Practical thin tube capillary structure
By employing a copper powder sintered porous capillary structure layer and a braided wire layer design in the heat pipe, the problems of insufficient heat conduction and gravity resistance of existing thin-tube structures are solved, achieving low thermal resistance, high-efficiency heat exchange and stable heat pipe performance.
Patent Information
- Application Number
- CN202520241907.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-02-17
- Publication Date
- 2026-02-13
- Estimated Expiration
- 2035-02-17
AI Technical Summary
Existing thin-tube structures have shortcomings in terms of heat conduction and anti-gravity performance. They have poor copper mesh adhesion, high contact thermal resistance, weak copper wire adhesion, low copper powder performance, high working fluid reflux resistance, and strong space limitations, making it difficult to meet high heat load requirements.
The design employs a porous capillary structure layer and a braided wire layer formed by copper powder sintering. The braided wire layer is located in the middle of the bottom surface of the heat pipe, and the capillary structure layer is closely attached to the braided wire layer. The copper powder thickness is 0.20-0.40mm, and the copper powder used is 100-150 mesh. The braided wire layer is used for gas-liquid separation and to enhance capillary force and anti-gravity performance.
It effectively reduces thermal resistance, improves heat conduction and heat exchange efficiency, enhances capillary force and anti-gravity performance, solves the problem of braided sintering falling off, reduces working fluid backflow resistance, and improves heat dissipation effect and heat pipe stability.
Smart Images
Figure CN223910105U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to heat pipe capillary structure design field, more specifically, it is a kind of practical thin pipe capillary structure. BACKGROUND
[0002] The common thin pipe structure and the following shortcomings are as follows at present:
[0003] (1) copper mesh + braided wire structure: the defect copper mesh adhesion is poor, and the contact thermal resistance is large, and the copper wire adhesion is poor and the capillary force is weak;
[0004] (2) single double edge copper powder structure: the defect simple copper powder performance is low, and the gravity resistance is poor, and the contact thermal resistance is large;
[0005] (3) full copper powder + copper wire structure: the defect is limited by space, and the copper wire thickness is thin and the performance is weak, and the working medium backflow resistance is large, and it is suitable for T≥2.0mm above heat pipe. INVENTION CONTENTS
[0006] In order to overcome the above-mentioned defects of the prior art, the utility model provides a practical thin pipe capillary structure.
[0007] The utility model technical scheme is as follows:
[0008] A practical thin pipe capillary structure, including heat pipe, braided wire layer, capillary structure layer;The heat pipe one end is heating part, and the other end is heat dissipation part;The braided wire layer is arranged at the middle position of the bottom surface of the heat pipe;The inner wall of the heating part of the heat pipe is provided with capillary structure layer, and the both ends of capillary structure layer are close to braided wire layer, and the bottom of braided wire layer is connected with the inner wall of heat pipe, and the top of braided wire layer is connected with the inner wall of capillary structure layer;The layer capillary structure is the porous structure formed by copper powder sintering.
[0009] The heat pipe is flat and hollow.
[0010] The braided wire layer extends from the heating part to the heat dissipation part of the heat pipe.
[0011] The capillary structure layer uses copper powder, and the thickness of copper powder is between 0.20-0.40mm, and the copper powder is 100-150 mesh.
[0012] The technical effects and advantages of the utility model are as follows:
[0013] (1) the heating area is covered with fine copper powder, which is beneficial to heat conduction and heat exchange to reduce thermal resistance, and the thin powder thickness ensures sufficient steam passage and reduces contact thermal resistance;It can effectively reduce the wafer temperature;The thermal resistance is low, and the power performance is good, and the process is more stable;
[0014] (2) This design can adopt thicker and wider copper braid than traditional powder + line heat pipe, the braid has working fluid backflow effect, and gas-liquid separation design is adopted, so that the capillary force and anti-gravity performance are greatly improved;
[0015] (3) The steam space of the heat dissipation end is larger, the pressure drop is small, the temperature difference of the heat pipe is small, no other capillary covers, and the heat dissipation effect is better;
[0016] (4) The problem of sintering and falling off of the braid is solved, the copper powder in the heating area can effectively fix the braid to make the sintering adhesion better;
[0017] (5) The upper and lower capillary structures of the heat pipe are in close contact, the heating end steam carrying reduces the working fluid backflow resistance, and the heat conduction and heat exchange of the heat pipe are better. BRIEF DESCRIPTION OF DRAWINGS
[0018] Figure 1 is a schematic view of the whole heat pipe;
[0019] Figure 2 is a schematic view of the inside of the heat pipe;
[0020] Figure 3 is Figure 1 A-A sectional view of the heat pipe;
[0021] Figure 4 is Figure 1 B-B sectional view of the heat pipe. DETAILED DESCRIPTION
[0022] The technical scheme in the embodiments of the present application will be described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.
[0023] As shown in Figures 1 to 4 A practical thin tube capillary structure, comprising a heat pipe 1, a braid layer 2, and a capillary structure layer 3; one end of the heat pipe is a heating part 11, and the other end is a heat dissipation part 12; the braid layer 2 is sintered and fixed at the center position of the bottom surface of the heat pipe; the inner wall of the heating part of the heat pipe is sintered and fixed with the capillary structure layer 3, the two ends of the capillary structure layer are tightly attached to the braid layer, the bottom of the braid layer is connected to the inner wall of the heat pipe, and the top of the braid layer is connected to the inner wall of the capillary structure layer; the capillary structure layer is a porous structure formed by sintering of copper powder.
[0024] Further, the heat pipe is flat and hollow, and the hollow part is the steam passage C.
[0025] Further, the braid layer extends from the heating part to the heat dissipation part of the heat pipe.
[0026] Further, the capillary structure layer uses copper powder with a thickness of 0.20-0.40mm, and the copper powder is 100-150 mesh.
[0027] Technical requirements:
[0028] (1) The first capillary structure, i.e. the capillary structure layer, uses copper powder with a thickness of 0.20-0.40mm (to reduce thermal resistance); the copper powder is 100-150 mesh, too thin copper powder is difficult to process and unevenly filled with powder, and too thick copper powder blocks the steam passage; the appropriate powder thickness is selected according to the thickness of the heat pipe; the powder filling width of the copper powder covers the heating area; and it is just appropriate;
[0029] (2) The second capillary structure, i.e. the woven wire layer, uses woven wire; the woven wire is designed to have a thickness to separate the gas path and the water path and reduce steam carrying at the heating end; and it has a certain thickness to enhance the capillary lifting power and anti-gravity performance;
[0030] (3) The first capillary and the second capillary are in close contact on the upper and lower surfaces of the heat pipe heating area;
[0031] (4) The heat dissipation area only uses the woven wire capillary structure.
[0032] The above only describes preferred embodiments of the present application and is not intended to limit the present application, and any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.
Claims
1. A practical thin-tube capillary structure, characterized in that: It includes a heat pipe, a braided wire layer, and a capillary structure layer; one end of the heat pipe is a heating section, and the other end is a heat dissipation section; a braided wire layer is disposed in the center of the bottom surface of the heat pipe; a capillary structure layer is disposed on the inner wall of the heating section of the heat pipe, with both ends of the capillary structure layer tightly attached to the braided wire layer, the bottom of the braided wire layer connecting to the inner wall of the heat pipe, and the top of the braided wire layer connecting to the inner wall of the capillary structure layer; the capillary structure layer is a porous structure formed by sintering copper powder.
2. The practical thin-tube capillary structure according to claim 1, characterized in that: The heat pipe is flat and hollow.
3. The practical thin-tube capillary structure according to claim 1, characterized in that: The braided layer extends from the heating section of the heat pipe to the heat dissipation section.
4. A practical thin-tube capillary structure according to claim 1, characterized in that: The capillary structure layer uses copper powder with a thickness of 0.20-0.40 mm, and the copper powder is 100-150 mesh.