Soldering paste printing device for mainboard production

Abstract

The utility model relates to the technical field of surface mounting, in particular to a soldering paste printing device for mainboard production, which comprises a support frame, a first electric slide rail is mounted at the upper part of the support frame, a movable frame is mounted on the first electric slide rail in a sliding manner, an air cylinder is fixedly mounted on the movable frame, and a scraper is assembled at the tail end of a movable rod of the air cylinder. By means of the pressing mechanism composed of the push plate, the wedge-shaped block and the pressing plate, it is guaranteed that the main board is tightly attached to the bottom face of the screen template in the printing process, displacement or warping is avoided, printing consistency and accuracy are guaranteed, meanwhile, uniform and accurate smearing of soldering paste is facilitated, printing quality is improved, and the risks of poor printing and through printing are reduced; according to the device, intelligent control devices such as the electric sliding rail and the air cylinder are integrated, full-automatic operation of soldering paste printing is achieved, the printing speed is increased, manual intervention is reduced, the operation difficulty is lowered, and the device is particularly suitable for the large-scale and high-efficiency production environment.

Description

TECHNICAL FIELD

[0001] The utility model relates to surface mount technology field especially relates to a mainboard production is with solder paste printing device. BACKGROUND

[0002] In modern electronic manufacturing industry, surface mount technology is one of the key processes of manufacturing high performance, high density electronic products, one of the core steps of surface mount technology is solder paste printing, that is, the solder paste is accurately applied to the solder pad of the circuit board, so as to install and weld electronic components subsequently, the quality of solder paste printing directly affects the performance and reliability of the final product, therefore, it is crucial to develop efficient and accurate solder paste printing device.

[0003] The patent with the patent authorization announcement number CN203554805U discloses a solder paste manual silk screen table for surface mount technology, which is composed of a base and a frame covering the base, the frame is in contact with the base and a silk screen plate is embedded in the contact surface, and the outer edge of the silk screen plate is tightly matched with the inner edge of the frame. The silk screen plate adopts a three-layer structure design, including a first copper foil layer, an epoxy resin layer and a second copper foil layer, and a group of solder paste holes are engraved on it to realize the accurate outflow of solder paste. This design not only simplifies the equipment structure and reduces the production and maintenance cost, but also makes the device not limited by the site due to its small size and environmental protection characteristics, and is suitable for solder paste printing and production process of various surface mount printed circuit boards. In addition, the design of the solder paste hole can ensure the rapid and appropriate distribution of the solder paste, reduce material waste, almost not emit toxic and harmful substances, support the recycling of the silk screen plate, and embody the green and environmental protection concept. However, in actual application, the patent still has certain limitations. First, due to the lack of effective pressing mechanism, gaps may occur between the mainboard and the silk screen plate, thereby causing quality problems such as poor printing, position deviation or missing printing, affecting the printing precision and consistency. Secondly, the manual operation mode limits the printing speed, which is difficult to meet the demand of large-scale production, especially in the environment requiring high efficiency and large batch production, this limitation is particularly obvious.

[0004] Therefore, it is urgent to provide a solder paste printing device for mainboard production with mainboard pressing function and automation. UTILITY MODEL CONTENTS

[0005] In order to overcome the quality problems such as poor printing, position deviation or missing printing caused by the lack of effective pressing mechanism of the solder paste printing device in the prior art, and the shortcomings of slow printing speed and difficulty in meeting the demand of large-scale production caused by manual operation mode, the utility model provides a solder paste printing device for mainboard production with mainboard pressing function and automation.

[0006] To achieve the above problems, the utility model discloses the following technical schemes: a solder paste printing device for mainboard production, including support frame, the upper portion of support frame is installed with first electric slide rail, the mobile frame is slidably installed on first electric slide rail, the mobile frame is fixedly installed with pneumatic cylinder, the movable rod end of pneumatic cylinder is equipped with scraper, the support frame is fixedly installed with support frame, the bottom of support frame is provided with sliding slot, the sliding slot is slidably provided with silk screen template, the recess of the front side of support frame is provided with the symmetric distribution, and the front side of silk screen template is equipped with corresponding lug structure, the lower portion of support frame is fixedly connected with the symmetric distribution of hinged seat, the push board is hinged on the hinged seat, a plurality of telescopic tubes are fixedly connected on the support frame, and the telescopic tubes are slidably provided with the compression plate, and the compression plate is located below the silk screen template, the bottom of compression plate is fixedly connected with the symmetric distribution of wedge block, and the lower end of wedge block is in contact with the top of push board.

[0007] Further, the support frame is provided with a clamping groove on both sides, and the positioning plate is provided with a corresponding clamping block structure on both sides.

[0008] Further, the support frame is provided with a clamping groove on both sides, and the positioning plate is provided with a corresponding clamping block structure on both sides.

[0009] Further, the mobile frame is provided with a mounting frame on the side, the mounting frame is provided with a storage frame, the top of storage frame is provided with a sealing cover, the bottom of storage frame is provided with a solenoid valve, the outlet of solenoid valve is connected with a material guide pipe, and the lower end of material guide pipe extends above the silk screen template.

[0010] Further, the scraper is provided with a silica gel sleeve.

[0011] Further, the lug structure is provided with a clamping block, and the bottom of clamping block is clamped with the recess.

[0012] Compared with the prior art, the utility model has the following technical effects: 1, the compression mechanism composed of push plate, wedge block and compression plate ensures that the mainboard is closely attached to the bottom surface of the silk screen template during printing, avoids displacement or warping, ensures the consistency and accuracy of printing, helps to realize uniform and accurate application of solder paste, improves printing quality, reduces the risk of printing defects and missing printing, and in addition, the device integrates intelligent control devices such as electric slide rail and pneumatic cylinder, realizes full-automatic operation of solder paste printing, not only improves the printing speed, but also reduces manual intervention, reduces the operation difficulty, and is especially suitable for large-scale and high-efficiency production environment.

[0013] 2. The combination of the storage frame, the electromagnetic valve and the material guide pipe realizes the automatic supplement device of the solder paste, which can supplement the solder paste to the screen template at any time during the printing process, ensures the continuity of the printing process, reduces the manual intervention and improves the work efficiency.

[0014] 3. The second electric sliding rail drives the scraper to automatically clean the residual solder paste on the screen template after printing, effectively maintains the cleanliness of the screen template, reduces the workload of subsequent cleaning, shortens the equipment preparation time and further improves the overall production efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a three-dimensional structure schematic view of the utility model.

[0016] Figure 2 It is a three-dimensional sectional structure schematic view of the first electric sliding rail, the push plate and the pressing plate of the utility model.

[0017] Figure 3 It is a three-dimensional sectional structure schematic view of the support frame, the positioning plate and the buckle of the utility model.

[0018] Figure 4 It is a three-dimensional structure schematic view of the connecting frame, the second electric sliding rail and the scraper of the utility model.

[0019] Figure 5 It is a three-dimensional sectional structure schematic view of the mounting frame, the storage frame and the sealing cover of the utility model.

[0020] The reference signs are as follows: 1-support frame, 2-first electric sliding rail, 3-moving frame, 4-cylinder, 5-scraping knife, 6-support frame, 7-screen template, 8-hinge seat, 9-push plate, 10-telescopic cylinder, 11-pressing plate, 12-wedge block, 13-positioning plate, 14-buckle, 15-connecting frame, 16-second electric sliding rail, 17-scraper, 18-mounting frame, 19-storage frame, 20-sealing cover, 21-electromagnetic valve, 22-material guide pipe, 23-silicone sleeve, 24-clamp block. DETAILED DESCRIPTION

[0021] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only a part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all the other embodiments obtained by the ordinary skilled in the art without creative labor belong to the protection scope of the utility model.

[0022] Embodiment 1: please refer to Figures 1-3The utility model provides a kind of solder paste printing device for motherboard production, including support frame 1, first electric slide rail 2 is installed on the upper portion of support frame 1, mobile frame 3 is slidably installed on first electric slide rail 2, first electric slide rail 2 can drive mobile frame 3 to move along horizontal direction, air cylinder 4 is fixedly installed on mobile frame 3, the movable rod end of air cylinder 4 is equipped with doctor blade 5, for daub solder paste, support frame 6 is fixedly installed on support frame 1, the bottom of support frame 6 is equipped with slide groove, silk screen template 7 is slidably arranged on the slide groove, silk screen template 7 is slidably designed, convenient to take out and install, recess is equipped with the protruding block structure of corresponding left and right symmetry distribution on the front side of support frame 6, the protruding block structure is matched with recess, ensure that silk screen template 7 is closely connected with support frame 6, the protruding block structure is inserted with clamping block 24, the bottom of clamping block 24 is engaged with recess, further reinforce the position of silk screen template 7, prevent silk screen template 7 from shifting during operation, hinged seat 8 of left and right symmetry distribution is fixedly connected on the lower portion of support frame 1, push plate 9 is hinged on hinged seat 8, support frame 1 is fixedly connected with four peripherally distributed telescopic cylinders 10, four telescopic cylinders 10 are slidably provided with compression plate 11 in common, compression plate 11 is located below silk screen template 7, the bottom of compression plate 11 is fixedly connected with the wedge-shaped block 12 of left and right symmetry distribution, the bottom of the wedge-shaped block 12 is contacted with push plate 9, when push plate 9 acts, can lift wedge-shaped block 12 and make compression plate 11 act upward, to realize the compression of motherboard.

[0023] First, suitable silk screen template 7 is slid into support frame 6 through slide groove, the protruding block of silk screen template 7 is clamped into the recess of the front side of support frame 6, and is reinforced using clamping block 24 to ensure that the template position is correct and stable, then, the motherboard to be printed with solder paste is placed on compression plate 11, push plate 9 on hinged seat 8 is pressed down, so that the wedge-shaped block 12 at the bottom of compression plate 11 is lifted up, compression plate 11 moves upward on telescopic cylinder 10, so that the motherboard is closely attached to the bottom surface of silk screen template 7, then continuously press push plate 9 to ensure that the motherboard is uniformly compressed, prevent displacement or warping during printing, thereby avoiding the problems of solder paste missing printing or mispositioning, so as to improve the printing quality, then, air cylinder 4 drives doctor blade 5 to move up and down, adjust to appropriate height, prepare to daub solder paste, and through first electric slide rail 2, mobile frame 3 can drive doctor blade 5 to move accurately along horizontal direction, so that doctor blade 5 daubs solder paste along the opening part of silk screen template 7, since there is a pre-designed pattern on silk screen template 7, solder paste will only be printed on the corresponding position of motherboard through these openings, after the motherboard is printed, release push plate 9, compression plate 11 moves downward and separates from the motherboard under the action of gravity, so as to release the pressure on the motherboard, so the operator can safely take out the motherboard that has been printed with solder paste, ready for the next process.

[0024] Embodiment 2: on the basis of embodiment 1, please refer to Figure 3 The support frame 6 is provided with a clamping groove on the left and right sides, and the positioning plate 13 is provided with a corresponding clamping block 24 structure on the left and right sides. The positioning plate 13 is clamped on the support frame 6 through the clamping block 24 structure. The clamping block 24 structure is inserted with a buckle 14. The bottom end of the buckle 14 is clamped with the clamping groove, further fixing the positioning plate 13, and ensuring that it will not be displaced during operation.

[0025] Before placing the main board, first install the positioning plate 13. Align the clamping block 24 structure on both sides of the positioning plate 13 with the clamping groove on both sides of the support frame 6, and push the positioning plate 13 upwards until the clamping block 24 is completely embedded in the clamping groove. When the positioning plate 13 is installed in place, insert the buckle 14 into the clamping block 24 structure, so that the bottom end of the buckle 14 is clamped with the clamping groove, thereby fixing the positioning plate 13. After the positioning plate 13 is installed, place the main board to be printed into the positioning plate 13, ensuring that the edges and corners of the main board are accurately aligned with the pads on the silk screen template 7. With the assistance of the positioning plate 13, the position deviation of the main board during placement can be effectively avoided, ensuring the consistency and accuracy of the printing quality.

[0026] Please refer to Figure 4 The support frame 6 is provided with a clamping groove on the left and right sides, and the positioning plate 13 is provided with a corresponding clamping block 24 structure on the left and right sides. The positioning plate 13 is clamped on the support frame 6 through the clamping block 24 structure. The clamping block 24 structure is inserted with a buckle 14. The bottom end of the buckle 14 is clamped with the clamping groove, further fixing the positioning plate 13, and ensuring that it will not be displaced during operation.

[0027] After the printed main board is taken out, the second electric sliding rail is started to drive the scraper 17 to move forward and backward, so as to timely scrape off the residual solder paste on the bottom surface of the silk screen template 7, achieving the purpose of cleaning. This step not only maintains the cleanliness of the silk screen template 7, avoids the residual solder paste adhering to the next main board, thereby improving the printing precision, but also reduces the subsequent cleaning workload, improving the work efficiency.

[0028] Please refer to Figure 5 The mounting frame 18 is fixed on the left side of the moving frame 3. The mounting frame 18 is provided with a storage frame 19 for storing solder paste. The storage frame 19 is provided with a sealing cover 20 at the top for closing the storage frame 19. The storage frame 19 is provided with an electromagnetic valve 21 at the bottom. The outlet of the electromagnetic valve 21 is connected with a material guide pipe 22, and the lower end of the material guide pipe 22 extends to above the silk screen template 7.

[0029] In the printing process, when the solder paste needs to be replenished, the electromagnetic valve 21 is opened, the solder paste in the storage frame 19 flows into the screen template 7 through the material guide pipe 22, automatic material adding is realized, the continuity and stability of the solder paste supply are ensured, and the printing quality problem caused by insufficient solder paste is avoided.

[0030] The above examples are only for illustrating the technical concept and characteristics of the utility model, and the purpose is to enable people skilled in the art to understand the content of the utility model and implement it, and cannot limit the protection scope of the utility model. Any equivalent changes or modifications made according to the spirit and essence of the utility model shall be covered within the protection scope of the utility model.

Claims

1. A solder paste printing device for motherboard production, comprising a support frame (1), a first electric slide rail (2) mounted on the upper part of the support frame (1), a movable frame (3) slidably mounted on the first electric slide rail (2), a cylinder (4) fixedly mounted on the movable frame (3), a scraper (5) assembled at the end of the movable rod of the cylinder (4), a support frame (6) fixedly mounted on the support frame (1), a groove is provided at the bottom of the support frame (6), a screen template (7) is slidably arranged on the groove, symmetrically distributed grooves are provided on the front side of the support frame (6), and corresponding protrusion structures are provided on the front side of the screen template (7), characterized in that, The lower part of the support frame (1) is fixedly connected with symmetrically distributed hinge seats (8), the hinge seats (8) are hingedly connected with push plates (9), a plurality of telescopic cylinders (10) are fixedly connected to the support frame (1), a plurality of the telescopic cylinders (10) are commonly and slidingly provided with a pressing plate (11), the pressing plate (11) is located below the wire mesh template (7), the bottom of the pressing plate (11) is fixedly connected with symmetrically distributed wedge blocks (12), the lower ends of the wedge blocks (12) are in contact with the top of the push plate (9).

2. The solder paste printing device for a main board production according to claim 1, characterized in that, The support frame (6) is provided with clamping grooves on both sides, the positioning plates (13) are provided with corresponding clamping blocks (24) on both sides, the positioning plates (13) are clamped on the support frame (6) through the clamping blocks (24), the clamping blocks (24) are inserted with buckles (14), and the bottom ends of the buckles (14) are clamped with the clamping grooves.

3. The solder paste printing device for a main board production according to claim 2, characterized in that, The bottom of the support frame (6) is fixedly connected with symmetrically distributed connecting frames (15), each of the connecting frames (15) is fixedly connected with a second electric sliding rail (16), and the second electric sliding rails (16) are commonly and slidingly provided with a scraper (17), and the scraper (17) is located below the wire mesh template (7).

4. The solder paste printing device for a main board production according to claim 3, characterized in that, The side of the moving frame (3) is fixedly connected with a mounting frame (18), the mounting frame (18) is installed with a storage frame (19), the top of the storage frame (19) is provided with a sealing cover (20), the bottom of the storage frame (19) is installed with an electromagnetic valve (21), the discharge port of the electromagnetic valve (21) is connected with a material guide pipe (22), and the lower end of the material guide pipe (22) extends above the wire mesh template (7).

5. The solder paste printing device for a main board production according to claim 4, characterized in that, The scraper (17) is sleeved with a silica gel sleeve (23).

6. The solder paste printing device for a main board production according to claim 5, characterized in that, The clamping blocks (24) are inserted into the convex block structures, and the bottoms of the clamping blocks (24) are clamped with the grooves.

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