Production line transmission robot for wafer cutting

By using a synchronous wheel and bidirectional lead screw driven by servo motors and stepper motors, the cross motion of the production line transfer robot for wafer dicing is realized, which solves the problem of low loading and unloading efficiency in the existing technology, improves the continuity and stability of wafer dicing, and enhances the production efficiency of the entire production line.

CN223904075UActive Publication Date: 2026-02-13BEIJING IC-EAST SEMICONDUCTOR TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202520482490.7
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-03-19
Publication Date
2026-02-13
Estimated Expiration
2035-03-19

AI Technical Summary

Technical Problem

Existing wafer dicing production line transfer robots are inefficient and lack continuity during loading and unloading, affecting the overall production efficiency of the production line.

Method used

The system employs a servo motor to drive the synchronous wheel and a stepper motor to drive the bidirectional lead screw, enabling the moving seat to move in a cross motion. This allows for the simultaneous unloading of cut wafers and loading of uncut wafers. Combined with the design of the clamping plate and rollers, the system ensures the stability and continuity of the cutting process.

Benefits of technology

It improves the continuity and efficiency of wafer dicing, ensures the stability and continuity of the wafer dicing process, and enhances the production efficiency of the entire production line.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a production line transmission robot for wafer cutting, and relates to the technical field of wafer cutting. Sliding rails are fixedly connected to the two sides of the top end of the U-shaped seat, a first moving seat is clamped between the top ends of the two sliding rails in a sliding mode, two transverse plates are fixedly connected to the bottom end of the inner wall of the U-shaped seat, a sliding plate is clamped between the top ends of the two transverse plates in a sliding mode, and a second moving seat is arranged at the top end of the sliding plate. The bottom end of the second moving seat is fixedly connected with a guide plate. A servo motor drives one of the synchronous wheels to rotate forwards and backwards, the outer sides of the two synchronous wheels are in transmission connection through a synchronous belt, the two synchronous wheels are driven to rotate synchronously at the same time, the first moving seat and the second moving seat are driven to move in a crossed mode, and therefore the cut wafer body can be discharged, and meanwhile the cutting efficiency is improved. And the uncut wafer bodies are fed, so that the wafer cutting continuity is improved, and the wafer cutting efficiency is improved.
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Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cutting technical field, concretely is a wafer cutting production line transmission robot. BACKGROUND

[0002] In the semiconductor manufacturing industry, wafer cutting is a crucial process, which directly affects the quality and performance of subsequent chips, and the transmission robot in the wafer cutting production line is responsible for transmitting wafers from one process to the next process, especially in the loading and unloading process, its efficiency and continuity have a decisive influence on the production efficiency of the whole production line.

[0003] However, at present, the wafer cutting production line transmission robot commonly used in the market usually only sets one station when loading and unloading wafers, and when loading the uncut wafers, the robot must first take down the cut wafers from the workbench, and then put the new uncut wafers, which leads to poor continuity of the whole cutting process and further reduces the cutting efficiency. To solve the above problems, the inventor proposes a wafer cutting production line transmission robot to solve the above problems. UTILITY MODEL CONTENTS

[0004] In order to solve the problem of wafer continuous loading in wafer cutting production line, the utility model aims at providing a wafer cutting production line transmission robot.

[0005] To solve the above technical problems, the utility model adopts the following technical scheme: a wafer cutting production line transmission robot, comprising a U-shaped seat, both sides of the top end of the U-shaped seat are fixedly connected with slide rails, a moving seat one is slidably connected between the top ends of the two slide rails, two horizontal plates are fixedly connected to the bottom end of the inner wall of the U-shaped seat, a sliding plate is slidably connected between the top ends of the two horizontal plates, a moving seat two is arranged at the top end of the sliding plate, a guide plate is fixedly connected to the bottom end of the moving seat two, a roller is rotatably connected to the bottom end of the guide plate and movably penetrates the sliding plate, a fixed plate one is fixedly connected to the bottom end of the inner wall of the U-shaped seat and between the two horizontal plates, a guide groove is formed in the fixed plate one, the roller is slidably connected in the guide groove, a support seat is fixedly connected to the middle part of the top end of the moving seat one and the moving seat two, and a wafer body is placed on the support seat.

[0006] Preferably, two fixing plates are fixedly connected to both sides of the top of the second and first movable seats. A bidirectional lead screw is rotatably connected between one side of the two fixing plates. Two symmetrically distributed clamping plates are threaded to the outer side of the bidirectional lead screw. The wafer body is limited and fixed between the two clamping plates. A sliding rod is fixedly connected between the two fixing plates at a position symmetrical to the bidirectional lead screw. The clamping plates are slidably engaged with the outer side of the sliding rod. Guide rods are fixedly connected to the four corners of the bottom of the second movable seat. The bottom ends of the guide rods movably pass through the sliding plate. V-shaped grooves are opened on opposite sides of the clamping plates. The inner wall of the V-shaped grooves fits against the side of the wafer body.

[0007] Preferably, two symmetrically distributed synchronous pulleys are rotatably connected to one side of the inner wall of the U-shaped seat, and a synchronous belt is driven between the outer sides of the two synchronous pulleys. A connecting frame is fixedly connected between the bottom end of the movable seat and the slide plate, and the connecting frame is connected to the top and bottom of the synchronous belt respectively.

[0008] Preferably, a stepper motor is fixedly installed on one side of the second fixing plate, and the driving end of the stepper motor is fixedly connected to a bidirectional lead screw. A servo motor is fixedly installed on one side of the U-shaped seat, and the driving end of the servo motor is fixedly connected to the rotation shaft of one of the synchronous pulleys.

[0009] Compared with the prior art, the beneficial effects of this utility model are as follows:

[0010] 1. A servo motor drives one of the synchronous pulleys to rotate in both directions. The two synchronous pulleys are connected by a synchronous belt, which drives the two synchronous pulleys to rotate synchronously. This causes the moving seats 1 and 2 to move in opposite directions. This allows for the simultaneous feeding of uncut wafers while unloading cut wafers, improving the continuity of wafer cutting and thus increasing wafer cutting efficiency.

[0011] 2. By placing the wafer body on the top of the support base, and then driving the bidirectional lead screw to rotate by the stepper motor, the clamping plates are guided by the slide bar. At the same time, the two clamping plates move along the outside of the slide bar to one side of the wafer body, and the wafer body is positioned by the two clamping plates, thereby ensuring the stability of the cutting. Attached Figure Description

[0012] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0013] Figure 1 This is a schematic diagram of the overall structure of this utility model.

[0014] Figure 2 This is a schematic cross-sectional view of the present invention. Figure One .

[0015] Figure 3 This is a schematic cross-sectional view of the present invention. Figure Two .

[0016] Figure 4 This is a schematic diagram of a partial structure of the present invention. Figure One .

[0017] Figure 5 This is a schematic diagram of a partial structure of the present invention. Figure Two .

[0018] In the diagram: 1. U-shaped seat; 2. Slide rail; 3. Movable seat one; 4. Horizontal plate; 5. Slide plate; 6. Movable seat two; 7. Guide plate; 8. Roller; 9. Fixed plate one; 10. Guide groove; 11. Support seat; 12. Wafer body; 13. Fixed plate two; 14. Bidirectional lead screw; 15. Clamping plate; 16. V-groove; 17. Slide rod; 18. Stepper motor; 19. Synchronous pulley; 20. Synchronous belt; 21. Connecting frame; 22. Servo motor; 23. Guide rod. Detailed Implementation

[0019] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0020] Example: Figures 1-5 As shown, this utility model provides a production line transfer robot for wafer dicing, including a U-shaped base 1. Slide rails 2 are fixedly connected to both sides of the top of the U-shaped base 1. A movable base 3 is slidably engaged between the tops of the two slide rails 2. Two horizontal plates 4 are fixedly connected to the bottom of the inner wall of the U-shaped base 1. A sliding plate 5 is slidably engaged between the tops of the two horizontal plates 4. A movable base 6 is provided at the top of the sliding plate 5. A guide plate 7 is fixedly connected to the bottom of the movable base 6. The bottom of the guide plate 7 movably passes through the sliding plate 5 and is rotatably connected to a roller 8. A fixed plate 9 is fixedly connected to the bottom of the inner wall of the U-shaped base 1 and located between the two horizontal plates 4. A guide groove 10 is provided on the fixed plate 9. The roller 8 is slidably engaged in the guide groove 10. A support base 11 is fixedly connected to the middle of the top of both the movable base 3 and the movable base 6. A wafer body 12 is placed on the support base 11.

[0021] The two sides of the top of the moving seat two 6 and the moving seat one 3 are fixedly connected with the fixed plates two 13, the two sides of the two fixed plates two 13 are rotatably connected with the bidirectional screw rods 14, the outer sides of the bidirectional screw rods 14 are threadedly connected with the two clamping plates 15 which are symmetrically distributed, the wafer body 12 is fixedly limited between the two clamping plates 15, the two fixed plates two 13 are fixedly connected with the slide rods 17 at the symmetric positions of the bidirectional screw rods 14, and the clamping plates 15 are slidably connected to the outer sides of the slide rods 17.

[0022] By adopting the above technical scheme, through the rotation of the bidirectional screw rods 14, the slide rods 17 are used for guiding the clamping plates 15, and the two clamping plates 15 are moved to the sides away from or close to each other along the outer sides of the slide rods 17, after the wafer body 12 is placed on the top of the support seat 11, the wafer body 12 is positioned by the two clamping plates 15, so that the stability of cutting is ensured.

[0023] The bottom of the moving seat two 6 is fixedly connected with the guide rods 23, and the bottom of the guide rods 23 is movably penetrated through the slide plate 5.

[0024] By adopting the above technical scheme, the vertical movement of the moving seat two 6 is guided by the guide rods 23, so that the stability of the vertical movement of the moving seat two 6 is improved.

[0025] The inner wall of the U-shaped seat 1 is rotatably connected with the two synchronous wheels 19 which are symmetrically distributed, the outer sides of the two synchronous wheels 19 are drivingly connected with the synchronous belt 20, and the bottom of the moving seat one 3 and the slide plate 5 are fixedly connected with the connecting frames 21 which are connected with the upper and lower parts of the synchronous belt 20 respectively.

[0026] By adopting the above technical scheme, when one of the synchronous wheels 19 rotates in the opposite direction, the outer sides of the two synchronous wheels 19 are drivingly connected through the synchronous belt 20, and the two synchronous wheels 19 are driven to rotate synchronously, so that the two connecting frames 21 are driven to move in the opposite directions, and the moving seat one 3 and the moving seat two 6 are driven to cross each other, and the continuous feeding operation of the wafer body 12 is realized.

[0027] The opposite sides of the clamping plates 15 are provided with the V-shaped grooves 16, and the inner wall of the V-shaped grooves 16 is matched with the side surface of the wafer body 12.

[0028] By adopting the above technical scheme, the wafer body 12 with different diameters can be stably clamped by the V-shaped grooves 16.

[0029] The one side of the fixed plate two 13 is fixedly connected with the stepping motor 18, the driving end of the stepping motor 18 is fixedly connected with the bidirectional screw rod 14, the one side of the U-shaped seat 1 is fixedly connected with the servo motor 22, and the driving end of the servo motor 22 is fixedly connected with the rotating shaft of one of the synchronous wheels 19.

[0030] By adopting the technical scheme, the step motor 18 and the servo motor 22 are arranged, so as to drive the bidirectional screw rod 14 and the synchronous wheel 19 to rotate respectively, thereby achieving the driving of the device.

[0031] Working principle: when the wafer is cut, the wafer body 12 is placed on the top end of the support seat 11, then the step motor 18 drives the bidirectional screw rod 14 to rotate, the slide rod 17 guides the clamping plate 15, and the two clamping plates 15 move along the outer side of the slide rod 17 to one side of the wafer body 12, so as to position the wafer body 12, thereby ensuring the stability of cutting.

[0032] Furthermore, when the wafer body 12 is fed, the servo motor 22 drives one of the synchronous wheels 19 to rotate forward and reversely, the two synchronous wheels 19 are connected through the synchronous belt 20, and the two synchronous wheels 19 are driven to rotate synchronously, so as to drive the moving seat one 3 and the moving seat two 6 to cross, which can feed the wafer body 12 which has not been cut while discharging the wafer body 12 which has been cut, thereby improving the continuity of wafer cutting; when the slide plate 5 moves horizontally along the top end of the fixed plate one 9, the movement of the roller 8 is guided by the guide groove 10; when the roller 8 moves from the horizontal section of the guide groove 10 to the inclined section of the guide groove 10, the moving seat two 6 moves horizontally and vertically at the same time, so that when the moving seat two 6 meets the moving seat one 3, the moving seat two 6 passes below the moving seat one 3, thereby ensuring the stability of operation.

[0033] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Therefore, if these modifications and variations of the present application belong to the scope of the claims of the present application and the equivalent technology, the present application also intends to include these modifications and variations.

Claims

1. A wafer cutting line transfer robot comprising a U-shaped base (1), characterized in that: Both sides of the top end of the U-shaped seat (1) are fixedly connected with slide rails (2), the top ends of the two slide rails (2) are slidably connected with a moving seat one (3), the bottom end of the inner wall of the U-shaped seat (1) is fixedly connected with two cross plates (4), the top ends of the two cross plates (4) are slidably connected with a sliding plate (5), the top end of the sliding plate (5) is provided with a moving seat two (6), the bottom end of the moving seat two (6) is fixedly connected with a guide plate (7), the bottom end of the guide plate (7) is movably penetrated through the sliding plate (5) and is rotatably connected with a roller (8), the bottom end of the inner wall of the U-shaped seat (1) and between the two cross plates (4) is fixedly connected with a fixed plate one (9), the fixed plate one (9) is provided with a guide groove (10), the roller (8) is slidably connected in the guide groove (10), the top ends of the moving seat one (3) and the moving seat two (6) are fixedly connected with support seats (11), the support seats (11) are placed with a wafer body (12).

2. A wafer dicing in-line transfer robot as claimed in claim 1, wherein, Both sides of the top end of the moving seat two (6) and the moving seat one (3) are fixedly connected with fixed plates two (13), one side between the two fixed plates two (13) is rotatably connected with a bidirectional screw rod (14), the outer side of the bidirectional screw rod (14) is threadedly connected with two symmetrical clamping plates (15), the wafer body (12) is limitingly fixed between the two clamping plates (15), the slide rods (17) are fixedly connected between the two fixed plates two (13) and the symmetrical positions of the bidirectional screw rod (14), the clamping plates (15) are slidably connected on the outer side of the slide rods (17).

3. A wafer dicing in-line transfer robot as recited in claim 1, wherein, The bottom end of the moving seat two (6) is fixedly connected with guide rods (23) at four corners, and the bottom ends of the guide rods (23) are movably penetrated through the sliding plate (5).

4. A wafer dicing in-line transfer robot as claimed in claim 2, wherein, One side of the inner wall of the U-shaped seat (1) is rotatably connected with two symmetrical synchronous wheels (19), the outer sides between the two synchronous wheels (19) are transmissionally connected with a synchronous belt (20), the bottom ends between the moving seat one (3) and the sliding plate (5) are fixedly connected with connecting frames (21), and the connecting frames (21) are connected with the upper and lower sides of the synchronous belt (20) respectively.

5. A wafer dicing in-line transfer robot as claimed in claim 2, wherein, Opposite sides of the clamping plates (15) are provided with V-shaped grooves (16), and the inner walls of the V-shaped grooves (16) are fitted with the side surfaces of the wafer body (12).

6. A wafer dicing in-line transfer robot as claimed in claim 4, wherein, One side of the fixed plate two (13) is fixedly installed with a stepping motor (18), the driving end of the stepping motor (18) is fixedly connected with the bidirectional screw rod (14), one side of the U-shaped seat (1) is fixedly installed with a servo motor (22), and the driving end of the servo motor (22) is fixedly connected with the rotating shaft of one of the synchronous wheels (19).