Display module capable of reducing bending size and electronic equipment

Abstract

The utility model discloses a display module capable of reducing bending width and an electronic device, the display module comprises display glass, a module FPC and a backlight module, the module FPC is bound on the display glass, a solder mask ink layer is formed on the back of the module FPC in a bending area, and the solder mask ink layer is bonded on the display glass. The backlight module is arranged on the lower layer of the display glass in a stacked mode, the edge of the appearance of the backlight module does not exceed the edge of the corresponding appearance of the display glass at the position close to one end of the bending area of the module FPC, the module FPC is fixed to the back face of the backlight module after being bent, and inner sealing glue is arranged at the position of the bending area of the back face of the module FPC. The inner sealing glue is pasted on the back face of the module FPC, the side face of the display glass and the side face of the backlight module. The display module has the beneficial effect that the bending width of the display module at the FPC of the module can be reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to display module technical field especially relates to a display module and electronic equipment that can reduce the size of bending. BACKGROUND

[0002] In liquid crystal display module, module FPC is bound on liquid crystal display glass, and module FPC is fixed on the back of backlight module after being bent subsequently, in conventional liquid crystal display module, heat -setting green oil and a line glue are arranged on the back of module FPC to play corresponding protection effect, under this structure, the factors that influence the bending size of module FPC are: 1, the distance between the edge of heat -setting green oil on the back of module FPC and the edge of display glass, this size is generally greater than or equal to 0.2mm;2, the distance between the bending single layer area starting bending line on the front of module FPC and the edge of heat -setting green oil on the back, this size is generally greater than or equal to 0.4mm;3, the distance between the edge of heat -setting green oil and the edge of binding PAD of actual glass, this size is generally greater than or equal to 0.3mm;4, the distance between the edge of the appearance of backlight module and the edge of corresponding display glass, this size is generally greater than or equal to 0.5mm;5, the width of a line glue is about 0.6mm, based on the above structure, when module FPC is bent, the bending size of the existing display module is generally greater than or equal to 0.9mm, so in order to ensure smooth assembly, the corresponding position of whole machine also needs to reserve at least 0.9mm position to accommodate module FPC bending. But at present, in order to pursue better narrow frame effect, the display module under the existing bending size still cannot meet the demand.

[0003] Therefore, the prior art has defects and needs to be improved. INVENTION CONTENTS

[0004] The utility model aims at overcoming the insufficient of prior art, provide a kind of display module and electronic equipment that can reduce bending size.

[0005] The technical scheme of the utility model is as follows: the utility model provides a kind of display module that can reduce bending size, comprising: display glass, module FPC and backlight module, the module FPC is bound on the display glass, the back of the module FPC is formed with solder resist layer in bending area, the backlight module is stacked and is set in the lower layer of the display glass, at the bending area one end close to the module FPC, the appearance edge of the backlight module does not exceed the corresponding appearance edge of the display glass, the module FPC is fixed on the back of the backlight module after being bent, and inner sealant is equipped at the bending area of the back of the module FPC, and the inner sealant is pasted on the back of the module FPC, the side of display glass and the side of backlight module.

[0006] Preferably, at one end close to the bending area of the module FPC, the contour edge of the backlight module is flush with the corresponding contour edge of the display glass.

[0007] The utility model discloses still provide a kind of electronic equipment, including the display module of the above-mentioned can reduce bending size, the electronic equipment further includes equipment mainboard, and the module FPC of display module is electrically connected with the equipment mainboard.

[0008] With the above scheme, the utility model has the beneficial effects that by setting inner sealant to replace existing one-line glue, the space occupied by one-line glue in the bending area is avoided, by replacing the heat-set ink layer with the solder resist layer, higher processing precision can be obtained, the occupied size of the heat-set ink layer is reduced, by reducing the edge of the backlight module not exceeding the display glass, the problem of increased width of the bending area caused by the backlight module is avoided, and by the above structure, the bending width size of the display module can be effectively reduced, so that the bending width can be minimized to 0.45mm, and the frame width of the electronic equipment is effectively reduced. BRIEF DESCRIPTION OF DRAWINGS

[0009] Figure 1 It is a structural schematic view of the display module of the utility model. DETAILED DESCRIPTION

[0010] The utility model will be described in detail in combination with the drawings and specific embodiments.

[0011] Please refer to Figure 1In the embodiment, the display module capable of reducing the bending size comprises a display glass 1, a module FPC 2 and a backlight module 3, the module FPC 2 is bound on the single-layer area of the display glass 1, the back surface of the module FPC 2 is provided with a solder resist layer 21 at the bending area, which is used to replace the heat-set ink layer in the prior art, since the tolerance of the solder resist layer 21 is only 0.07 mm, which is far less than 0.2 mm of the heat-set ink layer, the influence of the ink layer on the width size of the bending area can be reduced. The backlight module 3 is stacked on the lower layer of the display glass 1, at the bending area end close to the module FPC 1, the contour edge of the backlight module 3 is flush with the corresponding contour edge of the display glass 1, so that the backlight module 3 does not protrude from the display glass 1 to increase the bending width when the module FPC 2 is bent, the module FPC 2 is fixed on the back surface of the backlight module 3 after being bent, and the inner sealing glue 4 is filled at the bending area of the back surface of the module FPC 1, the inner sealing glue 4 is obtained by filling the glue material at the position and then curing and shaping, the inner sealing glue 4 is pasted on the back surface of the module FPC 2, the side surface of the display glass and the side surface of the backlight module, the inner sealing glue structure is used to replace the one-line glue structure, so as to avoid the influence on the bending width of the bending area, the inner sealing glue 4 can not only protect the circuit of the module FPC 1, but also can paste and connect the display glass 1 and the backlight module 3, and has the functions of fixing and reducing the bending stress.

[0012] The electronic device also comprises the display module capable of reducing the bending size, and the module FPC of the display module is electrically connected with the device mainboard.

[0013] In conclusion, the beneficial effects of the scheme are that the inner sealing glue is used to replace the one-line glue, so as to avoid the space occupied by the one-line glue in the bending area, the solder resist layer is used to replace the heat-set ink layer, so as to obtain higher processing precision and reduce the occupied size of the heat-set ink layer, the edge of the backlight module does not exceed the display glass, so as to avoid the problem of the increase of the width of the bending area caused by the backlight module, the bending width size of the display module can be effectively reduced through the above structure, the bending width can be minimized to 0.45 mm, and the frame width of the electronic device is effectively reduced.

[0014] The above is only a preferred embodiment of the utility model, and is not used to limit the utility model, any modification, equivalent replacement and improvement made within the spirit and principle of the utility model should be included in the protection scope of the utility model.

Claims

1. A display module capable of reducing a bending size, characterized in that, The display glass, the module FPC and the backlight module, the back of the module FPC is provided with a solder resist layer at the bending area, the backlight module is stacked at the lower layer of the display glass, the contour edge of the backlight module does not exceed the corresponding contour edge of the display glass at the end of the bending area of the module FPC, the module FPC is fixed at the back of the backlight module after bending, and the inner sealing glue is arranged at the bending area of the back of the module FPC, and the inner sealing glue is pasted on the back of the module FPC, the side of the display glass and the side of the backlight module. The contour edge of the backlight module is flush with the corresponding contour edge of the display glass at the end of the bending area of the module FPC. 2.The display module with reduced bending size of claim 1, wherein, The display module with reduced bending size as claimed in claim 1 or 2 is also included.

3. An electronic device, comprising: The module FPC is also electrically connected with the device mainboard.

4. The electronic device of claim 3, wherein, ​

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