Heating plate for wafer gluing and developing

Abstract

The utility model relates to the technical field of heating plates, in particular to a heating plate for wafer gluing and developing, which comprises a heating plate mechanism for wafer gluing and developing. The heating plate mechanism for wafer gluing and developing comprises a wafer gluing and developing heating plate first shell, a wafer gluing and developing heating plate second shell, a wafer gluing and developing heating plate third shell, a wafer gluing and developing heating plate connecting groove, a heating plate body and a heating plate first fixing plate piece, when the equipment is operated, a wafer gluing and developing heating plate connecting groove is used for connecting the heating plate mechanism for wafer gluing and developing to a proper position, wafer gluing is placed on the surface of a heating plate body, and the current operation power of a first heating plate cooling fan and a second heating plate cooling fan is set through control equipment; the equipment has the beneficial effects that the fan rotating shaft and the fan blades are assembled, so that heat generated by the heating plate body can be quickly taken away, and overheating is prevented.

Description

TECHNICAL FIELD

[0001] The utility model belongs to the technical field of heating plate, concretely relates to a heating plate for wafer coating and developing. BACKGROUND

[0002] Wafer coating and developing is a key step in the semiconductor manufacturing process, which is to coat photoresist on the wafer surface before exposure in the photoetching machine, and then to carry out baking and developing treatment to form the required pattern, so that the heating plate is needed in the semiconductor manufacturing to heat and bake.

[0003] The heating plate for wafer coating and developing disclosed in the authorized announcement No. CN 221863094 U has the problem that most of the existing heating plates are connected to the main body of the heating plate by bolts, when the heating element inside the heating plate fails, the staff needs to disassemble the bolts one by one with the help of tools, and after the maintenance is completed, the staff also needs to install the bolts with the help of tools, which is time-consuming and laborious and too troublesome, so the utility model is proposed to solve the above problems, but it does not solve the problems of real-time temperature monitoring and operation control of the heating plate mechanism for wafer coating and developing. SUMMARY

[0004] The utility model aims at providing a heating plate for wafer coating and developing to solve the problems in the background.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical scheme:

[0006] A heating plate for wafer coating and developing, comprising a heating plate mechanism for wafer coating and developing, the heating plate mechanism for wafer coating and developing comprises a wafer coating and developing heating plate first shell, a wafer coating and developing heating plate second shell, a wafer coating and developing heating plate third shell, a wafer coating and developing heating plate connecting groove, a heating plate body and a heating plate first fixed plate piece, the wafer coating and developing heating plate first shell side is fixedly provided with the wafer coating and developing heating plate second shell, the wafer coating and developing heating plate second shell top is fixedly provided with the wafer coating and developing heating plate third shell, the wafer coating and developing heating plate third shell side is fixedly provided with the wafer coating and developing heating plate connecting groove, the wafer coating and developing heating plate connecting groove side is fixedly provided with the heating plate body, and the heating plate body side is fixedly provided with the heating plate first fixed plate piece.

[0007] The heating plate first fixed plate member is fixedly provided with a heating plate second fixed plate member on one side, and a heating plate convenient disassembly plate member is movably arranged on the side, the wafer coating and developing heating plate first shell is movably arranged with a first heating plate cooling fan on the other side, and the first heating plate cooling fan is movably arranged with a second heating plate cooling fan on one side.

[0008] Preferably, the heating plate body is fixedly provided with a resistance heating pipe at the bottom end, which can quickly generate heat, accelerate the preheating and developing process of the wafer, improve the production efficiency, and realize uniform heat energy distribution through the design of the resistance heating pipe, so as to ensure that the temperature of the entire wafer surface remains consistent during the heating process, avoiding process defects caused by temperature difference and thus losses.

[0009] Preferably, the first heating plate cooling fan is fixedly provided with a fan connecting rod on the other side, which can optimize the airflow direction, make the airflow more effectively dissipate heat from the heating plate body, enhance the cooling effect, and provide stable support to reduce the vibration of the first and second heating plate cooling fans during operation, thereby reducing the impact on surrounding parts and improving the stability and service life of the overall equipment.

[0010] Preferably, the fan connecting rod is movably arranged with a fan shaft on one side, and the fan shaft is movably arranged with a fan blade on one side, which can quickly remove the heat generated by the heating plate body, prevent overheating, and keep the wafer coating and developing heating plate mechanism within the optimal working temperature range, providing uniform airflow to ensure that the temperature of the entire heating plate body surface is uniform and avoid process defects caused by local overheating.

[0011] Preferably, the control device is fixedly provided with a temperature collection sensor at the top end, which can monitor the temperature of the heating plate body in real time and change the value through the control device to ensure accurate temperature control. The data of the temperature sensor can be integrated with the control device to automatically adjust the heating power to a certain extent, ensuring that the temperature always remains within the set range.

[0012] Preferably, the temperature collection sensor is fixedly provided with a screen at the bottom end, and the screen is fixedly provided with a button on one side, which can view the current operating power of the first and second heating plate cooling fans, the heating temperature of the resistance heating pipe, and the real-time temperature collected by the temperature collection sensor, and change the current operating power of the first and second heating plate cooling fans and the heating temperature of the resistance heating pipe.

[0013] Compared with the prior art, the device has the advantages that

[0014] 1. The device operates to use the wafer coating development heating plate connecting groove to connect the wafer coating development heating plate mechanism to a suitable position, place the wafer coating on the surface of the heating plate body, set the operation power of the first heating plate cooling fan and the second heating plate cooling fan through the control device, and the heating temperature of the resistance heating pipe is used for developing and heating the wafer coating.

[0015] 2. The device has the advantages that the fan rotating shaft and fan blades can quickly take away the heat generated by the heating plate body, prevent overheating, keep the wafer coating development heating plate mechanism in the best working temperature range, provide uniform airflow, help ensure that the temperature of the entire heating plate body surface is uniform, avoid process defects caused by local overheating, the temperature collecting sensor can monitor the temperature of the heating plate body in real time, and the numerical value can be changed through the control device to ensure accurate temperature control. The data of the temperature sensor can be integrated with the control device to automatically adjust the heating power to a certain extent, and ensure that the temperature always remains in the set range. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 It is a schematic diagram of the installation of the resistance heating pipe structure of the utility model;

[0018] Figure 3 It is a schematic diagram of the installation of the heating plate cooling fan structure of the utility model;

[0019] Figure 4 It is a schematic diagram of the installation of the control device structure of the utility model.

[0020] In the drawing: 1, wafer coating development heating plate first shell; 2, wafer coating development heating plate second shell; 3, wafer coating development heating plate third shell; 4, wafer coating development heating plate connecting groove; 5, heating plate body; 6, heating plate first fixed plate part; 7, heating plate second fixed plate part; 8, heating plate convenient dismounting plate part; 9, control device; 10, first heating plate cooling fan; 11, second heating plate cooling fan; 12, resistance heating pipe; 13, fan connecting rod; 14, fan rotating shaft; 15, fan blade; 16, temperature collecting sensor; 17, screen; 18, button. DETAILED DESCRIPTION

[0021] Clearly and completely describe the technical scheme in the embodiments of the utility model with reference to the drawings in the embodiments of the utility model, obviously, the described embodiment is only a part of the embodiment of the utility model, and is not all the embodiment. Based on the embodiment in the utility model, all other embodiments obtained by the ordinary skill in the art without making creative labor belong to the range of protection of the utility model.

[0022] Please refer to Figures 1-4 The utility model provides a technical scheme:

[0023] A wafer gluing and developing heating plate, including wafer gluing and developing heating plate mechanism, wafer gluing and developing heating plate mechanism includes wafer gluing and developing heating plate first casing 1, wafer gluing and developing heating plate second casing 2, wafer gluing and developing heating plate third casing 3, wafer gluing and developing heating plate connecting groove 4, heating plate body 5 and heating plate first fixed plate spare 6, wafer gluing and developing heating plate first casing 1 one side is fixedly provided with wafer gluing and developing heating plate second casing 2, wafer gluing and developing heating plate second casing 2 top is fixedly provided with wafer gluing and developing heating plate third casing 3, wafer gluing and developing heating plate third casing 3 one side is fixedly provided with wafer gluing and developing heating plate connecting groove 4, wafer gluing and developing heating plate connecting groove 4 one side is fixedly provided with heating plate body 5, heating plate body 5 one side is fixedly provided with heating plate first fixed plate spare 6;

[0024] Heating plate first fixed plate spare 6 one side is fixedly provided with heating plate second fixed plate spare 7, one side is movably provided with heating plate convenient dismounting plate spare 8, wafer gluing and developing heating plate first casing 1 other side is fixedly provided with control equipment 9, wafer gluing and developing heating plate second casing 2 one side is movably provided with first heating plate cooling fan 10, first heating plate cooling fan 10 one side is movably provided with second heating plate cooling fan 11.

[0025] In the embodiment, preferably, the heating plate body 5 is fixedly provided with a resistance heating pipe 12 at the bottom end, which can quickly generate heat, accelerate the preheating and developing process of the wafer, improve the production efficiency, and the design of the resistance heating pipe 12 can realize uniform heat energy distribution, ensure that the entire wafer surface maintains consistent temperature during the heating process, avoid process defects caused by temperature difference and thus cause loss.

[0026] In the embodiment, preferably, the first heating plate cooling fan 10 is fixedly arranged with a fan connecting rod 13 on the other side, which has the beneficial effect that the fan connecting rod 13 can optimize the air flow direction, so that the air flow can be more effectively cooled from the heating plate body 5, thereby enhancing the cooling effect. The fan connecting rod 13 can provide stable support, reduce the vibration of the first heating plate cooling fan 10 and the second heating plate cooling fan 11 when they are running, thereby reducing the impact on the surrounding parts and improving the stability and life of the overall equipment.

[0027] In the embodiment, preferably, the fan connecting rod 13 is movably arranged with a fan rotating shaft 14 on one side, and the fan rotating shaft 14 is movably arranged with a fan blade 15 on one side, which has the beneficial effect that the heat generated by the heating plate body 5 can be quickly taken away to prevent overheating and keep the wafer coating and developing heating plate mechanism within the optimal working temperature range. By providing uniform air flow, it helps to ensure that the temperature of the entire heating plate body 5 surface is uniform, avoiding process defects caused by local overheating.

[0028] In the embodiment, preferably, the temperature collecting sensor 16 is fixedly arranged at the top end of the control device 9, which has the beneficial effect that the temperature sensor can monitor the temperature of the heating plate body 5 in real time and change the value through the control device 9 to ensure accurate temperature control. The data of the temperature sensor can be integrated with the control device 9 to automatically adjust the heating power to a certain extent and ensure that the temperature always remains within the set range.

[0029] In the embodiment, preferably, the temperature collecting sensor 16 is fixedly arranged with a screen 17 at the bottom end, and the screen 17 is fixedly arranged with a button 18 on one side, which has the beneficial effect that the current operation power of the first heating plate cooling fan 10 and the second heating plate cooling fan 11, the heating temperature of the resistance heating tube 12 and the real-time temperature collected by the temperature collecting sensor 16 can be viewed and the current operation power of the first heating plate cooling fan 10 and the second heating plate cooling fan 11 and the heating temperature of the resistance heating tube 12 can be changed.

[0030] The wafer coating and developing heating plate of the embodiment is connected to a suitable position by the wafer coating and developing heating plate connecting groove 4 when the device is operated, the wafer coating is placed on the surface of the heating plate body 5, the operation power of the first heating plate cooling fan 10 and the second heating plate cooling fan 11 is set by the control device 9, and the wafer coating is developed and heated by the heating temperature of the resistance heating pipe 12. The device has the advantages that the fan rotating shaft 14 and the fan blade 15 can quickly take away the heat generated by the heating plate body 5, prevent overheating, keep the wafer coating and developing heating plate mechanism in the best working temperature range, provide uniform airflow, help ensure that the temperature of the whole heating plate body 5 surface is uniform, avoid process defects caused by local overheating, the temperature collecting sensor 16 can monitor the temperature of the heating plate body 5 in real time, and the numerical value is changed by the control device 9, so that the temperature control is accurate, the data of the temperature sensor can be integrated with the control device 9, the heating power is automatically adjusted to a certain extent, and the temperature is always kept in the set range.

[0031] The basic principle, main features and advantages of the present application are shown and described above. It should be understood by those skilled in the art that the present application is not limited by the above embodiments, and the above embodiments and descriptions in the specification are only preferred examples of the present application and do not limit the present application. Without departing from the spirit and scope of the present application, various changes and improvements can be made to the present application, and these changes and improvements all fall within the scope of the present application. The scope of protection of the present application is defined by the appended claims and their equivalents.

Claims

1. A heating plate for wafer coating and developing, characterized in that: The invention includes a heating plate mechanism for wafer coating and developing, comprising a first housing (1) of a wafer coating and developing heating plate, a second housing (2) of a wafer coating and developing heating plate, a third housing (3) of a wafer coating and developing heating plate, a connecting groove (4) of a wafer coating and developing heating plate, a heating plate body (5) and a first fixing plate (6) of a heating plate. The second housing (2) of the wafer coating and developing heating plate is fixedly disposed on one side of the first housing (1), the third housing (3) of the wafer coating and developing heating plate is fixedly disposed on the top of the second housing (2), the connecting groove (4) of the wafer coating and developing heating plate is fixedly disposed on one side of the third housing (3), the heating plate body (5) is fixedly disposed on one side of the connecting groove (4), and the first fixing plate (6) of the heating plate is fixedly disposed on one side of the heating plate body (5). A second heating plate (7) is fixedly provided on one side of the first fixing plate (6) of the heating plate, and a heating plate easy-to-disassemble plate (8) is movably provided on the same side. A control device (9) is fixedly provided on the other side of the first housing (1) of the wafer coating and developing heating plate. A first heating plate cooling fan (10) is movably provided on one side of the second housing (2) of the wafer coating and developing heating plate, and a second heating plate cooling fan (11) is movably provided on one side of the first heating plate cooling fan (10).

2. The heating plate for wafer coating and developing according to claim 1, characterized in that: A resistance heating tube (12) is fixedly installed at the bottom of the heating plate body (5).

3. The heating plate for wafer coating and developing according to claim 1, characterized in that: A fan connecting rod (13) is fixedly installed on the other side of the first heating plate cooling fan (10).

4. A heating plate for wafer coating and developing according to claim 3, characterized in that: A fan shaft (14) is movably disposed on one side of the fan connecting rod (13), and a fan blade (15) is movably disposed on one side of the fan shaft (14).

5. A heating plate for wafer coating and developing according to claim 1, characterized in that: A temperature collection sensor (16) is fixedly installed on the top of the control device (9).

6. A heating plate for wafer coating and developing according to claim 5, characterized in that: A screen (17) is fixedly installed at the bottom of the temperature collection sensor (16), and a button (18) is fixedly installed on one side of the screen (17).

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