Polishing liquid filling device of chemical mechanical polishing machine

Abstract

The utility model discloses a polishing liquid filling device of a chemical mechanical polishing machine, which comprises a liquid storage tank for storing polishing liquid and a liquid supply component capable of conveying the polishing liquid into the chemical mechanical polishing machine from the liquid storage tank. According to the polishing solution filling device of the chemical mechanical polishing machine, the filling operation efficiency and the operation precision of the polishing solution can be effectively improved, the filling process is more stable and controllable, and the situations of material waste, environmental pollution and the like caused by scattering of the polishing solution can be effectively avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to multi -wire cutting machine assembly replacement and maintenance supporting equipment technical field especially relates to a chemical mechanical polishing machine polishing liquid filling device. BACKGROUND

[0002] In the third generation semiconductor material, silicon carbide has the characteristics of wide band gap, high breakdown field, high saturation electron drift velocity, high thermal conductivity, etc., and can be applied to high-voltage environment above 1200 volts, so its application in harsh environment has obvious advantages.

[0003] After the traditional rough polishing process of silicon carbide wafer, in order to further improve the surface quality of wafer, improve the surface roughness and flatness, and make the surface quality characteristics meet the precision requirements in the subsequent processing, generally, ultra-precision polishing treatment is implemented. Correspondingly, ultra-precision polishing is a very key link in the processing of silicon carbide surface, and with the development of ultra-precision polishing technology, at present, the ultra-precision polishing processing methods suitable for silicon carbide wafer mainly include mechanical grinding, magnetorheological polishing, ion beam polishing and chemical mechanical polishing, among which, chemical mechanical polishing (CMP) technology is the most effective processing method to realize global planarization of silicon carbide wafer.

[0004] Chemical mechanical polishing is a process of removing and planarizing the surface material of workpiece through the synergistic effect of chemical corrosion and mechanical wear. The wafer undergoes chemical oxidation under the action of polishing liquid, and a chemical reaction softening layer is generated on the surface, which is then removed under the mechanical polishing action of abrasive particles. Since chemical mechanical polishing technology involves the application of multiple disciplines such as chemistry, physics, friction, mechanics and materials science, there are many factors that affect its polishing effect, mainly including polishing liquid related factors (such as abrasive particles, oxidizing agent, pH value, additives, etc.), polishing pad related factors (such as hardness, elasticity, surface topography, etc.) and polishing related parameters (such as polishing pressure, polishing head / polishing disc speed, polishing liquid flow, etc.). Among them, the performance of polishing liquid is the core of chemical mechanical polishing technology, so its influence on the processing effect of chemical mechanical polishing is decisive. Generally speaking, the polishing liquid used in chemical mechanical polishing process is composed of abrasive particles, oxidizing agent, deionized water and additives, so these factors can be used to control the polishing effect.

[0005] In the existing chemical mechanical polishing process of silicon carbide wafer, the polishing liquid as consumables needs to be frequently filled to ensure the use of process flow. Although the existing polishing liquid filling operation mode can meet the basic operation requirements at present, there are still some deficiencies in the filling and storage and transportation process of polishing liquid.

[0006] Firstly, there is no polishing liquid filling device specially used for the chemical mechanical polishing machine in the silicon carbide manufacturing process, and the current polishing liquid filling operation process completely relies on the manual operation of the workers, and the operation efficiency is low.

[0007] Secondly, in the manual filling process, the existing polishing liquid monomer has a high weight, the liquid filling process is a pure manual lifting and filling process, the labor load of the workers is large, and the operation accuracy cannot be guaranteed during continuous filling operation.

[0008] In addition, in the polishing liquid filling process of the chemical mechanical polishing treatment, the stability of the manual filling operation is poor, which leads to the fact that the polishing liquid is easy to spill during the filling process, causing material waste, increasing the process cost, and causing pollution on the workbench and the ground around it after the filling is completed. Manual cleaning operation is required to increase the overall operation cycle time of the polishing liquid filling, resulting in low efficiency of the polishing liquid filling process.

[0009] Therefore, how to optimize the polishing liquid filling operation mode in the chemical mechanical polishing treatment process, improve the operation efficiency and operation accuracy, and make the filling operation process more stable and controllable, while avoiding material waste and environmental pollution caused by polishing liquid spilling is an important technical problem to be solved by those skilled in the art. Practical new type content

[0010] The purpose of the present application is to provide a chemical mechanical polishing machine polishing liquid filling device which can effectively improve the filling operation efficiency and operation accuracy of the polishing liquid, make the filling process more stable and controllable, and effectively avoid the occurrence of polishing liquid spilling and the resulting material waste and environmental pollution.

[0011] To solve the above technical problems, the present application provides a chemical mechanical polishing machine polishing liquid filling device, which comprises a liquid storage tank storing polishing liquid, and a liquid supply assembly capable of sending the polishing liquid from the liquid storage tank to the chemical mechanical polishing machine.

[0012] Preferably, the liquid supply assembly comprises a liquid filling gun adapted to the chemical mechanical polishing machine and a liquid suction pipe communicated between the liquid filling gun and the liquid storage tank.

[0013] Preferably, the liquid supply assembly further comprises a liquid suction pump capable of driving the polishing liquid in the liquid suction pipe into the chemical mechanical polishing machine.

[0014] Preferably, the liquid suction pump is communicated with the liquid suction pipe.

[0015] Preferably, the liquid suction pump is communicated with the liquid filling gun.

[0016] Preferably, a tool car is further included, a bottom of the tool car is provided with a walking mechanism, and the liquid storage tank and the liquid supply assembly are both movably arranged on the tool car.

[0017] Preferably, a temporary storage box is detachably arranged on the tool car, and an inner portion of the temporary storage box has a temporary storage cavity capable of accommodating the liquid supply assembly.

[0018] Preferably, the bottom of the tool car has a horizontally arranged tray, the liquid storage tank is fixed on the tray, one end of the tray is provided with a support arranged in a vertical direction, and the temporary storage box is detachably arranged at a middle portion of the support and above the liquid storage tank.

[0019] Preferably, a top surface of the tray is protrusively provided with a plurality of protective plates, the protective plates are located at outer edge portions of the tray, and each of the protective plates extends along a circumferential direction of the tray and is connected to a tail end of the protective plate.

[0020] Preferably, a top end of the support is provided with a handle.

[0021] With the above background, the chemical mechanical polishing machine polishing liquid filling device provided by the present application can store the polishing liquid in the liquid storage tank, and when it is necessary to fill the polishing liquid into the chemical mechanical polishing machine, the staff can operate the liquid supply assembly to connect the liquid storage tank with a polishing liquid containing space of the chemical mechanical polishing machine, and then the liquid supply assembly can continuously deliver the polishing liquid in the liquid storage tank into the chemical mechanical polishing machine until the polishing liquid filled in the chemical mechanical polishing machine meets the current working condition requirement, and then the polishing liquid delivery work of the liquid supply assembly can be stopped to complete the single-time polishing liquid filling operation. The chemical mechanical polishing machine polishing liquid filling device can smoothly realize the filling of the polishing liquid into the chemical mechanical polishing machine through the cooperation of the liquid storage tank and the liquid supply assembly, and the staff does not need to lift and carry the tank body or the storage tank and other polishing liquid storage devices during the whole filling process, thereby greatly reducing the labor intensity of the staff and making the polishing liquid filling operation process more simple and efficient. The filling operation is completely realized by the liquid supply assembly, the operation process is stable and controllable, the operation precision of the polishing liquid filling process is effectively improved, the problems of material waste and environmental pollution caused by the spilling of the polishing liquid to the work station work surface and the like are avoided, the staff does not need to frequently implement the work station cleaning treatment, and thus the labor intensity of the staff is further reduced, and the whole polishing liquid filling process is more simple and efficient.

[0022] In another preferred scheme of the utility model, the liquid supply assembly comprises a liquid filling gun matched with the chemical mechanical polishing machine and a liquid suction pipe communicated between the liquid filling gun and the liquid storage tank. In the actual implementation of the polishing liquid filling operation, the liquid filling gun can be held and operated by the staff to realize the conduction and blockage of the liquid suction pipe, so that the continuous conveying or stopping of the polishing liquid in the liquid storage tank to the chemical mechanical polishing machine through the liquid suction pipe is realized to meet the corresponding working condition requirements. The structure of the liquid suction pipe is simple, the material conduction is smooth and efficient, the operation of the liquid filling gun is convenient and reliable, the labor intensity of the staff can be further reduced, and the filling operation convenience and operation efficiency of the polishing liquid are improved. BRIEF DESCRIPTION OF DRAWINGS

[0023] In order to more clearly illustrate the technical scheme in the embodiments of the utility model or the prior art, the drawings needed to be used in the following embodiment or prior art description will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor on the basis of these drawings.

[0024] Figure 1 The shaft drawing of the chemical mechanical polishing machine polishing liquid filling device provided in the specific embodiment of the utility model is shown in the figure.

[0025] Figure 2 The front view of the chemical mechanical polishing machine polishing liquid filling device provided in the specific embodiment of the utility model is shown in the figure. Figure 1

[0026] Figure 3 The top view of the chemical mechanical polishing machine polishing liquid filling device provided in the specific embodiment of the utility model is shown in the figure. Figure 1

[0027] Figure 4 The side view of the chemical mechanical polishing machine polishing liquid filling device provided in the specific embodiment of the utility model is shown in the figure. Figure 1

[0028] Among them:

[0029] 11-liquid storage tank;

[0030] 12-liquid filling gun;121-liquid suction pipe;

[0031] 13-tool car;131-traveling mechanism;132-temporary storage box;133-temporary storage cavity;134-tray;135-bracket;136-guard plate;137-control handle;138-radiating hole. DETAILED DESCRIPTION

[0032] The core of the utility model is to provide a kind of chemical mechanical polishing machine polishing liquid filling device, which can effectively improve the filling operation efficiency and operation precision of polishing liquid, make its filling process more stable and controllable, and effectively avoid the occurrence of polishing liquid spilling and the resulting material waste and environmental pollution etc.​​​

[0033] In order to make the person skilled in the art better understand the scheme of the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments.

[0034] It should be noted that in the present application, unless otherwise explicitly specified and limited, the terms "mounting", "connecting", "connecting", "fixing" and the like should be understood broadly, for example, it can be fixedly connected, or it can be detachably connected, or integrally connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the communication between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0035] In addition, in the present application, unless otherwise explicitly specified and limited, the first feature "on" or "under" the second feature can include that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact through another feature between them.

[0036] In addition, the first feature "on", "above" and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or only indicates that the horizontal height of the first feature is higher than that of the second feature. The first feature "under", "below" and "under" the second feature includes that the first feature is directly below and obliquely below the second feature, or only indicates that the horizontal height of the first feature is less than that of the second feature. The orientation or positional relationship indicated by the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0037] Please refer to Figures 1 to 4 .

[0038] In the specific embodiment, the chemical mechanical polishing machine polishing liquid filling device provided by the present application comprises a liquid storage tank 11 storing polishing liquid, and further comprises a liquid supply assembly capable of sending the polishing liquid from the liquid storage tank 11 to the chemical mechanical polishing machine.

[0039] In the specific operation process, the polishing liquid is stored in the storage tank 11. When it is necessary to fill the polishing liquid into the chemical mechanical polishing machine, the staff can operate the liquid supply assembly to connect the storage tank 11 with the polishing liquid containing space of the chemical mechanical polishing machine. Then, the liquid supply assembly can continuously deliver the polishing liquid in the storage tank 11 into the chemical mechanical polishing machine until the polishing liquid filled in the chemical mechanical polishing machine meets the current working condition requirement. Then, the polishing liquid delivery work of the liquid supply assembly can be stopped to complete the single filling operation of the polishing liquid.

[0040] The polishing liquid filling device of the chemical mechanical polishing machine can smoothly realize the filling of the polishing liquid into the chemical mechanical polishing machine through the cooperation of the storage tank 11 and the liquid supply assembly. During the whole filling process, the staff does not need to lift and carry the tank body or the storage tank and other polishing liquid storage devices, thereby greatly reducing the labor intensity of the staff and making the polishing liquid filling operation process more simple and efficient. The filling operation is completely realized by the liquid supply assembly, and the operation process is stable and controllable, which effectively improves the operation precision of the polishing liquid filling process, avoids the occurrence of the situation that the polishing liquid is spilled due to the need to carry the polishing liquid storage device in the prior art, and thereby eliminates the problems of material waste and environmental pollution caused by the spilling of the polishing liquid to the work station work surface and the like. The staff does not need to frequently implement the work station cleaning treatment, thereby further reducing the labor intensity of the staff, and the whole polishing liquid filling process is more simple and efficient.

[0041] Specifically, the liquid supply assembly includes a liquid filling gun 12 matched with the chemical mechanical polishing machine and a liquid suction pipe 121 communicated between the liquid filling gun 12 and the storage tank 11. In the actual implementation of the polishing liquid filling operation, the staff can hold and operate the liquid filling gun 12 to realize the conduction and blockage of the liquid suction pipe 121, so as to realize the continuous delivery or stop of the polishing liquid in the storage tank 11 into the chemical mechanical polishing machine through the liquid suction pipe 121 to meet the corresponding working condition requirement. The structure of the liquid suction pipe 121 is simple, the material conduction is smooth and efficient, and the operation of the liquid filling gun 12 is convenient and reliable, which can further reduce the labor intensity of the staff and improve the filling operation convenience and operation efficiency of the polishing liquid.

[0042] Generally, the liquid supply assembly further includes a liquid suction pump capable of guiding the polishing liquid in the liquid suction pipe 121 into the chemical mechanical polishing machine. The liquid suction pump can stably pump the polishing liquid in the storage tank 11 into the chemical mechanical polishing machine through the liquid suction pipe 121 during operation, so as to further improve the filling and delivery efficiency and operation stability of the polishing liquid.

[0043] Correspondingly, the liquid pumping device is communicated with the liquid pumping pipe 121. That is, the liquid pumping device can be directly communicated and arranged on the effective conveying path of the liquid pumping pipe 121, so that the liquid pumping device can be reliably communicated and matched with the liquid pumping pipe 121, the pumping efficiency of the polishing liquid is improved, and the cooperative effect of the liquid pumping device and the liquid pumping pipe 121 is ensured.

[0044] In addition, the liquid pumping device can also be communicated and arranged on the liquid adding gun 12. In this way, the liquid pumping device can be linked and controlled by the liquid adding gun 12, so as to realize flexible control of starting and stopping of the liquid pumping device, so as to further improve the operation efficiency and control precision of the polishing liquid filling device of the chemical mechanical polisher.

[0045] Of course, the liquid pumping device can also be replaced by other pumping devices or power devices capable of conveying liquid materials. In principle, as long as the actual application needs of the polishing liquid filling device of the chemical mechanical polisher can be met.

[0046] On the other hand, the polishing liquid filling device of the chemical mechanical polisher further comprises a tool trolley 13, the bottom of the tool trolley 13 is provided with a walking mechanism 131, and the liquid storage tank 11 and the liquid supply assembly are linked and arranged on the tool trolley 13. The walking mechanism 131 can be used to timely move the tool trolley 13 to different stations, so as to match the station of the chemical mechanical polisher which needs to be filled with polishing liquid under the current working condition, so as to further improve the filling efficiency and operation precision of the polishing liquid, reduce the storage and filling operation difficulty of the polishing liquid, avoid the spilling of the polishing liquid during the storage and filling process, and reduce the labor intensity of the workers.

[0047] Generally, the walking mechanism 131 can be a universal wheel corresponding to each corner and edge of the bottom of the tool trolley 13, or a directional wheel or other mechanism can be selected as the specific application type of the walking mechanism 131 under the condition that the working condition allows. In principle, as long as the actual application needs of the polishing liquid filling device of the chemical mechanical polisher can be met.

[0048] On this basis, the tool trolley 13 is detachably provided with a temporary storage box 132, and the temporary storage box 132 has a temporary storage cavity 133 capable of accommodating the liquid supply assembly. When the filling work is completed or no filling work is needed, the related matched parts of the liquid supply assembly can be stored in the temporary storage cavity 133, so as to centrally store and arrange the related parts of the liquid supply assembly, avoid the structural interference or collision between the related matched parts of the liquid supply assembly and other matched parts of the tool trolley 13, and further avoid the non-working damage of the matched parts of the liquid supply assembly. When the polishing liquid filling work needs to be carried out, the related matched parts of the liquid supply assembly can be taken out from the temporary storage cavity 133, and the filling work can be carried out accordingly.

[0049] Further, the bottom of the tool trolley 13 is provided with a horizontal tray 134, the liquid storage tank 11 is fixed on the tray 134, one end of the tray 134 is provided with a vertical support 135, the temporary storage box 132 is detachably arranged at the middle of the support 135, and the temporary storage box 132 is above the liquid storage tank 11. The support 135 can provide reliable structural support and sufficient arrangement space for the temporary storage box 132 and the matching components such as the liquid supply assembly. Correspondingly, the tray 134 can also provide stable and reliable structural support for the liquid storage tank 11, thereby further improving the assembly structure strength of the chemical mechanical polishing machine polishing liquid filling device and making the storage and transportation operation of the tool trolley 13 and the components thereon more stable and efficient.

[0050] Generally, the top surface of the tray 134 is protrudingly provided with a plurality of guard plates 136, the guard plates 136 are located at the outer edge of the tray 134, and each guard plate 136 extends along the circumference of the tray 134 and is connected end to end. Each guard plate 136 cooperates and fits to form reliable structural protection and lateral structural support for the outer periphery of the tray 134, thereby effectively protecting the liquid storage tank 11 on the tray 134 from lateral structural damage and providing moderate structural limitation, avoiding the liquid storage tank 11 from loosening, mispositioning or falling off the tray 134, thereby further ensuring the structural stability and operation reliability of the chemical mechanical polishing machine polishing liquid filling device.

[0051] Correspondingly, the top end of the support 135 is provided with a trolley handle 137. In actual operation, the worker can hold the trolley handle 137 to push or pull the tool trolley 13 as a whole to the corresponding station, so that the movement and arrangement of the tool trolley 13 and the matching components arranged thereon are more flexible and controllable, and the operation efficiency and control accuracy are higher, so as to further optimize the related polishing liquid filling operation effect of the chemical mechanical polishing machine.

[0052] In addition, in actual assembly application, the material of the tool trolley 13 main structure and the related matching components such as the tray 134, the support 135, the guard plate 136 and the trolley handle 137 is preferably stainless steel, so as to utilize the high structural strength and corrosion resistance of the stainless steel parts to ensure the working condition resistance and structural reliability of the chemical mechanical polishing machine polishing liquid filling device, and the fatigue strength is correspondingly improved, which is more durable in actual application.

[0053] In addition, in actual application, the bottom thickening structure and the side thickening structure can be arranged on the main body structure of the tool car 13 or the matching shell structure of the liquid storage tank 11, so as to further improve the matching bearing structure strength of the liquid storage tank 11 and the tool car 13. The pipeline adaptive opening and the integrated heat dissipation hole 138, the control switch, the charging port and other matching modules and the corresponding sealing design structure can be arranged at the relevant structure of the tool car 13, so as to meet the equipment application requirements under different working conditions, and improve the working condition adaptability and operation safety of the chemical mechanical polishing machine filling device.

[0054] As can be seen from the above, the chemical mechanical polishing machine polishing liquid filling device provided in the utility model comprises a liquid storage tank storing polishing liquid, and further comprises a liquid supply assembly capable of sending the polishing liquid from the liquid storage tank to the chemical mechanical polishing machine. In the operation process, the polishing liquid is stored in the liquid storage tank, and when it is necessary to fill the polishing liquid into the chemical mechanical polishing machine, the liquid supply assembly can be operated by the staff to connect the liquid storage tank with the polishing liquid containing space of the chemical mechanical polishing machine, and then the polishing liquid in the liquid storage tank can be continuously supplied into the chemical mechanical polishing machine by the liquid supply assembly until the polishing liquid filled in the chemical mechanical polishing machine meets the current working condition requirement, and then the polishing liquid supply work of the liquid supply assembly can be stopped to complete the single polishing liquid filling operation. The chemical mechanical polishing machine polishing liquid filling device cooperates with the liquid storage tank and the liquid supply assembly to smoothly realize the filling of the polishing liquid into the chemical mechanical polishing machine, and the staff does not need to lift and carry the tank body or the polishing liquid storage device such as a storage tank during the whole filling process, so that the labor intensity of the staff is greatly reduced, and the polishing liquid filling operation process is more simple and efficient. The filling operation is completely realized by the liquid supply assembly, the operation process is stable and controllable, the operation precision of the polishing liquid filling process is effectively improved, the situation that the polishing liquid is spilled due to the need to carry the polishing liquid storage device in the prior art is avoided, and thus the problems of material waste and environmental pollution caused by the spilling of the polishing liquid to the work position operating surface and the like are eliminated. The staff does not need to frequently implement work position cleaning treatment, so that the labor intensity of the staff is further reduced, and the whole polishing liquid filling process is more simple and efficient.

[0055] The chemical mechanical polishing machine polishing liquid filling device provided in the utility model is described in detail above. The principles and implementation modes of the utility model are described by applying specific examples in this paper. The description of the above examples is only used to help understand the method and core idea of the utility model. It should be pointed out that the utility model can be improved and modified in many ways without departing from the principles of the utility model, and these improvements and modifications also fall within the protection scope of the utility model claims.

Claims

1. A slurry filling device for a chemical mechanical polishing machine, characterized in that, The polishing liquid storage tank is connected with a liquid supply assembly which is capable of sending the polishing liquid from the polishing liquid storage tank to a chemical mechanical polishing machine. The liquid supply assembly comprises a liquid supply gun which is adapted to the chemical mechanical polishing machine and a liquid suction pipe which is connected between the liquid supply gun and the polishing liquid storage tank.

2. The chemical mechanical polisher polishing solution filling device according to claim 1, wherein The liquid suction pump is connected with the liquid suction pipe.

3. The chemical mechanical polisher polishing solution filling apparatus according to claim 1, wherein The liquid suction pump is connected with the liquid supply gun.

4. The chemical mechanical polisher polishing solution filling apparatus according to claim 1, wherein The polishing liquid storage tank and the liquid supply assembly are movably arranged on a tool trolley.

5. The chemical mechanical polisher polishing solution filling apparatus according to claim 4, wherein The tool trolley is detachably provided with a temporary storage box which has a temporary storage cavity capable of accommodating the liquid supply assembly.

6. The chemical mechanical polisher polishing solution filling apparatus of claim 5, wherein The tool trolley is provided with a horizontal tray at the bottom, the polishing liquid storage tank is fixed on the tray, one end of the tray is provided with a vertical support, and the temporary storage box is detachably arranged on the middle part of the support and above the polishing liquid storage tank.

7. The chemical mechanical polisher polishing solution filling apparatus according to claim 6, wherein The top surface of the tray is provided with a plurality of protective plates which are located at the outer edge of the tray and extend along the circumference of the tray and are connected end to end.

8. The chemical mechanical polisher polishing solution filling apparatus of claim 6, wherein The top end of the support is provided with a handle.

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