Wireless data acquisition terminal

Abstract

The utility model relates to the technical field of data acquisition equipment, and discloses a wireless data acquisition terminal, which comprises an acquisition equipment main body and a protective cover, the protective cover is detachably connected with the acquisition equipment main body, the surface of the protective cover is provided with a through groove, the inner cavity of the acquisition equipment main body is provided with a baffle plate matched with the through groove, and the baffle plate is connected with the acquisition equipment main body. And one side of the acquisition equipment main body is provided with a wiring port. According to the utility model, the antenna is convenient to unfold and fold, and electronic devices in the equipment can be protected, through the arrangement of the driving mechanism, the rotation direction of the rotating shaft can be controlled through the motor, the driving gear can drive the toothed plate to move towards two directions and control the opening and closing of the baffle plate, and through the mode of the built-in signal antenna, the antenna can be conveniently unfolded and folded. And the baffle plate is embedded with the through groove, so that external dust is prevented from entering the wireless data acquisition equipment, and short circuit of an electronic device caused by the dust when the wireless data acquisition equipment is idle is avoided.

Description

TECHNICAL FIELD

[0001] The utility model relates to data acquisition equipment technical field, concretely is a kind of data wireless acquisition terminal. BACKGROUND

[0002] With the rapid development of Internet of Things technology, wireless data acquisition terminal is widely used in many fields, including industrial automation, environmental monitoring, intelligent agriculture, smart city and so on. These terminal devices need to realize efficient, reliable data acquisition, processing and wireless communication functions, and at the same time require high durability, flexibility and low power consumption. However, the existing wireless data acquisition terminal mostly faces some problems, such as single communication protocol support, poor hardware scalability, unstable power management, etc. These problems make the existing devices difficult to meet the needs of different environments in actual application. Therefore, how to design a data wireless acquisition terminal with multi-protocol communication capability, flexible expansion and stable power management has become a technical problem to be solved. UTILITY MODEL CONTENT

[0003] The utility model aims at providing a kind of data wireless acquisition terminal to solve the problems mentioned in the background art.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of data wireless acquisition terminal, comprising:

[0005] Sensor interface module, magnetic quick release connector is used to realize the physical connection of sensor cable;

[0006] Adjustable gain signal conditioning module is connected with AD623 instrument amplifier through gain resistor network set by jumper cap;

[0007] Main control module adopts sandwich type PCB layout, including radio frequency layer, insulating layer and digital signal layer;

[0008] Multi-protocol communication switching module realizes communication mode switching by physical dial switch control SKY13370 radio frequency switch chip;

[0009] Dynamic power switching module contains super capacitor group and LTC4412 chip composed of software intervention-free power backup circuit;

[0010] Modular expansion interface is externally connected with GPS or industrial bus expansion card through Samtec high-speed connector;

[0011] The sensor interface module, adjustable gain signal conditioning module and main control module are sequentially connected by pin welding; the multi-protocol communication switching module and the main control module are vertically stacked through gold finger connector; the dynamic power switching module is connected with the main control module power supply pin through FPC flexible flat cable.

[0012] Preferably, in the sandwich type PCB layout of the master module, the radio frequency layer adopts Rogers4350B high frequency board material, the digital signal layer adopts FR4 board material, and cross-layer connection is realized through blind buried holes between the two layers.

[0013] Preferably, the dynamic power switching module comprises a PhoenixContact SAC-5P-MSTB solar input interface, and the super capacitor group is directly welded with an LM2596 step-down chip through a copper substrate.

[0014] Preferably, the WiFi, Bluetooth and LoRa radio frequency units of the multi-protocol communication switching module are separated by a metal isolation plate, the thickness of the isolation plate is 1.2mm, and the ground treatment is performed.

[0015] Preferably, the dust cover of the modular expansion interface adopts a fluorine rubber material, and opening and closing self-locking is realized through a spring needle mechanism.

[0016] Preferably, the jumper socket of the adjustable gain signal conditioning module is at an angle of 45° with the PCB board, and the gain resistor network adopts a Vishay PTF56 series low temperature drift resistor.

[0017] Preferably, the magnetic quick-release connector of the sensor interface module comprises a silica gel sealing ring with an IP67 protection level, and the magnet adopts N52 neodymium iron boron material.

[0018] Preferably, an EMI shielding cover is arranged between the master module and the multi-protocol communication switching module, the shielding cover has an opening diameter of not greater than 1mm and is welded with the PCB ground plane.

[0019] Preferably, the super capacitor group of the dynamic power switching module is fixed through a stainless steel slide rail buckle, and the contact surface of the slide rail is gold plated.

[0020] Compared with the prior art, the wireless data acquisition terminal has the following beneficial effects:

[0021] The wireless data acquisition terminal has strong communication flexibility, reliable sensor connection mode, effective power management, good expansibility and excellent anti-interference performance, can stably work in various application scenarios, and meets the needs of modern wireless data acquisition terminals in efficiency, reliability and expansibility. BRIEF DESCRIPTION OF DRAWINGS

[0022] The accompanying drawings are used to provide a further understanding of the present application, and constitute a part of the specification, and are used to explain the present application together with embodiments of the present application, and do not constitute a limitation on the present application. In the drawings:

[0023] Figure 1The utility model discloses a system schematic diagram.

[0024] In the drawing, the meaning of each reference sign is as follows: 1, sensor interface module; 2, adjustable gain signal conditioning module; 3, main control module; 4, multi-protocol communication switching module; 5, dynamic power switching module; 6, modular expansion interface. DETAILED DESCRIPTION

[0025] The technical scheme in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0026] As shown in Figure 1 A data wireless acquisition terminal, comprising:

[0027] The sensor interface module 1 realizes the physical connection of the sensor cable by adopting a magnetic quick-release connector; the sensor interface module provides physical connection through the magnetic quick-release connector, so that the sensor can be conveniently connected or detached. The interface can ensure stable transmission of signals and avoid poor contact or damage that may be caused by traditional connection methods. The magnetic quick-release connector has high reliability and stability, and the use of an IP67 protection level silica gel sealing ring can effectively prevent the intrusion of moisture and dust, thereby increasing the applicable environment of the equipment. The magnet is made of N52 neodymium iron boron material, which has high strength and durability, thereby ensuring the firmness of the connection. The model of the magnetic quick-release connector is selected from the Samtec MTAM series or the Hirose 31 series, which is connected with the sensor cable through the magnetic quick-release connector, thereby ensuring stable and convenient physical connection.

[0028] The adjustable gain signal conditioning module 2 is connected with an AD623 instrument amplifier through a jumper cap set gain resistor network; the module is used for adjusting the gain of signals and adapting the signal intensity output by different sensors. The gain resistor network set by the jumper cap can adjust the gain according to the demand. The AD623 instrument amplifier is responsible for amplifying the low-intensity signal to an appropriate range and providing high-precision signal output. Through the design of adjustable gain, the signal amplification degree can be flexibly adjusted according to the characteristics of different sensors, thereby improving the adaptability and precision of the system, and being very effective for the processing of weak signals.

[0029] The model of the AD623 instrument amplifier is selected, the gain resistor network is set through the jumper cap, the resistor is connected with the AD623, a signal conditioning loop is formed, and the loop is directly connected with the main control module.

[0030] The master module 3 adopts a sandwich PCB layout, including a radio frequency layer, an insulating layer and a digital signal layer; the master module integrates the radio frequency layer, the insulating layer and the digital signal layer together through the sandwich PCB layout, coordinates the work of each module, and is responsible for signal processing, data calculation and wireless communication. The radio frequency layer optimizes the transmission quality of wireless signals, the insulating layer provides electrical isolation, and the digital signal layer is responsible for the processing of digital signals. The sandwich PCB layout not only optimizes signal transmission and electromagnetic compatibility (EMC), but also makes the PCB size compact, reducing the volume of the system. The radio frequency layer adopts Rogers4350B high-frequency board material, which improves the stability and anti-interference ability of the radio frequency signal, and the digital signal layer adopts FR4 board material, which balances the cost and performance. The model selects STM32 or ESP32, which is connected with the adjustable gain signal conditioning module and the sensor interface module through the pin welding; and is connected with the multi-protocol communication switching module through the gold finger connector, and is connected with the dynamic power switching module.

[0031] The multi-protocol communication switching module 4 realizes communication mode switching by controlling the SKY13370 radio frequency switch chip through the physical dial switch; the module realizes the switching of Wi-Fi, Bluetooth, LoRa and other communication protocols by controlling the SKY13370 radio frequency switch chip through the physical dial switch. Different protocols are suitable for different wireless communication needs, for example, Wi-Fi is suitable for high-speed transmission, and LoRa is suitable for long-distance low-power communication. The multi-protocol switching module provides high flexibility and scalability, so that the device can switch communication protocols according to actual needs, improving the application range of the device, especially suitable for the adaptation needs of different environments. The model selects the SKY13370 radio frequency switch chip. The gold finger connector is connected with the master module to provide the communication mode switching function.

[0032] The dynamic power switching module 5 includes a super capacitor group and a LTC4412 chip to form a software-free power backup circuit; the module includes a super capacitor group and a LTC4412 chip to form a software-free power backup circuit. When the external power is interrupted or the voltage is unstable, the super capacitor can provide short-time power support to ensure continuous operation of the device and avoid data loss. Through the dynamic power switching module, the device can still operate stably when the power fluctuates or is interrupted, improving the reliability and anti-interference ability of the device, especially in environments without continuous power supply, which has significant advantages. The model selects the LTC4412 power switching chip and the PhoenixContact SAC-5P-MSTB solar input interface. The FPC flexible flat cable is connected with the power pin of the master module.

[0033] The modular expansion interface 6 is connected with the GPS or industrial bus expansion card through the Samtec high-speed connector;

[0034] The sensor interface module 1, the adjustable gain signal conditioning module 2, and the main control module 3 are sequentially connected by a row of pins; the multi-protocol communication switching module 4 and the main control module 3 are vertically stacked through a gold finger connector; and the dynamic power switching module 5 is connected with the main control module 3 through FPC soft wires.

[0035] Preferably, in the sandwich PCB layout of the main control module 3, the radio frequency layer uses Rogers4350B high-frequency board material, and the digital signal layer uses FR4 board material, and cross-layer connection is achieved through blind buried holes. The modular expansion interface provides an interface for externally connecting a GPS module or an industrial bus expansion card, supporting the device to be expanded and functionalized according to application requirements. Different expansion modules can be externally connected through Samtec high-speed connectors, improving the flexibility of the device. The modular design allows the device to be customized and expanded according to different requirements, increasing the flexibility and adaptability of the system, and facilitating users to add new functions according to actual conditions. Samtec high-speed connectors are selected. The high-speed connectors are connected with external devices, and an interface for a GPS or industrial bus expansion card is provided.

[0036] In this embodiment, the dynamic power switching module 5 includes a Phoenix Contact SAC-5P-MSTB solar input interface, and the super capacitor group is directly soldered with an LM2596 voltage reduction chip through a copper substrate. A flexible energy input method is provided, which is particularly suitable for devices that need to operate independently for a long time, such as remote environmental monitoring terminals or field devices. The solar input interface can ensure that the device can automatically charge using solar energy in the absence of external power supply, improving the energy autonomy of the device. By directly soldering the copper substrate with the LM2596 voltage reduction chip, the line loss and the delay response time of the power supply are reduced, providing more efficient and stable power management. The super capacitor group can quickly respond to power fluctuations or interruptions, avoiding system crashes caused by sudden power outages. The super capacitor group is fixed by a stainless steel slide rail buckle, enhancing the firmness of the capacitor, while the gold-plated contact surface of the slide rail improves the contact stability, reduces the contact resistance, and prolongs the service life.

[0037] In this embodiment, the WiFi, Bluetooth, and LoRa radio frequency units of the multi-protocol communication switching module 4 are separated by a metal isolation plate with a thickness of 1.2 mm and grounding treatment. Separating the Wi-Fi, Bluetooth, and LoRa radio frequency units by a metal isolation plate can effectively avoid radio frequency interference and improve the performance stability of each communication protocol. The interference between the radio frequency units is minimized, ensuring that different protocols can work stably and independently. The thickness of the isolation plate is moderate, which can effectively shield the mutual interference of different radio frequency units, while the grounding treatment enhances the anti-interference ability, reduces the influence of EMI (electromagnetic interference) on the performance of the device, and ensures the normal operation of the device in complex electromagnetic environments.

[0038] In this embodiment, the dust cover of the modular expansion interface 6 is made of fluororubber material, and the opening and closing self-locking is realized through a spring needle mechanism. The fluororubber material has excellent high temperature resistance, corrosion resistance and aging resistance, which can effectively prevent the invasion of dust, dirt and other substances, ensure the cleanliness and reliability of the interface, and prolong the service life of the equipment. This design makes it easy for users to easily open and close the dust cover when needed, while ensuring that the cover is not easily loose or detached during use, further improving the stability and safety of the equipment.

[0039] In this embodiment, the jumper socket of the adjustable gain signal conditioning module (2) is at a 45° angle with the PCB board, and the gain resistor network uses Vishay PTF56 series low temperature drift resistors. This design makes the connection of the jumper socket and the circuit board more compact, enhances the utilization rate of the space on the board, and avoids unnecessary space waste. Vishay PTF56 series low temperature drift resistors have high precision and low temperature drift characteristics, which can work stably in environments with large temperature changes, ensuring the accuracy and stability of gain adjustment.

[0040] In this embodiment, the magnetic quick-release connector of the sensor interface module 1 contains an IP67 protection level silicone seal ring, and the magnet is made of N52 neodymium iron boron material. The design of the magnetic quick-release connector makes the connection and disconnection of the sensor more convenient and fast, especially suitable for scenarios that require frequent replacement of sensors. At the same time, the IP67 protection level silicone seal ring can effectively prevent the invasion of water, dust and other external factors, improving the reliability of the equipment in harsh environments. N52 neodymium iron boron magnets have high magnetic performance, ensuring the firmness of the connector connection, and have strong anti-vibration ability, improving the stability in high vibration environments.

[0041] In this embodiment, an EMI shield is provided between the main control module 3 and the multi-protocol communication switching module 4, the shield opening diameter is not greater than 1mm and is welded with the PCB ground plane. The EMI shield between the main control module and the multi-protocol communication switching module can effectively reduce electromagnetic interference, prevent signal crosstalk, and improve the anti-interference ability of the system, especially in complex electromagnetic environments to ensure the stable operation of the communication module. This design optimizes the structure of the shield, making it more tightly welded with the ground plane, effectively preventing electromagnetic interference leakage, and ensuring good performance of the equipment in high frequency signal environments.

[0042] In this embodiment, the super capacitor group of the dynamic power switching module 5 is fixed by a stainless steel slide rail buckle, and the slide rail contact surface is gold plated.

[0043] It is to be understood that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting; it is not intended to exclude myriad other embodiments of the present application that other inventors can develop based on the same general inventive concepts embodied by the described embodiments. That is, although the present application is described in terms of particular embodiments and implementations, it is to be understood that the terminology used is for the purpose of descriptive clarity and that it is intended to be limited only by the words recited in the appended claims. The scope of the present application shall be limited only by the claims.

[0044] While the embodiments of the present application have been shown and described with respect to particular embodiments thereof, it will be understood by those skilled in the art that various changes in form and details can be made therein without departing from the spirit and scope of the application. Therefore, the scope of the application should not be limited by the embodiments, but should be defined only in accordance with the following claims and their equivalents.

Claims

1. A wireless data acquisition terminal, characterized in that, The utility model relates to a sensor interface module (1) adopts the magnetic quick release connector to realize the physical connection of sensor cable, the adjustable gain signal conditioning module (2) is connected with AD623 instrument amplifier through the gain resistance network of jumper cap setting, the main control module (3) adopts sandwich type PCB layout, contains radio frequency layer, insulating layer and digital signal layer, the multi-protocol communication switching module (4) realizes the communication mode switching by the physical dial switch control SKY13370 radio frequency switch chip, the dynamic power switching module (5) contains the super capacitor group and the software intervention power backup circuit of LTC4412 chip composition, the modularization extension interface (6) is through Samtec high speed connector external GPS or industry bus extension card, the sensor interface module (1), adjustable gain signal conditioning module (2), main control module (3) are connected in proper order through the row pin welding, the multi-protocol communication switching module (4) and main control module (3) are vertically stacked through the gold finger connector, the dynamic power switching module (5) is connected with main control module (3) power supply pin through FPC soft wire. The sandwich type PCB layout of the main control module (3) is that the radio frequency layer adopts Rogers4350B high frequency board material, the digital signal layer adopts FR4 board material, and the cross-layer connection is realized through blind buried hole between the two layers. The dynamic power switching module (5) includes a Phoenix Contact SAC-5P-MSTB solar input interface, and the super capacitor group is directly welded with an LM2596 step-down chip through a copper substrate. The WiFi, Bluetooth, and LoRa radio frequency units of the multi-protocol communication switching module (4) are separated by a metal isolation plate with a thickness of 1.2 mm and grounding treatment. The dust cover of the modularization extension interface (6) is made of fluororubber material and is opened and closed by a spring needle mechanism. The jumper socket of the adjustable gain signal conditioning module (2) forms a 45° angle with the PCB board, and the gain resistance network uses Vishay PTF56 series low-temperature drift resistors. The magnetic quick release connector of the sensor interface module (1) includes an IP67-rated silica gel sealing ring, and the magnet is made of N52 neodymium iron boron material. An EMI shield is provided between the main control module (3) and the multi-protocol communication switching module (4), the shield has an opening diameter of not greater than 1 mm and is welded with the PCB ground plane.

2. The data wireless acquisition terminal according to claim 1, characterized in that: The super capacitor group of the dynamic power switching module (5) is fixed by a stainless steel slide rail buckle, and the slide rail contact surface is gold plated.

3. The data wireless acquisition terminal of claim 1, wherein: ​ 4. The data wireless acquisition terminal of claim 1, wherein: ​ 5. The data wireless acquisition terminal of claim 1, wherein: ​ 6. The data wireless acquisition terminal of claim 1, wherein: ​ 7. The data wireless acquisition terminal of claim 1, wherein: ​ 8. The data wireless acquisition terminal of claim 1, wherein: ​ 9. The data wireless acquisition terminal of claim 1, wherein: ​

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