Shell structure of semiconductor cavity

Abstract

The utility model discloses a shell structure of a semiconductor cavity, which comprises a fixed column and a placing box, a placing groove is arranged in the placing box, the bottom of the inner wall of the placing groove is connected with a motor through a bolt, a telescopic rod is inserted into the output end of the motor, the top of the telescopic rod is connected with a placing plate through a bolt, and the placing plate is connected with the fixed column through a bolt. According to the shell structure of the semiconductor cavity, by means of the buffer plate and the spring, articles can be stably stored in the storage box, the lifting rod is controlled through the motor by means of the switch, and the lifting rod is driven to rotate by means of the lifting rod, so that the storage box is convenient to use, and the service life of the storage box is prolonged. According to the storage box, the storage box is simple in structure and convenient to use, a worker can conveniently place and take articles, the collision situation is effectively reduced to a certain degree, the service life of the storage box is well maintained, the device can store a plurality of articles at the same time through the fixing columns and the clamping grooves, and the independent storage box can be conveniently placed and taken through the clamping blocks and the fixing pins.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor, concretely is a kind of shell structure of semiconductor cavity. BACKGROUND

[0002] Semiconductor is a kind of material with the conductivity between conductor and insulator, and its characteristics can be changed by doping to realize the conduction of current carriers (electrons or holes), which is a kind of material that can control current flexibly.

[0003] The prior art patent document with the publication number CN216250655U provides: a semiconductor equipment sealing cavity, which is provided with an upper chamber, a lower chamber, a gas inlet interface, an automatic sealing door, a maintenance operation door and an exhaust pipe; the lower chamber is installed below the upper chamber, a mechanical sealing device is arranged at the connection position of the upper chamber and the lower chamber; the upper surface of the upper chamber is uniformly distributed with gas inlet interfaces, the automatic sealing door and the maintenance operation door are arranged on the side surface of the upper chamber; a differential pressure sensor is arranged on the side surface of the upper chamber; the exhaust pipe is installed on the bottom surface of the lower chamber, and an exhaust valve is arranged at the end of the exhaust pipe; the upper part of the upper chamber is provided with a gas inlet diffusion plate, and the lower part of the lower chamber is provided with an exhaust collection plate; the utility model can maintain good sealing performance, the internal environment of the cavity is separated from the external environment, the internal environment of the cavity can maintain high cleanliness, and after filling with protective gas, problems such as backflow and turbulent flow can be avoided, and the entry of external gas into the sealing cavity is reduced.

[0004] Although the device has many advantages, it still has the following problems: the internal space of the device is relatively deep, which is inconvenient for the staff to take when needed, and secondly, the storage structure of the device is relatively single, and it is difficult to meet the needs of multiple taking. CONTENT OF THE UTILITY MODEL

[0005] The purpose of this part is to outline some aspects of the embodiments of the utility model and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this part and the abstract of the specification and the utility model name to avoid obscuring the purpose of this part, the abstract of the specification and the utility model name, and such simplifications or omissions cannot be used to limit the scope of the utility model.

[0006] 1. Technical problem to be solved:

[0007] In order to solve the problems of deep internal space, inconvenience for staff to take when needed and single storage structure in the above-mentioned, the utility model is proposed.

[0008] Therefore, the purpose of the utility model is to provide a shell structure of semiconductor cavity, which aims to solve the problem of deep internal space and inconvenience for staff to take when needed as much as possible and to achieve the purpose of meeting various storage needs as much as possible.

[0009] 2. Technical solutions:

[0010] To solve the above technical problems, according to one aspect of the present application, the present application provides the following technical solutions:

[0011] A shell structure of a semiconductor cavity, which comprises a fixed column and a placing box, a placing groove is formed in the inside of the placing box, a motor is connected to the inner wall bottom of the placing groove through bolts, an extension rod is inserted into the output end of the motor, a placing plate is connected to the top of the extension rod through bolts, a buffer plate is arranged above the placing plate, springs are welded to the surface of the buffer plate, a fixed plate is welded to one end of the spring, the height of the extension rod is controlled by the motor, which facilitates the operation of the staff and reduces the working difficulty to a certain extent.

[0012] As a preferred scheme of the shell structure of the semiconductor cavity, the side of the placing box is connected to a switch in series with the motor through bolts, and the top of the placing box is connected to a cover plate through bearings. Through the structural design of the cover plate, the possibility of the semiconductor cavity being covered by external dust is reduced.

[0013] As a preferred scheme of the shell structure of the semiconductor cavity, one end of the placing box is connected to a clamping block through bolts, the surface of the fixed column is provided with a clamping groove, the length and width of the clamping groove and the clamping block are matched, a hole is formed in the top of the fixed column, a handle is arranged above the hole, a fixed pin is connected to the bottom of the handle through bolts, a fixed hole is formed in the inner wall bottom of the clamping groove, a fixed groove is formed in the inside of the clamping block, the diameter of the fixed hole, the diameter of the fixed pin, the diameter of the fixed groove, and the diameter of the hole and the fixed pin are matched. Through the clamping design of the clamping block and the clamping groove and the plug-in structure design between the fixed pin and the fixed hole and the fixed groove, the stability of the placing box is good.

[0014] As a preferred scheme of the shell structure of the semiconductor cavity, a vertical plate is connected to the top of the placing plate through bolts, the number of the vertical plates is multiple, and the vertical plates are distributed in an equidistant manner.

[0015] As a preferred scheme of the shell structure of the semiconductor cavity, a plurality of ventilation holes are formed in the bottom of the placing box, and the ventilation holes are distributed in an equidistant manner.

[0016] As a preferred scheme of the shell structure of the semiconductor cavity, the bottom of the fixing column is connected with a placing cavity through bolts, the number of the placing boxes is multiple, and the placing boxes are distributed in a ring shape.

[0017] As a preferred scheme of the shell structure of the semiconductor cavity, the side surface of the cover plate is provided with a square groove, the inner wall of the square groove is connected with a rubber strip, the top of the cover plate is provided with a semicircular groove, the inner wall of the placing groove is provided with a ring groove, and the inner wall of the ring groove is connected with a rubber ring.

[0018] 3. Beneficial effects:

[0019] Compared with the prior art, the shell structure of the semiconductor cavity has the beneficial effects that:

[0020] The shell structure of the semiconductor cavity can stably store the semiconductor cavity through the buffer plate and the spring, the staff can easily place and take the semiconductor cavity through the motor control of the lifting rod by the switch, the collision between the semiconductor cavity and the inner wall of the box body in the process of placing and taking is effectively reduced to some extent, and the service life of the semiconductor cavity is better maintained.

[0021] The shell structure of the semiconductor cavity can store multiple semiconductor cavities through the fixing column and the clamping groove, the staff can place and take the single placing box according to the actual situation through the clamping block and the fixing pin, and high work efficiency is better maintained to some extent. DRAWINGS

[0022] In order to more clearly illustrate the technical scheme of the embodiments of the utility model, the utility model will be described in detail below in combination with the drawings and detailed embodiments. Obviously, the drawings in the following description are only some embodiments of the utility model, and other drawings can be obtained by those skilled in the art without creative labor. Among them:

[0023] Figure 1 It is the whole structure schematic diagram of the shell structure of the semiconductor cavity of the utility model;

[0024] Figure 2 It is the fixing column structure explosion schematic diagram of the shell structure of the semiconductor cavity of the utility model;

[0025] Figure 3 It is the placing box structure schematic diagram of the shell structure of the semiconductor cavity of the utility model;

[0026] Figure 4The utility model discloses a shell structure's placement box structure's explosion schematic view of semiconductor cavity.

[0027] Mark explanation in drawing: 1, fixed column, 2, placement box, 3, placement groove, 4, switch, 5, cover plate, 6, square groove, 7, rubber strip, 8, semicircular groove, 9, rubber ring, 10, ring groove, 11, motor, 12, telescopic rod, 13, placement plate, 14, vertical board, 15, buffer plate, 16, spring, 17, fixed plate, 18, hole, 19, handle, 20, fixed pin, 21, clamping groove, 22, fixed hole, 23, clamping block, 24, fixed groove, 25, air vent, 26, placement cavity. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purpose, features and advantages of the utility model more obvious and easy to understand, the specific embodiment of the utility model is described in detail below with reference to the drawings.

[0029] The utility model is described in detail in combination with the schematic view, and in order to facilitate the description, the sectional view of the device structure will be partially enlarged without the general proportion when the embodiment of the utility model is described in detail, and the schematic view is only an example, which should not limit the scope of the utility model protection here. In addition, the three-dimensional spatial dimension of length, width and depth should be included in the actual manufacture.

[0030] The orientation or position relationship indicated in the term is based on the orientation or position relationship shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model.

[0031] The connection mode in the term should be understood broadly, for example, "connection" can be fixed connection, can also be detachable connection, or integrally connected, can be mechanical connection, can also be electrical connection, can be directly connected, can also be indirectly connected through an intermediate medium, and can be the communication inside two elements. For ordinary skilled persons in the art, the specific meaning of the above-mentioned term in the utility model can be understood according to the specific circumstances.

[0032] The embodiment of the utility model will be further described in detail below with reference to the drawings.

[0033] The utility model provides a kind of overall structure schematic diagram of the shell structure one embodiment of semiconductor cavity, comprising:

[0034] Please refer to Figures 1-4 The utility model provides a kind of technical scheme:

[0035] The utility model provides a shell structure of semiconductor cavity, including fixed column 1 and the placement box 2, the inside of placement box 2 is set up with the placement groove 3, the inner wall bottom of placement groove 3 is connected with motor 11 through bolt, the output end of motor 11 is inserted with telescopic rod 12, and the staff is convenient to place and take semiconductor cavity by controlling lifting rod through motor 11, the top of telescopic rod 12 is connected with placement plate 13 through bolt, the top of placement plate 13 is provided with buffer plate 15, spring 16 is welded on the surface of buffer plate 15, one end of spring 16 is welded with fixed plate 17, and the storage box is stably stored semiconductor cavity by buffer plate 15 and spring 16.

[0036] It is worth mentioning that, in order to better take and use the semiconductor cavity, specifically, the side of the placement box 2 is connected with the switch 4 of the electric series motor 11 through the bolt, and the top of the placement box 2 is connected with the cover plate 5 through the bearing. The height of the telescopic rod 12 is controlled by the switch 4, so that the staff can better take and use the semiconductor cavity.

[0037] Then, in order to better fix the placement box 2 outside the fixed column 1, specifically, one end of the placement box 2 is connected with the clamping block 23 through the bolt, the surface of the fixed column 1 is provided with the clamping groove 21, the length and width of the clamping groove 21 and the clamping block 23 are matched, the top of the fixed column 1 is provided with the hole 18, the top of the hole 18 is provided with the handle 19, the bottom of the handle 19 is connected with the fixed pin 20 through the bolt, the bottom of the inner wall of the clamping groove 21 is provided with the fixed hole 22, the inside of the clamping block 23 is provided with the fixed slot 24, the diameter of the fixed hole 22, the diameter of the fixed pin 20, the diameter of the fixed slot 24, the diameter of the hole 18 and the fixed pin 20 are matched, and the fixed pin 20 is inserted, so that the placement box 2 is better fixed outside the fixed column 1.

[0038] At the same time, in order to stably place the semiconductor cavity, specifically, the top of the placement plate 13 is connected with the vertical plate 14 through the bolt, the number of the vertical plate 14 is multiple, the vertical plate 14 is equidistantly distributed, and the semiconductor cavity is stably placed on the top of the placement plate 13 by the symmetrically distributed vertical plate 14 to a certain extent.

[0039] Further, in order to better dissipate the heat energy of the motor 11 during operation, specifically, the bottom of the placement box 2 is provided with the ventilation hole 25, the number of the ventilation hole 25 is multiple, and the ventilation hole 25 is equidistantly distributed. Through the multiple equidistantly distributed ventilation holes 25, the heat energy of the motor 11 during operation can be better dissipated.

[0040] It is worth noting that in order to better place multiple semiconductor cavities, specifically, the bottom of the fixing column 1 is connected with a placing cavity 26 through bolts, the number of the placing box 2 is multiple, the placing box 2 is in a ring distribution form, through the structural design of the multiple placing boxes 2, the device is convenient for better placing multiple semiconductor cavities.

[0041] Finally, in order to better increase the sealing effect inside the placing box 2, specifically, the side surface of the cover plate 5 is provided with a square groove 6, the inner wall of the square groove 6 is connected with a rubber strip 7, the top of the cover plate 5 is provided with a semicircular groove 8, the inner wall of the placing groove 3 is provided with a ring groove 10, the inner wall of the ring groove 10 is connected with a rubber ring 9, through the structural design of the rubber strip 7 and the rubber ring 9, the device is convenient for better increasing the sealing effect inside the placing box 2.

[0042] In addition, the circuits, electronic components and modules involved in the utility model are prior art, and those skilled in the art can realize them without further description, and the content protected by the utility model does not involve improvement of internal structure and method.

[0043] The device or equipment model involved in the present application can be as follows:

[0044] Motor: 31ZY.

[0045] In combination Figures 1-4 , the shell structure of the semiconductor cavity of the embodiment is used as follows:

[0046] 1: When the shell structure of the semiconductor cavity is used, the device needs to be moved to a suitable position, the staff can open the cover plate 5 through the bearing through the semicircular groove 8, the inside of the placing box 2 is provided with a placing groove 3, the switch 4 of the electric series motor 11 is connected with the side surface of the placing box 2 through bolts, the telescopic rod 12 on the top of the motor 11 in the placing groove 3 is lifted, so that the placing plate 13 is exposed, the semiconductor cavity is placed on the top of the placing plate 13, the switch 4 is pressed, and the cover plate 5 is covered, so that the storage is completed, the heat of the motor 11 is conveniently dissipated through the ventilation hole 25 at the bottom of the placing box 2, so that the service life of the semiconductor cavity is better maintained;

[0047] 2: when the device needs more stable storage of semiconductor cavity, after the placement plate 13 is lifted, the surface of the fixed plate 17 is welded with the spring 16, by applying force to the spring 16, the buffer plate 15 welded at one end of the spring 16 stands on both sides of the semiconductor cavity, through the vertical plate 14 connected by bolts on the top of the placement plate 13, it is beneficial to maintain the placement of the semiconductor cavity to further stabilize the placement, through the rubber strip 7 and the rubber ring 9 arranged inside the square groove 6 and the ring groove 10, it is convenient to increase the better sealing when storing the semiconductor, through the buffer plate 15 and the spring 16, the storage box can be more stable to store the semiconductor cavity, by using the switch 4 to control the lifting rod through the motor 11, it is convenient for the staff to place and take the semiconductor cavity, to a certain extent, it effectively reduces the collision between the semiconductor cavity and the inner wall of the box in the process of placing and taking;

[0048] 3: when the staff needs to take a certain storage box 2 alone, the staff can rotate the handle 19, so that the fixed pin 20 is taken out from the inside of the fixed hole 22, passes through the fixed slot 24 arranged in the inside of the clamping block 23 and the hole 18 on the surface of the fixed column 1, and places the fixed pin 20 aside, takes out the clamping block 23 from the inner wall of the clamping groove 21, and the staff can further operate according to the actual situation.

[0049] Although the present application has been described above with reference to the embodiments, various modifications can be made to it and equivalent components can be substituted for those in it without departing from the scope of the present application. In particular, each feature disclosed in the embodiments of the present application can be combined with any other feature disclosed in the embodiments of the present application, as long as there is no structural conflict. The combinations of these features have not been described in the present specification only because of the consideration of omitting the description and saving the resources. Therefore, the present application is not limited to the specific embodiments disclosed in the present specification, but includes all the technical solutions falling within the scope of the claims.

Claims

1. A housing structure of a semiconductor cavity, characterized by, Including fixed column (1) and the placement box (2), the inside of the placement box (2) is provided with a placement groove (3), the inner wall bottom of the placement groove (3) is connected with a motor (11) through a bolt, the output end of the motor (11) is inserted with a telescopic rod (12), the top of the telescopic rod (12) is connected with a placement plate (13) through a bolt, the upper side of the placement plate (13) is provided with a buffer plate (15), the surface of the buffer plate (15) is welded with a spring (16), one end of the spring (16) is welded with a fixed plate (17).

2. The housing structure of a semiconductor cavity according to claim 1, wherein The side of the placement box (2) is connected with a switch (4) electrically connected with the motor (11) through a bolt, and the top of the placement box (2) is connected with a cover plate (5) through a bearing.

3. The housing structure of a semiconductor cavity according to claim 1, wherein One end of the placement box (2) is connected with a clamping block (23) through a bolt, the surface of the fixed column (1) is provided with a clamping groove (21), the length and width of the clamping groove (21) are consistent with those of the clamping block (23), the top of the fixed column (1) is provided with a hole (18), the upper side of the hole (18) is provided with a handle (19), the bottom of the handle (19) is connected with a fixed pin (20) through a bolt, the inner wall bottom of the clamping groove (21) is provided with a fixed hole (22), the inside of the clamping block (23) is provided with a fixed groove (24), the diameter of the fixed hole (22), the diameter of the fixed pin (20), the diameter of the fixed groove (24), and the diameter of the hole (18) and the fixed pin (20) are consistent.

4. The housing structure of a semiconductor cavity according to claim 1, wherein The top of the placement plate (13) is connected with a vertical plate (14) through a bolt, the number of the vertical plate (14) is multiple, and the vertical plate (14) is in equidistant distribution form.

5. The housing structure of a semiconductor cavity according to claim 1, wherein The bottom of the placement box (2) is provided with a ventilation hole (25), the number of the ventilation hole (25) is multiple, and the ventilation hole (25) is in equidistant distribution form.

6. The housing structure of a semiconductor cavity according to claim 1, wherein The bottom of the fixed column (1) is connected with a placement cavity (26) through a bolt, the number of the placement box (2) is multiple, and the placement box (2) is in ring distribution form.

7. The housing structure of a semiconductor cavity according to claim 2, wherein The side of the cover plate (5) is provided with a square groove (6), the inner wall of the square groove (6) is clamped with a rubber strip (7), the top of the cover plate (5) is provided with a semicircular groove (8), the inner wall of the placement groove (3) is provided with a ring groove (10), and the inner wall of the ring groove (10) is clamped with a rubber ring (9).

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