Soldering machine and soldering machine track system for preventing elargol from overflowing frame

Abstract

The utility model discloses a soldering machine and a soldering machine track system for preventing elargol from overflowing a frame, and relates to the technical field of soldering machines, and the soldering machine track system for preventing the elargol from overflowing the frame comprises a dispensing head; soldering lug heads; the first conveying track is used for driving the frame to enter from the feeding opening and sequentially move to the position below the dispensing head and the position below the soldering lug head; the second conveying track is used for driving the frame to move from the lower part of the soldering lug head to the discharge hole; the heating device is arranged corresponding to the second conveying track so as to heat the frame moving to the second conveying track; and the dispensing head, the soldering lug head, the first conveying track, the second conveying track and the heating device are all connected with the control device. The system can effectively solve the problem that the silver colloid overflows out of the frame due to the flowability of the silver colloid after a product is subjected to dispensing and soldering operation on a soldering machine track in sequence and before the product enters a drying oven to be baked.

Description

TECHNICAL FIELD

[0001] The utility model relates to a soldering piece machine technical field more specifically, relate to a kind of soldering piece machine track system for avoiding silver glue overflow frame.In addition, it further relates to a soldering piece machine comprising the soldering piece machine track system for avoiding silver glue overflow frame described above. BACKGROUND

[0002] In prior art, soldering piece machine DB (Die Bond, patch machine) needs to execute two actions of dispensing and soldering piece, wherein, dispensing operation refers to that frame 04 (also PCB pad) is transported to dispensing position by conveying track 03 of soldering piece machine, then frame 04 is dispensed by dispensing head 01, while soldering piece operation refers to that frame 04 after dispensing is transported to soldering piece position, then surface mount device such as chip is pressed with dispensing by soldering head 02, so that chip is welded on frame 04, finally frame 04 after soldering piece is continuously transported forward by soldering piece machine track, to transport product after soldering piece to oven for baking, and its structure is shown in Figure 1 However, due to the fluidity of silver glue 05, there is a problem of silver glue 05 overflow frame 04, which will eventually cause waste product.

[0003] In summary, how to solve the problem of silver glue overflow frame due to the fluidity of silver glue after product completes dispensing and soldering piece operation on soldering piece machine track in turn before entering oven for baking is a problem to be solved by technical personnel in the field at present. UTILITY MODEL CONTENT

[0004] Therefore, the utility model aims at providing a soldering piece machine track system for avoiding silver glue overflow frame, which can effectively solve the problem of silver glue overflow frame due to the fluidity of silver glue after product completes dispensing and soldering piece operation on soldering piece machine track in turn before entering oven for baking.

[0005] Another object of the utility model is to provide a soldering piece machine comprising the soldering piece machine track system for avoiding silver glue overflow frame described above.

[0006] In order to achieve the above object, the utility model provides the following technical scheme:

[0007] A soldering piece machine track system for avoiding silver glue overflow frame, comprising:

[0008] Dispensing head;

[0009] Soldering head;

[0010] First conveying track, for driving frame to enter from feed port and move to below the dispensing head and below the soldering head in turn;

[0011] a second conveying track for moving the frame from under the soldering head to a discharge opening;

[0012] a heating device corresponding to the second conveying track for heating the frame moving on the second conveying track;

[0013] a control device, the dispensing head, the soldering head, the first conveying track, the second conveying track and the heating device are connected to the control device.

[0014] In an embodiment, the heating device comprises a heating couple arranged in the second conveying track.

[0015] In an embodiment, the heating device comprises an electric oven, the second conveying track is arranged in the electric oven, and the electric oven is provided with an inlet and an outlet along the conveying direction of the second conveying track.

[0016] In an embodiment, the heating device comprises an electric heating fan, the second conveying track is provided with the electric heating fan on one side.

[0017] In an embodiment, the heating device comprises an infrared tunnel furnace, the second conveying track is arranged in the infrared tunnel furnace, and the infrared tunnel furnace is provided with an inlet and an outlet along the conveying direction of the second conveying track.

[0018] In an embodiment, the heating device comprises a focused laser beam arranged on one side or both sides of the second conveying track.

[0019] In an embodiment, the heating device comprises a microwave curing furnace, the second conveying track is arranged in the microwave curing furnace, and the microwave curing furnace is provided with an inlet and an outlet along the conveying direction of the second conveying track.

[0020] In an embodiment, the heating device comprises a pulse thermal compression bonding machine arranged on one side of the second conveying track, a thermal compression head of the pulse thermal compression bonding machine is used for heating the second conveying track.

[0021] In an embodiment, the first conveying track and the second conveying track are in a split structure or an integrated structure, and the first conveying track and the second conveying track are flush in height.

[0022] A soldering machine comprising the soldering machine track system for avoiding silver adhesive overflow frame according to any one of the above.

[0023] In use of the soldering piece machine track system for avoiding silver adhesive overflow frame provided by the utility model, firstly, the control device controls the first conveying track to run, so as to drive the frame with the chip to enter from the feeding port and move to the lower part of the glue dispensing head. Then, the control device controls the glue dispensing head to run, so as to carry out the glue dispensing operation on the frame. Then, the control device controls the first conveying track to continue running, so that the frame moves to the lower part of the soldering piece head. After that, the control device controls the soldering piece head to run, so as to press the surface mount device such as chip on the silver adhesive by the soldering piece head, and make the surface mount device such as chip welded on the frame. At the same time, the control device can control the heating device to run, so as to heat the second conveying track, and realize the heating operation on the second conveying track area. Finally, the control device controls the second conveying track to run, so that the frame is conveyed from the first conveying track end to the second conveying track, and the silver adhesive on the frame is quickly pre-solidified and shaped under the high temperature condition, and will not flow everywhere, that is, the second conveying track which can be heated helps the silver adhesive to be quickly pre-solidified, and effectively prevents the silver adhesive from overflowing the frame and causing the product to be scrapped.

[0024] In conclusion, the soldering piece machine track system for avoiding silver adhesive overflow frame provided by the utility model can effectively solve the problem that the silver adhesive overflows the frame due to the flowability of the silver adhesive after the product sequentially completes the glue dispensing and soldering piece operations on the soldering piece machine track and before entering the oven for baking.

[0025] In addition, the utility model also provides a soldering piece machine comprising the soldering piece machine track system for avoiding silver adhesive overflow frame. BRIEF DESCRIPTION OF DRAWINGS

[0026] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are only the embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to the provided drawings without creating the creative labor.

[0027] Figure 1 It is the structural schematic diagram of the soldering piece machine in the prior art;

[0028] Figure 2 It is the structural schematic diagram of silver adhesive overflow frame in the prior art;

[0029] Figure 3 It is the structural schematic diagram of the soldering piece machine track system for avoiding silver adhesive overflow frame provided by the utility model;

[0030] Figure 4 It is the structural schematic diagram of silver adhesive not overflowing frame after using the system.

[0031] Figures 1-2 In conclusion, the soldering piece machine track system for avoiding silver adhesive overflow frame provided by the utility model can effectively solve the problem that the silver adhesive overflows the frame due to the flowability of the silver adhesive after the product sequentially completes the glue dispensing and soldering piece operations on the soldering piece machine track and before entering the oven for baking.

[0032] 01 is a dispensing head, 02 is a soldering piece head, 03 is a conveying track, 04 is a frame, 05 is silver glue;

[0033] Figures 3-4 In the middle:

[0034] 1 is a dispensing head, 2 is a soldering piece head, 3 is a first conveying track, 4 is a second conveying track, 5 is a heating device, 6 is a frame, 7 is silver glue, and 8 is a wafer. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0036] The core of the present application is to provide a soldering machine track system for avoiding silver glue overflow from a frame, which can effectively solve the problem of silver glue overflow from the frame due to the fluidity of the silver glue after the dispensing and soldering operations are sequentially completed on the soldering machine track and before entering the oven for baking. Another core of the present application is to provide a soldering machine comprising the above-mentioned soldering machine track system for avoiding silver glue overflow from a frame.

[0037] Please refer to Figure 3 and Figure 4 , wherein, Figure 3 is a structure diagram of the soldering machine track system for avoiding silver glue overflow from a frame provided by the present application; Figure 4 is a structure diagram of silver glue not overflowing from a frame after using the system.

[0038] The present embodiment provides a soldering machine track system for avoiding silver glue overflow from a frame, comprising:

[0039] a dispensing head 1;

[0040] a soldering piece head 2;

[0041] a first conveying track 3 for driving the frame 6 to enter from a feeding port and sequentially move to below the dispensing head 1 and below the soldering piece head 2;

[0042] a second conveying track 4 for driving the frame 6 to move from below the soldering piece head 2 to a discharging port;

[0043] a heating device 5 corresponding to the second conveying track 4, for heating the frame 6 moving on the second conveying track 4;

[0044] The control device, the dispensing head 1, the soldering head 2, the first conveying track 3, the second conveying track 4 and the heating device 5 are connected with the control device.

[0045] It should be noted that the soldering machine is also called "mounting machine" or "surface mounting system". In the production line, the soldering machine is arranged after the dispensing machine or the screen printing machine, and is a device for accurately placing the surface mounting components on the PCB pad through the moving mounting head. That is, the soldering machine mainly includes two actions of dispensing and soldering, the frame 6 (i.e. the PCB pad) runs on the track, and is dispensed at the dispensing position first, then is conveyed to the soldering position for soldering, and finally is discharged to wait for the oven baking.

[0046] In order to avoid the problem that the silver glue 7 of individual products overflows the frame 6 due to the too long residence time of the products in the residence stage before the soldering and baking, the silver glue 7 pre-solidification function (for example, the pre-solidification of the products through the area heating before the soldering and baking) can be added in the residence stage of the products before the soldering and baking (i.e. the stage of conveying the frame 6 by the second conveying track 4), so as to increase the offset tolerance rate of the dispensing and soldering position of the soldering station.

[0047] It should be further noted that the device further includes the wafer 8 connected with the control device. The wafer 8 is a power management triode, which is a kind of semiconductor device for controlling current, and functions to amplify the weak signal into the electric signal with large amplitude value, and is also used as a non-contact switch. In the actual application process, the shape, structure, size, material, type and position of the dispensing head 1, the soldering head 2, the first conveying track 3, the second conveying track 4, the heating device 5 and the control device can be determined according to the actual situation and actual demand.

[0048] When the soldering machine track system for avoiding the silver glue overflow frame provided by the utility model is used, first, the control device controls the first conveying track 3 to run, so as to drive the frame 6 with the chip to enter from the feeding port and move to the lower side of the dispensing head 1. Then, the control device controls the dispensing head 1 to run, so as to perform the dispensing operation on the frame 6. Then, the control device controls the first conveying track 3 to continue running, so that the frame 6 moves to the lower side of the soldering head 2. Thereafter, the control device controls the soldering head 2 to run, so as to press the chip and other surface mounting components on the silver glue 7 by the soldering head 2, so that the chip and other surface mounting components are welded on the frame 6. At the same time, the control device can control the heating device 5 to run, so as to heat the second conveying track 4, so that the heating operation is realized in the area of the second conveying track 4. Finally, the control device controls the second conveying track 4 to run, so that the frame 6 is conveyed from the end of the first conveying track 3 to the second conveying track 4. The silver glue 7 on the frame 6 is quickly pre-solidified and shaped under the high temperature condition, and will not flow everywhere, that is, the second conveying track 4 which can be heated helps the silver glue 7 to be quickly pre-solidified, effectively preventing the silver glue 7 from overflowing the frame 6 and causing the product to be scrapped, such as Figure 4As shown.

[0049] In summary, the soldering piece machine track system for avoiding silver adhesive overflow from the frame can effectively solve the problem of silver adhesive 7 overflow from the frame 6 due to the fluidity of the silver adhesive 7 after the product completes the dispensing and soldering piece operations on the soldering piece machine track and before entering the oven for baking.

[0050] In an embodiment, the heating device 5 includes a heating couple arranged in the second conveying track 4. That is, the second conveying track 4 with the heating couple can achieve the purpose of pre-curing the product, so that the product is quickly and timely pre-cured on the second conveying track 4 to prevent the silver adhesive 7 from overflowing from the frame 6. One or more heating couples can be arranged in the second conveying track 4, and the position, heating power, etc. of the heating couple can be determined according to actual conditions and actual needs.

[0051] In an embodiment, the heating device 5 includes an electric oven, the second conveying track 4 is arranged in the electric oven, and the electric oven is provided with an inlet and an outlet along the conveying direction of the second conveying track 4. That is, the electric oven can be used to heat the second conveying track 4 after the product is soldered and before the product formally enters the oven for baking in the next stage, so that the product moving on the second conveying track 4 is heated and warmed, and the product is quickly and timely pre-cured on the second conveying track 4 to prevent the silver adhesive 7 from overflowing from the frame 6 and damaging the product.

[0052] In an embodiment, the heating device 5 includes an electric heating fan, and the side of the second conveying track 4 is provided with the electric heating fan. That is, the electric heating fan can be arranged on one side or both sides of the second conveying track 4 to heat the product, so that the product is quickly pre-cured on the second conveying track 4 to prevent the silver adhesive 7 from overflowing from the frame 6 and damaging the product.

[0053] In an embodiment, the heating device 5 includes an infrared tunnel furnace, and the second conveying track 4 is arranged in the infrared tunnel furnace, and the infrared tunnel furnace is provided with an inlet and an outlet along the conveying direction of the second conveying track 4 to heat the second conveying track 4 by using the infrared rays of the infrared tunnel furnace.

[0054] In an embodiment, the heating device 5 includes a focused laser beam arranged on one side or both sides of the second conveying track 4 to heat the second conveying track 4 by using the laser of the focused laser beam.

[0055] In an embodiment, the heating device 5 includes a microwave curing furnace, and the second conveying track 4 is arranged in the microwave curing furnace, and the microwave curing furnace is provided with an inlet and an outlet along the conveying direction of the second conveying track 4 to heat the second conveying track 4 by using the microwaves of the microwave curing furnace.

[0056] In an embodiment, the heating device 5 comprises a pulse thermal compression bonding machine arranged on one side of the second conveying track 4, and a thermal compression head of the pulse thermal compression bonding machine is used to heat the second conveying track 4 to utilize pulse heating of the pulse thermal compression bonding machine. That is, the pulse thermal compression bonding machine utilizes low voltage and large current to heat the thermal compression head with high impedance by loading a certain pulse voltage on the thermal compression head, so as to heat the object in contact with the thermal compression head.

[0057] In an embodiment, the first conveying track 3 and the second conveying track 4 are in a split structure or an integrated structure, and the first conveying track 3 and the second conveying track 4 are in the same height.

[0058] It should be noted that the first conveying track 3 and the second conveying track 4 can be arranged in a split structure, so that the first conveying track 3 for dispensing and welding piece area is separated from the second conveying track 4 for heating and pre-curing area, thereby avoiding the heating device 5 for heating the second conveying track 4 from directly contacting the first conveying track 3 and affecting the dispensing and welding piece operation on the first conveying track 3. In addition, the first conveying track 3 and the second conveying track 4 are in the same height, and the distance between the first conveying track 3 and the second conveying track 4 is small, so that the product can be smoothly transferred from the first conveying track 3 to the second conveying track 4.

[0059] It should be further noted that the first conveying track 3 and the second conveying track 4 can also be arranged in an integrated structure, but a heat insulation member needs to be arranged at the boundary between the first conveying track 3 and the second conveying track 4, so as to avoid the heat of the heating device 5 from being transferred to the first conveying track 3 and affecting the normal operation of the product on the first conveying track 3. In actual application, the structure and size of the first conveying track 3 and the second conveying track 4 can be determined according to actual conditions and actual requirements.

[0060] In addition to the above-mentioned welding machine track system for avoiding silver glue overflow frame, the welding machine track system for avoiding silver glue overflow frame disclosed in the above-mentioned embodiment is also provided, and the structure of other parts of the welding machine can refer to the prior art, which will not be described herein.

[0061] It should be noted that the first conveying track and the second conveying track mentioned in the present application are only for distinguishing different positions, and there is no sequence.

[0062] In addition, it should be noted that the directions or positional relationships indicated by "in and out", "up and down" and the like in the present application are based on the directions or positional relationships shown in the drawings, and are only for the purpose of simplifying the description and facilitating understanding, and therefore cannot be understood as a limitation on the present application.

[0063] The various embodiments are described in a progressive manner in the specification, each of which focuses on the differences from other embodiments, and the same or similar parts between the various embodiments can be mutually referred to. Any combination of all the embodiments provided by the present application is within the protection scope of the present application, and will not be described here.

[0064] The welding piece machine and the welding piece machine track system for avoiding silver glue overflow from the frame are described in detail above. The principle and implementation mode of the present application are described by applying specific examples in this paper, and the description of the above embodiments is only used to help understand the method and core idea of the present application. It should be pointed out that, for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principle of the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A soldering machine track system for preventing silver paste overflow from a frame, characterized in that, include: Dispensing head (1); Solder head (2); The first conveying track (3) is used to drive the frame (6) to enter from the feed port and move sequentially to the bottom of the dispensing head (1) and the bottom of the welding head (2); The second conveying track (4) is used to move the frame (6) from below the welding head (2) to the discharge port; A heating device (5) is provided corresponding to the second conveying track (4) to heat the frame (6) that moves onto the second conveying track (4). The control device is connected to the dispensing head (1), the welding head (2), the first conveying track (3), the second conveying track (4), and the heating device (5).

2. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes a heating coupler, which is located inside the second conveying track (4).

3. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes an electric oven, the second conveying track (4) is located inside the electric oven, and the electric oven has an inlet and outlet along the conveying direction of the second conveying track (4).

4. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes an electric fan, and the electric fan is provided on the side of the second conveying track (4).

5. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes an infrared tunnel furnace, the second conveying track (4) is located inside the infrared tunnel furnace, and the infrared tunnel furnace has an inlet and outlet along the conveying direction of the second conveying track (4).

6. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes a focused laser beam located on one or both sides of the second conveying track (4).

7. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes a microwave curing oven, the second conveying track (4) is located inside the microwave curing oven, and the microwave curing oven has an inlet and outlet along the conveying direction of the second conveying track (4).

8. The soldering machine track system for preventing silver paste overflow from the frame according to claim 1, characterized in that, The heating device (5) includes a pulse hot press bonding machine located on one side of the second conveying track (4), and the hot press head of the pulse hot press bonding machine is used to heat the second conveying track (4).

9. The soldering machine track system for preventing silver paste overflow from the frame according to any one of claims 1 to 8, characterized in that, The first conveying track (3) and the second conveying track (4) are either separate or integrated structures, and the first conveying track (3) and the second conveying track (4) are at the same height.

10. A welding machine, characterized in that, The soldering machine track system for preventing silver paste from overflowing from the frame, as described in any one of claims 1 to 9.

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