Composite heat-conducting high-frequency circuit board

Abstract

The utility model discloses a composite heat-conducting high-frequency circuit board, which comprises a high-frequency circuit board, the left end and the right end of the high-frequency circuit board are both fixedly provided with mounting racks, the front parts and the rear parts of the upper ends of the two mounting racks are both provided with mounting holes, and the front ends and the rear ends of the two mounting racks are both fixedly provided with a protection device. And a heat conduction device is fixedly mounted at the upper end of the high-frequency circuit board. According to the composite heat-conducting high-frequency circuit board, the bending resistance of the high-frequency circuit board is improved through the heat-conducting copper layer, the heat-conducting copper layer and the insulating heat-conducting glue have good heat-conducting performance, the upper surface of the high-frequency circuit board can conduct heat quickly, meanwhile, the heat dissipation holes are formed in the middle of the high-frequency circuit board, and in addition, the heat dissipation holes are formed in the middle of the high-frequency circuit board. The cooling fin is attached to the lower end of the high-frequency circuit board through the second insulating heat-conducting glue layer, so that the upper surface and the lower surface of the high-frequency circuit board have good heat dissipation performance, and the heat dissipation effect of the high-frequency circuit board is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to a circuit board technical field, especially a kind of composite heat-conducting high-frequency circuit board. BACKGROUND

[0002] High-frequency circuit board, also known as high-frequency printed circuit board (High Frequency PCB), is a kind of special design circuit board, can handle and transmit high-frequency signal, high-frequency board is mainly used in high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter) field PCB. Therefore, high-frequency circuit board is a kind of special circuit board specially designed for high electromagnetic frequency, with high-frequency signal processing and transmission capacity, and is widely used in electronic equipment requiring high-speed, high-frequency signal transmission.

[0003] With the improvement of electronic components integration and the increase of working frequency, the heat generated is more and more significant, and the heat dissipation performance of high-frequency circuit board as the carrier of various components is directly related to the performance of the whole device. If the heat dissipation is poor, the high temperature will have a negative impact on the performance of components, and high-frequency circuit board is usually applied to occasions with high performance and stability requirements, such as communication equipment, satellite communication, etc. In these applications, any performance decline or failure caused by poor heat dissipation may have serious consequences. SUMMARY

[0004] The main purpose of the utility model is to provide a kind of composite heat-conducting high-frequency circuit board, which can effectively solve the problems in the background art.

[0005] To achieve the above-mentioned purpose, the technical scheme adopted by the utility model is as follows:

[0006] A kind of composite heat-conducting high-frequency circuit board, comprising high-frequency circuit board, the left end and the right end of the high-frequency circuit board are fixedly installed with mounting bracket, the upper end front and the upper end rear of two mounting brackets are provided with mounting hole, the front end and the rear end of two mounting brackets are fixedly installed with protection device, the upper end of the high-frequency circuit board is fixedly installed with heat-conducting device.

[0007] Preferably, the heat-conducting device comprises a heat-conducting copper layer, two mounting screws are installed on the upper end left part and the upper end right part of the heat-conducting copper layer, a through hole is opened in the upper end middle part of the heat-conducting copper layer, a first insulating heat-conducting adhesive layer is installed on the lower end of the heat-conducting copper layer, and the heat-conducting copper layer is installed on the upper end of the high-frequency circuit board through the first insulating heat-conducting adhesive layer. The heat-conducting copper layer is fixed on the upper end of the high-frequency circuit board by the first insulating heat-conducting adhesive layer and mounting screws, and is further reinforced and installed by mounting screws. The heat-conducting copper layer not only improves the bending resistance of the high-frequency circuit board, but also has good heat-conducting performance, so that the upper surface of the high-frequency circuit board can quickly conduct heat.

[0008] Preferably, the high-frequency circuit board upper end middle part is provided with a heat dissipation hole, the high-frequency circuit board upper end left part and upper end right part are each provided with two screw holes, the high-frequency circuit board lower end is provided with a heat dissipation fin, the heat dissipation fin upper end is provided with a second insulating heat conductive adhesive layer, and the heat dissipation fin is attached to the high-frequency circuit board lower end through the second insulating heat conductive adhesive layer.

[0009] Preferably, the protection device comprises a first side plate and a second side plate, the first side plate and the second side plate are each provided with a plurality of openings at the front end, and the first side plate and the second side plate are respectively fixedly installed at the front end and the rear end of the two mounting frames.

[0010] Preferably, the heat dissipation hole and the through hole are in upper and lower correspondence in position and are both circular in shape.

[0011] Preferably, the mounting screw and the screw hole are in upper and lower correspondence in position.

[0012] Compared with the prior art, the high-frequency circuit board has the following beneficial effects:

[0013] 1. The heat conductive copper layer on the heat conduction device is attached to the upper end of the high-frequency circuit board through the first insulating heat conductive adhesive layer and is fixed by the mounting screw, and is further fixed by the mounting screw, so that the heat conductive copper layer improves the bending resistance of the high-frequency circuit board, and the heat conductive copper layer and the insulating heat conductive adhesive have good heat conduction performance, so that the upper surface of the high-frequency circuit board can quickly conduct heat, and the middle part of the high-frequency circuit board is also provided with a heat dissipation hole, and the heat dissipation fin is attached to the lower end of the high-frequency circuit board through the second insulating heat conductive adhesive layer, so that the upper and lower surfaces of the high-frequency circuit board have good heat dissipation performance, and the heat dissipation effect of the high-frequency circuit board is improved.

[0014] 2. The first side plate and the second side plate of the protection device and the two mounting frames can protect the side edges of the high-frequency circuit board, further improve the rigidity of the high-frequency circuit board, and the two side plates are each provided with a plurality of openings, so that the side edges of the high-frequency circuit board also have good air permeability.

[0015] 3, the substrate of the high-frequency circuit board is a Rogers board, the Rogers material has a precise dielectric constant, the stability of the dielectric constant ensures that the speed and delay of the signal remain constant during transmission, thereby improving the integrity of the signal, and the loss factor of the Rogers material is very low, the low loss characteristic helps to improve the efficiency of the circuit and the integrity of the signal, in addition, the Rogers material has excellent thermal stability, and the thermal expansion coefficient is low, so that the size and performance of the material remain stable in a high-temperature or temperature-varying environment. BRIEF DESCRIPTION OF DRAWINGS

[0016] Figure 1 It is a whole structure schematic view of the high-frequency circuit board of the composite heat conduction of the utility model;

[0017] Figure 2 It is a whole structure schematic view of the heat conduction device of the utility model;

[0018] Figure 3 It is a whole structure schematic view of the high-frequency circuit board of the utility model;

[0019] Figure 4 It is a whole structure schematic view of the protective device of the utility model.

[0020] In the drawing: 1, mounting frame; 2, heat conduction device; 3, high-frequency circuit board; 4, protective device; 5, mounting hole; 20, heat conduction copper layer; 21, through hole; 22, mounting screw; 23, No. 1 insulating heat conduction adhesive layer; 30, screw hole; 31, heat dissipation hole; 32, heat dissipation fin; 33, No. 2 insulating heat conduction adhesive layer; 40, No. 1 side plate; 41, No. 2 side plate; 42, opening. DETAILED DESCRIPTION

[0021] In order to make the technical means, creative features, purposes and effects achieved by the utility model easy to understand, the utility model is further described below in combination with specific implementation manners.

[0022] In the description of the utility model, it should be explained that the orientation or position relationship indicated by the terms "upper", "lower", "inner", "outer", "front end", "rear end", "two ends", "one end" and "the other end" is the orientation or position relationship shown in the drawing, and is only for the convenience of describing the utility model and simplifying the description, and cannot be understood as indicating or implying that the indicated device or element must have a specific orientation, a specific orientation and operation, therefore, it cannot be understood as a limitation on the utility model. In addition, the terms "first" and "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance.

[0023] In the description of the utility model, it is necessary to explain, unless another explicit provision and limitation, the term "installation", "set with", "connection" and so on, should do broad sense understanding, for example "connection", can be fixed connection, also can be detachable connection, or integrally connected;Can be mechanical connection, also can be electrical connection;Can be directly connected, also can be indirectly connected through the intermediate medium, can be two elements inside the communication. For ordinary skilled in the art, the specific meaning of the above terms in the utility model can be understood according to the specific circumstances.

[0024] As Figures 1-4 The utility model discloses a kind of composite heat-conducting high-frequency circuit board, including high-frequency circuit board 3, high-frequency circuit board 3 left end and right end are fixedly installed with mounting bracket 1, two mounting brackets 1 upper end front and upper end rear are all opened with mounting hole 5, two mounting brackets 1 front end and rear end are fixedly installed with protection device 4, and high-frequency circuit board 3 upper end is fixedly installed with heat-conducting device 2.

[0025] Heat-conducting device 2 includes heat-conducting copper layer 20, two mounting screws 22 are installed in the upper end left part and the upper end right part of heat-conducting copper layer 20, through hole 21 is opened in the upper end middle part of heat-conducting copper layer 20, No. 1 insulating heat-conducting adhesive layer 23 is installed in the lower end of heat-conducting copper layer 20, and heat-conducting copper layer 20 is installed on the upper end of high-frequency circuit board 3 by No. 1 insulating heat-conducting adhesive layer 23. Heat-conducting copper layer 20 is fixed on the upper end of high-frequency circuit board 3 by mounting screw 22, and is reinforced and installed again, the bending resistance of high-frequency circuit board 3 is improved by heat-conducting copper layer 20, and the heat-conducting performance of heat-conducting copper layer 20 and insulating heat-conducting adhesive is good, so that the upper surface of high-frequency circuit board 3 can be quickly heat-conducted.

[0026] High-frequency circuit board 3 upper end middle part is opened with heat dissipation hole 31, and the upper end left part and the upper end right part of high-frequency circuit board 3 are both opened with two screw holes 30, high-frequency circuit board 3 lower end is installed with fin 32, fin 32 upper end is installed with No. 2 insulating heat-conducting adhesive layer 33, and fin 32 is pasted on the lower end of high-frequency circuit board 3 by No. 2 insulating heat-conducting adhesive layer 33;Heat dissipation hole 31 and through hole 21 are in upper and lower correspondence in position, and the shape is circular;Mounting screw 22 and screw hole 30 are in upper and lower correspondence in position. High-frequency circuit board 3 middle part is also provided with heat dissipation hole 31, in addition, fin 32 is pasted on the lower end of high-frequency circuit board 3 by No. 2 insulating heat-conducting adhesive layer 33, so that high-frequency circuit board 3 upper and lower surfaces have good heat dissipation, and the heat dissipation effect of high-frequency circuit board 3 is improved.

[0027] The protection device 4 comprises a first side plate 40 and a second side plate 41, a plurality of openings 42 are formed in front ends of the first side plate 40 and the second side plate 41, and the first side plate 40 and the second side plate 41 are fixedly installed at front ends and rear ends of the two mounting racks 1. The first side plate 40, the second side plate 41 and the two mounting racks 1 can protect the side edges of the high-frequency circuit board 3, further improve the rigidity of the high-frequency circuit board 3, and a plurality of openings 42 are formed in the two side plates, so that the side edges of the high-frequency circuit board 3 can also have good air permeability.

[0028] It should be noted that the utility model discloses a composite heat conduction high-frequency circuit board, the first side plate 40, the second side plate 41 and the two mounting racks 1 on the protection device 4 can protect the side edges of the high-frequency circuit board 3, further improve the rigidity of the high-frequency circuit board 3, and a plurality of openings 42 are formed in the two side plates, so that the side edges of the high-frequency circuit board 3 can also have good air permeability, and the heat conduction device 2 is fixed on the upper end of the high-frequency circuit board 3 by the fixing screw 22 of the insulating heat conduction adhesive layer 23 of the heat conduction copper layer 20, and is further reinforced and installed by the fixing screw 22, the heat conduction copper layer 20 not only improves the bending resistance of the high-frequency circuit board 3, and the heat conduction copper layer 20 and the insulating heat conduction adhesive have good heat conduction performance, so that the upper surface of the high-frequency circuit board 3 can quickly conduct heat, at the same time, the high-frequency circuit board 3 is also provided with the heat dissipation hole 31 in the middle, in addition, the heat dissipation fin 32 is attached to the lower end of the high-frequency circuit board 3 through the second insulating heat conduction adhesive layer 33, so that the high-frequency circuit board 3 has good heat dissipation on the upper and lower surfaces, and the heat dissipation effect of the high-frequency circuit board 3 is improved.

[0029] The basic principle and main features of the utility model and the advantages of the utility model are shown and described. Those skilled in the art should understand that the utility model is not limited to the above-mentioned embodiments, and the above-mentioned embodiments and descriptions in the specification are only to illustrate the principle of the utility model, and various changes and improvements can be made without departing from the spirit and scope of the utility model, and these changes and improvements all fall within the scope of the utility model claimed. The scope of protection of the utility model is defined by the appended claims and their equivalents.

Claims

1. A composite heat-conducting high-frequency wiring board comprising a high-frequency wiring board (3), characterized by: The high-frequency circuit board (3) left end and right end are fixedly installed with mounting bracket (1), two mounting bracket (1) upper end front and upper end rear are opened with mounting hole (5), two mounting bracket (1) front end and rear end are fixedly installed with protection device (4), the high-frequency circuit board (3) upper end is fixedly installed with heat conduction device (2).

2. The composite high-frequency circuit board of claim 1, wherein: The heat conduction device (2) includes a heat conduction copper layer (20), the heat conduction copper layer (20) upper end left part and upper end right part are installed with two mounting screws (22), the heat conduction copper layer (20) upper end middle part is opened with through hole (21), the heat conduction copper layer (20) lower end is installed with a insulating heat conductive adhesive layer (23), the heat conduction copper layer (20) is installed on the high-frequency circuit board (3) upper end through the insulating heat conductive adhesive layer (23).

3. The high-frequency circuit board with composite thermal conductivity according to claim 2, characterized in that: The high-frequency circuit board (3) upper end middle part is opened with heat dissipation hole (31), the high-frequency circuit board (3) upper end left part and upper end right part are opened with two screw holes (30), the high-frequency circuit board (3) lower end is installed with heat dissipation fin (32), the heat dissipation fin (32) upper end is installed with two insulating heat conductive adhesive layer (33), the heat dissipation fin (32) is attached to the high-frequency circuit board (3) lower end through two insulating heat conductive adhesive layer (33).

4. The high-frequency circuit board with composite thermal conductivity according to claim 1, characterized in that: The protection device (4) includes a first side plate (40) and a second side plate (41), the first side plate (40) and the second side plate (41) are opened with a plurality of openings (42) at the front end, the first side plate (40) and the second side plate (41) are fixedly installed at the front end and the rear end of the two mounting brackets (1) respectively.

5. A high-frequency circuit board with composite thermal conductivity according to claim 3, characterized in that: The heat dissipation hole (31) and the through hole (21) are in upper and lower correspondence in position, and the shape is circular.

6. The high-frequency circuit board with composite thermal conductivity according to claim 3, characterized in that: The mounting screw (22) and the screw hole (30) are in upper and lower correspondence in position.

Images