced shower nozzle (10).

3. The semiconductor die bonding end gas cyclonic mixing and injection treatment apparatus of claim 1, wherein, Including mounting seat (11), mounting seat (11) is provided with water pump (12) of controlling cleaning water pipe (7).

4. The semiconductor chip soldering tail gas cyclone mixing and spraying treatment equipment according to claim 1, characterized in that, Rear filter barrel (3) inside is provided with two layers of water removal curtain (13) near the position of air outlet (5).

5. The semiconductor chip soldering tail gas cyclone mixing and spraying treatment equipment according to claim 1, characterized in that, Front filter barrel (2) and rear filter barrel (3) bottom are provided with water tank bottom plate (14), and water tank bottom plate (14) bottom is provided with water tank (15), and water tank (15) is provided with filter screen (16) inside.

6. The semiconductor die bonding exhaust cyclone motion spray processing apparatus of claim 5 wherein, Water tank (15) side is provided with overflow pipe (17) and sewer pipe (18).

7. The semiconductor die bonding end gas cyclonic mixing and injection treatment apparatus of claim 1 wherein, Frame (1) top is provided with access door plate (19) near front filter barrel (2).

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