Dispensing head mechanism and LED die bonder
By designing buffer, extrusion, and monitoring components for the dispensing head mechanism, precise control of the adhesive amount was achieved, solving the problems of adhesive creep and poor soldering caused by inaccurate adhesive amount in surface mount LED packaging, improving product yield and reducing costs.
Patent Information
- Application Number
- CN202520364918.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-04
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-03-04
AI Technical Summary
In the die bonding process of surface mount LED packaging, the difference in the amount of adhesive can lead to adhesive creep on the chip surface and insufficient chip bonding, resulting in failures such as poor soldering and chip removal during the wire bonding process. Existing technologies cannot accurately control the amount of adhesive, which affects product yield and increases manufacturing costs.
A dispensing head mechanism was designed, including a buffer component, an extrusion component, and a monitoring component. The monitoring component monitors the position of the adhesive, the extrusion component controls the amount of adhesive, and the inner and outer funnel structures limit the diffusion of the adhesive, thereby achieving precise control of the amount of adhesive.
It improved the accuracy of die bond application, improved the problem of die bond creep on the chip surface, increased product yield, and reduced manufacturing costs.
Smart Images
Figure CN223902206U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to patch LED encapsulation production technical field, especially point to a kind of glue head mechanism and LED die bonder. BACKGROUND
[0002] At present, in the Die Bond (die bonding or patching) process in patch LED encapsulation, the preparation method using glue adhesion combines chip and substrate, but the difference of glue amount in machine debugging process cannot be accurately specific size, and the difference of glue amount can cause chip surface to climb glue and chip combination insufficient, thereby causing Wire Bond (soldering wire) process to appear virtual welding and pull crystal and other failures, process uses artificial microscope sampling inspection, and the delay and incompleteness of defect discovery cause low product yield, thereby increase manufacturing cost. SUMMARY
[0003] Therefore, the utility model discloses a kind of glue head mechanism and LED die bonder to solve the deficiency in prior art.
[0004] To achieve the above object, the utility model provides a kind of glue head mechanism, including buffer component, extrusion component, monitoring component and discharge port, one end of the buffer component is connected with material conveying mechanism, the other end of the buffer component is connected with the discharge port, the monitoring component is connected with the buffer component, the monitoring component is used to monitor whether glue in the buffer component reaches preset position, the extrusion component is connected with the buffer component, and the extrusion component is used to extrude the buffer component, so that glue in the buffer component flows out through the discharge port;
[0005] The discharge port includes inner funnel and outer funnel, the inner funnel is arranged inside the outer funnel, the inner funnel and the outer funnel are both narrow at top and wide at bottom structure, the bottom of the inner funnel is higher than the bottom of the outer funnel, and the opening area of the bottom of the inner funnel is less than the opening area of the bottom of the outer funnel.
[0006] The utility model has the advantages that when performing die bonding operation, glue is conveyed into buffer component by material conveying mechanism, monitoring component is used to monitor that glue in buffer glue reaches preset position, and conveying operation is stopped, so that the amount of glue required for die bonding is controlled within appropriate range, then extrusion component is used to extrude buffer component, so that glue in buffer component flows out through inner funnel of discharge port, at this time, the bottom of outer funnel contacts encapsulation chip, the diffusion range of glue on encapsulation chip is limited by outer funnel, by the above setting, not only the precision of die bonding glue amount can be improved, but also the problem of chip surface climbing glue can be improved, thereby product yield can be improved and manufacturing cost can be reduced.
[0007] Preferably, the buffer assembly comprises a containing cylinder and a buffer bag, the containing cylinder is a hollow structure, the buffer bag is located in the containing cylinder, one end of the buffer bag is connected with the material feeding mechanism through a corrugated pipe, the other end of the buffer bag is connected with the top of the inner funnel through a discharging pipe, and the discharging pipe is connected with the containing cylinder.
[0008] Preferably, the extrusion assembly comprises an extrusion piece and a driving piece, the extrusion piece is located in the containing cylinder, the extrusion piece is connected with the driving piece through a first connecting rod, and the driving piece is located outside the containing cylinder and used for driving the extrusion piece to extrude the buffer bag.
[0009] Preferably, the extrusion piece comprises an extrusion pipe and a scratchproof ring, the extrusion pipe and the scratchproof ring are both sleeved on the end of the buffer bag close to the receiving pipeline, the scratchproof ring is connected with the end of the extrusion pipe close to the discharging pipe, the side surface of the scratchproof ring is an arc surface, and the end of the scratchproof ring away from the extrusion pipe extends outwardly to form a curled edge structure.
[0010] Preferably, the driving piece comprises a screw rod, a displacement block and a servo motor, the displacement block is threadedly connected with the screw rod, the displacement block is connected with the first connecting rod, the driving shaft of the servo motor is connected with the end of the screw rod, and the servo motor is connected with the containing cylinder through a mounting base.
[0011] Preferably, the side surface of the containing cylinder is provided with a displacement groove, and one end of the first connecting rod passes through the displacement groove and is connected with the extrusion piece.
[0012] Preferably, the monitoring assembly comprises a liquid level sensor, and the liquid level sensor is mounted on the receiving pipeline.
[0013] Preferably, the glue dispensing head mechanism further comprises a guiding assembly, the guiding assembly comprises a guiding rod and a guiding block, the guiding block is sleeved on the guiding rod, the guiding block is connected with the displacement block through a connecting ring, the guiding block is connected with the extrusion piece through a second connecting rod, and the guiding rod is connected with the containing cylinder through a mounting frame.
[0014] To achieve the above object, the utility model also provides a LED die bonder which comprises the glue dispensing head mechanism.
[0015] The additional aspects and advantages of the utility model will be partly given in the following description, partly will become obvious from the following description, or will be understood through the practice of the utility model. BRIEF DESCRIPTION OF DRAWINGS
[0016] Fig. 1 The structure schematic view of the glue dispensing head mechanism provided for the first embodiment of the utility model is shown in the figure.
[0017] Fig. 2 A sectional view of the glue dispensing head mechanism provided by the first embodiment of the utility model;
[0018] Fig. 3 A structure schematic view of the extrusion part provided by the first embodiment of the utility model.
[0019] Main element symbol explanation:
[0020] 11, accommodating cylinder; 111, displacement groove; 12, buffer bag; 21, extrusion pipe; 22, scratchproof ring; 23, edge lifting structure; 24, first connecting rod; 25, screw rod; 26, displacement block; 27, servo motor; 31, inner funnel; 32, outer funnel; 40, receiving pipeline; 50, discharge pipe; 60, mounting base; 71, guide rod; 72, guide block; 73, second connecting rod; 80, mounting frame.
[0021] The following specific embodiments will further illustrate the utility model in combination with the above-mentioned drawings. Specific embodiments
[0022] In order to facilitate the understanding of the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show several embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.
[0023] It should be noted that when an element is referred to as "fixed to" another element, it can be directly on the other element or there can be a middle element. When an element is referred to as "connected" to another element, it can be directly connected to the other element or there can be a middle element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terms used in the specification of the utility model herein are only for the purpose of describing specific embodiments and are not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0025] Please refer to Figs. 1 to 3 The glue dispensing head mechanism in the first embodiment of the utility model comprises a buffer assembly, an extrusion assembly, a monitoring assembly and a discharge port.
[0026] The other end of the buffer assembly is connected with the discharging port, the buffer assembly is used for storing a certain amount of glue, the monitoring assembly is connected with the buffer assembly, and the monitoring assembly is used for monitoring whether the glue in the buffer assembly reaches a preset position. It can be understood that the feeding mechanism is started and stopped by a industrial computer, the feeding mechanism feeds the glue into the buffer assembly, the monitoring assembly monitors the glue in the buffer assembly, and when the glue reaches the preset position, the monitoring assembly can send a signal to the industrial computer, so that the industrial computer controls the feeding mechanism to stop feeding, thereby controlling the amount of glue during each die bonding. It is beneficial to improve the adverse effects caused by too much or too little glue. It should be noted that the industrial computer and the feeding mechanism are prior art, and thus will not be described here.
[0027] In the embodiment, the extrusion assembly is connected with the buffer assembly, the discharging port comprises an inner funnel 31 and an outer funnel 32, the inner funnel 31 is arranged inside the outer funnel 32, both the inner funnel 31 and the outer funnel 32 have a structure of being narrow at the top and wide at the bottom, the bottom of the inner funnel 31 is higher than the bottom of the outer funnel 32, and the opening area of the bottom of the inner funnel 31 is smaller than the opening area of the bottom of the outer funnel 32. It should be noted that the extrusion assembly extrudes the buffer assembly, so that the glue in the buffer assembly flows out of the discharging port to the packaging chip, and the outer funnel 32 limits the spreading range of the glue on the packaging chip, which is beneficial to improve the problem of glue climbing on the surface of the packaging chip.
[0028] In the embodiment, the bottom of the outer funnel 32 is coated with a anti-sticking coating, which can be Teflon, to further improve the problem of glue climbing on the surface of the packaging chip.
[0029] In the embodiment, the buffer assembly comprises a containing cylinder 11 and a buffer bag 12, the containing cylinder 11 has a hollow structure, and the buffer bag 12 is located in the containing cylinder 11. One end of the buffer bag 12 is connected with the feeding mechanism through a receiving pipeline 40, and the other end of the buffer bag 12 is connected with the top of the inner funnel 31 through a discharging pipeline 50. The receiving pipeline 40 and the discharging pipeline 50 are both connected with the containing cylinder 11. Specifically, a first mounting groove is formed in the top of the containing cylinder 11, the receiving pipeline 40 is in interference fit with the first mounting groove, a second mounting groove is formed in the bottom of the containing cylinder 11, the discharging pipeline 50 is in interference fit with the second mounting groove, and the receiving pipeline 40 is parallel to the discharging pipeline 50.
[0030] In the embodiment, the monitoring assembly comprises a liquid level sensor, the liquid level sensor is installed in the receiving pipeline 40, and the liquid level sensor is used for monitoring whether the glue in the buffer bag 12 reaches a preset position. The liquid level sensor is electrically connected with the industrial computer.
[0031] In the embodiment, the extrusion assembly comprises an extrusion member and a driving member, the extrusion member is located inside the accommodating cylinder 11, and the extrusion member is sleeved on the end of the buffer bag 12 close to the receiving pipeline 40, the extrusion member is connected with the driving member through the first connecting rod 24, the driving member is located outside the accommodating cylinder 11, and the driving member is connected with the outer wall of the accommodating cylinder 11, and the driving member is used to drive the extrusion member to extrude the buffer bag 12.
[0032] In the embodiment, the extrusion member comprises an extrusion pipe 21 and a scratch-proof ring 22, the extrusion pipe 21 and the scratch-proof ring 22 are both sleeved on the end of the buffer bag 12 close to the receiving pipeline 40, the scratch-proof ring 22 is connected with the end of the extrusion pipe 21 close to the discharging pipe 50, the extrusion pipe 21 is parallel to the discharging pipe 50, the outer wall of the extrusion pipe 21 is connected with one end of the first connecting rod 24, the side surface of the scratch-proof ring 22 is arc-shaped, the opening of the end of the scratch-proof ring 22 close to the extrusion pipe 21 is same as the opening of the extrusion pipe 21, the opening of the end of the scratch-proof ring 22 away from the extrusion pipe 21 is smaller than the opening of the end of the scratch-proof ring 22 close to the extrusion pipe 21, and the end of the scratch-proof ring 22 away from the extrusion pipe 21 is curled outward to form a curled edge structure 23.
[0033] In the embodiment, the driving member comprises a screw rod 25, a displacement block 26 and a servo motor 27, the servo motor 27 is connected with the outer wall of the accommodating cylinder 11 through a mounting seat 60, the driving shaft of the servo motor 27 is connected with one end of the screw rod 25, the displacement block 26 is threadedly connected with the screw rod 25, and the displacement block 26 is connected with the first connecting rod 24, that is, the displacement block 26 is connected with the extrusion pipe 21 through the first connecting rod 24.
[0034] It should be noted that the servo motor 27 is electrically connected with the industrial computer, when the extrusion operation is needed, the industrial computer starts the servo motor 27 to work, the servo motor 27 drives the screw rod 25 to rotate, the displacement block 26 is threadedly connected with the screw rod 25, and the displacement block 26 can move along the extension direction of the screw rod 25 under the driving of the screw rod 25, so that the extrusion pipe 21 is driven to move up and down through the displacement block 26.
[0035] In the embodiment, in order to ensure that the displacement block 26 translates along the extension direction of the screw rod 25, the glue dispensing head mechanism further comprises a guide assembly, the guide assembly comprises a guide rod 71 and a guide block 72, the guide block 72 is sleeved on the guide rod 71, the guide rod 71 is parallel to the screw rod 25, the guide block 72 is connected with the displacement block 26 through a connecting ring, and the guide block 72 is connected with the extrusion pipe 21 through a second connecting rod 73, and the guide rod 71 is connected with the accommodating cylinder 11 through a mounting frame 80, so as to realize that the displacement block 26 translates along the extension direction of the screw rod 25 under the limitation of the guide assembly when the screw rod 25 rotates.
[0036] In the embodiment, two displacement grooves 111 are formed in the side of the containing cylinder 11, and the first connecting rod 24 and the second connecting rod 73 are connected with the outer wall of the extrusion pipe 21 through the corresponding displacement grooves 111.
[0037] In the embodiment, when the die bonding operation is performed, the glue is fed into the buffer assembly through the feeding mechanism, the monitoring assembly is used to monitor the glue in the buffer assembly to the preset position, and the feeding operation is stopped, so that the glue amount required for die bonding is controlled in a proper range, and then the buffer assembly is extruded through the extrusion assembly, so that the glue in the buffer assembly flows out through the inner funnel 31 of the discharge port.
[0038] It should be noted that the above implementation process is only for the purpose of illustrating the feasibility of the present application, but it does not mean that the dispensing head mechanism of the present application has only the above-mentioned unique implementation process, on the contrary, as long as the dispensing head mechanism of the present application can be implemented, it can be included in the feasible implementation scheme of the present application.
[0039] The LED die bonder in the second embodiment of the present application comprises the dispensing head mechanism in the first embodiment.
[0040] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In the description of the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.
[0041] The above-described embodiments only express several implementation manners of the present application, and the description is more specific and detailed, but it cannot be understood as a limitation on the scope of the present application. It should be noted that for ordinary skilled persons in the art, without departing from the concept of the present application, a number of modifications and improvements can be made, which are all within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.
Claims
1. A dispensing head mechanism, comprising: The device comprises a buffer assembly, an extrusion assembly, a monitoring assembly and a discharge port, one end of the buffer assembly is connected with a material feeding mechanism, the other end of the buffer assembly is connected with the discharge port, the monitoring assembly is connected with the buffer assembly, the monitoring assembly is used for monitoring whether the glue in the buffer assembly reaches a preset position, the extrusion assembly is connected with the buffer assembly, and the extrusion assembly is used for extruding the buffer assembly so that the glue in the buffer assembly flows out through the discharge port; The discharge port comprises an inner funnel and an outer funnel, the inner funnel is arranged inside the outer funnel, the inner funnel and the outer funnel are both narrow at the top and wide at the bottom, the bottom of the inner funnel is higher than the bottom of the outer funnel, and the opening area of the bottom of the inner funnel is smaller than the opening area of the bottom of the outer funnel.
2. The glue head mechanism of claim 1, wherein, The buffer assembly comprises a containing cylinder and a buffer bag, the containing cylinder is a hollow structure, the buffer bag is located in the containing cylinder, one end of the buffer bag is connected with the material feeding mechanism through a receiving pipeline, and the other end of the buffer bag is connected with the top of the inner funnel through a discharge pipe.
3. The glue head mechanism of claim 2, wherein, The extrusion assembly comprises an extrusion piece and a driving piece, the extrusion piece is located in the containing cylinder, the extrusion piece is connected with the driving piece through a first connecting rod, and the driving piece is located outside the containing cylinder.
4. The glue head mechanism of claim 3, wherein, The extrusion piece comprises an extrusion pipe and a scratch-proof ring, the extrusion pipe and the scratch-proof ring are both sleeved on the end of the buffer bag close to the receiving pipeline, the scratch-proof ring is connected with the end of the extrusion pipe close to the discharge pipe, the side surface of the scratch-proof ring is an arc surface, and the end of the scratch-proof ring away from the extrusion pipe extends outward to form a curled edge structure.
5. The glue head mechanism of claim 3, wherein, The driving piece comprises a screw rod, a displacement block and a servo motor, the displacement block is threadedly connected with the screw rod, the displacement block is connected with the first connecting rod, the driving shaft of the servo motor is connected with the end of the screw rod, and the servo motor is connected with the containing cylinder through a mounting seat.
6. The glue head mechanism of claim 3, wherein, The side surface of the containing cylinder is provided with a displacement groove, and one end of the first connecting rod penetrates through the displacement groove and is connected with the extrusion piece.
7. The glue head mechanism of claim 2, wherein, The monitoring assembly comprises a liquid level sensor, and the liquid level sensor is mounted on the receiving pipeline.
8. The glue head mechanism of claim 5, wherein, The glue dispensing head mechanism further comprises a guide assembly, the guide assembly comprises a guide rod and a guide block, the guide block is sleeved on the guide rod, the guide block is connected with the displacement block through a connecting ring, the guide block is connected with the extrusion piece through a second connecting rod, and the guide rod is connected with the containing cylinder through a mounting bracket.
9. An LED die bonder, characterized in that, The device comprises the glue dispensing head mechanism of any one of claims 1-8.