Wafer coarse alignment device

Abstract

The utility model discloses a wafer coarse alignment device which comprises a working table, a first sliding table is arranged on the working table, a second sliding table is arranged on the first sliding table, and the sliding directions of the first sliding table and the second sliding table are perpendicular to each other; a rotary table is arranged at the upper end of the second sliding table and rotates in the horizontal direction, and a fixing module for fixing a wafer is arranged at the upper end of the rotary table; a linear array laser sensor group is arranged on the second sliding table through a stand column data transmission assembly, the receiving end of the linear array laser sensor group is located below the wafer, the transmitting end of the linear array laser sensor group is located above the wafer, and laser beams emitted by the transmitting end are distributed in the radial direction of the wafer. According to the utility model, the linear array laser sensor group is used for detecting the notch or the cut edge of the wafer, rapid detection can be realized, and the detection precision is high; the rough alignment efficiency can be effectively improved, so that the wafer processing efficiency of the photoetching machine is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing field, concretely relates to a wafer rough alignment device. BACKGROUND

[0002] Photoetching technology refers to the process of transferring circuit pattern onto silicon wafer by high-precision exposure method such as ultraviolet light, extreme ultraviolet light (EUV) or electron beam. Before the full-automatic photoetching machine processes the wafer, the wafer in the magazine needs to be positionally adjusted to be sent to the fine alignment table for alignment. This process of positional adjustment is called rough alignment.

[0003] In the photoetching machine in the prior art, mechanical rough alignment is adopted, two air cylinders are used to clamp the wafer, the center is determined, then the wafer is rotated, and finally the 0 and 1 signals of the IO sensor are used to determine the notch direction. The rough alignment speed of this way cannot be too fast, otherwise the wafer may be damaged by the clamping of the air cylinder. At the same time, due to the different thickness and strength of the wafers, the thinner wafers need to be clamped by the air cylinder at a slow speed, otherwise the wafers are easy to be damaged. SUMMARY

[0004] In view of the above deficiencies of the prior art, the utility model provides a wafer rough alignment device, which reduces the damage rate of the wafer and improves the efficiency of wafer rough alignment.

[0005] To achieve the above-mentioned purposes, the utility model adopts the following technical scheme:

[0006] The utility model provides a wafer rough alignment device, which comprises a workbench, a first sliding table is arranged on the workbench, a second sliding table is arranged on the first sliding table, the sliding directions of the first sliding table and the second sliding table are perpendicular to each other, a rotary table is arranged at the upper end of the second sliding table, the rotary table rotates along the horizontal direction, a fixing module for fixing the wafer is arranged at the upper end of the rotary table, a linear array laser sensor group is arranged on the second sliding table through a stand data transmission assembly, the receiving end of the linear array laser sensor group is located below the wafer, the emitting end is located above the wafer, and the laser beams emitted by the emitting end are distributed along the radial direction of the wafer.

[0007] Further, a first linear movement module is arranged on one side of the first sliding table, a first sliding rail assembly is arranged on the other side of the first sliding table, the first linear movement module is fixed on the workbench, one side of the first sliding table is fixed on the sliding block of the first linear movement module, and the first sliding rail assembly is parallel to the first linear movement module.

[0008] Further, a second linear movement module is arranged on one side of the second sliding table, a second sliding rail assembly is arranged on the other side of the second sliding table, the second linear movement module is fixed on the first sliding table, one side of the second sliding table is fixed on the sliding block of the second linear movement module, and the second sliding rail assembly is parallel to the second linear movement module.

[0009] Further, the rotary table comprises a rotating motor arranged at the upper end of the second sliding table, a rotating shaft is connected to the output shaft of the rotating motor, the upper end of the rotating motor is provided with a support plate, the support plate is fixed on the second sliding table through a first vertical column, the upper end of the support plate is provided with a rotary table seat through a second vertical column, the rotating shaft is connected to a bearing arranged in the rotary table seat through the support plate, and the rotating shaft penetrates the rotary table seat and is connected to the fixed module.

[0010] Further, the vertical column data transmission assembly comprises a support column fixed on the second sliding table, a data female connector is arranged at the upper end of the support column, hollow extension rods are arranged at the receiving end and the transmitting end of the linear array laser sensor group, data male connectors are arranged on the extension rods, and the data male connectors are threadedly connected with the data female connector to realize data transmission.

[0011] Further, a plurality of expansion holes are arranged on the second sliding table, the expansion holes are threaded holes, and the support column is installed on the expansion holes through a threaded segment.

[0012] Further, the fixed module comprises a circular table rotatably connected to the rotary table, and a suction disc for sucking the wafer is arranged at the upper end of the circular table, wherein the suction disc is made of soft rubber.

[0013] The wafer is fixed by the suction disc in a suction manner and is not prone to damage in the moving process, therefore, the second sliding table, the first sliding table and the rotary table can be simultaneously moved and rotated, the efficiency of coarse alignment can be effectively improved, and the processing efficiency of the wafer by the photolithography machine is further improved. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a front view of the wafer coarse alignment device.

[0015] Figure 2 It is an installation schematic view of the linear array laser sensor group.

[0016] Figure 3 It is a structural view of the second sliding table.

[0017] 1, workbench, 2, first sliding rail assembly, 3, first sliding table, 4, rotating motor, 5, first vertical column, 6, second sliding table, 7, second linear movement module, 8, first linear movement module, 9, support plate, 10, second vertical column, 11, rotary table seat, 12, fixed module, 13, I-shaped sliding block, 14, wafer, 15, receiving end, 16, data female connector, 17, transmitting end, 18, expansion hole, 19, suction disc. DETAILED DESCRIPTION

[0018] The specific embodiments of this utility model are described below to enable those skilled in the art to understand this utility model. However, it should be understood that this utility model is not limited to the scope of the specific embodiments. For those skilled in the art, as long as various changes are within the spirit and scope of this utility model as defined and determined by the appended claims, these changes are obvious. All utility model creations utilizing the concept of this utility model are within the scope of protection.

[0019] Example 1

[0020] like Figure 1 As shown, a wafer coarse alignment device includes a worktable 1, a first slide 3 on the worktable 1, and a second slide 6 on the first slide 3, the sliding directions of the first slide 3 and the second slide 6 being perpendicular to each other; a turntable is provided at the upper end of the second slide 6, the turntable rotates in the horizontal direction, and a fixing module 12 for fixing the wafer 14 is provided at the upper end of the turntable; a linear array laser sensor group is provided on the second slide 6 via a column data transmission assembly, the receiving end 15 of the linear array laser sensor group is located below the wafer 14, and the transmitting end 17 is located above the wafer 14, as shown. Figure 2 As shown, the laser beam emitted from the transmitter 17 is distributed radially along the wafer 14.

[0021] In this embodiment, a first linear motion module 8 is provided on one side of the first slide table 3, and a first slide rail assembly 2 is provided on the other side. The first linear motion module 8 is fixed on the worktable 1, and one side of the first slide table 3 is fixed on the slider of the first linear motion module 8. The first slide rail assembly 2 is parallel to the first linear motion module 8. The first linear motion module 8 serves as the component that drives the first slide table 3 to move in the x-direction, providing power for the movement of the first slide table 3. The first slide rail assembly 2 cooperates with the first linear motion module 8 to achieve sliding support for the first slide table 3.

[0022] In this embodiment, a second linear motion module 7 is provided on one side of the second slide table 6, and a second slide rail assembly is provided on the other side. The second linear motion module 7 is fixed on the first slide table 3, and one side of the second slide table 6 is fixed on the slider of the second linear motion module 7. The second slide rail assembly is parallel to the second linear motion module 7. The second linear motion module 7 serves as the component that drives the second slide table 6 to move along the y-direction, providing power for the movement of the second slide table 6. The second slide rail assembly cooperates with the second linear motion module 7 to achieve sliding support for the second slide table 6.

[0023] In this embodiment, the second slide rail assembly and the first slide rail assembly 2 use the same components, including an I-shaped slide rail and an I-shaped slider 13. The I-shaped slide rail is installed on the first slide table 3 and the worktable 1. The I-shaped slider 13 is slidably connected to the I-shaped slide rail. The I-shaped slider 13 is installed on the bottom of the second slide table 6 and the first slide table 3.

[0024] As Figure 3 shown, the first sliding table 3 and the second sliding table 6 have the same structure, and the size of the second sliding table 6 is smaller than that of the first sliding table 3.

[0025] In the embodiment, the rotating table includes a rotating motor 4 arranged at the upper end of the second sliding table 6, which provides power for driving the rotation of the wafer 14. The output shaft of the rotating motor 4 is connected with a rotating shaft. The upper end of the rotating motor 4 is provided with a support plate 9, which is fixed on the second sliding table 6 through a first vertical column 5. The upper end of the support plate 9 is provided with a rotating table seat 11 through a second vertical column 10. The rotating shaft is connected with a bearing arranged in the rotating table seat 11 through the support plate 9, and the rotating shaft penetrates the rotating table seat 11 and is connected with a fixed module 12.

[0026] Embodiment 2

[0027] The difference between the embodiment and the embodiment 1 is that the specific structure of the vertical column data transmission assembly is disclosed. The vertical column data transmission assembly of the embodiment includes a support column fixed on the second sliding table 6. The upper end of the support column is provided with a data female connector 16. The receiving end 15 and the transmitting end 17 of the linear array laser sensor group are both provided with hollow extension rods. The extension rods are provided with data male connectors. The data lines extend from the inside of the extension rods to the data male connectors. The data male connectors are threadedly connected with the data female connector 16 to realize data transmission. The data female connector 16 is connected with the controller of the lithography machine through an external data line, or the support column also adopts a hollow pipe structure, and the data lines are directly wired from the bottom of the support column. The support column and the extension rod are used to improve the installation height of the receiving end 15.

[0028] In the embodiment, a plurality of expansion holes 18 are arranged on the second sliding table 6. The expansion holes 18 are threaded holes. The support column is installed on the expansion holes 18 through the threaded segments. The installation position of the linear array laser sensor group can be moved to meet the detection requirements of wafers 14 of different sizes.

[0029] Embodiment 3

[0030] The difference between the embodiment and the embodiment 2 is that the specific structure of the fixed module 12 is further disclosed. The fixed module 12 of the embodiment includes a circular table rotatably connected with the rotating table. The bottom of the circular table is designed with a threaded hole, which is fixedly connected with the upper end of the rotating shaft through the threaded hole. The upper end of the circular table is provided with a chuck 19 for sucking the wafer 14. The chuck 19 is made of soft rubber material. In the process of installing the wafer 14, since the chuck 19 is made of soft material, only the wafer 14 needs to be pressed lightly, so that the chuck 19 is attached to the surface of the wafer 14, and the stable adsorption of the chuck 19 to the wafer 14 can be realized.

[0031] The utility model discloses a line array laser sensor group is used to detect the gap or cutting edge of wafer 14, can realize quick detection, and the detection precision is high, and the line array laser sensor group can cover most wafer 14 radius range through array formula's laser, and the detection of gap or cutting edge can be realized to wafer 14 rotation a round, greatly improved the detection efficiency. Moreover, wafer 14 is fixed through the adsorption of sucking disc 19, and is not prone to damage in the movement, therefore, second sliding stage 6, first sliding stage 3 and rotating platform can move and rotate simultaneously, can effectively promote the efficiency of rough alignment, and then promote the processing efficiency of photolithography machine to wafer 14.

Claims

1. A wafer coarse alignment device, comprising: The utility model provides a wafer testing device, including workbench, be provided with first sliding table on workbench, be provided with second sliding table on first sliding table, the sliding direction of first sliding table and second sliding table is perpendicular to each other, the upper end of second sliding table is provided with rotary table, rotary table rotates along the horizontal direction, the upper end of rotary table is provided with fixed module group that fixes wafer, be provided with linear array laser sensor group through the stand data transmission subassembly on second sliding table, the receiving end of linear array laser sensor group is located the below of wafer, and the transmitting end is located the above of wafer, and the laser beam that transmitting end sends distributes along the radial of wafer.

2. The wafer coarse alignment apparatus of claim 1 wherein, One side of the first sliding table is provided with a first linear movement module, and the other side is provided with a first slide rail assembly. The first linear movement module is fixed on the workbench. One side of the first sliding table is fixed on the slider of the first linear movement module. The first slide rail assembly is parallel to the first linear movement module.

3. The wafer coarse alignment apparatus of claim 1 wherein, One side of the second sliding table is provided with a second linear movement module, and the other side is provided with a second slide rail assembly. The second linear movement module is fixed on the first sliding table. One side of the second sliding table is fixed on the slider of the second linear movement module. The second slide rail assembly is parallel to the second linear movement module.

4. The wafer coarse alignment apparatus of claim 1 wherein, The rotary table includes a rotating motor provided on the upper end of the second sliding table. The output shaft of the rotating motor is connected with a rotating shaft. The upper end of the rotating motor is provided with a support plate. The support plate is fixed on the second sliding table through a first stand. The upper end of the support plate is provided with a rotary table seat through a second stand. The rotating shaft is connected with a bearing provided in the rotary table seat through the support plate. The rotating shaft penetrates the rotary table seat and is connected with the fixed module.

5. The wafer coarse alignment apparatus of claim 1 wherein, The stand data transmission assembly includes a support column fixed on the second sliding table. The upper end of the support column is provided with a data female connector. The receiving end and the transmitting end of the linear array laser sensor group are provided with hollow extension rods. The extension rods are provided with data male connectors. The data male connectors are threadedly connected with the data female connector to realize data transmission.

6. The wafer coarse alignment apparatus of claim 5 wherein, The second sliding table is provided with a plurality of expansion holes. The expansion holes are threaded holes. The support column is installed on the expansion holes through the threaded segments.

7. The wafer coarse alignment apparatus of claim 1 wherein, The fixed module includes a circular table rotatably connected with the rotary table. The upper end of the circular table is provided with a suction cup for suctioning the wafer. The suction cup is made of soft rubber.

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